Patents Examined by Thiem Phan
  • Patent number: 10054645
    Abstract: An object of the present invention is to accurately perform deterioration determination of a lithium ion secondary battery. In order to attain the object, in a deterioration determination method of the present invention, first, measurement processing of charging a deterioration determination target which is a battery cell or a battery module connecting a plurality of battery cells with each other up to a predetermined voltage value, discharging, and measuring a charge voltage value (a charge voltage value after the start of the discharge) within a predetermined period of time from the start of the discharge is repeated a plurality of times. Then, a deterioration state of the deterioration determination target is determined in consideration of a change mode of the charge voltage value after the start of the discharge due to the repetition of the charge and discharge.
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: August 21, 2018
    Assignee: NEC Corporation
    Inventor: Kenji Kobayashi
  • Patent number: 10056729
    Abstract: A terminal reel cart that supports two reels of terminals and two terminal applicators such that the terminal applicators can be loaded with the strip of terminals and moved into position relative to a terminal station of a wire processing system. The terminal reel cart supports the reels of terminals and the terminal applicators. The reel cart includes a plurality of wheels that allow the cart to be easily moved throughout a processing facility. The reel cart includes a pair of paper take up reels that are each driven by a motor and collects the paper backing from the strip of terminals. The paper take up reels are driven by a drive motor on the wire processing system.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: August 21, 2018
    Assignee: Artos Engineering Company
    Inventors: Michael A. Kirst, Rich Schwartz
  • Patent number: 10056522
    Abstract: One embodiment of the present invention provides an apparatus for attaching conductive tabs to photovoltaic structures. The apparatus includes a cassette configured to store a plurality of conductive tabs and a pick-and-place apparatus configured to obtain a conductive tab from the cassette and place the conductive tab at an edge of a photovoltaic structure. The pick-and-place apparatus further includes a tab holder configured to pick up and release the conductive tab and a substantially horizontal track coupled to the tab holder. The tab holder is further configured to move back and forth along the track.
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: August 21, 2018
    Assignee: SolarCity Corporation
    Inventor: Pablo Gonzalez
  • Patent number: 10051769
    Abstract: Provided is an electronic component mounting system that includes an electronic component mounting line that includes multiple electronic component mounters to which identification marks, respectively, are affixed, a management computer, and a portable terminal that has a recognition unit that recognizes the identification mark. In the management computer, a maintenance operation plan is created, a maintenance instruction in which the maintenance operation plan and the identification mark are associated with each other is issued, each of the multiple maintenance instructions and maintenance information that is associated with each of the multiple maintenance instructions are stored, one of the multiple maintenance instructions and maintenance information that is associated with the one maintenance instruction are transmitted to the portable terminal.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: August 14, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Hiroaki Kurata
  • Patent number: 10049813
    Abstract: A method of roll-forming with gap fillers for a solenoid used for a transmission includes the steps of providing a can of a solenoid, the can having a discontinuous surface with a gap, providing additional material in the gap, and roll-forming the additional material in the gap simultaneously with roll-forming the can to maintain a smooth path for rollers during roll-forming for the solenoid.
    Type: Grant
    Filed: April 25, 2016
    Date of Patent: August 14, 2018
    Assignee: BORGWARNER INC.
    Inventor: Philip A. Ruehl
  • Patent number: 10048301
    Abstract: An electromagnetic chamber absorber provided improved absorption across a wideband and both lower diffuse and specular scatter and a method for constructing the same. An exemplary device can compromise a periodic arrangement of disconnected electromagnetically lossy elements where the periodicity of the lattice is adjusted to suppress all or most grating lobe scattering. Because the electromagnetically lossy elements are disconnected, scalable manufacturing approaches are enabled. The lossy elements can be easily fabricated via shaping, which includes rolling, folding and cutting resistive and/or magnetic sheet materials. The lossy elements can be repeatably placed in a periodic lattice using low density scaffolding approaches and/or other alignment mechanisms. The absorption at the lower frequency part of the electromagnetic bands (below 1-2 GHz) can be improved via the addition of parallel lossy sheets into the low-density scaffolding.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: August 14, 2018
    Inventors: Kathleen C. Maloney, James G. Maloney, Rebecca B. Schultz, John W. Schultz
  • Patent number: 10050500
    Abstract: A coil end shaping apparatus shapes three flatwise bent portions f1 to f3 in a lead wire portion extending from one end of a coil by bringing first and second shaping dies close to each other such that one of the flatwise bent portions is bent in the direction that is opposite to the direction in which the rest are bent. The second shaping die, which is a movable die, has an clearance portion that prevents a portion of the lead wire portion to be bent along the flatwise direction on the side closest to the free end from being restrained by not contacting the lead wire portion while the flatwise bent portions on the base end side with respect to the flatwise bent portion on the side closest to the free end, of the three flatwise bent portions, are shaped in the lead wire portion.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: August 14, 2018
    Assignees: AISIN AW CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Shingo Hashimoto, Katsuya Ito, Takanori Ota, Norihiko Akao, Hirotaka Kawaura, Hisayuki Kobayashi, Hiroharu Sugiura
  • Patent number: 10048462
    Abstract: A manufacturing method of an imaging module and an imaging module manufacturing apparatus capable of performing positioning of an imaging element unit and a lens unit with high accuracy are provided. A manufacturing apparatus 200 holds a lens unit 10 and an imaging element unit 20 on a Z axis, and images a measurement chart by an imaging element 27 in a state where a probe 113a comes into contact with each of terminals 14A to 14F electrically connected to an x-direction VCM 16A, a y-direction VCM 16C, and a z-direction VCM 16E of the lens unit 10 and electricity flows to a lens drive unit 16 inside the lens unit 10. A contactor of the probe 113a is configured of a non-magnetic material.
