Patents Examined by Tho Duong
  • Drum type heat exchanger
    Patent number: 7063128
    Abstract: A drum type heat exchanger for effectively ventilating and purifying room air of a factory, a building or a house and the like is described. The drum type heat exchanger has heat transfer means with a drum shape and thus an entire size is reduced as much as possible and become compact, such that a handling and an installation is easy, a thermal efficiency to an installation space of the heat transfer means is maximized, and overall maintenance and repair such as a check or exchange of the heat transfer means are easy. Additionally, the drum type heat exchanger uses a drum with a short radius of rotation so that an entire operation cycle time is shortened and a heat transfer area is sufficiently secured in order to keep the thermal efficiency high.
    Type: Grant
    Filed: June 14, 2004
    Date of Patent: June 20, 2006
    Assignee: Daeryun Ind Co., Ltd
    Inventor: Byung-sook You
  • Air conditioning device
    Patent number: 7059385
    Abstract: The invention relates to an air condition device consisting of recovery cells (1, 2), an inlet (3) and exhaust ducts (4) leading to and from a room, an inlet (5) and exhaust ducts (6) located at the other end of the device and leading to and from the outdoor air, the air flows in the air conditioning device being controlled by means of rotating deflectors (7, 8). The deflectors (7, 8) consist of baffles fixed to different control axes (9, 10) and rotating about their axes, the air openings (11, 12) provided in the deflectors being located altematingly at the same recovery cell (1, 2), where the air flow directions are reversed periodically.
    Type: Grant
    Filed: April 17, 2001
    Date of Patent: June 13, 2006
    Assignee: MG Innovations Corp.
    Inventor: Kari Moilala
  • Thermally active convection apparatus
    Patent number: 7055575
    Abstract: Apparatus for abstracting heat comprises a container charged with a first liquid and with small auxiliary containers free to circulate in the first liquid. Each of the small auxiliary containers is charged with a second liquid. The first and second liquids each have a selected temperature of transformation that facilitates use of the apparatus to heat or cool a substance contacted by the apparatus.
    Type: Grant
    Filed: June 17, 2003
    Date of Patent: June 6, 2006
    Inventor: Thomas P. Noel
  • Multitubular heat exchanger
    Patent number: 7055586
    Abstract: A multi-tube heat exchanger capable of increasing heat exchanging performance without increasing its heat transmitting area, as well as avoiding a reduction in heat exchanging efficiency due to adhering pollutant or the like. The multi-tube heat exchanger includes an inner tube group through which a first fluid passes and an outer tube around which a second fluid passes. The heat transmitting tube is constituted of only a heat transmitting tube main body and a number of lump-like projections formed at a predetermined interval in the length direction on one or both opposing wall faces on longer sides of the heat transmitting tube main body. Longitudinal eddies are generated in high-temperature gas by the, thereby consequently increasing heat exchanging efficiency.
    Type: Grant
    Filed: May 22, 2002
    Date of Patent: June 6, 2006
    Assignee: Maruyasu Industries Co., Ltd.
    Inventors: Yasufumi Sakakibara, Naruki Harada
  • Clip for heat sink
    Patent number: 7055589
    Abstract: A clip (30) securing a heat sink (10) includes a pair of spaced V-shaped main bodies (32) respectively received in grooves (16) of the heat sink. A pair of spaced wings (38) extends outwardly from opposite ends of each main body. The wings are slanted slightly upwardly. A hook (42) is formed at a free end of each wing. Each hook has a V-shaped profile. The wings are wider than the hooks, for facilitating manual operation of the clip.
    Type: Grant
    Filed: April 30, 2003
    Date of Patent: June 6, 2006
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hsieh Kun Lee, Donyun Lee
  • Refrigerating unit having heat-exchanger mounting shroud
    Patent number: 7055582
    Abstract: A refrigerating unit including a base, a heat exchanger, and a shroud attached to the base The heat exchanger may have opposite side edges defined by a pair of substantially cylindrical headers, at least one of the headers having an inlet tube or an outlet tube extending, and a substantially rectangular shroud attached to the base and being provided with notched corners. The shroud has a top surface with at least one elongate boss, and integrally-formed resilient gripping portions which capture the heat exchanger headers. The heat exchanger is mounted to the base through engagement with the shroud, clearance is provided between a shroud notched corner and the inlet or outlet tube, and the boss provides a means for supporting the shroud when placed upside down.
