Abstract: A producing method of a wired circuit board includes the steps of preparing the wired circuit board, placing the wired circuit board on a support table, and applying light from above the wired circuit board toward the wired circuit board, and sensing pattern reflected light, table reflected light and foreign-matter reflected light to inspect the conductive pattern and the foreign matter based on a contrast therebetween. In the step of inspecting the conductive pattern and the foreign matter, a reflectance of the table reflected light is in a range of 25 to 55%, and a reflectance of the foreign-matter reflected light is in a range of not more than 10%.

Abstract: A method for making a coaxial cable including an inner conductor, an outer conductor, and a dielectric material layer therebetween may include forming the inner conductor by at least forming a bimetallic strip into a tubular bimetallic layer having a pair of longitudinal edge portions at a longitudinal seam. The bimetallic strip may include an inner metal layer and an outer metal layer bonded thereto and coextensive therewith. Each of the longitudinal edge portions may be folded over. The method may also include forming a welded joint between adjacent portions of the folded over longitudinal edge portions and defining surplus material at the welded joint. The method may further include removing the surplus material at the welded joint and forming the dielectric material layer surrounding the inner conductor. The method may also include forming the outer conductor surrounding the dielectric material layer.

Abstract: A micro pin hybrid interconnect array includes a crystal anode array and a ceramic substrate. The array and substrate are joined together using an interconnect geometry having a large aspect ratio of height to width. The joint affixing the interconnect to the crystal anode array is devoid of solder.

Abstract: A plurality of reference holes are formed in the surface of a first substrate made of a first material, and a plurality of columnar members are each fitted in the reference holes in such a manner that at least a part of each of the columnar members projects from the surface of the first substrate. Subsequently, an electrode surface layer made of a second material is formed on the surface of the first substrate in such a manner that an end portion of each of the columnar members are exposed at the surface and then the columnar members are removed. Thus obtained is a substrate-like electrode including at least an electrode surface layer provided with through holes having a cross section matching a sectional shape of the projecting portion of the columnar members.

Abstract: A packaging method for assembling a captive screw to a printed circuit board (PCB) includes the steps of providing a captive screw having a screw head, a threaded shank and a sleeve; pressing a fixture toward the screw head for a part of the threaded shank to exposed from a distal end of the sleeve, and then clamping the fixture on the sleeve; providing a PCB having through holes and a layer of solder provided thereon; using a tool to pick up the fixture and the captive screw and align the threaded shank with one through hole on the PCB; releasing the fixture and the captive screw from the tool for a flange at the distal end of the sleeve to extend into the through hole; heating, melting and then cooling to harden the solder layer, so that the sleeve is fixedly held to the PCB; and removing the fixture.

Abstract: An object of the invention is to provide a method of manufacturing a liquid discharge head in which a distance between a discharge opening and an energy generating element is uniform, simply and with good precision.

Abstract: A microelectronic device mounting substrate includes a bond pad with a side wall and an upper surface. A dielectric first layer is disposed on the mounting substrate and a solder mask second layer is disposed on the dielectric first layer. A uniform recess is disposed through the solder mask second layer and the dielectric first layer that exposes the portion of the bond pad upper surface.

Abstract: A tool for changing first and second parts of a connector from a pre-assembly relationship into an assembled relationship. The tool is portable and has a frame with an operating mechanism thereon. The operating mechanism has a plunger that is movable to thereby change the relationship of the connector parts. The operating mechanism is operable by a pressurized fluid within a container that is connected to the frame.

Abstract: An object of an aspect of the present invention is to provide a method of producing a circuit board that allows highly accurate preservation of the circuit profile and gives a circuit having a desired depth in preparation of a fine circuit by additive process.

Abstract: A method of manufacture for an end effector assembly is provided. The method includes providing a pair of jaw members. A step of the method includes forming one or more seal plates positionable on one of the pair of jaw members. Etching a dam along a side of the one or more seal plates is a step of the method, wherein the etched dam inhibits the flow of a plastic on the one or more seal plate such that a height of the plastic with respect to the at least one seal plate during an overmolding process may be controlled. The method includes positioning the one or more seal plates on the one of the pair of jaw members; and overmolding the seal plate to one or more of the pair of jaw members.

Abstract: Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process.

