Abstract: The present disclosure is related to a power module includes a first printed circuit board (PCB), a second PCB, a magnetic component and a connecting component. A secondary side switch set and a winding are disposed on the first PCB, respectively. A primary side switch set is disposed on the second PCB adjacent to the first PCB. A magnetic component includes an upper magnetic cover disposed on the first side of the first PCB; a lower magnetic cover disposed between the first PCB and the second PCB; and a lateral column located between the two magnetic covers. The lateral column passes through the first PCB, and is fastened with the two magnetic covers. The magnetic component and the winding collaboratively form a transformer. The connecting component is disposed between the two PCBs to connect the corresponding potential points of the two PCBs.

Abstract: The first capacitor is opposed to and electrically connected to the first back electrode. The second capacitor is opposed to and electrically connected to the second back electrode. Each of the first circuit and the second circuit has a main region that overlaps with a corresponding one of the first capacitor and the second capacitor. At least one circuit of the first circuit and the second circuit has an extension region extending from the main region toward another circuit of the first circuit and the second circuit. At least one of one of the pair of first wires and the second wire is bonded to the extension region.

Abstract: A thin film board according to the present invention has a structure in which a land, which is a connection portion with a transmission line of a printed circuit board, is used as a back wiring and extends from the end to the inside of the thin film board, and the back wiring and the front wiring are connected by a through hole. In the structure of this thin film board, the land does not become a stub and does not affect the high frequency characteristics of the circuit element. That is, there is no trade-off between the connectivity between the printed circuit board and the thin film board and the high frequency characteristics of the circuit element. Therefore, the thin film board and the circuit element in which the thin film board is mounted on the printed circuit board can support high frequency electric signals up to 60 GHz.

Abstract: An electronic device is disclosed. The electronic device may comprise: a housing having a first dielectric constant and including a first part; a substrate disposed inside the housing and including a communication module disposed on the surface thereof opposite to the first part; and a ceramic layer formed between the substrate and the first part to cover the communication module, wherein the first part and the ceramic layer are formed to have a second dielectric constant different from the first dielectric constant. Various other embodiments understood through the specification are possible.

Abstract: The present application discloses a flexible flat cable and a display panel. The flexible flat cable includes a substrate, a first terminal and a second terminal. The substrate is insulating, and the first terminal and the second terminal are disposed at the first end and the second end of the substrate respectively, and are coupled with each other by a capacitor assembly.

Abstract: The force sensing dome switch is configured to simultaneously, or nearly simultaneously, close or open two separate circuits. For one of these circuits, the force sensing dome switch acts as a variable resistor whose value is controlled by applied force. Each force sensing dome switch is disposed upon a printed circuit board (PCB) comprising two separate circuits. An example force sensing dome switch comprises: a conductive dome in conductive contact with a first trace of a first circuit, the conductive dome is configured to make conductive contact with a second trace of the first circuit when pressed down; and a force-sensing resistor element positioned between the PCB and the conductive dome, the force-sensing resistor element overlays a pair of interdigitated traces of a second circuit and is configured to conductively connect the pair of interdigitated traces when pressed against the PCB by the conductive dome.

Abstract: A superconducting power cable system includes a superconducting power cable in a first temperature environment separated from a second temperature environment by a thermal barrier. The first temperature environment is an interior of a cryostat and is at a lower temperature than the second temperature environment located outside of the cryostat. At least one superconducting feeder cable has a first end electrically coupled to the superconducting power cable in the first temperature environment, and a second end electrically coupled to a normal conducting current lead in the second temperature environment. Each superconducting feeder cable is a flexible superconducting cable or wire formed of multiple superconducting tapes that are wound in a helical fashion and in multiple layers around a round former.

Abstract: An electrical junction box comprises an electrically conductive housing and at least one cable end wherein an everted braided shield section of the cable end is received in a retainer section of the housing and an electrically conductive adhesive is provided.

Abstract: A ceramic electronic device includes: a multilayer chip in which each of internal electrode layers and each of dielectric layers are alternately stacked, wherein the multilayer chip has a first capacity region having a first electrostatic capacity C1 and a first inductance L1 and a second capacity region having a second electrostatic capacity C2 and a second inductance L2, wherein the first electrostatic capacity C1, the first inductance L1, the second electrostatic capacity C2 and the second inductance L2 satisfy (C1·L1)/(C2·L2)<0.5 or 1.9<(C1·L1)/(C2·L2).

Abstract: An electronic device includes: a housing and a printed circuit board (PCB) structure disposed in the housing. The PCB structure includes a circuit board including an opening area formed through a first surface of the circuit board and a second surface of the circuit board opposite the first surface and a conductive pattern formed in a peripheral area around the opening area, a plate disposed on the second surface of the circuit board covering the opening area, an electronic element disposed on the plate and electrically connected with the circuit board, a resin portion disposed between the plate and the circuit board and extending from the conductive pattern, the resin portion including a conductive material, and a solder portion formed between the resin portion and the plate.

