Abstract: A cooling apparatus for a pluggable module comprises a pluggable module cage to house the pluggable module and a heat pipe coupled with a hot interface at one end and a cold interface at another end. The cooling apparatus further comprises an attachment mechanism for attaching the hot interface and the heat pipe to the pluggable module. The attachment mechanism permits mobility required to insert and secure the pluggable module in place inside the pluggable module cage to allow a good thermal coupling between the hot interface and the pluggable module.

Abstract: The invention provides a server device. The server device includes a casing, an electronic assembly, and a heat dissipation assembly. The casing includes a housing and a partition. The partition is disposed in the housing and forms an accommodation space and a heat dissipation space in the housing that are not communicated with each other. The housing has a plurality of first vent holes communicated with the heat dissipation space. The electronic assembly is located in the accommodation space. The heat dissipation assembly includes a heat dissipation component and a heat pipe. The heat dissipation component is located in the heat dissipation space. The heat pipe includes a heat absorption portion and a condensation portion connected to each other. The heat pipe is disposed through the partition, the heat absorption portion is thermally coupled to the electronic assembly, and the condensation portion is coupled to the heat dissipation component.

Abstract: An information handling system may include a chassis and a variable venting assembly comprising a wall having a plurality of spaced venting holes and an adjustable venting block mechanically coupled to the wall via an axis of rotation and having a plurality of spaced blocking fins such that as a position of the adjustable venting block varies, an overlap between the spaced blocking fins and the spaced venting holes varies.

Abstract: A cooling unit can be downsized. Air is taken in through an intake port, and heat is discharged from a heat source through an exhaust port. A heat transport unit, forming a part of a cooling fan or is substantially in contact with it, has a first region which has one end facing the heat source and another end having a through hole which air taken in or air to be discharged passes through, and in which air passes through the through hole to perform heat exchange with the air in an inner wall of the through hole. The cooling fan has an intake opening and an exhaust opening. The through hole has an intake through hole and/or an exhaust through hole. Air passes through the intake port, the intake through hole, the intake opening, the exhaust opening, the exhaust through hole, and the exhaust port in this order.

Abstract: A video recorder (100) is configured and assembled to provide improved ventilation for cooling and improved protection against liquid intrusion. The video recorder is formed of a main chassis housing, a top cover, and a bezel for coupling the top cover to the main chassis housing. Once assembled, channels are formed which provide paths for both liquid egress and airflow intake. The channels allow airflow into fan intake openings located within a top portion of the main chassis housing. The channels further provide for liquid to be diverted away from the fan intake openings.

Abstract: Provided is a display device. The display device includes a housing including a front glass and a rear cover, a display panel arranged within the housing, and an air circulator arranged behind the display panel for circulating air between the front glass and the front surface of the display panel, wherein the air circulator includes a circulation fan circulating air, a case receiving the circulation fan and having open top to discharge air in a direction of long edges of the display panel, a first connection part formed to be open at one end of the case in the direction of long edges, and a second connection part formed to be open at the other end of the case in the direction of long edges.

Abstract: A direct current interrupting switch assembly comprising a primary conductor and a secondary conductor integrated with a direct voltage source and a load. The primary conductor of the switch assembly has two branches, the first branch including a fuse with a melting member and the second branch including a pyroswitch with an interrupting member. In a first position, the second branch of the primary conductor is uninterrupted, and the interrupting member is a sufficient distance apart from the secondary conductor. When the interrupting member is moved to a second position, the current in second branch of the primary conductor is interrupted and the interrupting member contacts the secondary conductor of the switch assembly.

Abstract: A vapor chamber includes an electromagnetic (EM) shielding layer. The vapor chamber is constructed from a structural base material that provides for a suitable size, strength, and/or weight for a specific application. The vapor chamber is treated at the region(s) to provide suitable EM shielding characteristics for the specific application. For example, an oxidation layer is removed from the region(s) to expose the structural base material while the vapor chamber is in an inert environment that prevents further oxidation. Then, while the vapor chamber remains within the same inert environment, a material having suitable electrical conductive properties is deposited onto the exposed structural base material to form an EM shielding layer at the region(s). When the vapor chamber is installed into an electronic device, the EM shielding layer may be electrically grounded so as to isolate one or more components within the electronic device from EM signal interference.

