Abstract: A method for foreign object detection for an induction charging device is described, including an oscillator circuit, in particular, for a hand-held power tool, a resonance frequency and an associated actual quality of the oscillator circuit being detected and the actual quality is subsequently compared to a setpoint quality as a function of the resonance frequency and a decision is made about the presence of a foreign object based on a defined setpoint quality range. The method provides that an upper limit and/or a lower limit of the setpoint quality range and the profile of the actual quality are adapted to one another. Also described is an induction charging device including an oscillator circuit and a control and regulating unit for carrying out the method.

Abstract: The various embodiment of the present disclosure provides a system to define and identify an absolute mechanical reference position for a rotating element, The system comprises a radial ring magnet comprising plurality of pole pairs mounted to the rotating element, a first magnetic sensor in proximity of the radial ring magnet to detect angular position of said rotating element, at least one second magnetic sensor in proximity of the radial ring magnet to detect the passage of each of the pole pair and a control module adapted to define said absolute mechanical position by computing a unique first set of feature values for each of said plurality of pole pairs based on responses of said first magnetic sensor and said second magnetic sensor. The first set of feature values is stored in a memory unit.

Abstract: There is provided mechanisms for detecting a fault of a transmission line (20) in a power system (10) comprising at least one of an extreme weak system (10a) and an extreme strong system (10b). A method comprises obtaining travelling wave polarities from two terminals (21a, 21b) of the transmission line during occurrence of the fault, the travelling wave polarities being defined by two current polarities and two voltage polarities. The method comprises determining the obtained travelling wave polarities to be detectable and the obtained travelling wave polarities to be non-detectable. The method comprises detecting the fault to be internal based on the detectable travelling wave polarities and the non-detectable travelling wave polarities. There is also provided an arrangement configured to perform such a method.

Abstract: Circuits and methods for testing wafers are disclosed herein. An embodiment of a method includes electrically contacting a first probe and a second probe to a wafer. A gas is blown in the areas proximate the first probe and the second probe. An electric potential is then applied between the first probe and the second probe while the gas is being blown.

Abstract: A probe card includes a substrate module having an installation hole and a first stair-shaped structure provided on two stairs thereof with a first connection surface and a first transmission surface having a first contact pad, a probe module having a probe and a second stair-shaped structure provided on two stairs thereof with a second connection surface and a second transmission surface having a second contact pad electrically connected with the probe, and a pressing member. The probe module is disposed in the installation hole so that the first and second connection surfaces are connected and the first and second transmission surfaces are opposite. The pressing member is detachably pressed on the probe module to press the second connection surface against the first connection surface and make the first and second contact pads electrically connected.

Abstract: A wafer test machine is disclosed. The wafer test machine comprises a main body having a chamber defined therein, wherein a probe card is disposed at an upper portion of the chamber; a chuck for fixing a wafer in the chamber; a moving unit for moving the chuck in the chamber, thus making a contact between the probe card and the wafer; and a laser cleaning apparatus for cleaning the probe card in the chamber using a laser beam, when the probe card does not contact the wafer.

Abstract: A sensing structure is presented for use in testing integrated circuits on a substrate. The sensing structure includes a probe region corresponding to a conductive region for connecting to the integrated circuit. A first sensing region at least partially surrounds the probe region. A plurality of sensing elements connects in series such that a first of the plurality of sensing elements has two terminals respectively connected to the first sensing region and the probe region. And a second of the plurality of sensing elements has two terminals respectively connected to the probe region and a first reference potential.

Abstract: A multi-layer eddy current probe has a large number of flat spiral coils which are arranged in different coil layers of a multi-layer arrangement, wherein a respective insulating layer which is composed of electrically insulating material is arranged between adjacent coil layers of the multi-layer arrangement. Each of the flat coils has an inner terminal and an outer terminal. Selected terminals of selected flat coils of different coil layers are electrically connected to one another by way of vias. The flat coils form at least one coil group which has at least three flat coils which are arranged one above the other in different layers, wherein the inner terminals of the at least three flat coils of the coil group are electrically conductively connected by means of a common inner via.

Abstract: In some embodiments, a magnetometer mounting apparatus and system may reduce noise and magnetic flux interference by mounting the magnetometer inside a cavity in a collar that fits around a tool insert. The cavity may be sealed with a hatch cover/outsert. Another embodiment mounts a plurality of magnetometers around the periphery of a mounting ring that is coupled to the insert. Yet another embodiment mounts the magnetometers in a gap sub in the BHA. Still another embodiment longitudinally mounts the magnetometers on the insert such that a diagonal distance between two magnetometers is the greatest possible on the insert.

Abstract: A magnetic detection apparatus includes a Hall device configured to include terminals and to generate an electromotive force based on a magnetic field, a Hall output controller configured to control an output of the Hall device such that an output phase alteration order of a first section of the output is symmetrical to an output phase alteration order of a second section of the output on the basis of half cycle of a control cycle of the Hall device, an amplifier configured to be connected to output terminals of the Hall device to amplify the output of the Hall device, and an amplifier output controller configured to control an output polarity of the amplifier based on the output of the Hall device.