Abstract: In an exemplary embodiment, a coil component includes: an element body part 10 including a magnetic material; a coil 30 built into the element body part 10; an external electrode 50a electrically connected to the coil 30 and provided at least on a bottom face 12 of the element body part 10 along a side 13a of the bottom face 12; and an external electrode 50b electrically connected to the coil 30 and provided at least on the bottom face 12 along a side 13b, opposite the side 13a, of the bottom face 12; wherein the external electrode 50a has a tip part 52a facing the external electrode 50b; the external electrode 50b has a tip part 52b facing the external electrode 50a; and a void 70a is formed between the external electrode 50a and the bottom face 12 in a manner extending from the tip part 52a.

Abstract: A ceramic electronic component includes: a ceramic body including a pair of end surfaces, and a side surface connecting the pair of end surfaces and including a pair of end regions adjacent to the pair of end surfaces and an intermediate region located between the pair of end regions; and a pair of external electrodes including a pair of base layers that cover the pair of end surfaces and the pair of end regions of the side surface and include outer surfaces, a difference of a surface roughness Ra of the outer surfaces with respect to the intermediate region of the side surface being 40 nm or less, and a pair of plating layers covering the outer surfaces of the pair of base layers and including a pair of extending portions extending from the outer surfaces of the pair of base layers to the intermediate region of the side surface.

Abstract: A high-speed transmission circuit comprises a connector pin that serves as part of a signal path, has a first conductivity, and has a connector pin leg that is coupled to a pad that has a second conductivity lower than the first conductivity. The connector pin leg and at least a portion of the pad form a resonant sub-circuit coupled to the signal path. The second conductivity causes a reduction in insertion loss in the signal path by damping a current in the resonant sub-circuit.

Abstract: Provided is a display device, including: an array substrate having a display area and a non-display area at least partially surrounding the display area, and the non-display area includes a step region, and a part of the display area is reused as a fingerprint recognition region; a flexible circuit board bonded to the step region and bent to a side of the array substrate facing away from a light-exiting direction of the display device, and the flexible circuit board includes a bent portion facing towards a side surface of the array substrate, and the bent portion includes a bent sub-portion, which is tilted towards the display area along the light-exiting direction of the display device; and at least one light source arranged on the bent sub-portion of the flexible circuit board, and light emitted from the at least one light source is transmitted towards the fingerprint recognition region.

Abstract: A multi-layer ceramic electronic component includes: a ceramic body including a first end surface and a second end surface facing in a direction of a first axis, and internal electrodes laminated in a direction of a second axis orthogonal to the first axis and drawn from the first end surface or the second end surface; a first external electrode disposed to cover the first end surface; and a second external electrode disposed to cover the second end surface. Each of the first external electrode and the second external electrode has an electrode end surface facing in the direction of the first axis. The electrode end surface includes a pair of first peripheral regions located at peripheral edges in the direction of the second axis, and a first concave region located between the pair of first peripheral regions and recessed from the pair of first peripheral regions.

Abstract: A method of connecting an electronic component on a mounting substrate where the electronic component is arranged with a first surface of the electronic component facing the mounting substrate and an opposite surface of the electronic component is facing away from the mounting substrate. A first component-side conductor on the second surface of the electronic component is electrically connected to a first substrate-side conductor on the mounting substrate by an electrically-conductive adhesive.

Abstract: A multilayer capacitor includes a capacitor body including first to six surfaces, and including a dielectric layer, first and second internal electrodes, and first and second external electrodes. The first and second external electrodes include first and second sintered layers, and first and second plating layers, respectively. An insulating layer is disposed on the capacitor body, to cover an end portion of a first band portion of the first sintered layer and an end portion of a second band portion of the second sintered layer, and has a maximum thickness of 10 ?m or more. A portion of the first band portion of the first sintered layer is exposed from the insulating layer. A portion of the second band portion of the second sintered layer is exposed from the insulating layer.

Abstract: A power supply apparatus includes a board including a major surface on which a circuit element is mounted, and a case. The case includes a cover portion located at a distance from the board and covering the major surface of the board, and a plurality of leg portions extending from the cover portion toward the board, the case being attached to the board by the leg portions. The leg portions of the case include corner-attachable leg portions that are engaged with corner portions of the board.

Abstract: A pet care device may include a head having a sterilizer and a handle extending from the head. The head may be formed of an outer body and an inner body positioned in an inner region of the outer body. A first space may be formed between the outer body and the inner body in which the sterilizer is provided. The sterilizer may include at least one light emitting device, and a light device may cover the first space. A second space partitioned from the first space may be at least partially located inside the inner body. Hair and/or debris may be collected in the second space.

Abstract: A component carrier includes an electrically insulating layer structure, a first electrically conductive layer structure, a second electrically conductive layer structure, and a laser through-hole with an electrically conductive medium filling at least part of the through-hole. The first electrically conductive layer structure covers a first side of the electrically insulating layer structure and has a first window extending through the first electrically conductive layer structure formed by etching using a conformal mask. The second electrically conductive layer structure covers an opposed side of the electrically insulating layer structure and has a second window extending through the second electrically conductive layer structure formed by etching using a conformal mask. The laser through-hole extends through the electrically insulating layer structure. At least a portion of at least one sidewall of the electrically conductive layer structures delimiting the windows is tapered.