Patents Examined by Teresa Walberg
  • Patent number: 8701749
    Abstract: A method for producing a heat exchanger, a) a coolant pipe and a blank are provided; b) a bead that is made of a plastic adhesive is placed between the coolant pipe and the blank so as to extend in a manner that is adapted to the shape of the coolant pipe; and c) the bead located between the coolant pipe and the blank is compressed.
    Type: Grant
    Filed: June 7, 2005
    Date of Patent: April 22, 2014
    Assignee: BSH Bosch und Siemens Hausgerate GmbH
    Inventors: Detlef Cieslik, Thorsten Kusnik, Berthold Pflomm
  • Patent number: 8662147
    Abstract: The present invention is directed to provide a geothermal air-conditioner device utilising the earth's temperature and electrical field for processing—preheating, cooling and purifying—room intake air. This air-conditioner device includes at least one first pressure reducing chamber (1) with air intake opening (8) and second pressure reducing chamber (2) with processed air outlet (9), whereas these chambers are connected to each other by air conduits (3) located in the ground for conveying air from the first pressure reducing chamber (1) to the second pressure reducing chamber (2). The earth layer (4) on the air channels (3) is covered by a coarse material layer (5), under which at least one first ventilation conduit (6) is extending, through which coarse material layer is connected to air in chamber (1). Likewise there is exhaust ventilation piping (7) to provide exhaust from the coarse material layer (5) located.
    Type: Grant
    Filed: July 10, 2007
    Date of Patent: March 4, 2014
    Assignee: Airmaker GTR Ltd
    Inventor: Heiki Juris
  • Patent number: 8662149
    Abstract: A cryogenic fluid vaporizer using ambient air comprising a conduit through which the fluid is passed having an outer finned tubular sleeve which includes a thermal insulation barrier between the conduit and the outer finned tubular sleeve. A fan may be included to provide an increased rate of heat transfer from the air to the outer surface of the fins of the tubular sleeve. The combination of the externally finned area and the insulating thermal barrier prevents the information of ice or frost on the exterior surface of the fins during the transfer of heat from the ambient air to the cryogenic fluid providing a frost-free cryogenic ambient air vaporizer for continuous operation.
    Type: Grant
    Filed: November 28, 2012
    Date of Patent: March 4, 2014
    Inventors: Robert E. Bernert, Jr., Robert E. Bernert, Sr.
  • Patent number: 8646516
    Abstract: A plate and fin type heat exchanger has a heat exchanger core made from a plurality of stacked, alternating first and second heat exchange plates of a generally inverted, U-shaped cross-section. Each plate has a top wall, closed peripheral sidewalls and open ends, and the open ends of the first plates are oriented at 90° to the open ends of the second plates. The sidewalls of the plates have end portions, which in adjacent plates, are aligned to form corners of the heat exchanger core. Opposed U-shaped manifold bodies are provided having open ends and lateral walls joined in a fluid tight manner to the aligned plate sidewall end portions. End plates close off the open ends of the U-shaped bodies to form manifolds. The corners formed by the aligned plate sidewall end portions allow for an improved connection between the heat exchanger core and the U-shaped manifold bodies.
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: February 11, 2014
    Assignee: Pana Canada Corporation
    Inventors: Kenneth Abels, W. Dennis Moss, Steven Lin, Alan Wu
  • Patent number: 8607850
    Abstract: A heat exchanger includes a heat-exchange section including a first group of tubes and a second group of tubes alternating with the first group of tubes. The first and second groups of tubes are in contact with a heat-conductive medium. In one structure, a first inlet manifold at a first end of the heat-exchange section is fluidly coupled to first ends of the first group of tubes. A first outlet manifold is isolated from the first inlet manifold and is fluidly coupled to first ends of the second group of tubes. A second inlet manifold at a second end of the heat-exchange section is fluidly coupled to second ends of the second group of tubes. A second outlet manifold is isolated from the second inlet manifold and is fluidly coupled to second ends of the first group of tubes.
