Patents Examined by Tho Duong
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Patent number: 7108055Abstract: An optimized design for a composite heat sink is provided utilizing a high thermal conducting base and low thermal conducting fins. The base preferably is constructed from anisotropic graphite material, and the fins are preferably constructed from a thermally conductive plastic material. In the case of a low profile heat sink having a fin height of no greater than about 3 times that of the base, the composite construction provides superior cooling yet lighter weight as compared to a conventional all-aluminum heat sink of the same dimensions.Type: GrantFiled: December 22, 2003Date of Patent: September 19, 2006Assignee: Advanced Energy Technology Inc.Inventors: Daniel W. Krassowski, Gary G. Chen
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Patent number: 7104313Abstract: An apparatus for using fluid laden with nanoparticles for application in electronic cooling is described. In one embodiment, an electromagnetic pump is used to circulate the nanoparticle laden fluid.Type: GrantFiled: December 31, 2003Date of Patent: September 12, 2006Assignee: Intel CorporationInventors: Himanshu Pokharna, Rajiv K. Mongia, Ravi S. Prasher, Sridhar V. Machiroutu, Je-Young Chang, John W. Horigan
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Patent number: 7100677Abstract: A liquid cooling system includes a tank (10) for thermally contacting a heat source (100), a cylindrical heat dissipating unit (20) mounted on the tank, and a pump (30) located within the cylindrical heat dissipating unit. The tank defines a cavity therein for containing liquid coolant for heat exchange, and an inlet (122) in communication with the cavity. The heat dissipating unit defines a chamber therein in flow communication with the cavity, and an outlet (275) in communication with the chamber. The pump has an entrance (31) in flow communication with the outlet, and an exit (32) in flow communication with the inlet, thereby the tank, the heat dissipating unit, and the pump together forming a loop for circulation the of liquid coolant.Type: GrantFiled: July 27, 2004Date of Patent: September 5, 2006Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Hsieh Kun Lee, Cheng-Tien Lai, Shi Wen Zhou
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Patent number: 7100681Abstract: A heat dissipation device includes a base, a plurality of first fins, a plate, a plurality of second fins and two heat pipes. Each heat pipe includes a heat-receiving portion sandwiched between the base and the first fins, a heat-exchange portion sandwiched between the plate and the first fins, a connecting portion connecting the heat-receiving portion and the heat-exchange portion, a heat-discharging portion extending through the plate and inserted into the second fins. At least one of the heat pipes defines two different planes which intercross at the heat-exchange portion of the at least one of the heat pipes.Type: GrantFiled: October 31, 2005Date of Patent: September 5, 2006Assignee: Foxconn Technology Co., Ltd.Inventors: Yi-Qiang Wu, Wei Deng, Liang-Hui Zhao, Gen-Ping Deng
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Patent number: 7096932Abstract: A multi-fluid heat exchanger having separate fluid flow paths for two fluid streams to be heated or cooled by a third fluid stream includes first and second elongated, parallel tubular headers (10, 12), having opposed ends (14), generally uniformly spaced elongated tube slots (16) in each of the headers (10, 12) with the tube slots (16) in one header (10) facing-and aligned with the tube slots (16) and the other header (12), a plurality of flattened tubes (20) extending between the headers (10, 12) and having ends (22) received in aligned ones of the tube slots (16), one tube slot (24) in each header being unoccupied by any of the flattened tubes (20), the one tube slots (24) being aligned with each other and located at a predetermined location between the ends (14) of the headers (10, 12) and between two groups (A, B) of the flattened tubes (20) so there are two groups of the flattened tubes (20) on each side of the one tube slot (24), a pair of baffles (30) in each header (10, 12) with one on each side of tType: GrantFiled: December 22, 2003Date of Patent: August 29, 2006Assignee: Modine Manufacturing CompanyInventors: David M. Scoville, Ken Nakayama, Richard T. Gebhard
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Patent number: 7093649Abstract: A flat heat exchanger plate typically used in a bulk material heat exchanger is provided. The flat heat exchanger plate is designed to operate under a negative internal pressure to eliminate depressions or dimples that are typically formed into the sides of these types of heat exchanger coils during the manufacture process. With the removal of the depressions or dimples the tendency for bulk material to accumulate to the exterior surface of the plate is reduced, thereby increasing the service period of the plate.Type: GrantFiled: February 10, 2004Date of Patent: August 22, 2006Inventor: Peter Dawson
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Patent number: 7093650Abstract: It is an object of this invention to obtain a heat conduction pipe superior in corrosion resistance as well as heat exchange efficiency between fluid flowing respectively through an inside and an outside for great heat radiation property and endothermic characteristics. It is also object of this invention to form the heat conduction pipe superior in the corrosion resistance as well as the heat radiation property and endothermic characteristics at inexpensive price. To achieve the above, at least single resin coating layer is formed on an outer circumferential surface of a metal pipe, a metal fin member is spirally wound on an outer circumferential surface of the resin coating layer with a side end surface the metal fin member in contact. The winding contact portion is made to encroach a surface of the resin coating layer to form the heat conduction pipe.Type: GrantFiled: September 1, 2004Date of Patent: August 22, 2006Assignee: Usui Kokusai Sangyo Kaisha, Ltd.Inventors: Yasuaki Hashimoto, Shu Yotsumoto