Abstract: Disclosed is a circuit protection device including a case, a first negative temperature coefficient thermistor which is accommodated in the case and includes a first resistant heating element, a pair of electrodes installed on both sides of the first resistant heating element, and a first lead wire and a second lead wire withdrawn from the pair of electrodes, respectively, a thermal fuse which is accommodated in the case and includes a thermal fuse body and a third lead wire and a fourth lead wire connected to both ends of the thermal fuse body, respectively, and a second negative temperature coefficient thermistor which is accommodated in the case and includes a second resistant heating element, a pair of electrodes installed on both sides of the second resistant heating element, and a fifth lead wire and a sixth lead wire withdrawn from the pair of electrodes, respectively.

Abstract: A heat dissipation module for optical transceiver is provided. The heat dissipation module for optical transceiver includes a liquid cooling device, a casing assembly and an elastic fastener. The liquid cooling device includes a liquid cooling tube and a base, and the liquid cooling tube is in connection with the base. The casing assembly includes a top plate. The top plate includes a top surface, a bottom surface and an opening. The opening is through the top surface and the bottom surface. At least one part of the liquid cooling device is extended into the opening and protruded over the bottom surface. The elastic fastener is configured for fastening the liquid cooling device on the casing assembly, and the liquid cooling device is pluggably fastened to the casing assembly.

Abstract: Systems and methods for cooling a vehicle computing system are provided. A computing system can include a cooling baseplate including a first planar cooling surface and a second planar cooling surface. The computing system can further include one or more computing devices including a processor blade positioned on the first planar cooling surface, a coprocessor blade positioned on the second planar cooling surface, and a flexible connector coupled between the processor blade and the coprocessor blade. The flexible connector can be configured to transfer at least one of data or electric power between the processor blade and the coprocessor blade. The first planar cooling surface can be configured to transfer heat from the processor blade to a cooling fluid via conduction. The second planar cooling surface can be configured to transfer heat from the coprocessor blade to the cooling fluid via conduction.

Abstract: An apparatus for dissipating heat from a photonic transceiver module. The apparatus includes a top-plate member disposed in a length direction of a package for the photonic transceiver module. The apparatus further includes multiple fins formed on the top-plate member along the length direction from a backend position to a frontend position except at least one fin with a shorter length, forming an elongated void from the backend position to one backend of the at least one fin. Additionally, the apparatus includes a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of backend of the horizontal sheet. Furthermore, the apparatus includes a spring loaded in the elongated void between the flange and the one backend of the at least one fin to minimize an air gap at the backend of the horizontal sheet.

Abstract: A temperature-dependent switch having a housing that comprises a cover part and an electrically conductive lower part. The switch further comprises a first external contact surface arranged on the upper side of the cover part, and a second external contact surface provided externally on the housing. Still further, the switch comprises a temperature-dependent switching mechanism that is arranged in the housing and that, depending on its temperature, establishes or opens an electrically conductive connection between the first and the second external contact surfaces. A circumferential cutting burr acting as a sealing means is furthermore provided, that penetrates into the insulating foil or the cover part, wherein the cutting burr is arranged on a sealing ring that is connected to the lower part by means of a non-positive, positive and/or firmly bonded connection.

Abstract: A heat dissipation wall system includes a base wall having an outer surface, a plurality of side walls extending approximately perpendicularly from the base wall to define a component housing between the base wall and the side walls, and a plurality of heat dissipation channels defined by the base wall and extending into the base wall from the outer surface. Each of the heat dissipation channels includes a respective first airflow aperture that extends through the base wall from the outer surface to the component housing and that is configured to allow an airflow adjacent the outer surface to enter the component housing, and a respective second airflow aperture that is spaced apart from the first airflow aperture, that extends through the base wall from the outer surface to the component housing, and that is configured to allow an airflow adjacent the outer surface to enter the component housing.

