Abstract: An apparatus for transferring a semiconductor die from a wafer tape to a product substrate. The apparatus includes a wafer frame configured to secure the wafer tape and a support frame configured to secure a support substrate. The support substrate includes a plurality of holes and secures the product substrate. The apparatus further includes an actuator to transfer the semiconductor die to a transfer location on the product substrate.

Abstract: The present disclosure relates to a micro light emitting diode (Micro LED) transfer-printing device. A heating device and a movable cooling device are arranged on a rack, wherein a cooling surface of the cooling device is opposite to a heating surface of the heating device. A roller mechanism is arranged between the heating device and the cooling device, and a cyclically rotatable conveyor belt is configured on the roller mechanism. A temperature control glue is configured on an outer surface of the conveyor belt. Compared with the conventional solution, the proposed Micro LED transfer-printing device realizes cyclic absorption and transfer-printing of the Micro LED such that the transfer-printing efficiency may be enhanced.

Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.

Abstract: Examples are disclosed that relate to aligning a pressure sensitive adhesive to a body of a display device for attachment of a display module to the display device. One example provides an electronic display device comprising a body, the body comprising a wall and a deck extending inwardly from the wall. The deck comprises a first reference feature configured to interface with a first index feature on a pressure sensitive adhesive application fixture, and a second reference feature configured to interface with a second index feature on the pressure sensitive adhesive application fixture. The electronic display device further comprises a display module supported by the deck, and a pressure sensitive adhesive adhering the display module to the deck.

Abstract: A conductive transfer for application to a surface is described. The conductive transfer comprises first and second non-conductive ink layers and an electrically conductive layer positioned between the first and second non-conductive ink layers. The conductive transfer also includes an adhesive layer for adhering the conductive transfer to the surface of an article.

Abstract: A metal recycling method comprises attaching a tape to a metal layer of a semiconductor structure; and separating a part of the metal layer from the semiconductor structure and transferring the part of the metal layer to the tape by a pressure difference.

Abstract: The present disclosure provides a method for transferring an image to a substrate that includes providing a transfer medium having at least one registration mark; printing an image on the transfer medium; covering the image with a backing layer, the backing layer not covering the registration mark; covering the backing layer with an adhesive layer; penetrating the adhesive layer and the backing layer with a cutting device at locations around the image, the penetrating of the adhesive layer and backing layer not penetrating the transfer medium; removing portions of the adhesive layer and backing layer from the locations around the image; and transferring the image to the substrate.

Abstract: A method for producing a multi-layered absorbent articles is disclosed. At least two of the layers include a colored region.

Abstract: The present invention relates to a device and method for transferring an impression from a substrate to a surface comprising a surface coated with first layer of release agent; either a second layer of polyvinyl acetate; and a third layer of mixture of acrylamide and styrene acetate or a single layer of mixture of polyvinyl acetate, acrylamide and styrene acetate; and having the impression to be transferred thereon, and a method of making the aforesaid device and transferring an impression from a substrate to a surface.

Abstract: The present disclosure provides an automatic labeling apparatus and method, as well as an assembly jig and method, the automatic labeling apparatus includes an attachment platform provided with an attachment surface, an attachment unit provided with a label receiving surface, and a separation unit, wherein the separation unit is configured to separate a label from a label base paper to the label receiving surface with a glue surface of the label away from the label receiving surface, the label receiving surface being configured to make the glue surface of the label higher than the attachment surface when the label is on the label receiving surface.

Abstract: Method for reversible bonding between a first element and a second element, comprising the implementation of the following steps: a) producing at least one oxide layer on at least one first face of the first element or of the second element; b) joining the first face of the first element with the first face of the second element such that the oxide layer forms a bonding interface between the first element and the second element; c) disjoining the second element with regard to the first element by the application of a heat treatment under controlled humid atmosphere physically and/or chemically degrading the oxide layer.

