Abstract: The present invention provides a method for producing synthetic leather using a silicone rubber coating liquid; and synthetic leather produced by the method.

Abstract: A spacer-locator with integrated locator pins and spacer tabs for use in joining applications. The spacer-locator provides consistent and accurate spacing between mating surfaces and the locator pins provide enhanced location control of the joining components while providing a mechanical advantage to the shear strength at the joint. Also, a spacer-locator for joining at least two objects along mating surfaces, the spacer-locator constraining more than five degrees of freedom for the objects to be joined.

Abstract: An apparatus and method of manufacturing a display apparatus are provided. The apparatus for manufacturing a display apparatus includes a support; a first stage arranged on the support, the first stage being configured to move linearly and to receive a film member thereon, a second stage spaced apart from the first stage, and arranged on the support, the second stage being configured to move linearly and to receive a display panel thereon. an adhesive belt spaced from the support, the adhesive belt being configured to selectively adhere to the film member, a tension maintenance portion arranged on the support, the tension maintenance portion being configured to ascend and descend and to maintain a tension of the adhesive belt, and a pressing portion under the tension maintenance portion, the pressing portion being configured to move linearly and to press the adhesive belt toward one of the first stage and the second stage.

Abstract: [Object] To provide a method and an apparatus for manufacturing electronic devices by transferring the device chips from one substrate for producing device chips to the other substrate for a product having a large display. [Means of Realizing the Object] A substrate having a plurality of device chips is brought into contact with a first drum including a selective adhesive region, the device chips are transferred by making the device chips be adhered to the selective adhesive layer of the first drum and separating at least part of the device chips from the substrate by rotating the first drum, then, the device chips on the first drum are made to be come into contact with the other substrate for the product, and the device chips are transferred to the substrate for the product by rotating the first drum.

Abstract: The invention relates to a device, a special paper and a method for producing three-dimensional objects.

Abstract: A method of forming a patterned metal unit on an article. The method includes the steps of: providing an article that has an insulating surface; transferring a catalyst layer onto the insulating surface of the article, the catalyst layer including a catalytic material; removing a part of the catalyst layer to form a patterned catalyst layer; and forming a patterned metal layer on the patterned catalyst layer by an electroless plating technique to obtain a patterned metal unit that is constituted by the patterned catalyst layer and the patterned metal layer.

Abstract: The present disclosure relates to segmented transfer tapes useful in the transfer of only a portion of the segments of the transfer tapes and methods of making thereof. The segmented transfer tapes include a removable template layer having a structured surface; a transfer layer comprising a backfill layer, wherein the backfill layer has a structured first major surface, and an adhesive layer; at least one transferable segment formed in the transfer layer; at least one non-transferable segment formed in the transfer layer, the at least one non-transferable segment includes an adhesive surface, wherein a passivating layer is disposed on at least a portion of the adhesive surface of the at least one non-transferrable segment; and at least one kerf extending from the first major surface of the adhesive layer and into at least a portion of the removable template layer. The present disclosure also provides micro-optical assemblies and methods of making micro-optical assemblies from the segmented transfer tapes.

Abstract: An apparatus and method for curing an electron-beam coating on a flexible substrate. A continuously looping master web is mated with the flexible substrate to cover the electron-beam coating when passing through an electron-beam curing unit. Curing of the electron-beam coating takes place in normal atmospheric conditions, thereby eliminating the need for nitrogen gas or the like in a curing chamber.

Abstract: A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.

Abstract: A multi-scale manufacturing system comprising a centrally located multi-axis and multi-dimensional first manipulating component associated with a housing for manipulating a substrate and a template, a control subsystem coupled to the first manipulating component for controlling movement thereof, a pre-alignment subsystem for pre-aligning the substrate and the template, an assembly station for applying nanomaterial to the template, an alignment station for aligning the template and the substrate together to form a workpiece assembly, and a transfer subsystem for applying pressure to the workpiece assembly for transferring the nanomaterial from the template to the substrate.

Abstract: A method of transferring nanomaterials with sugar, the method including: depositing a colloidal sugar layer on a first substrate; pressing a second substrate and a nanomaterial layer located on the second substrate on the colloidal sugar layer, wherein the nanomaterial layer is adhered to the colloidal sugar layer; solidifying the colloidal sugar layer into a solid sugar layer; tearing the second substrate; locating a fourth substrate on the nanomaterial layer; placing the first substrate, the solid sugar layer, the nanomaterial layer and the fourth substrate in a solvent, wherein the solid sugar layer is dissolved in the solvent, and the nanomaterial layer is detached from the first substrate and attached to the fourth substrate.

