Abstract: An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a cover positioned on the microchannel structure to define a respective upper wall of each of the microchannels. The cover presents a compliant surface to the microchannels.

Abstract: A radiator includes a flat base (10), a pair of heat pipes (20) and a plurality of fins (30) on the base. The base defines a pair of grooves (12) through a top portion thereof. Each heat pipe includes parallel and symmetrical first and second sections (22, 24). The first sections are soldered to the base in the grooves. Each fin defines a notch (32) at a bottom portion thereof and a pair of holes (36) at opposite sides of the notch. Flanges (35) extend perpendicularly from the notches of the fins, cooperatively defining a streamline airflow guiding surface. Collars (37) extend perpendicularly from the holes of the fins, for receiving the second sections of the heat pipes.

Abstract: A heat dissipation device includes a liquid cooling system and a heat exchanger. The liquid cooling system includes a cold plate (20) having an inlet (244) and an outlet (246) to permit liquid to flow through the cold plate. The heat exchanger includes a heat conductive member (10) thermally connecting with the cold plate to fins (60).

Abstract: A wafer supporting unit (10) includes a base (12) and a thermally conductive member (14). The base is formed by nickel material. The thermally conductive member is formed in the shape of a lamina, includes silicone rubber (16) serving as the main material, and Ag fine powder (18) is blended with the silicone rubber. The Ag fine powder is blended with high density in part of the thermally conductive member, and a plurality of pillar-shaped regions (20) is formed with one end facing the bottom, and with the other end facing the top. The wafer supporting unit does not produce curvature in a wafer, and provides efficient cooling of the wafer, and does not cause heat degradation in a thermally conductive member prepared on the rear side of the wafer during processing.

Abstract: A heat exchanger, particularly a flat-tube heat exchanger for a motor vehicle, which includes two coolant boxes and a tube block with an inlet tube attached to one of the boxes and an outlet tube attached to another of the boxes, and wherein each tube extends at least in part along one longitudinal side of the associated box and has at least one radial opening which communicates with a side opening formed in the box.

Abstract: This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant inside the evaporator to evaporate or boil. The resulting vapor enters a condenser and returns to a liquid phase. Cooling fins are attached to the condenser to facilitate heat transfer with the surrounding airflow. The cooling system and computer or electronic device fit within standard computer cases and high density server rack-mountable cases.

Abstract: A heat dissipation device includes a seat, a fin set arranged on the seat, a fan, a fan mounting device having the fan mounted thereto, and a cover covering the fin set. The fan has a portion thereof located above the fin set. An opening is defined in fan mounting device and communicates the fan with the fin set and the fan with a space above a top of the fin set. The cover has a rearwards expanding port for guiding an airflow generated by a system fan to flow through the fin set. A top wall of the cover has a void to expose a portion of the top of the fin set.

Abstract: In a system for liquid cooling of electronics, where the electronics are subject to rotation in space, a liquid coolant storage tank includes a degassing and vortex-preventing structure to allow bubbles to float to the surface of the liquid inside the tank, and also to prevent vortices from forming near the outlet from the tank. The structure includes nested tubes or conduits. An inner conduit extends from the inlet into the tank, and its open end is covered by a second conduit with a baffle across its end, so that the flow is directed by the baffle to flow back along the outside of the inner conduit, and inside of the outer conduit. Especially at the inlet, a third conduit with large perforations surrounds the open end of the outer conduit. Smaller perforations on the inner conduit at the outlet side discourage any vortex from forming there. Reversal of the liquid flow, and the gradual increase in flow cross section prevent surging inside the tank.

Abstract: A field-replaceable active pumped liquid heat sink module includes a front portion and a back portion, each including a liquid pump, a radiator, an optional receiver, and a cold plate heat exchanger, all of which are connected together in a liquid pump loop through which a coolant such as water is circulated. The liquid pump, radiator, optional receiver and cold plate heat exchanger are in a liquid pump loop and are self-contained in a field-replaceable active pumped liquid heat sink module.

Abstract: A heat exchanger is mounted external to a section of flue pipe or is an integral part of a section of flue pipe. The heat exchanger preheats a domestic hot water supply and boosts the return water temperature prior to reentry to the furnace coil. The heat exchanger reduces fuel use, pollution and wear of the furnace and burner. A typical heat exchanger installation includes an oil or gas burner located on a furnace or boiler having a flue pipe leading to a gaseous outlet, such as a masonry chimney. A short vertical flue section leads to a draft-regulating damper. The flue heat exchanger may be a coil of tubing wrapped around flue section, such that the tubing picks up heat from the heated flue gasses. Preheated water exits from the heat exchanger.

