Patents Examined by Teresa J. Walberg
  • Patent number: 7726388
    Abstract: A plurality of heat exchange units (12) are placed in a frame (38). Respective heat exchange units (12) are positioned by pin holes (30) formed in fixing plates (21) installed on the heat exchange units (12) and knock pins (29) formed on a pair of bars (22) of the frame (38). The one side tank water inlet/outlet ports (19) and the other side tank water inlet/outlet ports (20) of the heat exchange units (12) are connected to the one side water receiving ports (35) of an upper tank (17) and the other side water receiving ports (36) of a lower tank (18), respectively. The upper tank (17), the heat exchange units (12), and the lower tank (18) are fixed to the frame (38) to form the heat exchanger (11). Thus, the heat exchanger having a specified heat exchange capacity and firmly supportable on a base can be provided.
    Type: Grant
    Filed: July 15, 2005
    Date of Patent: June 1, 2010
    Assignee: Komatsu Ltd.
    Inventor: Eiji Toda
  • Patent number: 7721795
    Abstract: The invention relates to a heat exchanger, especially a charge-air/coolant cooler (1), consisting of a plurality of disks (2), two adjacent disks (2) defining an intermediate region through which a heat exchanging medium flows. Said heat exchanger also comprises a heat exchanging medium inlet (9) and a heat exchanging medium outlet (11), that are common to the disks (2). At least two heat exchanging medium channels (5, 6) are respectively provided for the heat exchanging medium inlet and the heat exchanging medium outlet (9 and 11).
    Type: Grant
    Filed: November 10, 2004
    Date of Patent: May 25, 2010
    Assignee: Behr GmbH & Co. KG
    Inventors: Daniel Hendrix, Florian Moldovan, Jürgen Wegner
  • Patent number: 7721794
    Abstract: The invention involves a flat fin heat exchanger configuration 10 with a plurality of louvers 26 that are raised above the plane of the fin 16 between adjacent tube holes 19, 20 that receive tubes 14. Various alternative patterns of louvers enhance the heat transfer characteristics of the fin, and allow for the use of thinner materials to lower cost without diminishing performance. The exterior fin surface redirects air flow from the leading edge to the trailing edge of the fin. This effect directs the air flow over and in between the interrupted surfaces, thus breaking up air boundary layer around the fin. The louvers of the fin are oriented relative to the air flow in such a manner that each louver in effect creates another leading edge, thus contributing to a higher heat transfer coefficient.
    Type: Grant
    Filed: February 9, 2007
    Date of Patent: May 25, 2010
    Assignee: Lennox Industries Inc.
    Inventors: Michael E. Heidenreich, Hailing Wu
  • Patent number: 7717163
    Abstract: The difference in linear thermal expansion coefficient between the fins (57) and the adsorbent layer (58) is made smaller than the difference in the linear thermal expansion coefficient between the fins (57) and the adsorbent.
    Type: Grant
    Filed: March 29, 2005
    Date of Patent: May 18, 2010
    Assignee: Daikin Industries, Ltd.
    Inventors: Hirohiko Matsushita, Takahisa Sueoka, Shuji Ikegami, Shun Yoshioka, Eisaku Okubo
  • Patent number: 7717162
    Abstract: A fluid recovery system is adapted for use with a cooling system, such as for use in electronic applications. In one example, an enclosure is configured to contain fluid in both gas and liquid states, wherein the fluid is adapted for use in spray cooling electronic components. A plurality of pick-up ports is defined within the enclosure. In one implementation of the cooling system, an orifice size used in each of the pick-up ports results in withdrawal of fluid from submerged and non-submerged pick-up ports.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: May 18, 2010
    Assignee: Isothermal Systems Research, Inc.
    Inventors: Charles L. Tilton, Donald Tilton, Thomas D Weir, Randall T. Palmer
  • Patent number: 7717165
    Abstract: Disclosed is a heat exchanger, particularly a charge-air/coolant radiator (1), having a disk-type structure. Said heat exchanger comprises a plurality of disks (2) which are penetrated by a coolant and a fluid that is to be cooled. The inlet zone and/or outlet zone for the fluid that is to be cooled is/are expanded at least at the discharge end or delivery end.
    Type: Grant
    Filed: November 10, 2004
    Date of Patent: May 18, 2010
    Assignee: BEHR GmbH & Co. KG
    Inventors: Daniel Hendrix, Florian Moldovan, Jürgen Wegner
  • Patent number: 7703503
    Abstract: A heat pipe heat exchanger and a method for fabricating the same are disclosed. A heat pipe heat exchanger 1 is provided with a heat pipe 2, and a heat block 3 having a heat pipe-holding hole 3A, and a fin 4 having a fin base portion 4A, to which the heat pipe 2 is joined by a heating tube expansion method. The heat pipe 2 is plastically deformable and in which a predetermined amount of hydraulic fluid 2a is sealed. The heat pipe 2 is composed of a pipe having a cross section except a perfect circle. The heat pipe-holding hole 3A and the fin base portion 4A are composed of holes each having a cross section except the perfect circle.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: April 27, 2010
    Assignee: Hitachi Cable, Ltd.