Abstract: Transfer films, articles made therewith, and methods of making and using transfer films to form an electrical stack are disclosed. The transfer films (100) may include a plurality of co-extensive electrical protolayers (22, 23, 24) forming an electrical protolayer stack (20), at least selected or each electrical protolayer independently comprising at least 25 wt % sacrificial material and a thermally stable material and having a uniform thickness of less than 25 micrometers. The transfer films may include a plurality of co-extensive electrical protolayers forming an electrical protolayer stack, at least selected or each protolayer independently exhibiting a complex viscosity of between 103 and 104 Poise at a shear rate of 100/s when heated to a temperature between its Tg and Tdec.

Abstract: Methods and system which eliminate steps in the mounting a discrete device to an electronic circuit using a conductive film, shortening the time required to attach each discrete device. The methods place a discrete device onto the conductive tape and partially cure portions of the adhesive. The discrete device is then removed from the conductive tape along with the adhesive and conductive particles which have been transferred onto the contact pads of the discrete device. The discrete device is then placed on the substrate and aligned. Pressure and heat are applied to complete the bond.

Abstract: A bonding method of a flexible display module is provided. The flexible display module includes a flexible display panel having a first bonding area and an integrated driving circuit having a second bonding area. The bonding method includes: attaching, through a colloid, a transfer plate to a surface of the flexible display panel; solidifying the colloid facing the first bonding area to form a fixed portion; flattening the transfer plate to flatten the first bonding area through the fixed portion; aligning the second bonding area with the first bonding area pre-laminating the first bonding area and the second bonding area at a first temperature; breaking the fixed portion, and separating the flexible display panel and the transfer plate; flattening the flexible display panel; laminating the first bonding area and the second bonding area at a second temperature to form the flexible display module.

Abstract: A manufacturing method manufactures an electrode by use of a manufacturing apparatus including a B-roll configured to convey granules, a C-roll configured to convey a metal foil, and a cooling portion configured to cool down the metal foil on an upstream side relative to the C-roll in terms of a conveying direction of the metal foil. Further, the manufacturing apparatus cools down the metal foil by use of the cooling portion, supplies the metal foil thus cooled down by the cooling portion to the C-roll, and transfers the granules to the metal foil in a deposition gap between the B-roll and the C-roll.

Abstract: A method is proposed for transferring a bottom label and a wraparound label into an injection mould for producing an injection-moulded part provided with the labels, in that the bottom label is arranged on the end side and the wraparound label on the lateral side of an insert die and the insert die equipped with the two labels is introduced into the mould cavity of the moulding tool, after which the bottom label is deposited on the bottom and the wraparound label on the lateral surface of the mould cavity of the moulding tool, in order to back-mould them with a plastics material injected into the mould cavity.

Abstract: A sublimation printing method on cotton and/or viscose is described comprising the steps of: preparing a piece of laminar substrate, applying (for example) microcapsules onto a side of said piece of laminar substrate, wherein said microcapsules comprise a core of polyester and/or polyamide and/or polyethylene and a shell of cellulose and/or starch, ink-jet printing onto said side of said piece of laminar substrate using sublimation ink, preparing a piece of fabric containing a high amount of cotton and/or viscose, approaching said piece of laminar substrate and said piece of fabric, pressing and heating, and separating said piece of laminar substrate from said piece of fabric; a fabric ready for sublimation printing is obtained if the step of ink-jet printing is not performed.

Abstract: Embodiments of the invention are directed to a transfer lamination process and apparatus that reduces substrate warpage. In some embodiments, the transfer lamination process is performed using a transfer lamination device, which includes a transfer unit, a substrate rotator, and a transfer ribbon having a carrier layer and a transfer layer attached to the carrier layer. In some embodiments of the transfer lamination process, a transfer section of the transfer layer is transferred from the carrier layer to a first surface of a substrate using the transfer unit. In some embodiments of this transferring step, the transfer section is heated and pressed against the first surface of the substrate using the transfer unit, and the carrier layer is detached from the transfer section. The substrate is then inverted using the substrate rotator.

Abstract: A method for coating of a floor panel and a floor panel produced by the method. A method for producing a laminated product, for example a building panel, preferably a floor panel. The method includes applying a paper on one side of a wood fiber based core, e.g., an HDF panel, creating a décor on the paper by a digital printing process, applying a resin, preferably a melamine formaldehyde resin, on the paper, heating the décor and the paper with the resin, preferably by using an IR lamp; and applying heat and pressure in order to cure the resin and thereby obtain a laminated product. Also, alternative methods for producing a laminated product, and such a laminated product.

Abstract: A technique comprising: securing a device substrate (8) to a carrier (1) using one or more adhesive elements (6); forming electronic elements (10) on the device substrate with the device substrate thus secured to the carrier; and thereafter reducing the adhesion strength of at least one of the one or more adhesive elements to facilitate the release of the substrate from the carrier.