Patents Examined by Teresa Walberg
-
Patent number: 8479805Abstract: A heat-dissipating assembly includes a body and a bottom plate. The body has a heat-absorbing portion. The interior of the heat-absorbing portion is provided with a chamber covered by the bottom plate. The chamber has an evaporating region for generating a high pressure, and a condensing region for generating a low pressure. The pressure gradient between the evaporating region and the condensing region is used to drive the circulation of liquid/vapor phase of a working fluid. With this structure, heat can be conducted rapidly without providing any wick structure.Type: GrantFiled: August 31, 2010Date of Patent: July 9, 2013Assignee: Asia Vital Components Co., Ltd.Inventors: Shyy-Woei Chang, Kuei-Feng Chiang
-
Patent number: 8474512Abstract: A cooler device for a motor vehicle includes a radiator liquid cooler with a first cooler element for cooling radiator liquid for the motor vehicle's combustion engine, a charge air cooler with a second cooler element for cooling of charge air for the combustion engine, the first and the second cooler elements extending substantially parallel and side by side, with a narrow space between the cooler elements. A screening device in the space between the cooler elements regulates the air flow through the elements. A control mechanism switches the screening device to and fro between an open position in which the screening device does not, or at least does not appreciably, limit the air flow through the cooler elements, and a closed position in which the screening device limits the air flow through the cooler elements.Type: GrantFiled: June 25, 2007Date of Patent: July 2, 2013Assignee: Scania CV AB (Publ)Inventors: Rickard Pettersson, Frida Ödmark
-
Patent number: 8474518Abstract: A tank body 125 comprising header tanks 120 of a radiator is composed with a polyamide composition containing polyamide 6,10, glass fiber, copper and nucleating agent. At this time, the polyamide composition contains, based on the total weight of the polyamide 6,10, the glass fiber, the copper and the nucleating agent, (a) 48.9 to 79.988 percent by weight of the polyamide 6,10, (b) 20 to 50 percent by weight of the glass fiber, (c) 0.002 to 0.1 percent by weight of the copper, and (d) 0.01 to 1.5 percent by weight of the nucleating agent, and the result of measuring half-crystallization time of the polyamide composition is 5 minutes or less. In addition, the polyamide 6,10 used has a relative viscosity, as measured in 98 percent sulfuric acid, of 2.3 to 2.9.Type: GrantFiled: March 19, 2008Date of Patent: July 2, 2013Assignee: Denso CorporationInventors: Shinya Goto, Takahiko Nagaya, Masahiro Nozaki
-
Patent number: 8459338Abstract: The invention relates to a scraped surface heat exchanger (100) comprising a heat exchanging wall (20) having an cylindrical inner surface (21) with a radius (R+.delta.), a shaft (10) being rotatable mounted inside of and concentrically to the inner surface (21) of the heat exchanging wall (20) and having at least one gap portion (10A) with an outer surface (11) and a radius (R), and at least one scraping member (40) supported by the shaft (10) and extending to the inner surface (21) of the heat exchanger wall (20), characterized in that the at least one or the gap portions (10A) with an outer surface (11) and a radius (R) extend over at least 60% of the circumference of the shaft (10).Type: GrantFiled: March 6, 2012Date of Patent: June 11, 2013Assignee: INVENSYS APV A/SInventors: Knud Thorsen, Preben Koeningsfeldt, Ole Poulsen
-
Patent number: 8459334Abstract: A system and method to improve long term reliability of an integrated circuit package containing a patterned metal thermal interface (PMTI), the method including: coupling a heat sink to a heat source; providing a PMTI material between the heat source and the heat sink; providing a partial containment of a compressed malleable metal to impede the PMTI from being inched-out of its location under a bearing load.Type: GrantFiled: July 31, 2009Date of Patent: June 11, 2013Assignee: International Business Machines CorporationInventors: Yves C. Martin, Theodore G. Van Kessel
-
Patent number: 8453717Abstract: A heat sink comprising a heat spreader attached to a three-dimensional ordered open-cellular microstructure material. The three-dimensional ordered open-cellular microstructure material has dimensions that allow for large surface area to volume ratios. The three-dimensional ordered open-cellular microstructure may be comprised of hollow truss elements and partially filled with a thermally conductive material or a fluid.Type: GrantFiled: July 20, 2009Date of Patent: June 4, 2013Assignee: HRL Laboratories, LLCInventors: Christopher S. Roper, William B. Carter
-
Patent number: 8424590Abstract: A geothermal sleeve for a building structure keeps air at a moderate temperature by passing through a geothermal heat exchanger (e.g., pipes) located underground. The moderate air is drawn up from the underground pipes and pumped into existing spaces between the interior and exterior walls (or surfaces) of a dwelling. The moderate air fills in the spaces between the interior and exterior walls to create a geothermal sleeve to supplement climate control inside the building structure.Type: GrantFiled: April 18, 2008Date of Patent: April 23, 2013Inventor: Raymond Stuart Calamaro