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Patent number: 7089996Abstract: A radiator is disclosed for mounting in an upright position to a wall, comprising a front panel and a back panel between which an interior space is provided for introducing a fluid. The back panel is made of a heat-conductive material and is provided with fluid supply and drainage fittings for supplying and draining the fluid to and from said interior space. The back panel is further provided with cooling ribs for exchanging heat with surrounding air and mounting brackets for mounting the radiator on a wall. The front panel has pre-formed canals for directing the fluid flow in a controlled way from the supply fitting to the drainage fitting. The front panel is made of a synthetic material which is substantially non-heat-conductive. A seal is provided between the panels for making said interior space substantially fluid-tight. The front and back panels are assembled with the seal in between by means of bolts.Type: GrantFiled: December 14, 2001Date of Patent: August 15, 2006Inventors: Marcel Stroobants, Pierre Vercauteren
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Patent number: 7090002Abstract: A heat pipe is provided having a vessel with a closed first end, a second end, and a wick on an inner surface that defines a passageway. A convex wall is positioned at the second end so as to block the passageway. The convex wall is deformable so as to move from a first position wherein a portion of the wall is convex to a second position wherein the portion of the wall is concave. The convex wall may include at least one stress concentrator so that upon an application of a force to the convex wall, the stress concentrator causes the convex wall to buckle. A method for forming the above-described heat pipe is also provided.Type: GrantFiled: November 8, 2004Date of Patent: August 15, 2006Assignee: Thermal Corp.Inventors: Matthew Connors, Arthur H. Good
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Patent number: 7089999Abstract: A hood retaining structure for a heat-dissipating device. The heat-dissipating device includes a heat sink with at least one heat-dissipating fin set, and each heat-dissipating fin set includes a plurality of heat-dissipating fins erected vertically. The hood retaining structure is arranged on the heat-dissipating fins to retain a hood thereon and a fan is able to retain to the hood. The hood retaining structure includes a dent defined on an outer side of each heat-dissipating fin such that a retaining groove is defined after the heat-dissipating fin are assembled and at least one retaining rod and at least one retaining hook provided on lateral sides of the hood, the retaining rod and the retaining hook being configured to lock into the retaining groove. The retaining hook includes a push tab.Type: GrantFiled: March 10, 2005Date of Patent: August 15, 2006Assignee: Chaun-Choung Technology Corp.Inventors: Wen-Yuan Wu, Hung-Ming Chou
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Patent number: 7090001Abstract: A plate is thermally coupled to a heat generating device and thermally coupled to two heat pipes. Each heat pipe is configured to have a predetermined boiling point temperature selected according to design criteria. One or more additional heat pipes can be coupled to the plate. A heat spreader can be in thermal contact with the heat generating device and with at least one of the heat pipes. The heat pipes can differ in outer cross-sectional dimensions depending on thermal distance position relative to the heat generating device, such that the heat pipes located a farther thermal distance from the heat generating device have smaller outer cross-sectional dimensions than the heat pipes located a shorter thermal distance from the heat generating device.Type: GrantFiled: May 16, 2003Date of Patent: August 15, 2006Assignee: Cooligy, Inc.Inventors: Peng Zhou, Dolf van Der Heide, Kenneth Goodson, Girish Upadhya
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Patent number: 7086453Abstract: A liquid cooling system includes a cooling body (10), and a liquid circulation module (20). The cooling body comprises a cooling base (11) for thermally contacting a heat source, and a heat sink (14) mounted on the cooling base. An internal flow path is defined in the cooling body, for heat exchange with coolant. At least two passages (15) are formed through the heat sink. The liquid circulation module defines a plurality of external flow paths coupled to the internal flow path of the cooling base, thereby forming a loop for circulation of the coolant. The external flow paths comprises at least two output paths extending through the at least two passages of the heat sink, and along which the coolant that exits the internal flow path passes through the heat sink for cooling.Type: GrantFiled: August 17, 2004Date of Patent: August 8, 2006Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Hsieh Kun Lee, Chun-Chi Chen, Jianjun Zhang
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Patent number: 7082989Abstract: A heat exchanger is provided in which high heat transfer efficiency has been attained by optimizing the slit array and setting an optimum range for the width of a slit and the spacing between slits. Slits 51 and 52 formed in front of the heat transfer coil 4 and slits 55 and 56 formed behind the heat transfer coil are arranged so as to provide a mutually different length among adjoining partitioned slits in the vertical direction, as well as a mutually different length between directly opposite partitioned slits in the horizontal direction. As a result, the position at which the slit is partitioned is staggered.Type: GrantFiled: September 2, 2005Date of Patent: August 1, 2006Assignee: SANYO Electric Co., Ltd.Inventors: Masahiro Kobayashi, Hideaki Mukaida, Hiroshi Mukaiyama, Norio Sawada, Masafumi Ueda, Shigeya Ishigaki, Koji Sato
