Abstract: A fluid cooling system for an electronics package having a chassis is disclosed. The system includes an electronics package housed within a chassis, one or more mounting structures attached to the chassis, and a fluid cooling module interfaced with one or more electronics of the electronics package, the fluid cooling module housed within the chassis and mounted to the one or more mounting structures, where circulation of a fluid of the fluid cooling module cools the one or more electronics. A chassis fluid distribution manifold is used to connect with the chassis fluid inlet and outlet and to distribute fluid within the chassis.

Abstract: A fuse holder that includes a housing, which has a rotating fuse carrier that rotates about a pivot point between open and closed positions. The fuse carrier is configured to accept insertion of a fuse when in the open position, and configured to bring the fuse into electrical contact with a first and a second fuse clip when in the closed position. Additionally, the fuse carrier, when in the closed position, is further configured to orient the fuse so that the fuse is positioned more vertically than horizontally. In particular embodiments of the invention, the fuse carrier rotates about a pivot located in the housing.

Abstract: A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.

Abstract: An automotive power module has a plurality of power cards stacked to form an inverter module, and a DC-link capacitor mounted against the inverter module. Each of the power cards includes a top cover having opposite sides. One of the sides has extended therefrom a first matrix of pins. Each of the power cards also includes a plurality of integrated circuits defining transistors of an inverter mounted on the other of the sides, terminals extending from a perimeter of the top cover and in electrical communication with the integrated circuits, and a bottom cover having extended therefrom a second matrix of pins.

Abstract: A current-limiting fuse for an electronic apparatus, such as, for example, a transformer. The fuse can be withdrawable under a liquid insulating medium, such as oil, and is capable of being replaceable in the field. The fuse can include a fuse element that is encased within an electrically insulative sheath. Additionally, a plurality of contact blades can extend from a lower portion of the fuse and be securely engaged with contact clips that are in electrical communication with one or more components of the electronic apparatus. The contact blades can be positioned within a dielectric insulating medium while a reminder of the fuse between the contact blades and the enclosure can be positioned within an air gap. Further, the contact blades can accommodate seating of the fuse within the enclosure and/or an associated canister.

Abstract: A case adapted to be selectively connected to a first interface module, a second interface module and a third interface module is provided. The case includes a substrate. The substrate includes a first connection area and a second connection area. The first connection area is adjacent to the second connection area. The first connection area includes a first post. The second connection area includes a second post and a third post. In a first state, the first interface module is disposed in the first connection area. The second interface module is disposed in the second connection area. In a second state, the third interface module is disposed in the first connection area and the second connection area. The case is adapted to be selectively connected to different types of storage units.

Abstract: A fan arrangement to generate increased airflow in a chassis is disclosed. The chassis includes one area having electronic components. A first row of fan modules is located in the chassis relative to the electronic components to generate airflow in a direction of the length of the chassis through the electronic components. The first row of fan modules includes at least one gap between the fan modules. A second row of fan modules is located a predetermined distance from the first row. The second row of fan modules includes at least one gap between the fan modules. Each of the fan modules in the second row is staggered from one of the fan modules of the first row. A first panel connects one of fan modules in the first row with one of the fan modules of the second row to create a channel.

Abstract: A semiconductor module comprises a semiconductor apparatus and a cooling apparatus. The semiconductor apparatus includes a semiconductor chip and a circuit board. The cooling apparatus includes: a top plate; a side wall; a bottom plate; a coolant flow portion for causing a coolant to flow defined by the plates and the wall, where a cross section of the portion parallel to a principal surface of the top plate have a substantially rectangular shape with longer sides and shorter sides; an inlet associated with one direction along the shorter sides for letting a coolant into the portion; an outlet associated with another direction along the shorter sides for letting a coolant out of the portion; and a cooling pin fin arranged in the portion, extending between the top plate and the bottom plate, and having a substantially rhombic shape longer along the shorter sides than along the longer sides.

Abstract: Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing.

Abstract: A data center cooling system includes an outer container that defines a first volume; an inner container that defines a second volume and is positioned within the first volume, the inner container including an air outlet that includes an airflow path between the first and second volumes; a liquid seal to fluidly isolate a liquid phase of a non-conductive coolant that fills at least a portion of the first and second volumes from an ambient environment; and at least one server tray assembly. The server tray assembly includes a plurality of electronic heat-generating devices immersed in the liquid phase of the non-conductive coolant; and an immersion cooling system mounted to and in conductive thermal contact with one or more of the plurality of electronic heat-generating devices. The immersion cooling system includes a working fluid in thermal communication with the one or more electronic heat-generating devices and the non-conductive coolant.