Abstract: An apparatus includes a product substrate having a transfer surface, and a semiconductor die defined, at least in part, by a first surface adjoined to a second surface that extends in a direction transverse to the first surface. The semiconductor die is disposed on the transfer surface of the product substrate such that at least a portion of the first surface is in contact with the transfer surface, and at least a portion of the second surface is embedded onto the product substrate, beneath a plane that extends across the transfer surface.

Abstract: A multi-layer printed circuit board (PCB) includes a laminate between a PCB heating core and a PCB signal core. The PCB heating core includes an electrically conductive resistive heating element upon a first core substrate. During a lamination cure PCB fabrication stage, a platen contacts the PCB and a power supply is electrically connected to the resistive heating element. The laminate is cured with heat transferred by the platen and heat from the resistive heating element. The PCB heating core may be located within an inner layer of the multi-layer PCB to normalize a thermal gradient across the multi-layer PCB that may otherwise occur during the laminate cure fabrication stage. As a result of the normalized thermal gradient, the degree of laminate cure and material characteristics of the cured laminate material are more consistent throughout the multi-layer PCB thickness.

Abstract: A process of manufacturing a down product comprises at least one bonding pattern line for the compartment separation without forming sewing holes by printing and drying a heat-reactive adhesive on the inner surface of an inner fabric, an optional mesh material and/or an outer fabric in a predetermined pattern, laminating said inner fabric, optional mesh material and/or outer fabric, and then high-frequency heating them under pressing with a pressing pattern the same as the printing pattern to bond the inner fabric, optional mesh material and outer fabric. Accordingly, it is possible to manufacture a down product having a bonding pattern line composed of a bonding line with excellent adhesiveness and durability and an aesthetically excellent pattern line with good clearness and finishing quality as well as to achieve a mass production of down products by mechanization and automation.

Abstract: A method of transfer lamination involves applying a release coating to a first side of a film, applying an application layer to the first side of the film over the release coating, bonding the first side of the film to a substrate, applying a second coating to a second side of the film while the first side of the film is bonded to the substrate, and removing the film from the substrate leaving the application layer deposited on the substrate and the second coating on the second side of the film.

Abstract: Pillar delivery films for vacuum insulated glass units are disclosed. The delivery films include a support film or pocket tape, a sacrificial material on the support film, and a plurality of pillars. The pillars are at least partially embedded in the sacrificial material or formed within sacrificial material molds, and the sacrificial material is capable of being removed while leaving the pillars substantially intact. Methods of transferring pillars to a substrate using the pillar delivery films are disclosed. In order to make an insulated glass unit, the delivery films are laminated to a receptor such as a glass pane, and the support film and sacrificial material are removed to leave the pillars remaining on the glass.

Abstract: A method for producing a smooth coating on a substrate includes applying a release coating to a first side of a film, applying an application layer to said first side of said film over said release coating, bonding said first side of said film to a first substrate, applying a printable coating to a second side of said film while said first side of said film is bonded to said first substrate, and removing said film from said first substrate leaving said application layer deposited on said first substrate and said printable coating on said second side of said film.

Abstract: Provided is a lithium metal anode comprising a Langmuir-Blodgett films as an artificial solid electrolyte interface layer, a lithium metal battery comprising the same, and a preparation method thereof. Various ultra-thin film layers made of carbon and ceramic are formed on the surface of the LiM to serve as a stable artificial SEI layer and suppress formation and perforation of lithium dendrite and side reactions.

Abstract: A method and apparatus for forming a circuit on an uneven two-dimensional (2-D) or three-dimensional (3-D) surface of an object is described. An amount of electrically conductive material to form a circuit between two points on the object is determined. The determined amount of electrically conductive material is deposited on a first surface of a stretchable substrate. The stretchable substrate with the deposited electrically conductive material is applied to the object to form a circuit between two points on the object.

Abstract: Transfer films comprising a carrier film, a sacrificial template layer deposed on the carrier film and comprising reentrant forming template features, and a thermally stable backfill layer having a first surface conforming to the reentrant forming template features and forming reentrant features and an opposing planar second surface; and methods of making transfer films are disclosed.