Abstract: A system for joining tubular members comprising: a U-shaped joining member, with a first leg, a bottom of the U in communication with the first leg, and a second leg in communication with the bottom of the U, and wherein the first leg and second legs have a taper such that the cross-sectional surface area of the first leg is at a minimum at generally the far end of the first and second legs, and the cross-sectional surface is at a maximum at generally the beginning end of the first and second legs; an anchor member configured to fit generally in the bottom of the U; a first tubular member configured to fit abutting the anchor member, and between the first and second legs; a wire made of anisotropic material configured to be wound about the first leg, second leg, and a portion of the first tubular member located between the first leg and second leg; a second tubular member configured to structurally attach to the first tubular member, U-shaped joining member, anchor member, and anisotropic material; a pluralit

Abstract: A method of forming a seal about an electrically conductive core of a cable having an insulative outer cover and a terminal includes the steps of providing a lead of the core extending beyond an axial edge of the insulative outer cover; spraying a conformal coating onto the lead; crimping the terminal onto the cable while the conformal coating is still wet to displace the conformal coating from between the lead and the abutting contact surfaces of the terminal and to cover and seal remaining portions of the lead not in direct contact with the terminal with the conformal coating and curing the conformal coating over the remaining portions of the lead.

Abstract: A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic component having a groove formed on one surface thereof and an electrode formed inside the groove includes: forming a first circuit pattern on one surface of a first metal layer; pressing the first metal layer against a first insulator; forming a first conductive protrusion by selectively etching the other surface of the first metal layer; and mounting a first electronic component by disposing a conductive adhesive layer such that an electrode of the first electronic component and the first conductive protrusion are electrically connected to each other. Thus, an electronic component without its electrode protruded outward can be mounted easily and reliably and the manufacturing time can be shortened.

Abstract: Provided is a wiring substrate, a semiconductor device package including the wiring substrate, and methods of fabricating the same. The semiconductor device package may include a wiring substrate which may include a base film. The base film may include a mounting region and a non-mounting region. The wiring substrate may further include first wiring patterns on the non-mounting region and extending into the mounting region, second wiring patterns on the first wiring patterns of the non-mounting region, and an insulating layer on the non-mounting region, and a semiconductor device which may include bonding pads. At least one of side surfaces of the second wiring patterns adjacent to the mounting region may be electrically connected to at least one of the bonding pads of the semiconductor device.

Abstract: An apparatus for removal of a disk in a disk stack. The apparatus includes a shaft. The shaft has an end portion insertable into a disk remover tool. The shaft has a positioning portion at an end of the shaft opposite the insertable end portion. The positioning portion includes a surface de-tensionizer. The surface de-tensionizer provides disengagement of surface tension between the disk and a disk spacer during a disk removal process performed thereon.

Abstract: A terminal insertion apparatus having a connector housing holding unit, a terminal insertion unit, and a control unit. The connector housing holding unit holds a connector housing movably in horizontal and vertical directions. The terminal insertion unit inserts a terminal attached to an electric wire into a terminal accommodating chamber of the connector housing. After the terminal insertion unit has inserted an end of the terminal into the terminal accommodating chamber, the control unit controls a movable supporting unit of the connector housing holding unit so as to move a holding jig by amounts of movement in horizontal and vertical directions so that the terminal is not caught on an inner surface of the terminal accommodating chamber, and then the terminal is completely inserted in the terminal accommodating chamber.

Abstract: An apparatus and method are disclosed that may include a contact pin; and a plurality of loops of conductive wire, coated with insulation material, disposed in proximity to the contact pin, wherein along at least one portion of the conductive wire, at least one edge of the contact pin extends through the insulation material and thereby forms conductive electrical contact with the conductive wire.

Abstract: In one embodiment, a process, for fabricating a medical lead for stimulation of tissue of a patient, comprises: providing a plurality of wires; increasing an exterior surface area of each wire of the plurality of wires; arranging the plurality of wires angularly around a longitudinal axis; extruding polymer material of the plurality of wires; forming a lead body with a proximal end and a distal end after performing the extruding; and forming a plurality of terminals at a proximal end of the lead body; forming a plurality of segmented electrodes at a distal end of the lead body.

Abstract: A minimum Z height handheld electronic device and methods of assembly is described. The electronic device includes a single seamless housing having a front opening and a cover disposed within the front opening and attached to the seamless housing without a bezel.