Abstract: The subject invention provides a cooling assembly for removing heat from an electronic device. The cooling assembly includes a heat sink having a base plate and a plurality of fins extending upwardly from the base plate to a top extremity. A nozzle directs a flow of cooling fluid onto the fins and is disposed above the base plate and below the top extremity of the fins. The flow of cooling fluid is discharged from the nozzle adjacent the base plate and then flows upwardly through the fins to remove the heat from the base plate before removing any heat from the fins.

Abstract: A heat pipe (20) includes a pipe (21), a wick (22), and an operating fluid. The wick is a capillary structure including a carbon nanotube layer, and is fixed to an inside wall of the pipe. The operating fluid is sealed in the pipe and soaks into the wick. The operating fluid includes a pure liquid, and a plurality of nanometer-scale particles uniformly suspended in the pure liquid. The nanometer-scale particles can be carbon nanocapsules (30) or particles of a metal (32) with high thermal conductivity. Each carbon nanocapsule can further have a metal with high thermal conductivity filled therein. The carbon nanotube layer contains carbon nanotubes of small size and high thermal conductivity, therefore the capillary performance of the wick is good. Further, because the operating fluid includes nanometer-scale particles with high thermal conductivity, this ensures that the operating fluid has high thermal conductivity.

Abstract: A heat pipe includes a metal tube, a layer of nano-particles and a working fluid. The metal tube has an inner surface defining at least two pores. Each of the pores has a diameter in the range from about 2 to about 50 nanometers. The layer of nano-particles is formed at least one of on the surfaces of the meso-pores and on the inner surface of the metal tube. The working fluid is in the metal tube.

Abstract: A tube 101 is constituted by a pair of plates 111a, 111b which are fitted with each other in such a manner as to put an inner fin 101b between the plate 111a and the plate 111b. Differences in level 111c are formed on the second plate 111b, which fits inside, which differences in level each protrude inwardly by a distance equal to the thickness of the first plate 111a, whereby the outer wall surface of the tube 101 is made substantially level thereover. A gap which is formed between the outer wall surface of the tube 101 and a core plate, when the tube is passed through the core plate, can be as small as possible whereby the brazing properties can be improved.

Abstract: A fluid heat exchanger assembly having an upper wall and a lower wall extending between the inlet and the outlet for establishing a direction of flow to cool an electronic device. A plurality of projections extend linearly transversely across the direction of flow to define rows of projections with linear cavities between adjacent projections so that fluid flows into and out of the cavities as the fluid flows across the rows of projections for contraction and expansion of the coolant flow to maximize heat transfer. The projections may be rectangular, triangular or convex, as viewed in cross section.

Abstract: A vapor-lift pump heat transport apparatus having a small heat resistance and a large heat transport capacity. A heat exchange circulating solution container has a first space and a second space communicating with the first space through a communication opening and contains a heat exchange circulating solution, and vapor thereof, in each space. A circulating solution transport passage includes a pipe connected to the solution outlet of the container and provided with a sensible heat releasing heat exchanger, a pipe disposed in the container, and a pipe connected to a vapor-liquid two-phase fluid inlet and provided with a heating heat exchanger. A vapor-liquid two-phase fluid flows into only the first space through the vapor-liquid two-phase fluid inlet. When the entrance of the vapor-liquid two-phase fluid has caused a pressure difference between the first and second spaces, a difference occurs between the positions of the vapor-liquid interfaces in the first and second spaces.

Abstract: A pipe of a header pipe is formed by combining two separated bodies separated along a longitudinal direction. The first separated body has a tube holding wall portion including an insertion hole inserting a flat tube thereto, and a pair of straight portions protruded from the tube holding wall portion in an approximately orthogonal direction and set along both sides in a width direction of the tube, and is formed in a C-shaped cross sectional shape.

Abstract: A device for removing heat from an electronic component, comprising a heat sink that can be coupled to the electronic component and conduct heat therefrom. A finned appurtenance coupled to the heat sink can transfer the heat into a fluid medium. The fins are oriented at an angle with respect to several flow streams of the fluid medium across the fins. Each flow stream follows a unique direction.

Abstract: A heatpipe for cooling an integrated circuit. The heatpipe includes a pipe and radial fins that are formed by extruding a single piece of material, such as heat conducting metal. Each of the radial fins extends away from the pipe and runs (preferably) the length of the pipe. Each radial fin has normally oriented subfins that provide additional heat convection surface areas to the radial fins. Within the pipe are interior fins, also formed during the material extrusion process. The interior fins provide additional conduction cooling to a heat transferring fluid circulating within the pipe.

Abstract: A heat exchanger including a passageway having an internal passage adapted to form a first flow path, and an array of conduits having internal passages that collectively form a second flow path. The conduits extend through the internal passage of the passageway, and a first conduit of the array is provided with a lower total heat exchange surface area per unit volume therein than a second conduit of the array. A method of performing chemical processes is provided that includes providing a catalyst bed within the second flow path, and minimizing a temperature differential between a maximum temperature of a fluid in the second flow path and a minimum temperature of the fluid in the second flow path.