Patents Examined by Teresa J. Walberg
  • Patent number: 7320361
    Abstract: A known heat exchanger has a lower rate of blocking the movement of moisture through the joint as compared to a joint bonded with a moisture impermeable adhesive because the corrugated and flat substrates are bonded with thermoplastic fibers by performing heating and pressurizing treatments, but has insufficient moisture permeability because both the flat substrate, which is a partition, and the corrugated substrate, which is a space retaining plate, have a poor moisture permeability. In a heat exchanger in which two types of air flows are directed across a moisture permeable partition plate spaced apart from an adjacent partition plate by a space retaining plate, and perform heat exchange between them through the partition plate, a joint is formed by bonding the partition plate and the space retaining plate using fluoro-resin or hydrocarbon resin containing a hydrophilic group to provide an excellent moisture absorption and diffusion property.
    Type: Grant
    Filed: October 28, 2005
    Date of Patent: January 22, 2008
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hidemoto Arai, Hisao Yokoya, Kenzou Takahashi, Youichi Sugiyama, Masaru Takada, Masataka Yoshino
  • Patent number: 7316262
    Abstract: The subject invention pertains to a method and apparatus for storing thermal energy. The subject thermal energy storage apparatus can function as a heat absorber in a cooling system. A cooling system can incorporate a cooling cycle that utilizes thermal energy storage and has two coolant loops. The primary cooling loop acquires the waste heat from a heat source, such as an electronic device, by heat transfer to the primary coolant via, for example, a sensible heat process (where sensible heat is heat absorbed or transmitted by a substance during a change in temperature which is not accompanied by a change of state) or by evaporating the primary coolant through a latent heat phase change process. The waste heat absorbed by the primary coolant is transferred to the host material of the heat absorber.
    Type: Grant
    Filed: January 26, 2005
    Date of Patent: January 8, 2008
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow
  • Patent number: 7311139
    Abstract: A heat exchanger is provided for dissipating heat from a fluid. The heat exchanger includes a plurality of stacked pairs of plates. Each pair of plates includes a first plate and a second plate. The first plate extends along a first axis and has first and second sides. The first side of the first plate has a generally sinusoidal recess therein that extends along the first axis. The second plate extends along a second axis and has first and second sides. The first side of the second plate has a generally sinusoidal recess therein that extends along the second axis and that is out of phase with the sinusoidal recesses in the first side of the first plate. The first side of the first plate and the first side of the second plate form a mating relationship with each other such that the recess in the first side of the first plate communicates with the recess in the first side of the second plate at a plurality of axially spaced locations.
    Type: Grant
    Filed: August 11, 2005
    Date of Patent: December 25, 2007
    Assignee: Generac Power Systems, Inc.
    Inventors: Robert D. Kern, Guoming Wu
  • Patent number: 7306029
    Abstract: A heat transfer apparatus, such as a condenser, is provided. The apparatus includes a first component with a first heat transfer element that has first component inlet and outlet ports through which a first fluid may pass. A second component is also included and likewise has a second heat transfer element with second component inlet and outlet ports to pass a second fluid. The first component has a body that can receive a third fluid for heat transfer with the first heat transfer element. The first and second components are releasably attachable with one another so that when attached both the first and second heat transfer elements effect heat transfer with the third fluid. Attachment and removal of the first and second components allows for the heat transfer rate of the apparatus to be varied. An associated method is also provided.
    Type: Grant
    Filed: October 26, 2005
    Date of Patent: December 11, 2007
    Assignee: Westinghouse Savannah River Company LLC
    Inventor: James G. Dobos
  • Patent number: 7306028
    Abstract: A modular based heat sink which can be easily optimized for a given heat source relies upon both phase change based heat transfer and condenser modules that combine the efficiency of folded fin cooling and the efficiency of the two phase heat transfer.
    Type: Grant
    Filed: June 23, 2005
    Date of Patent: December 11, 2007
    Assignee: Thermal Corp.
    Inventors: Jon Zuo, Ernest H. Dubble, Donald M. Ernst
  • Patent number: 7303005
    Abstract: Constructions for and methods of manufacturing graphite heat spreaders having thermal vias placed therethrough are provided. Thermal vias having one or two flanges are disclosed, as are flush thermal vias. Graphite heat spreaders having surface layers covering the graphite material are provided. Graphite heat spreaders having a layer of cladding for increased structural integrity are provided. Also disclosed are methods of co-forging a graphite heat spreader element with a metal thermal via in place therein.
    Type: Grant
    Filed: January 25, 2006
    Date of Patent: December 4, 2007
    Assignee: GrafTech International Holdings Inc.