    Inventors: Hitoshi Sakayori, Tooru Kurosawa, Hironori Kitajima, Katsumi Nomura
  • Patent number: 7703505
    Abstract: A heat exchanger has at least three tubular conduits spaced apart for the flow of air between and around the conduits. The conduits communicate with inlet and outlet manifolds for the flow of a first liquid through the conduits. An intermediate conduit is located between at least two, but not all, of the spaced-apart tubular conduits, and the intermediate conduit has inlet and outlet openings for the flow of a second liquid through the intermediate conduit.
    Type: Grant
    Filed: November 24, 2006
    Date of Patent: April 27, 2010
    Assignee: Dana Canada Corporation
    Inventors: Allan K. So, Mark S. Kozdras
  • Patent number: 7703506
    Abstract: An exhaust heat exchanger for an exhaust gas recirculation system, including a first flow path for the intake air for an internal combustion engine, a second flow path for the exhaust of an internal combustion engine, and a housing enclosing the first and second flow paths. The first and second flow paths are each divided into a plurality of flow channels in heat-conducting, metallically connected contact with each other, and the flow channels include elements promoting heat exchange between the flow channels.
    Type: Grant
    Filed: April 14, 2005
    Date of Patent: April 27, 2010
    Assignee: Modine Manufacturing Company
    Inventors: Viktor Brost, Martin Wierse, Christoph Ruf
  • Patent number: 7699093
    Abstract: A tube support device for a tube bundle having a plurality of elongated tubes with a U-shaped bend portion is disclosed. The tube support device includes an elongated longitudinally extending strip having a pair of opposing faces. A plurality of tube engaging members extend from the pair of opposing faces. The tube support device includes an engagement assembly formed on one end of the tube support device. The engagement assembly is adapted to engage the anchor assembly positioned within the tube bundle, whereby the tube support device can be rotated into the desired orientation between the tubes to prevent vibration damage.
    Type: Grant
    Filed: October 6, 2006
    Date of Patent: April 20, 2010
    Assignee: ExxonMobil Research and Engineering Company
    Inventors: Amar S. Wanni, Thomas M. Rudy
  • Patent number: 7694722
    Abstract: Apparatus for cooling of an electrical element package, comprising in combination structure including a hollow body, defining a cavity containing cooling fluid, the structure defining an opening or passage whereby direct contact of the cooling fluid with the package is established for heat transfer from the package to the fluid contained in the cavity; a mesh located to enhance the heat transfer, and means for circulating the fluid to transfer heat to other heat transfer means acting to remove heat from the fluid.
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: April 13, 2010
    Assignee: Onscreen Technologies, Inc.
    Inventor: John M. Popovich
  • Patent number: 7694719
    Abstract: The present invention is a patterned metal thermal interface. In one embodiment a system for dissipating heat from a heat-generating device includes a heat sink having a first surface adapted for thermal coupling to a first surface of the heat generating device and a thermal interface having at least one patterned surface, the thermal interface being adapted to thermally couple the first surface of the heat sink to the first surface of the heat generating device. The patterned surface of the thermal interface allows the thermal interface to deform under compression between the heat sink and the heat generating device, leading to better conformity of the thermal interface to the surfaces of the heat sink and the heat generating device.
    Type: Grant
    Filed: January 4, 2007
    Date of Patent: April 13, 2010
    Assignee: International Business Machines Corporation
    Inventors: Bruce K. Furman, Sushumna Iruvanti, Paul A. Lauro, Yves C. Martin, Da Yuan Shih, Theodore G. Van Kessel, Wei Zou
  • Patent number: 7686072
    Abstract: A heat exchanger for a gas boiler for producing hot water is provided with a casing extending along a first axis and through which combustion fumes flow; a tube along which water flows, and which is housed inside casing, and coils about the first axis to form a helix having a succession of turns; and deflecting means for directing the fumes between successive turns of a first helix portion in a first direction and between successive turns of a second helix portion in a second direction opposite to first direction; the tube forming the turns of the first helix portion has a first cross section and the tube forming the turns of the second helix portion has a second cross section different from the first cross section.
    Type: Grant
    Filed: February 5, 2007
    Date of Patent: March 30, 2010
    Assignee: Riello S.p.A.
    Inventor: Christian Cannas
  • Patent number: 7686071
    Abstract: A condenser includes a condenser core, input and output manifolds connected therewith. The condenser core has a blade-thru structure, which is formed by a plurality of layers of thin metal blades stacked on top of another by joint interfaces or joined by spacer rings between two adjacent blades. Each layer of the blades includes condensation chamber(s), wherein the floor of the chamber is monolithic with the rest of the blade. The blades are so aligned that the condensation chamber(s) of each blade are on top of the condensation chamber(s) of the blade immediate underneath, thereby forming phase exchange column(s). Each condensation chamber has one or more apertures on the floor thereof, permitting vapor and condensate to pass therethrough and causing vibration of the chamber floor. Further disclosed is a heat dissipation system utilizing the blade-thru condenser, as well as a computer system utilizing the heat dissipation system.