-
Patent number: 8413712Abstract: A cooling device has a large number of closely spaced impinging jets, adjacent an impingement gap, with parallel return paths for supplying coolant flow for the impinging jets with the least possible pressure drop using an interdigitated, branched hierarchical manifold. Surface enhancement features spanning the impingement gap form U-shaped microchannels between single impinging jets and single outlets.Type: GrantFiled: November 13, 2006Date of Patent: April 9, 2013Assignee: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Urs Kloter, Ryan Joesph Linderman, Bruno Michel, Hugo E. Rothuizen
-
Patent number: 8397795Abstract: In a heater core that constitutes part of a vehicular air conditioning apparatus, first and second fins having louvers therein are arranged between a plurality of tubes. The first fins are disposed on a first heating section, which faces toward a first front passage through which air from a first blower unit flows, whereas the second fins are disposed on a second heating section, which faces toward a first rear passage through which air from a second blower unit flows. Further, as a boundary portion between the first heating section and the second heating section, partitioning fins, which do not contain any louvers therein, are disposed separately from the first and second fins.Type: GrantFiled: October 15, 2009Date of Patent: March 19, 2013Assignee: Keihin CorporationInventor: Takahiro Seto
-
Patent number: 8381802Abstract: This invention provides a heat transfer device which can improve its heat transfer performance in a heat exchanger with a flow rate of heat carrier fluid being set at a relatively low velocity, while restricting increase in pressure loss of the fluid flow. Plural longitudinal vortex generator winglets (10) are arranged in a spanwise direction on each side of the heat transfer object (T). The winglets on each side are oriented substantially in the same direction for deflecting the fluid to the same direction and conducting the fluid to an area behind the object. Each of the winglets has a configuration gradually decreasing in its height toward an upstream side of a flow of the fluid. Longitudinal vortices are produced behind the winglets by the fluid flowing rearward beyond the winglets.Type: GrantFiled: December 27, 2006Date of Patent: February 26, 2013Assignee: National University Corporation Yokohama National UniversityInventors: Kouichi Nishino, Gil-Dal Song
-
Patent number: 8376030Abstract: A system for heating includes a heat exchanger. The heat exchanger receives hot exhaust from combustion. The heat exchanger uses the heat from the hot exhaust to heat a fluid. A method for heating uses a heat exchanger. The heat exchanger receives hot exhaust and a fluid. The heat exchanger heats the fluid.Type: GrantFiled: December 26, 2006Date of Patent: February 19, 2013Inventor: Jayant Jatkar
-
Patent number: 8365810Abstract: A heat sink includes a heat conducting base, a heat conducting shaft thermally connected to and rotating with respect to the base, and a plurality of fins. The shaft includes a heat absorbing section thermally connected to the base and a heat dissipating section connected with the heat absorbing section. The fins are disposed on the heat dissipating section of the shaft.Type: GrantFiled: July 2, 2009Date of Patent: February 5, 2013Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Shou-Biao Xu, Shi-Wen Zhou, Chun-Chi Chen
-
Patent number: 8353332Abstract: An integrated electronics cooling device including a substrate having a first surface for mounting one or more electronic components and a second surface, a cooling assembly including a cooling chamber bounded on one side by the second surface of the substrate, and a vacuum insulated coolant conduit for providing a coolant to and removing the coolant from the cooling assembly.Type: GrantFiled: October 13, 2010Date of Patent: January 15, 2013Inventor: Aarne H. Reid
-
Patent number: 8327921Abstract: A fin assembly includes a plurality of fins interconnected together. Each of the fins includes a main body defining a plurality of openings and a plurality of locking units formed on the main body beside the plurality of openings, respectively. Each of the locking units includes an extension tab, a locking tab and a connecting tab. An engaging hole is defined in the extension tab. The locking tab forms an elastically deformable finger thereon. A locking tab of a fin is received in a corresponding opening of an adjacent fin. A free end of the locking tab of the fin resists on a connecting tab of the adjacent fin. A finger of the fin is engaged into an engaging hole of the adjacent fin.Type: GrantFiled: June 11, 2009Date of Patent: December 11, 2012Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventor: Xin-Xiang Zha
-