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Patent number: 7080684Abstract: A mold temperature control unit with which piping connection for supply and drain of cooling water in unit setup can be extremely simply made. In a mold temperature control unit 1 which unit body 2 comprises a plurality of cooling water systems performing supply and drain of cooling water to/from a plurality of elements to be cooled in a mold, a single cooling water supply port 11 and a single cooling water drain port 12 for said plurality of cooling water systems are disposed on the outer panel of the unit body 2.Type: GrantFiled: March 12, 2002Date of Patent: July 25, 2006Assignee: Sysko CorporationInventor: Toshio Shimoda
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Patent number: 7077189Abstract: A fluid heat exchanger assembly cools an electronic device with a cooling fluid supplied from a heat extractor (R, F) to a plurality of tubes extending between header tanks in an upper portion of a housing. A refrigerant is disposed in the lower portion of the housing for liquid-to-vapor transformation. The tubes are radially flexible to vary the volume of the tubes for modulating the flow of coolant liquid through the tubes in response to heat transferred by an electronic device to the lower portion of the housing.Type: GrantFiled: January 21, 2005Date of Patent: July 18, 2006Assignee: Delphi Technologies, Inc.Inventors: Ilya Reyzin, Mohinder Singh Bhatti
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Patent number: 7077187Abstract: A regenerative energy and/or mass exchange assembly has: an exchange media; a first flow path to pass a fluid stream through the exchange media; at least a second flow path to pass a further fluid stream through the exchange media; and at least one fluid stream diverter to divert the different flow paths to pass the respective fluid streams through different regions of the exchange media. A method for operating the regenerative assembly is also provided.Type: GrantFiled: August 30, 2001Date of Patent: July 18, 2006Assignee: Hydrogenics CorporationInventors: Joe Cargnelli, Jianming Ye, Xuesong Chen, Ravi B. Gopal
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Patent number: 7073566Abstract: An apparatus for ventilation systems includes an element for the transfer of heat from warm exhaust air (taken from inside a building) to cooler exterior fresh air which is drawn into the building. The present invention in particular provides an apparatus whereby, during a defrost cycle, interior air may circulate through both of the fresh air and exhaust air paths for delivery back into the building, i.e. the warm interior air, used as defrost air, may be able to circulate from the interior of the building into the ventilation apparatus and back to the interior of the building. The apparatus can thus use interior air as defrost air while diminishing or avoiding the creation of a negative air pressure in the building.Type: GrantFiled: November 20, 2001Date of Patent: July 11, 2006Assignee: Venmar Ventilation Inc.Inventors: Frederic Lagace, Jean-Francois Grondin, Pierre Cusson, Michel Julien, Daniel Marcoux
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Patent number: 7069981Abstract: A heat exchanger (50) is provided for transferring heat between first and second fluids (52) and (54) having a maximum operating mass flow rate through the heat exchanger (50) and mass flow rates that are substantially proportional to each other. The heat exchanger (50) provides essentially constant outlet temperatures for the first and second fluids (52,54) for all of the flow rates within the operating spectrum of the heat exchanger (50) without the use of an active control system. The heat exchanger (50) is of particular use in the fuel processing system (36) of proton exchange membrane type fuel cell systems.Type: GrantFiled: November 8, 2002Date of Patent: July 4, 2006Assignee: Modine Manufacturing CompanyInventors: Jeroen Valensa, Michael J. Reinke, Mark G. Voss
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Patent number: 7063134Abstract: A combined muffler and heat exchanger apparatus is provided. The apparatus includes a housing defining a heat transfer chamber and an acoustic attenuation chamber separated by a partition. A flow regulator and a fluid transport member are disposed within the heat transfer chamber. The flow regulator is adapted to regulate the flow of a first fluid, such as a heat source, between an input end of the housing and the partition. The fluid transport member is adapted to contain the flow of a second fluid. An acoustic regulator is disposed in the acoustic attenuation chamber and extends longitudinally from the partition to an output end of the housing. The acoustic regulator is a metal tube including a plurality of apertures adapted to attenuate exhaust stream acoustics associated with an automotive vehicle power source.Type: GrantFiled: June 24, 2004Date of Patent: June 20, 2006Assignee: Tenneco Automotive Operating Company Inc.Inventors: Wallace J. Poole, James R. Abbott, Gabriel A. Kuschel, Jian Guo Hua
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Patent number: 7063129Abstract: A heat transport device has an evaporator and a condenser connected through a vapor phase channel and a liquid phase channel and has wicks of the condenser arranged symmetrically around an axis orthogonal to the direction of gravity. The flow of fluid in a liquid phase inside the wicks is not disrupted even when the heat transport device is tilted at any angle relative to the horizontal surface or the vertical surface.Type: GrantFiled: November 25, 2003Date of Patent: June 20, 2006Assignee: Sony CorporationInventors: Takuya Makino, Takashi Mochizuki, Kazuhito Hori, Kazuyoshi Kiga, Noriaki Sakata