Patents Examined by Teresa Walberg
  • Patent number: 8291968
    Abstract: A distributor of flowable medium for a heat exchanger has a housing member and at least one substantially vertically oriented tube member arranged therein. The distributor has a hollow body arranged to be supported in one end of the tube member. An upturned funnel shaped core member is formed in the hollow body, resulting in an annular flow passage between the body and the core member. The body has an upper section with an inlet, a lower section with an outlet, and a mid section between the upper and lower sections. The flow passage extends from the inlet to the outlet at the lower section, and is configured to narrow progressively from the inlet towards the mid section, and widen progressively from the mid section towards the outlet for modifying flow characteristics of the medium flowing through the passage. Intake guide elements are provided at the upper section.
    Type: Grant
    Filed: August 9, 2006
    Date of Patent: October 23, 2012
    Assignee: Eestech, Inc.
    Inventor: Gregory Mark Paxton
  • Patent number: 8291966
    Abstract: Microelectronic devices with improved heat dissipation, methods of making microelectronic devices, and methods of cooling microelectronic devices are disclosed herein. In one embodiment, the microelectronic device includes a microelectronic substrate having a first surface, a second surface facing opposite from the first surface, and a plurality of active devices at least proximate to the first surface. The second surface has a plurality of heat transfer surface features that increase the surface area of the second surface. In another embodiment, an enclosure having a heat sink and a single or multi-phase thermal conductor can be positioned adjacent to the second surface to transfer heat from the active devices.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: October 23, 2012
    Assignee: Micron Technology, Inc.
    Inventors: Joseph T. Lindgren, Warren M. Farnworth, William M. Hiatt, Nishant Sinha
  • Patent number: 8281848
    Abstract: A heat exchanger assembly includes a first heat exchanger having a pair of mounts attached to one of the tanks of the first heat exchanger and a second heat exchanger having a pair of brackets attached to one of the tanks of the second heat exchanger. The brackets are freely insertable into the mounts when the two heat exchangers are at an acute angle with respect to each other. When the two heat exchangers are parallel with each other, an interference condition exists between the brackets and the mounts. The opposite side of the heat exchangers is secured using a retainer on one heat exchanger extending through a strap on the other heat exchanger.
    Type: Grant
    Filed: January 15, 2008
    Date of Patent: October 9, 2012
    Assignee: DENSO International America, Inc.
    Inventor: Sang Bae Park
  • Patent number: 8281849
    Abstract: The invention relates to a heat exchanger with at least two plate-shaped flow ducts which are in parallel to one another and at a distance from one another and have a flow connection through at least one connecting duct (8) which spans the distance. It is proposed that the at least one connecting duct (8) be formed by two self-centering tube connectors (4, 6) which can be plugged one into the other.
    Type: Grant
    Filed: September 7, 2006
    Date of Patent: October 9, 2012
    Assignee: Behr Industry GmbH & Co.
    Inventors: Steffen Grözinger, Horst Rothenhöfer, Volker Velte
  • Patent number: 8267163
    Abstract: A tube for a heat exchanger is disclosed, the tube including a plurality of protuberances formed on an inner surface of the tube. The protuberances are arranged in a pattern that maintains a substantially constant cross sectional hydraulic area along a length of the tube.
    Type: Grant
    Filed: March 17, 2008
    Date of Patent: September 18, 2012
    Assignee: Visteon Global Technologies, Inc.
