Abstract: An overvoltage protection device having a printed circuit board, varistor, and gas discharge tube, the varistor and discharge tube connected in series between a second and third electrical connection terminal of the circuit board via conductive tracks, wherein the varistor is connected to the first terminal by a third conductive track, the discharge tube is connected to the varistor by a fourth conductive track, the discharge tube is connected to the third electrical connection terminal by a sixth conductive track, and wherein the fourth and sixth conductive tracks have curved portions situated on either side of the discharge tube, having a concavity facing in the same orientation respective to the discharge tube and a thermofusible area able to separate a corresponding track into two parts in response to an overcurrent, a distance between the two parts of each track allowing generation of an arc in response to an overvoltage that activates the discharge tube.

Abstract: A compressor may include a compressor shell, a motor, a compression mechanism, and an assembly that houses an electronic component. The electronic component may control operation of the compressor and/or diagnose compressor faults. The assembly may include a shell, an electronic component, a fan, and an airflow deflector. The shell member may define an enclosure having an internal cavity. The fan and the electronic component may be disposed within the internal cavity. The airflow deflector may include a base portion, a first leg, and a second leg. The first and second legs may be spaced apart from each other and extend from the base portion. The fan may force air against the base portion. A first portion of the air may flow from the base portion along the first leg. A second portion of the air may flow from the base portion along the second leg.

Abstract: The embodiments of the present disclosure provide a heat dissipation structure, applied to an electronic device. The electronic device includes a power consumption element, and the power consumption element disposed in an accommodation cavity. The heat dissipation structure includes a cover, configured to cover and seal the accommodation cavity. The cover is thermally connected to the power consumption element through a heat-conducting element. The heat dissipation structure further includes a heat-dissipation component, thermally connected to the cover and including a heat-dissipation module and a fan. The heat-dissipation module is disposed in an air outlet channel of the fan, such that the wind generated by the fan takes away the heat of the heat-dissipation module.

Abstract: An outdoor display apparatus having a heat dissipation structure includes a first display module configured to display an image in a first direction, a second display module configured to display an image in a second direction opposite to the first direction, a housing configured to accommodate the first display module and the second display module, and having an inlet and an outlet, and a heat exchange device configured to receive heat from one of the first display module and the second display module and perform heat exchange, wherein the heat exchange device includes: a first heat exchange portion having at least one cooling passage to cool the first display module; a second heat exchange portion having at least one cooling passage to cool the second display module; and a heat exchanger configured to be selectively shared by the first heat exchange portion and the second heat exchange portion.

Abstract: A temperature-dependent switch includes a housing with a top face and an outer face that runs transversely to the top face. The switch includes a first outer contact area that is arranged on the top face. The switch includes a second outer contact area that is arranged at the housing. The switch includes a temperature-dependent switching mechanism that is arranged in the housing and configured to establish or open an electrically conductive connection between the first and the second outer contact area depending on a temperature of the switching mechanism. The housing is disposed in a metal mounting cap that includes a wall. An upper rim of the wall protrudes beyond the top face of the housing. An inner side of the wall bears at least partially against the outer face of the housing.

Abstract: The invention belongs to the technical field of water cooling radiators, and relates to a water cooling head, a water cooling radiator and an electronic equipment. The water cooling head includes a center module, a first water pump, a second water pump, and a heat exchange module. The center module is provided with a first water inlet channel, a second water inlet channel, a first water outlet channel, a second water outlet channel, a water inlet and a water outlet. The first water cavity is enclosed between the first water pump and the center module, and a second water cavity is enclosed between the second water pump and the center module, and a third water cavity is enclosed between the heat exchange module and the center module. The heat exchanging module is used for heat exchanging of the cooling liquid flowing through the third water cavity.

Abstract: An electronic assembly with phase-change material for thermal performance comprises a substrate and a semiconductor device mounted on the substrate. A sealed first thermal channel comprises a first evaporator section, a first fluid transport section, and a first condenser section. A phase-change material is contained in the sealed first thermal channel. The first evaporator section overlies the semiconductor device. The first fluid transport section extends between the first evaporator section and the first condenser section. The first evaporator section is spaced apart from the first condenser section. The first condenser section is in thermal communication with the heat sink.

Abstract: A fuse module including a mounting block formed of an electrically insulating material, the mounting block including a base portion and a wall portion disposed in a perpendicular relationship, the fuse module further including a fuse plate including an electrically conductive bus bar disposed on a bottom of the base portion, a fusible element electrically connected to the bus bar and disposed adjacent a front of the wall portion, and a fuse terminal electrically connected to the fusible element and disposed on a top of the base portion, the fuse module further including an electrically conductive terminal post extending from the top of the base portion and through the fuse terminal for facilitating connection to an electrical component.

Abstract: In an electric power conversion apparatus, a semiconductor module-cooler unit includes a semiconductor module and a cooler that has cooling pipes stacked with the semiconductor module in a stacking direction. A flow path forming component includes an electronic component main body and has an in-component flow path formed therein. A case receives both the semiconductor module-cooler unit and the flow path forming component therein. A pressure-applying member is arranged in the case to apply pressure to the semiconductor module-cooler unit from a rear side toward a front side in the stacking direction. Moreover, the flow path forming component is fixed to the case. The pressure-applying member, the semiconductor module-cooler unit and the flow path forming component are arranged in alignment with each other in the stacking direction. An in-cooler flow path formed in the cooler and the in-component flow path are fluidically connected with each other in the stacking direction.

