Abstract: Disclosed is a heat exchange apparatus. The heat exchange apparatus comprises a first valve member rotating about a first rotational axis, a second valve member rotating about a second rotational axis, and a heat exchanging medium that is positioned on a gas stream path formed between the first valve member and the second valve member, has a channel for enabling gas to pass therethrough, and receives and stores thermal energy from passing hot gas and then transfers the stored thermal energy to passing cold gas. A flow direction of the gas passing through the heat exchanging medium is repeatedly changed as the first and second valve members rotate. The heat exchange apparatus has first and second guides connected respectively to both sides of the heat exchanging medium and has passages for guiding the gas passing through the heat exchanging medium.

Abstract: A radiator structure used with a hot fluid and cooling fluid having a carbon fiber tube. The carbon fiber tube includes a wall portion having an inner surface and an outer surface. A passageway through the tube is used to conduct hot fluids. A second tube of similar construction is spaced form the first tube. A multiplicity of carbon fiber fins span and connect to the first and second tubes and are held thereto by a conductive adhesive.

Abstract: A thermosiphon cooling assembly includes a refrigerant disposed in a lower portion of a housing for undergoing a liquid-to-vapor-to-condensate cycle. A mixing device is disposed within the lower portion of the housing for increasing the transfer of heat from the electronic device during the liquid-to-vapor-to-condensate cycle. The mixing device may include a vapor stirrer disposed above the liquid of the refrigerant and/or a liquid stirrer disposed in the liquid of the refrigerant for moving the liquid of the refrigerant over a boiler plate.

Abstract: A thermosiphon cooling assembly for dissipating heat generated by an electronic device includes a housing having a housing top, housing bottom and opposing sides. The opposing sides extend between the housing top and the housing bottom to define a low profile entrance and a low profile exit. A refrigerant is disposed within one or more boiling chambers. Heat generated by the electronic device is transferred to the refrigerant by the boiling chambers for liquid-to-vapor transformation. Condenser tubes having a bottom end and a top end extend from the boiling chambers at a diagonally upward angle across the sides between the housing bottom and housing top. The condenser tubes receive and condense vapor boiled off from the refrigerant. Air moving devices axially move air through the housing. Air is flowed across the condenser tubes to facilitate condensation.

Abstract: An integrated liquid cooling system (100) includes a heat absorbing member (10), a heat dissipating member (20) and a pump (15). The heat absorbing member defines therein a fluid flow channel (115) for passage of a coolant. The heat dissipating member is mounted to and maintained in fluid communication with the heat absorbing member. The pump is received in the heat dissipating member and is maintained in fluid communication with the heat absorbing member and the heat dissipating member. The pump is configured for driving the coolant to circulate through the heat absorbing member and the heat dissipating member. The components (i.e., the heat absorbing member, the heat dissipating member and the pump) of the liquid cooling system are combined together to form an integrated structure without utilizing any separate connecting pipes.

Abstract: A radiator assembly includes a finned radiator core and a debris removing apparatus having a compressed air inlet and at least one compressed air outlet configured to direct compressed air through the radiator core. A work machine such as a wheel loader includes a radiator and a debris removing apparatus coupled with on-board compressed air and having at least one pressurized gas outlet configured to direct a gas toward the face of the radiator.

Abstract: In devices known in the art, “conventional firetube” and “waste heat recovery” boilers each require many small tubes making successive passes within the boiler. In one embodiment of the invention, however, an enhanced conduit replaces numerous conventional small tubes. In some embodiments, the enhanced conduit incorporates a plurality of fins, each of which extends through a wall of the conduit. In other embodiments, the enhanced conduit incorporates a plurality of tubes along its outer surface, through which a heat transfer medium flows. Both designs enhance the heat transfer relationship between the hot fluid and the heat transfer medium by providing a continuous heat transfer relationship with the heat transfer medium, increasing the surface area involved in the heat transfer relationship and enhancing convection/conduction couples. For some applications, all of the tube banks of other devices in the art can be replaced by one continuous enhanced conduit.

Abstract: A heat storing device for exchanging heat energy between a heat storing material and a fluid. The heat storing device has a heat storing module having heat storing material spaces filled with a heat storing material and fluid passages for a fluid to flow through adjacent to the heat storing material spaces. The heat storing module includes multiple plates in a stack. Each of the multiple plates has fluid passages in one side thereof. In mutually adjacent pairs of plates, the sides having the fluid passages face each other. When each pair of plates is seen face-on, with respect to the fluid passages of one of the plates, the fluid passages of the other plate intersect substantially at right angles, and the fluid passages of the two plates connect at these positions where they intersect.

Abstract: A thermosiphon cooling assembly cools an electronic device with a conical condensing tube disposed about a curved central axis curving upwardly from a top of the evaporating unit to an upper distal end and a shroud disposed outward of an exterior surface of the condensing tube at the upper distal end extending axially along the central axis from the upper distal end to a lower edge spaced from the top defining an air opening. An air moving device moves air about the central axis within the shroud to the air opening. A plurality of condensing fins are disposed in the condensing tube and each condensing fin forms a pair of corners with an interior surface of the condensing tube and a wick material is disposed in each of the corners to return condensed vapor to the evaporating unit.

Abstract: A liquid cooling device includes a heat-dissipating unit (1) and a heat-absorbing unit (2). The heat-dissipating unit (1) connects with the heat-absorbing unit (2) by an inlet pipe (4) and an outlet pipe (3) to form a closed circulation loop. The heat-dissipating unit (1) includes a base (10), a tank (20), a heat-dissipating body (30) beside the tank (20) and a cover (40), which are assembled together as a single unit. A pump (23) is placed in the tank (20) and operated to pump liquid coolant to flow in the circulation loop. During flowing through the base (10) and the cover (40), the liquid coolant transfers heat to the heat-dissipating body (30).