    Inventor: Graeme Stewart
  • Patent number: 8251132
    Abstract: A heat sink assembly includes a base, a fin group and a heat pipe connecting with the base and the fin group. The fin group includes a plurality of fins. Each of the fins defines a recess at a lower portion thereof. The heat pipe includes an evaporating portion extending through the base and a condensing portion extending through the fin group. The base is interferentially fitted into the recesses of the fins. The base, the fin group and the heat pipe directly and intimately connect with each other. The recess and the base have correspondingly T-shaped profiles. Each fin forms a bended flange defining the recess. The bended flange intimately contacts with the base and the evaporating portion of the heat pipe.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: August 28, 2012
    Assignees: Fu Zhun Precision Industry (ShenZhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jun Cao, Shi-Wen Zhou, Chun-Chi Chen
  • Patent number: 8245761
    Abstract: A heat sink includes a plurality of metal fins interconnected together. Each metal fin includes a main plate, a flange extending forwardly from the main plate and an interlocking unit formed on the flange. The interlocking unit includes an engaging ear and a hook. The ear extends rearwards from a rear edge of the flange and defines a locking hole therein. The flange defines a cutout adjacent to a front edge thereof. The cutout is aligned with the ear and recessed rearwards from the front edge of the flange. The hook extends forwardly from the flange and is located within the cutout. The ear of a fin is engaged in the cutout of an adjacent rear fin. The hook of the adjacent rear fin is engaged in the locking hole of the engaging ear of the fin.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: August 21, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Lei Han, Jun Ding, Ye-Fei Yu, Jun Li
  • Patent number: 8240361
    Abstract: The invention relates to a combined thermal protection and surface temperature control apparatus. In one embodiment, a combined thermal protection and surface temperature control apparatus comprises a porous member having an entrance side, and a separate exit side. One or more coolant entrance channels extend through the entrance side, extend part-way through the porous member, and end within the porous member before reaching the exit side. Conversely, one or more coolant exit channels begin within the porous member, extend through a portion of the porous member, and extend through the exit side. The coolant entrance and exit channels may be parallel and may alternate. The channels may only extend across a portion of the thickness of the porous member.
    Type: Grant
    Filed: November 2, 2006
    Date of Patent: August 14, 2012
    Assignee: The Boeing Company
    Inventors: William W. Behrens, Andrew R. Tucker
  • Patent number: 8230903
    Abstract: A heat sink for cooling a heat-generating device includes a base and a cooling section coupled thereto for cooling the device. The cooling section includes a plurality of flow tubes, each flow tube having an inlet, an outlet, and a bounding wall that defines a closed fluid flow path from the inlet to the outlet. Each of the flow tubes includes a central axis that is substantially parallel to a reference plane of the heat-generating device. The flow tubes may be arranged in a layered stack and include a bounding wall that has a thickness that decreases with increasing distance in the layered stack. The flow tubes may also include a cross-sectional area that decreases with increasing distance in the layered stack. Furthermore, the bounding wall of the flow tubes may have a non-planar configuration in a direction generally parallel to the central axis.
    Type: Grant
    Filed: April 18, 2008
    Date of Patent: July 31, 2012
    Assignee: International Business Machines Corporation
    Inventors: Stephen P. Ayotte, David J. Hill, Kristen L. Holverson, Christina M. Pepi, Timothy M. Sullivan
  • Patent number: 8230902
    Abstract: The present invention relates to a heat-dissipating element and a heat sink having heat-dissipating elements. The heat sink includes at least one substrate and a plurality of heat-dissipating elements. The substrate includes a base portion and a plurality of extending arms. Insertion slots are provided between each extending arm and two adjacent extending arms. Each heat-dissipating element is inserted in the corresponding insertion slot of the substrate. The lateral surfaces of each extending arm abut against the corresponding surfaces of the each heat-dissipating elements. A plurality of embossed heat-dissipating portions protrudes from at least one surface of each heat-dissipating element. According to the above, the present invention avoids the use of solders and heat transfer loss. Via the embossed heat-dissipating portions, the surface area of the heat-dissipating element for heat dissipation can be increased and thus the heat-dissipating effect is enhanced.
    Type: Grant
    Filed: March 25, 2008
    Date of Patent: July 31, 2012
    Assignee: Neng Tyi Precision Industries Co., Ltd.
