Abstract: A system comprises a hollow body forming a closed loop channel; one or more electromagnetic coils on the hollow body; a free-moving magnetic object in the channel; and a control system configured to control the one or more electromagnetic coils to cause the free-moving magnetic object to rotate within the channel during an acceleration phase and to cause one or more magnetic collisions with at least one of the one or more electromagnetic coils during an energy transfer phase, the one or more magnetic collisions causing a directional movement of the system.

Abstract: A base station apparatus, configured to establish a wireless link for a backhaul line with a relay apparatus, and provide a first period in which a radio resource is used by the base station apparatus for the backhaul line, and a second period in which the radio resource is not used by the backhaul line.

Abstract: The invention relates to a device combination for protecting electrical networks against overvoltages or overcurrents, comprising an essentially U-shaped base and at least one plug-in module, which can be plugged or pushed onto the base, wherein the base has connection terminals for connecting to the respective network and also has plug-in contacts, which are connected to the connection terminals and are complementary to mating plug-in contacts or contact tongues of the plug-in module, and the plug-in module has a housing which accommodates one or more lightning and/or overvoltage arresters, and the mating plug-in contacts or contact tongues pass through a floor side of the housing.

Abstract: A temperature abnormality detection system of the present invention includes a first temperature sensor that measures a first temperature indicated by a target device and a second temperature sensor that measures a second temperature indicated by ambient air around the target device. A temperature difference between the first temperature and the second temperature is calculated, and when this temperature difference becomes a predetermined threshold value or more, it is determined that a temperature abnormality of the target device has occurred.

Abstract: A circuit interrupting device includes an input conductor for electrically connecting to an external power supply, a load conductor for electrically connecting to a downstream load, a face conductor for electrically connecting to an external load, and a brush conductor in electrical communication with the input conductor and movable between a closed position and an open position. The brush conductor includes a second portion offset from a first portion such that a first terminal and a second terminal are positioned on separate planes. When the brush conductor is in the closed position, the first terminal contacts the load terminal and the second terminal contacts the face terminal to provide electrical communication between the input conductor, the load conductor, and the face conductor. When the brush conductor is in the open position, the first terminal is spaced apart from the load terminal and the second terminal is spaced apart from the face terminal.

Abstract: A circuit element includes a multilayer body including insulating substrates, a first coil conductor inside the multilayer body, and first and second outer electrodes and a ground electrode on outer surfaces of the multilayer body. The first coil conductor includes a winding axis extending in a stacking direction of the insulating substrates, the first coil conductor is connected to the first outer electrode, the second outer electrode, or the ground electrode, and the second outer electrode extends along a side surface of the multilayer body. An additional capacitance is generated between the second outer electrode and the first coil conductor. The second outer electrode includes first and second portions with different widths in a layer direction of the insulating substrates and the width of the second portion is larger than the width of the first portion.

Abstract: An electrostatic chuck includes a base plate that is made of a metal; a ceramic plate that is fixed to the base plate and configured to adsorb an object by electrostatic force; and a bonding layer that is provided between the base plate and the ceramic plate to bond the base plate and the ceramic plate to each other. The bonding layer is formed of a composite material including the metal forming the base plate and a ceramic forming the ceramic plate.

Abstract: An electrostatic chuck includes a plurality of ceramic substrates each having a step formed at a peripheral edge portion of one surface, the ceramic substrates being arranged adjacent to each other so that the steps face each other, electrodes each embedded in each of the plurality of ceramic substrates, and a filling portion that fills a groove portion formed by the facing steps of the adjacent ceramic substrates.

Abstract: A new and improved intrinsically safe barrier (“ISB”) provides advantages in connection with installation of field equipment in hazardous areas including Division 2/Zone 2 areas. In one embodiment the new ISB provides a pluggable/unpluggable ISB for use with a receiving terminal base adapted for individual field mounting and alternatively for use with a circuit mount terminal base to permit direct mounting of ISB on circuit boards. A highly effective heat sink design and potting material allows for heat dissipation to allow the ISB to serve a wider range of applications.

Abstract: A system topology may use intentional signal injection to monitor one or more power supply circuits that may supply electrical power to components of the system. The system topology may include voltage monitoring circuitry to monitor the output of the power supply. In some examples, a power supply rail fault may happen either inside or outside of the power supply circuit, but not be detectable by the voltage monitoring circuitry. Injecting a check signal in the presence of an actual fault, may cause oscillations at the output node of the power supply detectable by the voltage monitoring circuitry. Once the check signal, combined with the fault signal, at the output node reaches the monitoring threshold detectable by the voltage monitoring circuitry, the voltage monitoring circuitry may output an indication of the fault to processing circuitry of the system.