Abstract: A thermal concentrator composition with optimized design and reduced thermal resistance as a means of enhancing heat transfer and energy conversion. The composition comprises a low thermal resistance coating and methods of achieving quantum regions of energy transfer and non-linear design features resulting from cost effective manufacturing methods applicable to the material composition. The thermal concentrator composition is selected principally from the group of surface coatings, preferably comprised of diamond coatings, which are critical to obtaining maximum thermal transfer through classical and such quantum means including tunneling, waves, and phonon conversions.

Abstract: A heat dissipation device comprises a heat spreader for contacting an electronic device for absorbing heat therefrom. A plurality of fins is formed on the heat spreader. A first heat sink is separated from the heat spreader and comprises a first base substantially perpendicular to the heat spreader and a plurality of first fins formed on the first base. A second heat sink comprises a second base connecting with the first base and a plurality of second fins formed on the second base. Two heat pipes connect the heat spreader with the first base and the second base via opposite sides of the heat dissipation device. The heat pipes are partly sandwiched between the first base and the second base and transfers heat from the heat spreader to both of the first and the second heat sink.

Abstract: A loop-type heat exchange module (10) is disclosed, which includes an evaporator (11), a vapor conduit (12), a condenser (13), a liquid conduit (14), a cooling fan (16), a fastening seat (151) and a fan cover (152). The evaporator contains therein a working fluid. The working fluid evaporates into vapor after absorbing heat in the evaporator, and the generated vapor flows, via the vapor conduit, to the condenser where the vapor releases the heat and is condensed into condensate. The condensate then returns back, via the liquid conduit, to the evaporator to thereby form a heat transfer loop. The cooling fan is applied to produce a forced airflow towards the condenser. The fastening seat is used for fastening the evaporator to have an intimate contact with a heat-generating electronic component. The fan cover extends from one side of the fastening seat and receives the cooling fan and the condenser therein.

Abstract: A stacked, embossed plate heat exchanger (10) is provided for transferring heat between a first fluid flowing in a plurality of U-shaped flow paths (12) through the heat exchanger (10) and a second fluid flowing in a plurality of U-shaped flow paths (14) through the heat exchanger (10). Embossed beads (44) and (46) are provided in each of the plates (18A,18B) and are embossed on opposite sides of the plate (18A,18B) to mate with corresponding ones of the beads (44) and (46) on adjacent plates (18A,18B) to define the respective U-shaped flow paths (12,14).

Abstract: The present provides a heat-emitting element cooling apparatus which has a higher heat-emitting efficiency than that of conventional heat-emitting element cooling apparatus. A heat-emitting element cooling apparatus 1 includes a heat sink 7 and a fan unit 5. The heat sink 7 has a base 33 onto which a heat-emitting element is to be mounted, radiation fins of a first type 35, and radiation fins of a second type 37. The radiation fins 35 extend from an upper surface 33A in an upward direction. The radiation fins 37 extend from either of two side surfaces 33B and 33C in either of rightward and leftward directions. The radiation fins 35 and 37 continuously extend in forward and rearward directions respectively.

Abstract: An air cooled oil cooler has an upper plate, a lower plate and a plurality of tubes and outer fins disposed therebetween. Each tube contains an inner offset fin, and the outer fins formed in a corrugated shape and each having one return louver on an intermediate portion between a top portion and a bottom portion of the outer fin. The outer fins is disposed between the tubes so that the tubes and the outer fins are arranged alternatively and stacked in a pile between the upper and lower plates. The tubes are formed to be flat tubes having a height-width ratio of the tube to be 4.8-7.4%.

Abstract: A system for cooling heat-generating objects, such as computer boards situated in a rack, includes an enclosure in which the heat generating objects are situated. The enclosure has an air inlet and an air outlet, and a fan induces airflow into the air inlet, through the enclosure and out the air outlet. A heat exchanger is situated in the enclosure such that the heat exchanger is in a spaced apart relationship with the heat-generating object. Air moving through or past the heat-generating object is warmed, and the heat exchanger removes the heat before the air exits the enclosure.

Abstract: A core includes heat-exchange tubes and radiation fins are alternately stacked on each other. The heat-exchange tubes define refrigerant passages. A header tank is connected to the heat-exchange tubes. A partition separates the header tank into first and second header chambers to turn a refrigerant. The partition defines a communication hole allowing the first and second header chambers to communicate with each other.

Abstract: A heat dissipation device for electronic devices on a substrate comprises a base contacting one of the electronic devices for absorbing heat therefrom. A plurality of fins arranged on the base for dissipating heat. A plurality of airflow channels is defined between the fins, and each channel defines an intake and an outlet. A fan is located adjacent to the intakes and provides airflow entering the channels through the intakes and leaving the channels through the outlets. A first guiding member is located adjacent to the outlets. The airflow out of the outlets is guided, by the first guiding member, to be deflected towards the substrate for cooling other electronic devices neighboring the one contacting with the base.

Abstract: A heat dissipating device (1) includes a heat spreader (10), a radiator (2), at least one U-shaped heat pipe (12), a fan (3) mounted on the radiator and a pair of clips (4). The radiator includes a first heat sink (20) and a second heat sink (22). The first heat sink (20) includes a first base (200) and a plurality of fins (202) extending from a side of the first base. The second heat sink (22) includes a second base (220) and a plurality of fins (222) extending from a side of the second base. The heat pipe (12) includes an evaporating portion (120) attached to the heat spreader and a pair of condensing portions (122) extending upwardly from opposite ends of the evaporating portion. The two condensing portions are sandwiched between the first base and the second base. The heat pipe transfers heat from the heat spreader to both of the first base and second base.