Patents Examined by Teresa J. Walberg
  • Patent number: 8757246
    Abstract: A heat sink includes a fluid channel and a cooling wall in contact with coolant flowing in the fluid channel. The channel is configured to vary the velocity of coolant along the length of the fluid channel to vary the coolant's heat transfer coefficient and thereby compensate for the coolant's temperature rise along the length of the fluid channel. The result is a heat sink that is isothermal along its length.
    Type: Grant
    Filed: June 6, 2006
    Date of Patent: June 24, 2014
    Assignee: Raytheon Company
    Inventors: Craig H. McCordic, Leo S. Ludwick
  • Patent number: 8757248
    Abstract: The invention relates to a heat exchanger for heat exchange between fluids, comprising a housing having an inlet and an outlet for each fluid, the inlet and outlet for each fluid being connected to one another by a flow path, the flow path of a first fluid comprising multiple heat exchange modules comprising at least one longitudinal hollow tube, wherein the modules are arranged in a matrix configuration that comprises at least two columns of longitudinal tubes and at least two rows of longitudinal tubes, and wherein a module is provided with at least one connector for connecting to a co-operating connector of an adjacent module, such that the space enclosed between adjacent modules defines a flow path for a second fluid, parallel to the flow path for the first fluid.
    Type: Grant
    Filed: July 4, 2008
    Date of Patent: June 24, 2014
    Assignee: Heatmatrix Group B.V.
    Inventors: Ron Postma, Bart Van Den Berg, Robert Sakko, Hans Constant Dikhoff
  • Patent number: 8074706
    Abstract: A heat spreader comprising a casing, a micro-structure layer, a support device, and a working fluid is provided. The casing has an inner surface and is defined by a sealed chamber where the working fluid circulates therein. The micro-structure layer is formed on the inner surface of the casing, wherein the micro-structure layer comprises a first structure layer which is formed by the first metallic mesh. Specifically, the first metallic mesh forms the first structure layer on the inner surface through diffusion bonding so that the working fluid can circulate within the micro-structure layer by capillary action. In addition, the support device is disposed in the sealed chamber for supporting the casing. Thus, a heat spreader with a composite micro-structure can not only enhance the capillarity but also reduce the flowing resistance during operation.
    Type: Grant
    Filed: April 20, 2007
    Date of Patent: December 13, 2011
    Assignee: Taiwan Microloops Corp.
    Inventors: Cherng-Yuh Su, Kuo-Ying Lee, Chien-Hung Liin
  • Patent number: 8042606
    Abstract: A substrate formed of a suitable conductive-heat-transfer material is formed with small channels of a size selected to provide surface tension forces dominating a motion of a liquid-phase working fluid. A space above the channels of the substrate provides comparatively unobstructed space for the transport motion of a vapor phase of the working fluid effecting a heat-pipe effect in a multi-dimensional device. Channels may typically be formed in an orthogonal grid providing capillary return of liquids from a comparatively cooler condensation region to a comparatively warmer evaporation region, without any wicks other that the adhesion of the liquid phase working fluid to the vertices of the channels. Interference between the boundary layers of the liquid phase and the vapor phase of the working fluid are minimized by the depth of the channels, and the pedestals formed by the channel walls.
    Type: Grant
    Filed: May 2, 2007
    Date of Patent: October 25, 2011
    Assignee: Utah State University Research Foundation
    Inventors: J. Clair Batty, Scott M. Jensen
  • Patent number: 8006750
    Abstract: The present invention comprises a heat exchanger and method for sealing a heat exchanger tube to a header of the heat exchanger. The method comprises melt-bonding the tube to a header of the heat exchanger to form a bond and sealing the bond with a sealant material to form a seal.
    Type: Grant
    Filed: March 8, 2006
    Date of Patent: August 30, 2011
    Inventor: Anthony Joseph Cesaroni
  • Patent number: 8002018
    Abstract: A thermal-dissipating device is made by connecting a plurality of thermal-dissipating sheets with each other. The thermal-dissipating sheets include a plurality of connecting portions and a plurality of thermal-dissipating fins. The connecting portions are connected with each other. The thermal-dissipating fins are connected with the connecting portions, respectively. At least one set of the thermal-dissipating fins are connected with each other.