    Type: Grant
    Filed: September 29, 2011
    Date of Patent: December 17, 2013
    Assignee: Kappes, Cassiday & Associates
    Inventors: Daniel W. Kappes, Dustin J. Albin
  • Patent number: 8584735
    Abstract: A cooling device includes a heat sink body having a plurality of elongated channels that extend between respective channel inlets and outlets. A synthetic jet actuator module is adjacent to the heat sink body and includes a plurality of jet outlets adjacent to the respective channel inlets for emitting a plurality of vortices into the channels.
    Type: Grant
    Filed: July 28, 2009
    Date of Patent: November 19, 2013
    Assignee: Aerojet Rocketdyne of DE, Inc.
    Inventor: David W. Gerlach
  • Patent number: 8584743
    Abstract: Provided is a solid type heat dissipation device for electronic communication appliances. The solid type heat dissipation device includes a graphite thin plate horizontally transferring heat, a plurality of metal fillers passing through the graphite thin plate to vertically transfer heat, and a plurality of metal thin plates attached to upper and lower surfaces of the graphite thin plate and connected to the metal fillers.
    Type: Grant
    Filed: April 22, 2010
    Date of Patent: November 19, 2013
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Seok-Hwan Moon, Seung Youl Kang, Kyoung Ik Cho, Moo Jung Chu
  • Patent number: 8579016
    Abstract: An exemplary heat dissipation device dissipating heat generated by an electronic element mounted on a printed circuit board includes a supporter, a heat conducting base, a first fin assembly and a heat pipe. The heat conducting base is securely attached to a bottom side of the supporter and thermally contacting the electronic element. The first fin assembly is securely attached to a top side of the supporter. The heat pipe includes an evaporator sandwiched between the supporter and the heat conducting base, and a condenser extending through the supporter and extending in the first fin assembly.
    Type: Grant
    Filed: January 15, 2010
    Date of Patent: November 12, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Guo Chen, Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 8573289
    Abstract: A Heat Exchanger comprising a three-dimensional ordered microstructure material within a shell. The three-dimensional ordered microstructure material has dimensions that allow for large surface area to volume ratios, between 300 and 15000 m2/m3. Alternatively the three-dimensional ordered microstructure may have an open volume fraction between 0.4 and 0.6. The three-dimensional ordered microstructure may be comprised of hollow truss elements and partially filled with a thermally conductive material or a fluid. The Heat Exchanger has a heat transfer coefficient multiplied by the surface area to volume ratio between 3.7*107 and 7*109 Watts per M3K.
    Type: Grant
    Filed: July 20, 2009
    Date of Patent: November 5, 2013
    Assignee: HRL Laboratories, LLC
    Inventors: Christopher S. Roper, William B. Carter, Alan J. Jacobsen
  • Patent number: 8561676
    Abstract: A cooler (20) arranged in a PCU (12) is provided with a bottom plate (22), a top plate (28) and a shell (30) arranged between the bottom plate and the top plate. The shell (30) is provided with an inflow side pipe (32) and an outflow side pipe (34) for making a cooling medium flow inside. The bottom plate (22) is provided with fixing holes (36, 38) for fixing the cooler (20) at a suitable position in the PCU (12). Between the fixing hole (38) and the outflow side pipe (34), a notched section (42) is arranged on the bottom plate (22) to partially reduce rigidity so that the shell (30) does not break when an impulsive power is applied to the cooler (20). A notched section (40) may be arranged between the part where the fixing hole (36) is arranged and the inflow side pipe (32).
    Type: Grant
    Filed: August 6, 2008
    Date of Patent: October 22, 2013
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventor: Ken Asakura
  • Patent number: 8544530
    Abstract: A heat dissipation device includes a plurality of fins, a plurality of heat pipes connected to the fins in a thermal conductive relationship and a plurality of electric conductors extending through the fins. The fins are stacked together and spaced from each other. The heat pipes are extended through the fins. The electric conductors are electrically connected to the fins to enable consistent metal oxide films to be formed all over surfaces of the fins when anodizing the fins.