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: August 14, 2018
    Assignee: FUJIFILM Corporation
    Inventor: Takashi Mitsuyasu
  • Patent number: 10039185
    Abstract: Provided is a landless multilayer circuit board and a manufacturing method thereof. The manufacturing method includes steps of forming a first circuit on a first substrate, patterning a photoresist layer to form at least one via between the first circuit and a second circuit, forming at least one connecting pillar in the at least one via, removing the photoresist layer, forming a second substrate to cover the at least one connect pillar, and forming the second circuit on the second substrate. The second circuit is connected to the first circuit through the at least one connecting pillar. When the second circuit is formed, the at least one via does not need to be filled, thereby making the second circuit flat.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: July 31, 2018
    Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.
    Inventors: Ting-Hao Lin, Chiao-Cheng Chang, Yi-Nong Lin
  • Patent number: 10038292
    Abstract: A method for connecting a plurality of insulated wires to each other is provided. Each of the insulated wires has a conductor portion and an insulating coating covering the conductor portion. The insulating coating is made of an insulating material. The method includes stripping the insulating coating of each of the insulated wires to expose the conductor portion such that the insulating coating is removed from a section of the insulated wire along a direction in which the insulated wire extends and at a location away from an end portion of the insulated wire, and connecting the conductor portions of the insulated wires. The connecting includes crimping a crimp joint terminal onto the exposed conductor portions to join the exposed conductor portions, and after the crimping, welding the conductor portions by applying pressure and electric current or ultrasonic vibration to the crimp joint terminal.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: July 31, 2018
    Assignee: YAZAKI CORPORATION
    Inventors: Syogo Matsuoka, Sanae Katou, Ayako Shimizu
  • Patent number: 10034390
    Abstract: A method includes forming a plurality of metal posts. The plurality of metal posts is interconnected to form a metal-post row by weak portions between neighboring ones of the plurality of metal posts. The weak portions include a same metal as the plurality of metal posts. A majority of each of the plurality of metal posts is separated from respective neighboring ones of the plurality of metal posts. An end portion of each of the plurality of metal posts is plated with a metal. The plurality of metal posts is disposed into a metal post-storage. The method further includes retrieving one of the metal posts from a metal-post storage, and bonding the one of the metal posts on a metal pad.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: July 24, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Li Hsiao, Su-Chun Yang, Chih-Hang Tung, Da-Yuan Shih, Chen-Hua Yu
  • Patent number: 10021820
    Abstract: An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.
    Type: Grant
    Filed: September 8, 2015
    Date of Patent: July 10, 2018
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Jin-Song Zheng, Jing-Bin Liang, Hai-Gui Huang, Jun-Xi Liu, Ming-Jun Yi, Er-Hui Guo, Zhou Chen, Xi-Qiang Hu
  • Patent number: 10015920
    Abstract: An external set-up device calculates a shift amount of a supply position of a component which is supplied by a tape feeder that is disposed on the carriage. The storage stores supply position shifting data in which the shift amount of the component supply position is related to a feeder address and a feeder ID. The component mounter compares the feeder ID of the tape feeder with the feeder ID included in the component supply position shifting data which is read from the storage, and, in a case in which the feeder IDs do not match, calculates the shift amount of the component supply position of the corresponding tape feeder and updates the supply position shifting data. The component mounter mounts the components onto a board based on the updated component supply position shifting data.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: July 3, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Hideki Sumi
  • Patent number: 10014580
    Abstract: A method for manufacturing and turning a near field communication antenna is provided. A method for manufacturing and tuning a near field communication antenna comprising loading one or more ferrite substrates onto a workstation, loading an antenna biscuit onto the workstation, the antenna biscuit comprising one or more interconnected antennas, stamping the antenna biscuit to form one or more individual antennas, applying the one or more individual antennas to the one or more ferrite substrates to form one or more antenna assemblies, and adjusting placement of the one or more individual antennas relative to the ferrite substrates to adjust functional properties of the one or more antenna assemblies.