Abstract: An integrated circuit with analog device fault detection includes an integrated circuit die having an analog device, an on-line fault detector and a control circuit. The analog device has a power input, an analog device input and an analog device output and the on-line fault detector is coupled to at least one of the power input, the analog device input and the analog device output and has a fault detector output. The control circuit is coupled to the fault detector and responsive to the fault detector output. Detector self-test (DST) circuitry can be provided to test the on-line fault detector and one or more circuit breakers can be provided to protect the analog device and other devices attached to the analog device.

Abstract: Provided is a test contactor for testing a semiconductor device which includes a cylinder, a piston which is configured to reciprocate between a first position and a second position according to a change in pressure in the cylinder, and a pressing part which is configured to change its location according to the reciprocating motion of the piston. The pressing part is configured to be in contact with the semiconductor device when the piston is located at the first position, and the pressing part is configured not to be in contact with the semiconductor device when the piston is located at the second position.

Abstract: Electronic device structures such as a conductive housing member that forms part of an antenna may be tested during manufacturing. A test system may be provided that includes a test probe configured to energize the conductive housing member or other conductive structures under test and that includes temporary test structures that may be placed in the vicinity of or in direct contact with the device structures during testing to facilitate detection of manufacturing defects. Test equipment such as a network analyzer may provide radio-frequency test signals in a range of frequencies. An antenna probe may be used to gather corresponding wireless radio-frequency signal data. Forward transfer coefficient data may be computed from the transmitted and received radio-frequency signals. The forward transfer coefficient data or other test data may be compared to reference data to determine whether the device structures contain a fault.

Abstract: A sensing structure for use in testing integrated circuits on a substrate. The sensing structure includes at least two sensing regions connectable to a probe and at least one first sensing element. Each of the at least one first sensing elements is directly connected to two sensing regions such that for each sensing region a different value of an electrical parameter is measurable between the sensing region and a first reference potential so as to reliably determine a drift direction of a probe.

Abstract: A voltage monitoring device monitors voltage of each of battery cells connected in series to one another to configure an assembled battery. The device includes a capacitor circuit, a filter circuit, an input side connection switching unit, a potential difference detection unit, and an output side connection switching unit. The capacitor circuit includes a plurality of capacitors connected in series to one another. The filter circuit includes a plurality of resistors connected to an electrode terminal of each of the battery cells. The plurality of resistors are divided into a first resistor group and a second resistor group. The first resistor group is connected to a connection point between adjacent capacitors of the plurality of capacitors. The second resistor group is connected to an independent end of the plurality of capacitors. A resistance value of the first resistor group is smaller than a resistance value of the second resistor group.

Abstract: A device includes a sensor surface and a pair of electrodes. The sensor surface includes a first conductive layer separated from a second conductive layer by an intermediary layer, a magnetization direction of the first conductive layer and a magnetization direction of the second conductive layer having a ground state orientation of approximately 0 degrees. An electrical resistance between the pair of electrodes is determined by a magnetic field proximate the sensor surface.

Abstract: An extended range position sensor system includes a first set of spaced-apart magnets, a first sensor, a second set of spaced-apart magnets, a second sensor, and a processor. The first sensor is associated with and is movable relative to the first set of magnets, and is configured to generate a first sensor output signal in response to relative movement between the first sensor and the first set of magnets. The second sensor is associated with and is movable relative to the second set of magnets, and is configured to generate a second sensor output signal in response to relative movement between the second sensor and the second set of magnets. The processor is coupled to receive the first and second sensor output signals and is configured, in response thereto, to generate a position signal.

Abstract: Provided are a method and apparatus for measuring a location of a terminal using a magnetic field. For example, the apparatus may measure a location of a terminal using a magnetic field obtained by a magnetic field sensor and one or more sensor values obtained by a plurality of other sensors.

Abstract: The invention relates to an absolute position magnetic sensor for measuring the angular position, on a theta course, of a shaft passing through said sensor and comprising at least two systems for detecting the position of the shaft. Said invention is characterised in that: at least one of the detection systems generates a signal according to a “periodical” function of the theta/n period giving the periodical angular position of said shaft; at least one of the detection systems generates an absolute signal on a theta course of the shaft; and theta and n fit the equation: *theta/n=360*n>1.

Abstract: The disclosure relates to improvements in the measurement of shaft speed. The shaft has an end face and at least one detection mark provided on or in the end face of the shaft to enable the speed, angular displacement, position or movement of the shaft to be detected. The shaft is for use in a shaft assembly comprising a sensor positioned at a distance from the shaft end face. The sensor is configured to measure the speed, angular displacement, position or movement of the shaft by sensing movement of the detection marks.