Patents Examined by Thiem Phan
  • Wiring harness for an aerial vehicle
    Patent number: 9828091
    Abstract: Systems and methods are provided for a wiring harness for an aerial vehicle. A wing of the aerial vehicle comprises a pocket for insertion of the wiring harness. The wiring harness provides wiring and associated connections capable to attach to and power various components.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: November 28, 2017
    Assignee: X Development LLC
    Inventors: Damon Vander Lind, Eric Chin, Kurt Hallamasek
  • Exterior member mounting method
    Patent number: 9831017
    Abstract: An exterior member attaching method includes four steps. In an exterior member loading step, an exterior member is loaded onto a base plate in a state where the electric wire regulation pins provided on the base plate pass through exterior member holes. In an electric wire loading step, the electric wire is placed on the exterior member along the electric wire regulation pins. In an exterior member temporary bonding step, the electric wire is nipped by temporarily bonding a second half of the exterior member on the movable temporary bonding portion to a first half of the exterior member on the base plate while pushing the electric wire regulation pins to the base plate side. In an exterior member actual bonding step, a bonding end edge is bonded by moving a bonding roller.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: November 28, 2017
    Assignee: YAZAKI CORPORATION
    Inventors: Takafumi Ishida, Koji Nishina, Takaaki Yanagihashi
  • Method for forming wiring
    Patent number: 9832886
    Abstract: A method for forming a wiring according to the present invention includes: applying an ink (6) that exhibits electrical conductivity upon light absorption to a contact hole formation portion of an upper face of an insulating resin layer (3) formed on a lower wiring element (2); and irradiating the ink (6) with light to render the ink (6) conductive and also to remove a part of the insulating resin layer (3) by heat emitted from the ink (6) so as to form a contact hole (5), the part of the insulating resin layer (3) lying under the portion of the face to which the ink (6) is applied. A step of forming an upper wiring element (4) on the upper face of the insulating resin layer (3) may further be carried out, the upper wiring element (4) being electrically continuous with the lower wiring element (2) through the contact hole (5).
    Type: Grant
    Filed: March 5, 2015
    Date of Patent: November 28, 2017
    Assignee: NATIONAL UNIVERSITY CORPORATION YAMAGATA UNIVERSITY
    Inventors: Daisuke Kumaki, Shizuo Tokito, Yu Kobayashi, Shohei Norita
  • Motor stator locating method
    Patent number: 9819249
    Abstract: A motor stator locating method for locating a motor stator structure on a circuit board is disclosed. The motor stator structure includes a base and a contact pad set. The base is provided at a central portion thereof with a raised portion, which is wound around by a coil having a plurality of turns. The contact pad set is correspondingly attached to one side of the base opposite to the raised portion, and has a first and a second contact pad. The coil has two ends respectively connected to the first and the second contact pad. With these arrangements, the motor stator structure can be manufactured at largely improved production efficiency and reduced error rate.
    Type: Grant
    Filed: March 3, 2015
    Date of Patent: November 14, 2017
    Assignee: Asia Vital Components (Chengdu) Co., Ltd.
    Inventor: Meng Shen
  • Resin sealing method of motor core
    Patent number: 9819251
    Abstract: Provided is a resin sealing method of a motor core having a rotor core and a stator core formed in such a way that a plurality of iron core pieces is laminated. The resin sealing method includes pressing the rotor core and the stator core from a direction of lamination by using a set of an upper die and a lower die, then extruding a resin stored in a resin reservoir pot provided in one or both of the upper die and the lower die by using a plunger and allowing a magnet-insert hole formed in the direction of lamination of the rotor core and a connection hole formed in the direction of lamination of the stator core to be filled with the resin and harden the resin.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: November 14, 2017
    Assignee: MITSUI HIGH-TEC, INC.
    Inventor: Hirotoshi Mabu
  • Component placement device as well as a method for picking up a component and placing a component on a substrate
    Patent number: 9814144
    Abstract: A component placement device for picking up a component and placing a component on a substrate device comprises a holder which is movable at least in a main direction, as well as a nozzle for picking up a component. The nozzle is movable at least in a direction opposite the main direction relative to the holder. The component placement device comprises a fluid flow channel which opens or closes upon movement of the nozzle in the direction opposite the main direction relative to the holder, detection means for detecting the opening or closing of the fluid flow channel as well as means for controlling the movement of the holder in at least the main direction on the basis of a signal delivered by the detection means concerning the opening or closing of the fluid flow channel.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: November 7, 2017
    Assignee: Assembléon B.V.