Abstract: In one embodiment, a data center cooling system includes one or more information technology (IT) rooms having multiple electronic racks that generate heat. An external cooling unit is positioned above the IT rooms and is configured to provide cooling fluid and to exchange heat carried by the cooling fluid. The external cooling unit has a supply line to distribute cooling fluid downwardly to the IT rooms. As the cooling fluid cools the electronic racks, the cooling fluid heats up and at least partially turns to vapor which rises due to convection. The external cooling unit also has a return line to return the rising vapor to the external cooling unit, which cools the vapor. The vapor changes phase to liquid and is recirculated to the IT rooms.

Abstract: The present disclosure relates to a flexible screen, including a display substrate including a first portion, a second portion folded to form an end portion of the flexible screen and a third portion, said first, second, and third portions being sequentially connected, and a support plate for supporting the display substrate, wherein the first portion and the third portion of the display substrate are opposite to each other, the support plate is arranged between the first portion and the third portion of the display substrate, and one end of the support plate faces one surface of the second portion, and wherein the surface of the second portion facing the support plate is provided with an end heat dissipation device.

Abstract: A chip on film package includes; a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.

Abstract: A cooling module system for a heat producing information handling system component comprising a dual opposite outlet blower system comprising a power source and a blower fan motor for rotating a blower fan having a plurality of blades and a fan diameter for rotation of the blower fan in a rotational plane, a dual opposite outlet blower system housing including first surface having an fan inlet aperture, a second surface oppositely disposed of the first surface on which the blower fan is operatively coupled inside the dual opposite outlet blower system housing.

Abstract: Exemplary embodiments of the present disclosure of a fuse may include a fuse body having a first portion and a second portion. The first and second portions may be configured to mate together thereby forming an internal cavity. A first inner termination and a second inner termination may be at least partially attachable to the first and second portions of the fuse body at respective first and second ends. A fusible element may be disposed in the cavity of the fuse body and extendable from the first inner termination at the first end of the fuse body to the second inner termination at the second end of the fuse body. The fusible element may be attachable to the first inner termination at a first connection and the second inner termination at a second connection. The first and second connections may be inspectable when the fuse is in an assembled state.

Abstract: A heat dissipating assembly, adapted to be disposed at an M.2 expansion card and configured onto a main board with the M.2 expansion card, is provided. The heat dissipating assembly includes a first heat dissipating member and a first double-end screwing member. The first heat dissipating member is adapted to be disposed on the main board, located between the main board and the M.2 expansion card, and has at least one first through hole. The first double-end screwing member includes a first thread and a first nut having a first screw hole. The first thread passes through one of the at least one first through hole of the first heat dissipating member and is detachably fixed to the main board. The first nut presses against the first heat dissipating member.

Abstract: A portable data storage device includes at least one component that generates heat, an enclosure wall made of a first material and having a thermal conductivity and an exterior layer. The enclosure wall surrounds the at least one computer component and includes outer and inner boundaries. The exterior layer is made of a second material and has a thermal conductivity that is less than the thermal conductivity of the first material. The exterior layer is covers the outer boundary of the enclosure wall and includes an outer surface and an inner boundary. The outer boundary of the enclosure wall interfaces with the inner boundary of the exterior layer so that the outer surface of the exterior layer is in direct contact with the environment and the outer boundary of the enclosure wall is not. Heat is transferred to the environment at the outer surface of the exterior layer.

Abstract: A device and a system for preventing insertion of a fuse into a fuse holder, and methods for using the same. The device and the system comprise retaining elements that are adapted to engage with a fuse holder. When the device or system is engaged in a fuse holder, it is not possible to insert a fuse into the fuse holder. This allows for safe isolation of electric circuits.

Abstract: The present utility model relates to a fuse, a vehicle circuit for an electric vehicle, and an electric vehicle. The fuse has a longitudinal direction and a transverse direction, and includes: a bushing, having a through-hole cavity extending in the longitudinal direction and for accommodating quartz sand; a fuse body, accommodated in the through-hole cavity and having a plurality of openings spaced apart from each other in the transverse direction; and two contact blades, positioned at two ends of the through-hole cavity and each soldered to the fuse body by a conductive plate. An arc extinguishing medium layer is provided on the fuse body. A side edge of the arc extinguishing medium layer contacts edges of any two adjacent openings of the plurality of openings so as to cause the arc extinguishing medium layer to be close to a minimum transverse spacing between the two opening edges.

Abstract: Systems and method for thermally managing display assemblies are provided. A closed loop pathway for circulating gas includes a channel located behind an electronic display located at a housing. A fan unit is positioned within the rear channel. A storage area for an equipment storage device is located within or adjacent to the channel and is partitioned by a barrier. A loopback channel accepts a flow of the circulating gas and forms a pathway about the equipment storage device. The fan unit generates an area of relatively high pressure circulating gas compared to circulating gas in the storage area, which causes a portion of the circulating gas to travel through the loopback channel to cool equipment stored at the equipment storage device.