    Inventor: Wen-Chen Wei
  • Patent number: 8225852
    Abstract: A heat exchanger suitable for a vehicle includes a plurality of tubular first members arranged in a row and forming elongate gaps. These members form passageways for flow of a first fluid for heat exchange with cooling air flowing through the gaps. The first members and gaps form a primary heat exchange area. Inlet and outlet manifolds are connected to the first members for directing the first fluid through the first members. An associated cooling device circulates liquid coolant and comprises flat tube-like second members, each extending into a respective gap in a secondary area which is part of the primary area but smaller. The second members each have a thickness at least the width of their respective gaps. At least some of the first members can be formed with cut-outs in opposite flat sides, these cut-outs being sealingly closed by the second members.
    Type: Grant
    Filed: April 30, 2008
    Date of Patent: July 24, 2012
    Assignee: Dana Canada Corporation
    Inventors: Alan K. Wu, Kenneth Abels
  • Patent number: 8220527
    Abstract: A heat dissipation device includes a heat spreader for thermally engaging with a heat generating electronic device, a heat sink assembly located above the heat spreader, and first and second heat pipes connecting with the heat spreader and the heat sink assembly. Each of the first and second heat pipes comprises an evaporation section engaged in the heat spreader, two arc-shaped condensation sections thermally inserted in the heat sink assembly, and two connecting sections interconnecting corresponding condensation sections and the evaporation section. The condensation sections are coplanar with each other and located in a same circle. The condensation sections of the first heat pipe extend in a clockwise direction, while the condensation sections of the second heat pipe extend in an anticlockwise direction.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: July 17, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Peng Liu, Shi-Wen Zhou, Chun-Chi Chen, Yi-Jiun Li
  • Patent number: 8215380
    Abstract: The present invention relates to a hot water heat transfer pipe that exchanges heat between its interior and exterior. A plurality of projections, each having a height in the range of 0.8-2.0 mm or 0.1-0.25 times the inner diameter, is provided in at least one part of an inner surface of a portion of the heat transfer pipe positioned in a section where the Reynolds number of the fluid flowing in the interior is less than 7,000 to improve the heat transfer performance in the low Reynolds number zone and minimize pressure loss inside the pipe.
    Type: Grant
    Filed: May 11, 2005
    Date of Patent: July 10, 2012
    Assignees: Tsinghua University, Daikin Industries, Ltd.
    Inventors: Zhi xin Li, Ji an Meng, Mitsuharu Numata, Kazushige Kasai
  • Patent number: 8210246
    Abstract: A heat exchanger assembly includes a pair of outer headers each defining an outer cavity and a pair of inner headers each defining an inner cavity. Each inner header is disposed in one of the outer headers, and each header defines a plurality of header slots. A plurality of first fluid tubes extend between the outer headers from one of the header slots of each outer header to fluidly interconnect the outer cavities defined by the outer headers and a plurality of second fluid tubes are interleaved with the first refrigerant tubes and extend between the outer headers and through one of the header slots of each outer header and through the associated outer cavities defined by the outer headers and to the one of the header slots of each inner header to fluidly interconnect the inner cavities defined by the inner headers.
    Type: Grant
    Filed: March 11, 2008
    Date of Patent: July 3, 2012
    Assignee: Delphi Technologies, Inc.
    Inventors: Mohinder Singh Bhatti, Mark James Zima, Prasad Shripad Kadle
  • Patent number: 8210248
    Abstract: A heat exchanging core for a micro-channel heat exchanger includes at least one heat conducting plate, which has at least one channel formed between a first side and a second side of the heat conducting plate. The at least one channel has a channel length to hydraulic diameter ratio of less than 100, wherein the channel length is defined as a distance between the first and second sides of the heat conducting plate. A micro-channel heat exchanger includes a housing defining a cavity therein, the housing including an inlet and an outlet coupled to the cavity, and a heat exchanging core positioned within the cavity between the liquid inlet and the liquid outlet. The present invention provides, among other features, improved heat transfer, reduced pressure drops, and reduced jitter. The present invention can be implemented for laminar flow and/or turbulent flow environments.
    Type: Grant
    Filed: June 20, 2007
    Date of Patent: July 3, 2012
    Assignee: ASML Holding N.V.