    Type: Grant
    Filed: August 4, 2009
    Date of Patent: October 1, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Wei Li, Yi-Qiang Wu, Chun-Chi Chen
  • Patent number: 8540012
    Abstract: A heat exchanger and a method for fabricating the heat exchanger are disclosed. The heat exchanger comprises a heat exchanger core that is formed from a plurality of stacked aluminum panels that are joined together via friction stir welding. Each panel in the core is formed from at least two aluminum extrusions that are joined to one another via friction stir welding.
    Type: Grant
    Filed: June 15, 2009
    Date of Patent: September 24, 2013
    Assignee: Lockheed Martin Corporation
    Inventors: Nicholas J. Nagurny, Natalie B. Levings, Derek M. Beckner, Michael R. Eller, Patrick D. Grandelli, Joe Van Ryzin, Eliot Goldstein, Randy J. Brown, Leslie D. Kramer, Robert J. Howard
  • Patent number: 8534349
    Abstract: A heat exchanger tube (1), wherein a plurality of refrigerant passages (5) extending in the longitudinal direction of the tube are formed in a flat tube body (2) with a specified length parallel with each other in the lateral direction of the tube and, where the overall cross sectional area of the tube body (2) is (At), the overall cross sectional area of the refrigerant passage (5) is (Ac), the outer peripheral length of the tube body (2) is (L), and the overall inner peripheral length of the refrigerant passage (5) is (P), set so that the relation of Ac/At×100=30 to 55 and P/L×100=150 to 325 can be established, whereby a heat exchanging performance can be increased.
    Type: Grant
    Filed: November 22, 2001
    Date of Patent: September 17, 2013
    Assignee: Keihin Thermal Technology Corporation
    Inventors: Naoki Nishikawa, Koichiro Take, Noboru Ogasawara
  • Patent number: 8534345
    Abstract: The present invention provides a housing having an aperture adapted to receive a heat transfer unit. The heat transfer unit attaches to the housing and directs a heat transfer sleeve into the housing. The heat transfer sleeve also provides an aperture adapted to receive a beverage. The heat transfer sleeve stores a heat transfer material including but not limited to a fluid, gel, or other substance that can be heated or cooled depending upon the desired effect on the beverage. The removable heat transfer unit releasably attaches to the housing for removal of the unit to heat or cool the heat transfer material for use in affecting the temperature of the beverage.
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: September 17, 2013
    Assignee: Koolio, Inc.
    Inventors: Marcus French, Barbara French, Jeffrey Haynes, Joyce Hurd
  • Patent number: 8522862
    Abstract: The invention relates to a cooling fluid cooler for motor vehicles having a soldered cooling network (1) made of flat tubes (101) and ribs (102), produced from very thin aluminum sheets (a, b, c), and having header or loop-around chambers (3) at the ends of the flat tubes (101) for the cooling fluid flowing in the flat tubes (101), said chambers being cooled by cooling air flowing through the ribs (102). The cooling fluid cooler has exceptional cooling power and a light weight. This is achieved according to the invention in that each flat tube (101) is made of at least two formed sheet metal strips (a, b, c), wherein at least the one sheet metal strip (a, b) forms the wall of the flat tube and the other sheet metal strip forms a wavy internal insert (c) forming channels (10) in the same, and that the ratio of the constriction factor on the cooling fluid side to the constriction factor on the cooling air side is approximately in the range of 0.20 to 0.