    Inventors: Bradley E. Reis, Martin David Smalc, Brian J. Laser, Gary Stephen Kostyak, Prathib Skandakumaran, Matthew G. Getz, Michael Frastaci
  • Patent number: 7303002
    Abstract: A fin structure, a heat-transfer tube and a heat exchanger are formed of plate fins housed in a heat-transfer tube and have an excellent cooling efficiency by making the distribution and flow velocity of a flow uniform and by promoting an efficient heat-exchanging action. The fin structure includes plate fins housed in a heat-transfer tube and having a square section and a free shape in the longitudinal direction for dividing a passage for a fluid composed of a cooled medium or a cooling medium to flow in the heat-transfer tube, into a plurality of small passages. In the fin structure, notches, through holes, raised portions, ridges and/or troughs are formed in the sides or the upper or lower walls of the plate fins. The heat-transfer tube has the fin structure housed therein. The heat exchanger has the heat-transfer tube assembled therein.
    Type: Grant
    Filed: September 7, 2005
    Date of Patent: December 4, 2007
    Assignee: USUI Kokusai Sangyo Kaisha Limited
    Inventors: Shoichiro Usui, Tadahiro Goto
  • Patent number: 7299860
    Abstract: Invention disclosures novel design of structural components and fasteners that in addition to sound mechanical strength reveal excellent thermal characteristics, which allows using them as super efficient heat sinking/management solutions.
    Type: Grant
    Filed: January 24, 2006
    Date of Patent: November 27, 2007
    Inventor: Igor Victorovich Touzov
  • Patent number: 7299861
    Abstract: A water-cooling heat exchanger and a heat-dissipating device are mounted on a heat-generating element of a computer for rapidly guiding and dissipating the heat generated by the heat-generating element. A water-cooling head, a pump and a heat-dissipating fan are stacked up, and an annular heat exchanger is used to surround the above components, thereby to reduce the space of the whole construction to a lowest extent. With the heat-dissipating fan provided in the center of the annular heat exchanger, the airflow generated by the heat-dissipating fan can blow the heat exchanger in multiple directions, thereby to obtain the optimal effect of heat dissipation.
    Type: Grant
    Filed: January 13, 2006
    Date of Patent: November 27, 2007
    Assignee: Cooler Master Co., Ltd.
    Inventor: Lieh-Feng Lo
  • Patent number: 7299863
    Abstract: Disclosed is a louver fin type heat exchanger positioned upright at a certain angle with respect to the ground, wherein lower end portions of louver fins close to the ground are bent toward lower end portions of adjacent louver fins, such that the air passage at the lower end portion close to the ground has cross-section areas that are wide at certain portions and are narrow at other portions thereof. Accordingly, moisture congregates only at a portion where the cross-section of the air passage is great, so that the external air smoothly passes into or out the heat exchanger through the air passage where the moisture congregation does not occur, minimizing the pressure drop, and efficiency in heat exchange of the heat exchanger can be thusly improved.
    Type: Grant
    Filed: December 19, 2005
    Date of Patent: November 27, 2007
    Assignee: Korea Institute of Science and Technology
    Inventors: Dae-Young Lee, Hyun-Seon Choo
  • Patent number: 7296617
    Abstract: A heat sink for dissipating heat of an electronic device comprises a base, a first fin group comprising a plurality of fins stacked together, a second fin group comprising a plurality of fins and overlapping the first fin group, and a sinuous heat pipe attached to the base. The first and second fin groups are respectively engaged with the heat pipe twice at different locations of the first and second fin groups.
    Type: Grant
    Filed: September 7, 2005
    Date of Patent: November 20, 2007
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shi-Wen Zhou, Meng Fu
  • Patent number: 7296620
    Abstract: A heat exchanger apparatus includes an inlet header, an inlet connection connected to the inlet header, an outlet header, an outlet connection connected to the outlet header and a plurality of serpentine tube bodies. The plurality of serpentine tube bodies interconnect and are in communication with the inlet header and outlet header. Each serpentine tube body has a plurality of straight tube sections and a plurality of U-shaped return bend sections. Each one of the straight tube sections and each one of the return bend sections have an elliptically-shaped cross-sectional configuration. The plurality of serpentine tube bodies are arranged in a juxtaposed manner with consecutive ones of the serpentine tube bodies contacting each other at a point defining a series of stacked common planes disposed parallel with one another.
    Type: Grant
    Filed: March 31, 2006
    Date of Patent: November 20, 2007
    Assignee: EVAPCO, Inc.
    Inventors: Thomas William Bugler, III, George Robert Shriver, Richard Preston Merrill
  • Patent number: 7296619
    Abstract: A cooling device including a split-core with a plurality of twin fins connected with a plurality of grooves on the split-core is disclosed. Each twin fin includes a root and a pair of vanes extending from the root. Each root is connected with one of the grooves to mount the twin fins to the split-core. A heat spreader is in contact with a top portion of the vanes and a heat pipe is connected with the heat spreader and the split-core. A heat concentration in the split-core is dissipated by a thermal path through the heat pipes to the heat spreader and into the vanes and also by a path upward into the split-core and into the vanes via the roots of the twin fins.
    Type: Grant
    Filed: October 21, 2004
    Date of Patent: November 20, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Shankar Hegde
  • Patent number: 7293602
    Abstract: A fin and tube assembly for use in a heat exchanger comprising a carbon steel tube, a carbon steel fin, and an external brazing compound comprising a material selected from the group consisting of nickel, chrome, copper, aluminum, zinc, and graphite brazed to the tube and fin is disclosed. A method for making the assembly and a power plant which includes the assembly are also disclosed. The brazing compound functions to prevent corrosion of the carbon steel and also functions to attach the tube and fin together.