    Inventors: Roy Brewel, Richard Adrianus Johannes Van der Burg, Petrus Adrianus Antonius Van Hoogstraten
  • Core manufacturing device
    Patent number: 9812239
    Abstract: A manufacturing device for a rotor core includes: a magnetization device that magnetizes magnet raw materials before being magnetized disposed in magnet insertion holes of the rotor core to turn the magnet raw materials before being magnetized into permanent magnets; and a detachment device that detaches the rotor core from the magnetization device. The detachment device also functions as a mounting device that mounts a jig around the rotor core when the rotor core is detached from the magnetization device.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: November 7, 2017
    Assignee: JTEKT CORPORATION
    Inventors: Keita Nimura, Naotake Kanda, Ryosuke Yamaguchi
  • Connector installation tool
    Patent number: 9806483
    Abstract: A connector installation tool can include an inner surface having a first portion having a first perimeter, where the inner surface forms a cavity that traverses a first length of the inner surface. The connector installation tool can also include an opening having a width and traversing a second length of the outer surface and the first length of the inner surface. The connector installation tool can further include a front face located adjacent to and substantially perpendicular to the first portion of the inner surface. The connector installation tool can also include a rear face located adjacent to a distal end of the inner surface, where the rear face is substantially parallel to the front face.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: October 31, 2017
    Assignee: Cooper Technologies Company
    Inventors: Adam D. Ledgerwood, Timothy Daly
  • System for coupling a conductive substrate to a ribbon cable
    Patent number: 9799965
    Abstract: Devices and methods are disclosed for coupling a multi-conductor cable to a flexible substrate by means of a crimp.
    Type: Grant
    Filed: May 17, 2014
    Date of Patent: October 24, 2017
    Inventor: Igor Ofenbakh
  • Method for laying multiple conductors in a container
    Patent number: 9796494
    Abstract: A method for laying multiple conductors in a container may be provided. The method may comprise receiving the multiple conductors at a monitoring station; receiving the multiple conductors at a drive; and receiving the multiple conductors at the container.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: October 24, 2017
    Assignee: Southwire Company, LLC
    Inventors: Richard Temblador, Allan W. Daniel, John D. Moore, Daniel Irvin, Franklin Calhoun, Juan Alberto Galindo Gonzalez
  • Production management system for component mounting machine
    Patent number: 9801317
    Abstract: A production management system is configured so as to make it possible to produce component mounting boards to the same specifications in two lanes of a component mounting machine using one set of NC data by arranging feeders of two feeder set bases in the same manner and setting the mounting order of the components to the circuit boards in the two lanes to be the same in a same-direction production mode in which circuit boards are conveyed in the same front/back direction in the two lanes. In addition, the arrangement of the feeders and the mounting order of the components are optimized so that the difference in production times in the two lanes in the same-direction production mode is minimized.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: October 24, 2017
    Assignee: FUJI MACHINE MFG. CO., LTD.
    Inventors: Takashi Kurashina, Hiroaki Muratsuchi
  • Method of producing a liquid cooled coldplate
    Patent number: 9795057
    Abstract: A liquid cooled coldplate has a tub with an inlet port and an outlet port and a plurality of pockets recessed within a top surface of the tub. Each pocket has a peripheral opening and a ledge, the ledge disposed inwardly and downwardly from the peripheral opening. The inlet port and outlet port are in fluid communication with the pocket via an inlet slot and an outlet slot. A plurality of cooling plates are each received by a pocket and recessed within the pocket. Each cooling plate comprises an electronics side for receiving electronics and enhanced side for cooling the cooling plate. The enhanced side of the cooling plate comprises a plurality of pins formed by micro deformation technology. The tub may be formed by extrusion.
    Type: Grant
    Filed: May 16, 2016
    Date of Patent: October 17, 2017
    Inventors: Matthew A. Reeves, Robert Scott Holland, Sy-Jenq Loong
  • Method of manufacturing a semiconductor device
    Patent number: 9786540
    Abstract: A system and method for a semiconductor wafer carrier is disclosed. An embodiment comprises a semiconductor wafer carrier wherein conductive dopants are implanted into the carrier in order to amplify the coulombic forces between an electrostatic chuck and the carrier to compensate for reduced forces that result from thinner semiconductor wafers. Another embodiment forms conductive layers and vias within the carrier instead of implanting conductive dopants.
    Type: Grant
    Filed: October 13, 2014
    Date of Patent: October 10, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yung-Jean Lu, Ming-Fa Chen, Chen-Shien Chen, Jao Sheng Huang
  • Cylindrical surface spin weld apparatus
    Patent number: 9768574
    Abstract: A spin weld apparatus for spin welding a prepared end of a coaxial cable with a coaxial connector includes a cable clamp dimensioned to grip the coaxial cable and a drive collet dimensioned to enclose and rotationally interlock with a lateral surface of the coaxial connector. The drive collet is dimensioned to rotationally interlock with an interlocking portion of a spin welder. The spin welder is dimensioned to axially align the coaxial connector with the coaxial cable for spin welding when the drive collet is rotationally interlocked with the spin welder.