Abstract: A system includes a tray, where the tray includes a rail and a bracket that secures the rail to a networking device such that the rail is distanced from a surface of the networking device. A support post is removably coupled to the rail. The support post includes a first support member and a second support member vertically displaced from the first support member, where each of the first and second support members includes a support structure that supports a cable connected with a port at the surface of the networking device and routes the cable away from the networking device to another location distanced from the networking device. The cable supported by the first support member is separated and segregated from the cable supported by the second support member. With minimal touch, a support post can be moved from one location to another along the rail.

Abstract: A cooling system is provided for power conversion circuitry. An intake section of a cooling air channeling element is arranged to direct cooling air through an enclosure, and through or around system components to circuit board-mounted circuitry to be cooled. The element has internal structures, such as deflectors that create local pockets of lower velocity and/or higher pressure air to trap airborne particles that can be evacuated through apertures (e.g., in adjacent plates or mounting structures). The intake section leads to a distribution section that is positioned adjacent to the circuit components to be cooled. The element may have an open bottom that cooperates with surrounding structures to channel the cooling air, facilitating molding of a single-piece element that can be easily mounted during system assembly.

Abstract: A power fuse assembly includes a fuse mounting, a fuse unit, and a hinge assembly. The fuse unit is configured to carry current from a line connection to a load connection. The hinge assembly is configured to be removeably coupled to the fuse unit and to allow rotation of the fuse unit relative to the fuse mounting. The hinge assembly including: an inlet configured to accept incoming gases produced by the fuse unit in response to an overload event, the inlet having a first orientation; an outlet in fluid communication with the inlet, the outlet having a second orientation that is not equal to the first orientation; and a diverter component disposed between the inlet and the outlet, the diverter configured to guide the flow of the gases between the inlet and the outlet.

Abstract: The disclosure provides a fluid driving device including a casing and an oscillation film. The casing has a fluid chamber, a liquid inlet, a liquid outlet, and a vent hole. The oscillation film is movably disposed in the fluid chamber so as to divide the fluid chamber into a liquid channel and a gas channel that are not fluid-connected to each other. The liquid inlet and the liquid outlet are connected to the liquid channel, and the vent hole is connected to the gas channel. When the oscillation film oscillates, it forces liquid to flow into the liquid channel from the liquid inlet and forces gas to flow out of the gas channel from the vent hole, or it forces the liquid to flow out of the liquid channel from the liquid outlet and forces the gas to flow into the gas channel from the vent hole.

Abstract: In one embodiment, a method includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.

Abstract: Provided is a breaker capable of further downsizing without impairing rigidity and strength of a case. The breaker 1 comprises a fixed contact 21, a movable piece 4 having and pressing a movable contact 41 to the fixed contact 21, a thermally responsive element 5 for moving the movable piece 4 to separate the movable contact 41 from the fixed contact 21 by deformation thereof responding to temperature change, a case for containing the fixed piece 21, the movable piece 4 and the thermally responsive element 5, and a cover piece 8 attached on the case 7. The case 7 has an end face 72 on which the cover piece 8 is disposed, a containing recess 73 caved from the end face 72 and forming a space to which the movable piece 4 and the thermally responsive element 5 are contained, and a first protrusion protruding from the end face 72 and to which the cover piece 8 is fitted.

Abstract: The invention concerns a fuse box, comprising a busbar (6) and at least one fuse (8) connected to the busbar, each fuse including two opposite end portions (8A, 8B) and a central portion (82), at least the central portion of each fuse and a section of the busbar being encapsulated in a plastic coating layer. The central portion (82) includes a part (84) of reduced cross-section. The two end portions (8A, 8B) include two respective electrical connectors (81A, 81B), and at least the two electrical connectors (81A, 81B) of each fuse (8) are not encapsulated in the plastic coating layer, so that a new fuse (12) can be connected between the two electrical connectors (81A, 81B) in replacement of a blown fuse (8).

Abstract: Embodiments disclosed herein describe a manifold microchannel heat sink having a target surface, a microchannel structure and an insert disposed over the microchannel structure. The microchannel structure includes a plurality of fins extending in a normal direction from the target surface and defining a plurality of microchannels. The individual fins are shaped as rectangular plates and the individual microchannels comprise gaps between the individual fins. The plurality of fins are distributed on the target surface such that at least a thickness of the individual fins or a width of the gaps comprising the individual microchannels is varied along a plane of the target surface. The insert disposed over the microchannel structure has a plurality of inlet dividers and a plurality of outlet dividers. The individual inlet dividers define an inlet channel and the individual outlet dividers define an outlet channel.

Abstract: An electronic device includes a heat emitting element disposed on a PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.

Abstract: Disclosed are a heat radiating assembly and a connector. The heat radiating assembly is disposed on the connector used to mate with a docking connector having a heat generating portion. The heat radiating assembly includes a heat radiating member and a heat conduction member. The heat radiating member is provided with a trough. The heat conduction member is disposed in the trough and is configured to transfer heat of the heat generating portion to the heat radiating member, allowing the heat to be radiated through the heat radiating member. The connector includes the heat radiating assembly.

Abstract: There is disclosed in one example a computing apparatus, including: an active computing element; a first magnetic attractor mechanically coupled to the active computing element; and a cold plate disposed to conduct heat away from the active computing element, the cold plate including a second magnetic attractor disposed to magnetically couple with the first magnetic attractor.