Abstract: A system may include an electromagnetic load, a driver configured to drive the electromagnetic load with a driving signal, and a processing system communicatively coupled to the electromagnetic load and configured to, during a haptic mode of the system couple a first terminal of the electromagnetic load to a ground voltage and cause the driving signal to have a first slew rate, and during a load sensing mode of the system for sensing a current associated with the electromagnetic load, couple the first terminal to a current-sensing circuit having a sense resistor coupled between the first terminal and an electrical node driven to a common-mode voltage and cause the driving signal to have a second slew rate lower than the first slew rate.

Abstract: Magnetic coupling devices are disclosed having magnetic field sensors. The magnetic coupling device may include degaussing coils wrapped about pole extension shoes of the magnetic coupling device.

Abstract: Magnetic coupling devices are disclosed having magnetic field sensors. The magnetic coupling device may include degaussing coils wrapped about pole extension shoes of the magnetic coupling device.

Abstract: An automatic line integrity monitoring system may include a cable having a plurality of wires, and a controller configured to sequentially swap each wire of the cable from a main power supply to an auxiliary power supply. The controller further checks each wire for a current flow while the wire is connected to the auxiliary power supply, and, in response to the current flow satisfying a criterion, automatically disconnect the cable from the main power supply. The criterion may, for example, be an amperage threshold.

Abstract: Described are electrostatic chucks designed for use in supporting a workpiece during a workpiece processing step, the electrostatic chuck including a gas flow system.

Abstract: This disclosure describes systems, methods, and apparatus for non-invasive wafer chuck monitoring using a low voltage AC signal injected into a high voltage DC chucking voltage provided to a wafer chuck. Monitoring the injected signal can provide insight into the wafer chucking state and remedial actions, such as realignment of the wafer with the wafer chuck, can be carried out. Because of the low voltage nature of the AC signal, wafer chuck monitoring can be performed without influencing chucking performed by the higher voltage DC chucking voltage.

Abstract: The present disclosure provides an electrostatic chuck and a reaction chamber. The electrostatic chuck includes an insulation layer and a heating body arranged at a bottom of the insulation layer. The electrostatic chuck further includes a cooling pipeline. The cooling pipeline is arranged under the heating body, spaced apart from the heating body, and configured to transfer cooling liquid to absorb heat radiated by the heating body. The electrostatic chuck further includes a thin-wall structure respectively connected to the heating body and the cooling pipeline. The thin-wall structure is configured to reduce heat dissipation efficiency between the heating body and the cooling pipeline. The electrostatic chuck provided by the present disclosure may realize stable temperature control for the heating body during a processing process to effectively reduce whisker defects and to improve the product yield.

Abstract: A method of manufacturing a composite sintered body includes a step (Step S11) of molding mixed powder in which Al2O3, SiC, and MgO are mixed, into a green body having a predetermined shape and a step (Step S12) of generating a composite sintered body by sintering the green body. Then, in Step S11, the ratio of SiC to the mixed powder is not lower than 4.0 weight percentage and not higher than 13.0 weight percentage. Further, the purity of Al2O3 in Step S11 is not lower than 99.9%. It is thereby possible to suppress the abnormal grain growth of Al2O3 and suitably manufacture a composite sintered body having high relative dielectric constant and withstand voltage, and low tan ?.

Abstract: A method and apparatus provide an improved way to monitor a circuit for deterioration and obtain an advance warning of the deterioration so that action can be taken before the circuit breaker may trip for the circuit. The method establishes a baseline for the circuit, including monitoring the zero crossing point for the voltage and current for the circuit. In operation, the circuit is monitored using the zero crossing point and this information is compared to the baseline to determine if a change has occurred. The baseline information establishes thresholds that signify that the circuit is deteriorating so that the appropriate signal can be provided so that an appropriate action can be taken, interrupt the circuit, take remedial action, etc.

Abstract: There is provided a substrate fixing device. The substrate fixing device includes: a base plate; and an electrostatic chuck that is fixed to the base plate and configured to adsorb a subject by electrostatic force. The electrostatic chuck includes: an adsorptive layer configured to adsorb and retain the subject; and a heater layer that is provided between the adsorptive layer and the base plate and configured to heat the subject retrained by the adsorptive layer. A thickness of the heater layer is uniform over an entire area of the heater layer.