    Type: Grant
    Filed: October 10, 2007
    Date of Patent: August 23, 2011
    Inventor: Ching-Sung Kuo
  • Patent number: 8002022
    Abstract: The invention relates to a heat exchanger, in particular an exhaust gas heat exchanger for motor vehicles, having tubes (3) through which a gas can flow, which are arranged in a housing casing (2) and around which a liquid coolant can flow, wherein the tubes (3) have tube ends which are held by tube bases. It is proposed according to the invention that the tubes are embodied as flat tubes (3), and that, at least one side of the tubes (3), the tube ends (3a, 3b) are flared to form an approximately rectangular cross section and can be soldered to the tube bases (7, 8).
    Type: Grant
    Filed: September 14, 2006
    Date of Patent: August 23, 2011
    Assignee: BEHR GmbH & Co. KG
    Inventor: Peter Geskes
  • Patent number: 7997328
    Abstract: In an air conditioner, air-supply passages cross air-discharge passages, and heat exchangers are disposed at intersections between the air-supply passages and the air-discharge passages. This increases the effective heat-exchanging areas of the heat exchangers. In addition, the air conditioner is configured such that the air conditioner can be easily installed and repaired even when the air conditioner is rotated to be properly connected with air-supply ducts and air-discharge ducts.
    Type: Grant
    Filed: August 31, 2007
    Date of Patent: August 16, 2011
    Assignee: LG Electronics Inc.
    Inventors: Kyung Hwan Kim, Keun Hyoung Choi, Han Lim Choi
  • Patent number: 7980294
    Abstract: For providing a liquid cooling system for an electronic apparatus having a heat-generating element within a housing thereof, enabling small-sizes thereof and being effective for lowering noises when the apparatus is operated, equipped with a new type of a driving means for a liquid coolant therein, comprises a heat-receiving jacket 100 for transferring heat generated from the heat-generating element to a liquid coolant, to evaporate it, within an inside thereof; a radiator 200 for guiding the evaporated coolant supplied from the heat-receiving jacket into an inside thereof, so as to cool it to be liquefied; and a driving means 300 for applying driving force for circulating the liquid coolant, through repetition of heating and cooling upon a portion of the liquefied liquid coolant supplied from the radiator, while restricting a flow direction of the liquid coolant within an inside thereof into one direction, whereby circulating said liquid coolant within a circulation loop including the heat-receiving jacket,
    Type: Grant
    Filed: November 29, 2005
    Date of Patent: July 19, 2011
    Assignee: Hitachi, Ltd.
    Inventor: Shigeo Ohashi
  • Patent number: 7963318
    Abstract: A finned tube for the thermal cracking of hydrocarbons in the presence of steam is defined by a tube axis and includes a plurality of inner fins. The fins are inclined at an angle of 20° to 40° in relation to the tube axis and have a flank angle of 16° to 25°.
    Type: Grant
    Filed: February 4, 2008
    Date of Patent: June 21, 2011
    Assignee: Schmidt + Clemens GmbH + Co., KG
    Inventors: Peter Wölpert, Benno Ganser, Dietlinde Jakobi, Rolf Kirchheiner
  • Patent number: 7950446
    Abstract: A clip is capable of engaging with a heat sink for securing a fan to the heat sink. The clip includes a mounting plate, a supporting plate, a spring fastener and a spring positioning plate. The supporting plate extends from the mounting plate. The spring fastener extends from the supporting plate and spaced from the mounting plate for pressing the fan toward the heat sink. The spring positioning plate extends from the mounting plate. The mounting plate is horizontally inserted into the heat sink and the spring positioning plate is V-shaped and resiliently engaged in a V-shaped receiving space of the heat sink, thereby securing the clip to the heat sink.
    Type: Grant
    Filed: July 16, 2007
    Date of Patent: May 31, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventor: Jing Zhang
  • Patent number: 7946336
    Abstract: A heat sink is used for dissipating thermal energy generated by an electronic component of an electronic device. The heat sink includes a contact base and a fin base. The contact base is attached on the electronic component to transfer thermal energy, and the fin base is pivotally connected to the contact base to transfer thermal energy with the contact base. The fin base has a plurality of fins, and rotates relative to the contact base. A center of gravity of the fin base deviates from a rotation axis. When the electronic device is moved, due to the deviated center of gravity, the fin base rotates to make the fins disturb the air inside the electronic device.
    Type: Grant
    Filed: February 21, 2008
    Date of Patent: May 24, 2011
    Assignee: Inventec Corporation
    Inventors: Feng-Ku Wang, Shaw-Fuu Wang, Ting-Chiang Huang, Sheng-Jie Syu
  • Patent number: 7946337
    Abstract: A ultrasonic transducer is associated with a heat exchanger and is operable to vibrate a tube associated with the heat exchanger to break up accumulated solids which may have formed on an outer periphery of the tube. A gas flow passes over the tube to remove the pulverized solids.