    Type: Grant
    Filed: March 24, 2011
    Date of Patent: September 19, 2017
    Assignee: CommScope Technologies LLC
    Inventor: Kendrick Van Swearingen
  • Device for stripping a cable
    Patent number: 9768575
    Abstract: A device for simultaneously stripping at least two cable ends surrounded by insulation material includes a cutting device having first and second cutters that are movable relative to each other in a direction perpendicular to the longitudinal direction of the cable ends. The cutting edges of the first and second cutters are disposed substantially in the same plane and are movable towards each other such that the cutting edges simultaneously cut into the insulation material of the at least two cable ends. In addition, the cutting device and the cable ends are movable relative to each other in the longitudinal direction of the cable ends to simultaneously pull-off the cut insulation material from the at least two cable ends and thereby strip the at least two cable ends.
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: September 19, 2017
    Assignee: KOMAX SLE GMBH & CO., KG
    Inventor: Thomas Haslinger
  • Interposers
    Patent number: 9769923
    Abstract: Interposer circuitry (130) is formed on a possibly sacrificial substrate (210) from a porous core (130?) covered by a conductive coating (130?) which increases electrical conductance. The core is printed from nanoparticle ink. Then a support (120S) is formed, e.g. by molding, to mechanically stabilize the circuitry. A magnetic field can be used to stabilize the circuitry while the circuitry or the support are being formed. Other features are also provided.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: September 19, 2017
    Assignee: Invensas Corporation
    Inventors: Bong-Sub Lee, Cyprian Emeka Uzoh, Charles G. Woychik, Liang Wang, Laura Wills Mirkarimi, Arkalgud R. Sitaram
  • Physical unclonable interconnect function array
    Patent number: 9768110
    Abstract: A method for fabricating an interconnect function array includes forming a first plurality of conductive lines on a substrate, forming an insulator layer over the first plurality of conductive lines and the substrate, removing portions of the insulator layer to define cavities in the insulator layer that expose portions of the substrate and the first plurality of conductive lines, wherein the removal of the portions of the insulator layer results in a substantially random arrangement of cavities exposing portions of the substrate and the first plurality of conductive lines, depositing a conductive material in the cavities, and forming a second plurality of conductive lines on portions of the conductive material in the cavities and the insulator layer.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: September 19, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kai D. Feng, Wai-Kin Li, Ping-Chuan Wang, Zhijian Yang
  • Method for cracking a connecting rod
    Patent number: 9759253
    Abstract: The machine for cracking a connecting rod comprises an electro press with an electric motor (400) for actuating an expandable element. The electro press comprises a first S actuator part (410) and a second actuator part (430) arranged so that when the first actuator part is driven by the electric motor (400) from a first position to a second position, (a) the first actuator part (410) is first driven by the electric motor (400) from said first position (FIG. 12A) to an intermediate position (FIG. 12B), without displacing the second actuator part (430), and (b) subsequently the first actuator part (410) is further driven by the electric motor (400) from said intermediate position (FIG. 12B) to said second position (FIG. 12C), displacing the second actuator part from a non-expanding position to an expanding position.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: September 12, 2017
    Assignee: GAINDU, S.L.
    Inventors: Gorka Prieto, Javier Pena
  • Method for manufacturing printed wiring board
    Patent number: 9756735
    Abstract: A method for manufacturing a printed wiring board includes forming on carrier a laminate including a second metal foil, a resin layer laminated on the second foil and a first metal foil laminated on the resin layer, irradiating laser upon the first foil such that opening is formed through the first foil and resin layer and exposes surface of the second foil at bottom, plating the first foil such that a via conductor is formed in the opening and a first conductor layer including the first foil and an electroplating film is formed on surface of the resin layer, removing the carrier from the laminate, patterning the first conductor layer on the resin layer, and patterning the second foil such that a second conductor layer including the second foil is formed on opposite surface of the resin layer. The second foil has thickness greater than thickness of the first foil.
    Type: Grant
    Filed: October 19, 2015
    Date of Patent: September 5, 2017
    Assignee: IBIDEN CO., LTD.
    Inventor: Teruyuki Ishihara
  • Method for manufacturing lithium-ion capacitor
    Patent number: 9754725
    Abstract: A method for drying an electrode pair is disclosed. In at least one embodiment, the method includes preparing a positive electrode by applying a positive electrode material to a current collector; preparing a negative electrode by applying a negative electrode material to a current collector; preparing one set of an electrode pair made up of a positive electrode, a separator, and a negative electrode which are laminated in this order or preparing sets of electrode pairs, the sets being laminated, a separator being provided between the respective sets, each of the electrode pairs being made up of a positive electrode, a separator, and a negative electrode which are laminated in this order; accommodating the electrode pair(s) in a container; and drying the container in which the electrode pair(s) has been accommodated by use of the freeze-drying method.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: September 5, 2017
    Assignee: ESPEC Corp.
    Inventor: Junichi Inahara