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: July 3, 2018
    Assignee: A.K. Stamping Company, Inc.
    Inventors: Arthur Kurz, Bernard Duetsch
  • Patent number: 10014579
    Abstract: A method for manufacturing and turning a near field communication antenna is provided. A method for manufacturing and tuning a near field communication antenna comprising loading one or more ferrite substrates onto a workstation, loading an antenna biscuit onto the workstation, the antenna biscuit comprising one or more interconnected antennas, stamping the antenna biscuit to form one or more individual antennas, applying the one or more individual antennas to the one or more ferrite substrates to form one or more antenna assemblies, and adjusting placement of the one or more individual antennas relative to the ferrite substrates to adjust functional properties of the one or more antenna assemblies.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: July 3, 2018
    Assignee: A.K. Stamping Company, Inc.
    Inventors: Arthur Kurz, Bernard Duetsch
  • Patent number: 10010000
    Abstract: A system for manufacturing a product includes a mating connector connected to solder pins to provide an electrical conducting path, the solder pins being aligned against solder pads so that each solder pin is thermally and electrically connected to its corresponding solder pad by a solder paste bead. The system also includes a controller to adjust electrical resistive heating of a solder paste bead during a soldering process according to a temperature of the solder paste bead. A method of manufacturing a product includes aligning the solder pins against the solder pads, connecting the mating connector to the solder pins, and heating a solder paste bead by an electrical resistive heating, the solder paste bead undergoing a soldering process, where a temperature of the solder paste bead is being evaluated and the electrical resistive heating is adjusted according to the temperature of the solder paste bead.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: June 26, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Bruce J. Chamberlin, Andreas Huber, Harald Huels, Thomas-Michael Winkel
  • Patent number: 10002985
    Abstract: A solar cell module and a method for manufacturing the same are disclosed. The solar cell module includes solar cells each including a semiconductor substrate, and first electrodes and second electrodes extending in a first direction on a surface of the semiconductor substrate, conductive lines extended in a second direction crossing the first direction on the surface of the semiconductor substrate and connected to the first electrodes or the second electrodes through a conductive adhesive, and an insulating adhesive portion extending in the first direction on at least a portion of the surface of the semiconductor substrate, on which the conductive lines are disposed, and fixing the conductive lines to the semiconductor substrate and the first and second electrodes. The insulating adhesive portion is attached up to an upper part and a side of at least a portion of each conductive line.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: June 19, 2018
    Assignee: LG ELECTRONICS INC.
    Inventors: Joonhan Kwon, Hyeyoung Yang, Bojoong Kim
  • Patent number: 9999137
    Abstract: A method for filling a via on a printed circuit board formulates a paste as a dispersion of copper particulate that includes nanocopper particles in a solvent and a binder and depositing the paste into a via cavity formed in the printed circuit board. Heating the paste-filled cavity removes most of the solvent. The method sinters the deposited paste in the via cavity, planarizes the sintered via, and overplates the filled via with copper.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: June 12, 2018
    Assignee: Intrinsiq Materials, Inc.
    Inventors: David Ciufo, Janet Heyen
  • Patent number: 9997320
    Abstract: The circuit breaker is fabricated by an assembly step that makes a circuit breaker assembly with a moving contact metal plate, stationary contact metal plate, and bimetallic strip disposed in prescribed locations in an external case; and an anneal step that introduces the circuit breaker assembly made in the assembly step into an anneal oven, heats the circuit breaker assembly in the anneal oven and then cools it to anneal both the moving contact metal plate and the bimetallic strip and produce a heat-treated circuit breaker.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: June 12, 2018
    Assignee: OTSUKA TECHNO CORPORATION
    Inventors: Yoshihiro Nakanishi, Shiro Shibuya, Kazuo Tanabe
  • Patent number: 9985506
    Abstract: In a method for manufacturing an interior permanent magnet rotor unit, a radial magnetizing part including high magnetic permeability portions and low magnetic permeability portions face a core, and a magnetic field of axial magnetizing parts is applied to the radial magnetizing part in an axial direction of the radial magnetizing part. This causes the magnetic field to enter the core via the radial magnetizing part and cross magnet materials filling insertion holes of the core.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: May 29, 2018
    Assignee: JTEKT CORPORATION
    Inventor: Yoshiyuki Shibata