    Type: Grant
    Filed: June 22, 2005
    Date of Patent: November 13, 2007
    Assignee: Holtec International Inc.
    Inventors: Ranga Nadig, Ram Chandran, Michael Phipps
  • Patent number: 7290596
    Abstract: A thermal management system (300) includes a first heat transfer body (330) for providing a opposing heat flux to a localized region of elevated heat flux residing in adjacency to a region of lesser flux, such as on a surface (315a) of a circuit die (315) due to a integrated circuit hot-spot (310). A contact (320 or 321) defines a thermal conduction path for the opposing flux. A second heat transfer body (350) is in a heat transport relationship with the first heat transfer boy (330) and a second heat transport relationship with the region of lesser heat flux. In such arrangement, each region of heat flux is provided a thermal solution commensurate with the level of heat flux in the region. For example, the opposing heat flux of an active first heat transfer body (330), such as a thermoelectric cooler, may be provided at the hot-spot (310), while at the same time the lesser heat flux is absorbed by a passive second heat transfer body (350), such as a heat spreader.
    Type: Grant
    Filed: October 20, 2005
    Date of Patent: November 6, 2007
    Assignee: University of Maryland
    Inventors: Bao Yang, Avram Bar-Cohen
  • Patent number: 7287579
    Abstract: An exemplary heat exchanger includes a heat exchanger core having a core side fluid space and a cover plate and a substantially U-shaped wall fitted at one end with an inlet header and, at an opposing end, with an outlet header, which in combination with the cover plate, define a shell side fluid space. In this example, the cover plate forms two seals with two opposing sides of the U-shaped wall, forms a seal with the inlet header and forms a seal with the outlet header. Such a heat exchange may be suitable for use as an EGR cooler. Other exemplary devices, methods and systems are disclosed.
    Type: Grant
    Filed: September 5, 2006
    Date of Patent: October 30, 2007
    Assignee: Honeywell International, Inc.
    Inventors: Roland Dilley, Richard Paul Beldam, Steven M. Ayres
  • Patent number: 7287580
    Abstract: A heat exchanger having an active surface over which a fluid flows to affect an exchange of heat between the active surface and the fluid. In some embodiments, the active surface includes a logarithmic spiral wherein the radius of the logarithmic spiral measured at equiangular radii unfolds at a constant order of growth. Further embodiments exhibit an active surface conforming to the internal or external surface of particular class or genera of shells.
    Type: Grant
    Filed: July 10, 2006
    Date of Patent: October 30, 2007
    Assignee: Pax Scientific, Inc.
    Inventor: Jayden David Harman
  • Patent number: 7284597
    Abstract: A heat sink for removing heat from a heat-generating device includes a fin combination (10). The fin combination includes a plurality of fins interconnected together, each fin including a body (12), a flange (14) extending from the body and bent from an edge of the body, a tab (16) extending from an outer edge of the flange, a slot (17) formed in the body, and a detent (160) formed at a junction portion between the tab and the flange. The slot of a fin receives the tab of an adjacent fin. The detent of the adjacent fin engages with the flange and the body of the fin at a position near the slot of the fin, whereby the fin combination has the fins firmly connected together.
    Type: Grant
    Filed: September 16, 2005
    Date of Patent: October 23, 2007
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventor: Sheng-Jie Tang
  • Patent number: 7281573
    Abstract: A cooler includes a heat conducting member and a heat scattering member. The heat conducting portion is closely attached with a heat source. The heat scattering member has plural hollow cones respectively formed of sintered metallic particles with their size enlarged gradually from the bottom to the top. The metallic particles closer to the surface of the heat conducting member are smaller, having a greater contact area to transmit the heat more effectively. And, plus the ventilation of a fan on the heat scattering member, the air in the hole of the hollow cone is expelled out, so the air outside the hollow cone flows into its center through the porosities between the metallic particles, enabling the metallic particles of the hollow cone to increase the contact area with air for a better thermal release.
    Type: Grant
    Filed: December 14, 2005
    Date of Patent: October 16, 2007
    Assignee: Hua-Hsin Tsai
    Inventor: Ming-Kun Tsai
  • Patent number: 7281571
    Abstract: A heat exchanger comprising: a plurality of tubes in which a heat exchanging medium flows; tank members to which both end portions of these tubes are connected; and a female screw portion, into which a nut for attaching another member to the tank member is incorporated, brazed to the tank member, the female screw portion including: a main body portion, at the center of which a female screw hole is formed, penetrating a wall portion of the tank member; a flange portion, which is formed on one end side in the axial direction of the main body portion, contact with an outer plane of the wall portion; and a groove portion formed on a contact face of the flange portion contact with the outer plane of the wall portion, wherein the flange portion is brazed to the wall portion.
    Type: Grant
    Filed: August 17, 2005
    Date of Patent: October 16, 2007
    Assignee: DENSO Corporation
    Inventor: Shinya Miura