    Inventor: Herman Vogel
  • Patent number: 8205664
    Abstract: A combination heat sink form of a stack of radiation fins is disclosed. Each radiation fin has retaining flanges at two opposite lateral sides for securing another radiation fin. Each retaining flange has a bottom neck perpendicularly extending from the respective radiation fin, two pairs of vertically spaced retaining fingers respectively extending from two opposite lateral sides of the bottom neck in a parallel manner relative to the respective radiation fin for securing another radiation fin, a top retaining notch defined between the two pairs of vertically spaced retaining fingers above the bottom neck for accommodating the bottom neck of another radiation fin, and a retaining gap defined between each two vertically spaced retaining fingers for receiving another radiation fin.
    Type: Grant
    Filed: May 19, 2008
    Date of Patent: June 26, 2012
    Assignee: Kwo Ger Metal Technology, Inc.
    Inventor: Chun-Hao Deng
  • Patent number: 8201618
    Abstract: A heat dissipation module includes a heat column and a plurality of heat dissipation fins disposed outside of the heat column and connected with the heat column. The heat column has a column body and a base, and the column body has a top portion and a sidewall ringed with the top portion. The sidewall and the top portion are integrally formed. The base is disposed opposite to the top portion, and the base has an indentation for allowing an end of the sidewall of the column body to insert so as to form a closed space between the base and the column body. The base further has an annular protrusion close to the indentation, and after the end of the sidewall of the column body is inserted into the indentation of the base, the annular protrusion is processed to be filled between the indentation and the sidewall so as to tightly assemble the base and the column body.
    Type: Grant
    Filed: April 4, 2007
    Date of Patent: June 19, 2012
    Assignee: Delta Electronics Inc.
    Inventors: Min-Hui Yu, Chi-Feng Lin, Chin-Ming Chen
  • Patent number: 8196646
    Abstract: A heat exchanger assembly including a first and second heat exchangers disposed in sandwiched relationship with one another. The tubes and air fins of the first and second heat exchangers are aligned with one another in a transverse air flow direction. A plurality of middle connecting portions are integral with and extend in the transverse air flow direction between the aligned first and second air fins of the two heat exchangers. Each of the middle connecting portions has a slot for impeding heat conduction between the first and second air fins, and each of the slots in the middle connecting portions is disposed closer to the first tubes than to the second tubes to maximize the effective length of the second air fin.
    Type: Grant
    Filed: December 15, 2008
    Date of Patent: June 12, 2012
    Assignee: Delphi Technologies, Inc.
    Inventors: Lin-Jie Huang, Prasad S. Kadle
  • Patent number: 8171986
    Abstract: An apparatus includes a foam metal panel heat exchanger core positioned in a duct, an inlet flow passage for directing a first fluid to the heat exchanger core, and an exit flow passage for directing the first fluid from the heat exchanger core, wherein the inlet flow passage is tapered relative to an inlet face of the heat exchanger core and the exit flow passage is tapered relative to an outlet face of the heat exchanger core. The first fluid has a substantially uniform flow distribution through the core. The inlet and exit flow passages can be adjacent to each other. The core can be formed of a compressed foam.
    Type: Grant
    Filed: April 2, 2008
    Date of Patent: May 8, 2012
    Assignee: Northrop Grumman Systems Corporation
    Inventor: John Frederick Klein
  • Patent number: 8167027
    Abstract: A pipe arrangement for geothermal probes includes at least two pipes having at least one layer each that surrounds a lumen. One of the pipes functions as inflow pipe and the other pipe functions as return flow pipe. At least one of the pipes is produced at least in part from a non cross-linked polymer material and is distinguished in that the polymer material of the at least one layer for the pipes has a FNCT value (full notched creep test) according to ISO 16770 of at least 3000 hours.
    Type: Grant
    Filed: March 21, 2008
    Date of Patent: May 1, 2012
    Assignee: Rehau AG. & Co.
    Inventor: Volker Liebel