    Type: Grant
    Filed: August 3, 2007
    Date of Patent: May 24, 2011
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Philip J. Birbara, Arthur K. Colling
  • Patent number: 7942194
    Abstract: A heat sink, wherein a plurality of heat radiation fins are mounted on a base plate to which an electronic device is attached in a heat transmittable manner. The heat radiation fins are erected vertically and in parallel with each other on the reverse face of the base plate to which the electron device is contacted, and extended laterally from the base plate. A heat pipe transports heat between the extended portion of the heat radiation fins and the base plate.
    Type: Grant
    Filed: August 7, 2007
    Date of Patent: May 17, 2011
    Assignee: Fujikura Ltd.
    Inventor: Masataka Mochizuki
  • Patent number: 7934537
    Abstract: A liquid receptacle for rapidly lowering the temperature of a liquid contained therein to a warm range suitable for human contact and maintaining the liquid in the warm range for an extended period of time includes an inner vessel with an open upper end and a closed lower end and a wall connecting the upper and lower end. An insulated outer shell is spaced from the inner vessel to define an interstitial chamber between the inner vessel and the outer shell. A phase change material occupies the chamber and regeneratively absorbs thermal energy from the liquid to cool the liquid and then releases the thermal energy back to the liquid to maintain the temperature of the liquid.
    Type: Grant
    Filed: June 14, 2006
    Date of Patent: May 3, 2011
    Inventor: J. Bruce Kolowich
  • Patent number: 7931071
    Abstract: A heat exchanger includes an evaporation side heat pipe in which a working fluid flowing therein is heat exchanged with a high-temperature fluid to be evaporated, a condensation side heat pipe in which the working fluid flowing therein is heat exchanged with a low-temperature fluid to be condensed, and an inner fin located at least in the evaporation side heat pipe to increase a heat transmission area of the evaporation side heat pipe with the working fluid. The evaporation side heat pipe and the condensation side heat pipe are connected to form a closed cycle, and the evaporation side heat pipe is arranged such that the working fluid flows in the evaporation side heat pipe in a direction different from a horizontal direction. Furthermore, the inner fin has a bottom end that is positioned above a top surface of the working fluid at least in a liquid state.
    Type: Grant
    Filed: August 23, 2007
    Date of Patent: April 26, 2011
    Assignee: Denso Corporation
    Inventors: Kenshirou Muramatsu, Yasutoshi Yamanaka, Masashi Miyagawa, Kazuaki Kafuku
  • Patent number: 7926551
    Abstract: The present invention relates to a heater core and an air conditioner for an automobile equipped with the same, in which an amount of cooling water introduced into the heater core can be adjusted based on a temperature set by a user, thereby increasing a cooling and heating efficiency.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: April 19, 2011
    Assignee: Halla Climate Control Corp.
    Inventor: Seong Seok Han
  • Patent number: 7926558
    Abstract: A cooler device comprising a cooling portion with at least one tubular element which has an internal flow duct for guiding a first medium between a first and a second tank. A second cooling medium in contact with an outside surface of the tubular element cools the first medium as it is led through the flow duct. A first tank receives the first medium before it is led into the cooling portion. The first tank has an outside surface provided with protruding material portions which produce an enlarged contact surface with the cooling second medium so that the first medium is subjected to a first step of cooling within the first tank.
    Type: Grant
    Filed: March 9, 2006
    Date of Patent: April 19, 2011
    Assignee: Scania CV AB
    Inventor: Magnus Hagberg
  • Patent number: 7926557
    Abstract: A radiant panel includes a first and second skins and a fluid conduit between the first and second skins. The first and second skins each include an inner face and an outer face. The fluid conduit is formed in multiple rows, and is positioned within thermally conducting brackets bonded to an inner face of at least one of the skins. The thermally conducting brackets provide a thermally conducting path between the fluid conduit and the first and second skins of the radiant panel.
    Type: Grant
    Filed: October 20, 2006
    Date of Patent: April 19, 2011
    Assignee: Plascore, Inc.
    Inventors: Fritz Huebner, Kelly Van Koevering
  • Patent number: 7926552
    Abstract: An apparatus comprising a heat dispersion device having a first end. The first end has a shape different than that of the remainder of the heat dispersion device. The apparatus also comprises a jacket coupled to the heat dispersion device at the first end. The jacket has another shape associated with that of the remainder of the heat dispersion device.
    Type: Grant
    Filed: October 19, 2007
    Date of Patent: April 19, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jeffrey Metcalf, Brandon Rubenstein, Stephen D. Cromwell