    Type: Grant
    Filed: June 24, 2008
    Date of Patent: September 3, 2013
    Assignee: Modine Manufacturing Company
    Inventors: Frank Opferkuch, Jan Böbel, Axel Fezer, Klaus Mohrlok, Ulrich Schäffer
  • Patent number: 8505616
    Abstract: An exemplary cold plate housing defines an inlet port and an outlet port. A plurality of foam strip assemblies are disposed in the housing. The foam strip assemblies are arranged within the housing so coolant is flowable through a width of the foam strips. Each foam strip assembly includes at least first and second foam strip members each suitably having pore size of no more than around 50 micrometers and porosity of at least around 80 percent, and a first spacer member is interposed between the first and second foam strip members. Each of the foam strip assemblies may include a second spacer member interposed between the first spacer member and one of the first and second foam strip members. The spacer member may include a high thermal conductivity material, such as a metal like copper or aluminum, or a low thermal conductivity material such as a polymer or plastic.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: August 13, 2013
    Assignee: The Boeing Company
    Inventors: William W. Behrens, Andrew R. Tucker
  • Patent number: 8499825
    Abstract: The present invention provides a method for manufacturing a heat transfer member which method allows peel-off and cracking possibly caused by thermal expansion to be inhibited. That is, the present invention provides a method for manufacturing a heat transfer member 10, the method at least including a step of forming metal powder into a coating film 12 on a surface of a base material 11 by spraying the metal powder in a solid state onto the surface of the base material 11 together with compressed gas. In the film forming step, a spraying pressure at which the metal powder is sprayed onto the surface of the base material 11 is set so that the coating film 12 has a porous structure.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: August 6, 2013
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Yoshihiko Tsuzuki, Noritaka Miyamoto
  • Patent number: 8496049
    Abstract: A heat sink with distributed jet cooling is provided. The heat sink includes a base for thermal connection to at least one heated object, an array of fins thermally coupled to the base, and at least one multi-orifice synthetic jet or multiple single orifice jets disposed on a side of the array of fins. A heat sink with distributed and integrated jet cooling is also provided and includes a base and an array of fins. Respective ones of at least a subset of the fins comprise a synthetic jet configured to eject an ambient fluid into an ambient environment of the fins and base. Another heat sink with distributed and integrated jet cooling is provided and includes a base, an array of fins and multiple synthetic jets coupled to respective ones of the fins. The synthetic jets are provided for at least a subset of the fins.
    Type: Grant
    Filed: April 9, 2009
    Date of Patent: July 30, 2013
    Assignee: General Electric Company
    Inventors: Mehmet Arik, Tunc Icoz, Juan Manuel Rivas Davila, Charles Erklin Seeley, Yogen Vishwas Utturkar, Stanton Earl Weaver, Jr.
  • Patent number: 8490681
    Abstract: The invention provides a fluid cooling system comprising a heat exchanger with an outer wall forming a chamber with an inlet and an outlet for circulating a heat exchange medium in the chamber. The chamber has an opening towards the component which is to be cooled, and to protect the component, the opening is closed by a flexible wall which is attached to the outer wall. To protect the cover and the component against overload, the flexible wall is attached to an inner wall inside the chamber. The cooling system could be applied to electronic systems, e.g. for cooling a DCB substrate or similar electronic components.
    Type: Grant
    Filed: March 9, 2005
    Date of Patent: July 23, 2013
    Assignee: Danfoss Silicon Power GmbH
    Inventors: Ronald Eisele, Klaus Kristen Olesen
  • Patent number: 8485247
    Abstract: A multiple-layered microfluidic device includes at least a first fluid path and at least a second fluid path, wherein the first fluid path includes a layer or portion of a layer of the microfluidic device. The first path has multiple rows of serpentine wall segments positioned there along. The wall segments extend in a direction along the first path. The rows extend along a direction cross-ways to the first path. Adjacent ones of wall segments within a row are arranged such that concave portions face concave portions of adjacent ones of segments, while convex portions face convex portions of adjacent ones of segments.
    Type: Grant
    Filed: November 23, 2009
    Date of Patent: July 16, 2013
    Assignee: Corning Incorporated
    Inventor: Elena Daniela Lavric