Patent number: 8322403Abstract: A heat sink includes a fixing base, a plurality of heat pipes and a fixing body. The bottom surface of the fixing base is provided with a connecting plane and extends upwards to form a fixing arm. The fixing arm is provided with a plurality of first grooves. The fixing body is provided with a plurality of second grooves and combined with the fixing arm. The second grooves correspond to the first grooves for cooperatively receiving and clamping the upper edges of the evaporating sections of the heat pipes. The evaporating section of the heat pipe is provided with a contacting plane and an adhering plane. The contacting planes of the evaporating sections are adjacent to each other and the evaporating sections are fixed to the connecting plane of the fixing base. With this arrangement, the juxtaposed heat pipes can be assembled with the fixing base. Further, the condensing section of the heat pipe penetrates a plurality of fins to form the heat sink.Type: GrantFiled: September 4, 2009Date of Patent: December 4, 2012Assignees: Cpumate Inc., Golden Sun News Techniques Co., Ltd.Inventors: Kuo-Len Lin, Chen-Hsiang Lin, Ken Hsu, Chih-Hung Cheng
-
Patent number: 8316923Abstract: A heat dissipation device includes a heat sink, a plurality of fasteners extending through the heat sink, a fan holder mounted on the heat sink and a fan secured on the fan holder. The heat sink includes multiple claws to retain the fasteners therein. The fan holder includes a hoop surrounding the heat sink and a bracket supporting the fan. A plurality of sleeves are formed on the hoop and aligned with the claws of the heat sink, to thereby guide a tool to manipulate the fasteners to secure the heat sink to a printed circuit board.Type: GrantFiled: September 24, 2009Date of Patent: November 27, 2012Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventor: Jian Yang
-
Patent number: 8316921Abstract: A heat sink includes a fin assembly including a plurality of fins and a plate type heat pipe attached to the fin assembly. The plate type heat pipe includes a sealed shell in which a working fluid is filled, a wick layer formed on an inner face of the shell and a supporting member disposed in the shell. The supporting member includes a plurality of supporting portions and a plurality of bodies connecting the supporting portions. Each supporting portion includes a plurality of convex portions contacting a top of the wick layer and a plurality of concave portions contacting a bottom of the wick layer. The convex portions and the concave portions of each supporting portion are alternately arranged. Each convex portion and an adjacent concave portion cooperatively enclose a first through hole for the working fluid flowing therethrough.Type: GrantFiled: September 4, 2009Date of Patent: November 27, 2012Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Chuen-Shu Hou, Jiang-Jun Hu, Min Lu, De-Yu Wang
-
Patent number: 8316925Abstract: A heat exchanger arrangement comprising a charge cooler and a housing. The charge cooler comprises a charge cooler core, a header plate, a coolant entry duct and a coolant exit duct. Specifically, the charge cooler core comprises hallow heat-transfer elements through which a coolant can flow. The housing is in the form of a chamber with a single aperture for receiving the cooler core and comprises an air entry duct, an air exit duct and a flange. The cooler core is fixed inside the housing by fixing the header plate of the charge cooler to the flange of the housing. Additionally, the header plate of the charge cooler closes the single aperture for receiving the cooler core.Type: GrantFiled: June 30, 2008Date of Patent: November 27, 2012Assignee: Joāo de Deus & Filhos, S.A.Inventors: Eduardo Alberto Nunes Mendes Pimentel, Helder José Trindade Cavaca
-
Patent number: 8312919Abstract: A tray for a vacuum deposition apparatus includes a base having an upper surface, a number of cooling pipes fixed to the base each having a plurality of alternately arranged cooling portions and conduits, and a number of engaging members. The cooling portions protrude from the upper surface and each has a cooling channel therein. Two ends of the cooling channel communicate with two adjacent conduits. Each of the engaging members each has a hole surrounding a corresponding cooling portion therein.Type: GrantFiled: June 30, 2009Date of Patent: November 20, 2012Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Chung-Pei Wang
-
Patent number: 8297342Abstract: A heat sink assembly including a first member having a heat transfer surface adapted to directly contact a device to be cooled; a second member including coolant channels and a separate fluid channel; and a connection which at least partially mechanically connects the first member to the second member. The connection includes three bellows forming three conduits between the channels in the second member and the first member. A second one of the bellows and a third one of the bellows are located inside a first one of the bellows.Type: GrantFiled: June 29, 2009Date of Patent: October 30, 2012Assignee: International Business Machines CorporationInventor: Mark Delorman Schultz