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: March 30, 2010
    Assignee: ArticChoke Enterprises LLC
    Inventor: Paul Silverstein
  • Patent number: 7686069
    Abstract: A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: March 30, 2010
    Assignee: ThermoTek, Inc.
    Inventors: Overton L. Parish, IV, Roger S. DeVilbiss
  • Patent number: 7673672
    Abstract: A heat exchanger has a plurality of tubes and a plurality of fins alternatively arranged to define a core portion of the heat exchanger. A side plate is arranged at opposite sides of the core portion. Each end of the tubes and side plates extend through a core plate. Each core plate mates with a respective tank to define a sealed chamber. The ends of the tubes are disposed within the sealed chamber. The ends of the side plates and disposed outside the sealed chamber. This allows for a non-brazed connection between the core plates and the side plates.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: March 9, 2010
    Assignee: Denso International America, Inc.
    Inventors: Jodie Velzy, Jacob Wright, Yoshikazu Miyano
  • Patent number: 7661468
    Abstract: The present invention relates to cooling systems, and in particular to cooling systems providing forced convective gaseous flow. According to one aspect, a cooling system employs a heat sink in combination with an EHD pumping mechanism such as corona wind or micro-scale corona wind or by a temporally controlled ion-generation technique. A channel-array structure can be employed to embody the heat sink. The EHD pumps are located at the inlet or outlet of the heat sink channels. Many advantages are achieved by the cooling system of the invention, including that the entire system can have similar or better performance than a conventional heat sink and fan system but with one-tenth the volume and weight and can operate silently. The present invention also relates to a method of fabricating a micro-channel heat sink employing EHD gas flow.
    Type: Grant
    Filed: January 23, 2006
    Date of Patent: February 16, 2010
    Assignee: Ventiva, Inc.
    Inventor: Daniel Jon Schlitz
  • Patent number: 7654311
    Abstract: A thermal management system (300) includes a first heat transfer body (330) for providing a opposing heat flux to at least one localized region of elevated heat flux residing in adjacency to a region of lesser flux, such as on a surface (315a) of a circuit die (315) due to a integrated circuit hot-spot (310). A contact (320, 321 962a, 962b, 970a, 970b or 950) defines a thermal conduction path for the opposing flux. A second heat transfer body (350) is in a heat transport relationship with the first heat transfer boy (330) and a second heat transport relationship with the region of lesser heat flux. In such arrangement, each region of heat flux is provided a thermal solution commensurate with the level of heat flux in the region. For example, the opposing heat flux of an active first heat transfer body (330), such as a thermoelectric cooler, may be provided at the hot-spot (310), while at the same time the lesser heat flux is absorbed by a passive second heat transfer body (350), such as a heat spreader.
    Type: Grant
    Filed: July 31, 2006
    Date of Patent: February 2, 2010
    Assignee: University of Maryland
    Inventors: Bao Yang, Avram Bar-Cohen
  • Patent number: 7637309
    Abstract: A cooling module (1) comprises a first heat exchanger (3), which has a first pair of parallel manifolds (10, 11), and a second heat exchanger (4), which is in back-to-front relationship with the first heat exchanger (3) and has a second pair of parallel manifolds (7, 8) perpendicular to the first pair of manifolds (10, 11). The first pair of manifolds (10, 11) is fastened to the second pair of manifolds (7, 8) at four corners (13, 14, 15, 16) by means of four fasteners, of which the first is a rigid fastener (19), the second (20) and third (22) are two-way fasteners, and the fourth (27) is a four-way fastener. The four-way fastener (27) is situated at the corner (16) diametrically opposed to the corner (13) with the rigid faster (19), and the two-way fasteners (20, 22) are situated at one of the remaining corners (14, 15) each.
    Type: Grant
    Filed: November 9, 2006
    Date of Patent: December 29, 2009
    Assignee: Titanx Engine Cooling Holding AB
    Inventor: Arnaud Contet
  • Patent number: 7635020
    Abstract: A coolant-conducting element with an enclosed, linearly extending hollow profiled body, having an exterior wall with a multitude of access openings spaced apart from each other in a longitudinal direction and open or closed but can be opened, toward a conduit arrangement located in the interior. The conduit arrangement has an inflow conduit and an outflow conduit to each of which a number of access openings are assigned. A coolant-conducting arrangement with such a coolant-conducting element is also disclosed.
    Type: Grant
    Filed: March 3, 2004
    Date of Patent: December 22, 2009
    Assignee: Rittal GmbH & Co. KG
    Inventors: Marc Hartel, Ralf Dahmer