Abstract: An electronic apparatus includes: an apparatus chassis including therein an electronic board; a keyboard provided on a top of the apparatus chassis; and a fan device that includes a fan chassis and a blade part. The fan chassis includes a first air intake formed on a bottom surface thereof, a second air intake formed on a top surface thereof, and an air outlet formed on a side surface thereof. The blade part rotates inside the fan chassis. The fan device is arranged between a basal plate and a bottom surface of the keyboard inside the apparatus chassis. The basal plate includes a first inlet at a position overlapping the first air intake. The keyboard includes a second inlet that makes air pass through the keyboard in an up-down direction thereof. The electronic apparatus further includes a first water stop member that separates the first air intake from the electronic board.

Abstract: Embodiments include apparatuses, methods, and systems for managing thermal energy of a computing device. An apparatus may include a heat pipe physically and thermally attached to a container by a retainer. The container may include a plurality of slots to removably receive various plurality of pluggable circuit modules during a lifetime of the container. The heat pipe may facilitate a liquid coolant flow to remove thermal energy from a plurality of pluggable circuit modules removably received into the plurality of slots of the container. The retainer may have a tensile strength sufficient to withstand repeated receiving and removal of the various plurality of pluggable circuit modules during the lifetime of the container, without degrading the thermal attachment of the heat pipe to the container below a design performance threshold. Other embodiments may also be described and claimed.

Abstract: In one embodiment, an electronic cooling device includes an inlet port to receive cooling liquid from an external cooling liquid source. The cooling device further includes a base cooling unit having a first liquid distribution channel therein. The base cooling unit includes a cooling plate that forms a lower surface to be positioned on a top surface of one or more electronic devices to extract heat from the devices through the cooling plate using at least a portion of the cooling liquid from the external cooling liquid source. The cooling device further includes an upper cooling unit having a second liquid distribution channel to extract heat from air contacting the upper cooling unit using at least a portion of the cooling liquid received from the external cooling liquid source. The cooling device further includes an outlet port to return the cooling liquid to the external cooling liquid source. Internal fluid channel structural design can be used and customized for different applications and use cases.

Abstract: A computer case is provided, including: a housing, at least one partition and a plurality of fans. The housing has an assembling space and includes a front side plate, a rear side plate, a left side plate, a right side plate and a bottom side plate. The at least one partition divides the assembling space into a first area configured for a power supplier to disposed therewithin and a second area. The at least one partition has at least one through hole communicated the first area with the second area. The plurality of fans includes at least one first fan disposed on the front side plate, at least one second fan disposed on the rear side plate and at least one third fan disposed on the at least one partition. The at least one third fan corresponds to the at least one through hole.

Abstract: An air baffle component includes an air baffle rotationally connected to a housing of a device chassis having a module insertion port. The air baffle component also includes a level-1 elastic component. The air baffle component further includes a level-2 elastic component. The air baffle component additionally includes a connecting rod. The connecting rod includes a force-bearing rod rotationally connected to the housing of the device chassis between the air baffle and the module insertion port. The connecting rod also includes a pull rod connected to the force-bearing rode. The connecting rod further includes a baffle column on the pull rod. The level-1 elastic component provides a first elastic force for the force-bearing rod, so that the baffle column is caused to abut against a surface of the air baffle opposite to the module insertion port. The level-2 elastic component provides a second elastic force for the air baffle.

Abstract: A dual display device is provided, which includes a housing, a first display screen, a flexible display screen, and a rotating assembly. The housing includes a plurality of vertical walls and a bottom wall, the plurality of vertical walls include a second vertical wall. The first display screen is mounted in the housing at a first predetermined distance from the bottom wall, and a first edge of the first display screen is spaced apart from the second vertical wall by a second predetermined distance. The rotating assembly is rotatably disposed in an opening in an axial direction of the rotating assembly.