    Type: Grant
    Filed: October 15, 2002
    Date of Patent: June 6, 2006
    Assignee: Tecumseh Products Company
    Inventor: Sukru Erisgen
  • Heat exchanger with valve
    Patent number: 7055584
    Abstract: A housingless plate heat exchanger including a plate stack defining fluid passages, at least one collecting tank with a peripheral edge enclosing one end of the plate stack, and a valve receivable in the collecting tank through an assembly opening of the soldered collecting tank and plate stack. The collecting tank and plate stack are soldered together and have a fluid opening. A method of manufacturing the heat exchanger includes the steps of assembling plates of the plate heat exchanger in a plate stack, placing a collecting tank on one end of the plate stack, soldering the plate stack and collecting tank together, and after the soldering step mounting a valve in the collecting tank.
    Type: Grant
    Filed: May 17, 2004
    Date of Patent: June 6, 2006
    Assignee: Modine Manufacturing Company
    Inventor: Viktor Brost
  • Heat dissipation device
    Patent number: 7051792
    Abstract: A heat dissipation device includes a base (10) having a heat dissipating surface, a plurality of fins (20) and a pair of heat pipes (30). The fins cooperatively define a concave tunnel in a side thereof. The heat dissipating surface of the base is embedded in the tunnel of the fins. Each heat pipe has a vaporizing portion (32) engaged with the base and a condensing portion (31) engaged in the fins.
    Type: Grant
    Filed: August 17, 2004
    Date of Patent: May 30, 2006
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hsieh Kun Lee, Cui Jun Lu, MingXian Sun
  • Cooling apparatus and electronic equipment
    Patent number: 7051791
    Abstract: The rotation of axial-flow blades permits air entered through an inlet port to exit directly to outside of a case in the axial direction, and the rotation of centrifugal blades permits air entered through the inlet port to exit through a side surface outlet port to the outside of the case in the centrifugal direction. Accordingly, the amount of flow of air exiting from inside of the case can be increased so that the amount of heat dissipation is increased. It is therefore able to provide a cooling apparatus and electronic equipment mounting the cooling apparatus with improved cooling efficiency while achieving a small thickness.
    Type: Grant
    Filed: September 10, 2004
    Date of Patent: May 30, 2006
    Assignee: Sony Corporation
    Inventors: Toshio Hashimoto, Toru Kimura, Sachiko Kaneko
  • Reversible grooved tubes for heat exchangers
    Patent number: 7048043
    Abstract: Grooved metal tubes (1), of outer diameter De, the tubes being grooved internally with N helical ribs (2) of an apex angle ?, height H, base width LN and helical angle ?, two consecutive ribs being separated by a flat-bottomed groove (3) of width LR, with a pitch P equal to LR+LN. These tubes are characterised in that, a) De is between 4 and 20 mm, b) the number N of ribs ranges from 46 to 98, c) the rib height H ranges from 0.18 mm to 0.40 mm, d) the apex angle ? ranges from 15° to 30°, e) the helical angle ? ranges from 18° to 35°. These tubes make it possible to simultaneously obtain a high heat exchange coefficient in evaporation and condensation and a low pressure loss.
    Type: Grant
    Filed: April 12, 2002
    Date of Patent: May 23, 2006
    Assignee: Trefimetaux
    Inventors: Pascal Leterrible, Nicolas Avanan
  • Heat exchanger and related exchange module
    Patent number: 7044207
    Abstract: A heat exchange module is disclosed comprising two metal sheets welded along weld lines defining between them a group of channels disposed side by side substantially in a common plane, intended to be passed through by an exchange fluid and, from the fluidic point of view, being in parallel with each other between two connection orifices of the module. The group of channels has a generally U-shape configuration, which connects together the said connection orifices that are laterally separated from each other.
    Type: Grant
    Filed: July 26, 2000
    Date of Patent: May 16, 2006
    Assignee: Zie Pack
    Inventors: Roland Guidat, Michel Claudel, Florent Noel
  • Electronic apparatus
    Patent number: 7044198
    Abstract: A liquid cooling jacket and a system for use in an electronic apparatus, preferable in the cooling capacity or performance, with less in man-hour and manufacturing costs in need of process thereof, and applicable into a narrow space, wherein a plural number of lamination plates, each being formed through the punching process, are piled up in the width direction thereof, for each piece thereof, and are bonded with each other. A cooling liquid flows in a flow passage defined between the laminating plates, and the laminating plates themselves function as a cooling fin.
    Type: Grant
    Filed: March 5, 2004
    Date of Patent: May 16, 2006
    Assignee: Hitachi, Ltd.
    Inventors: Hitoshi Matsushima, Shinji Matsushita, Ichirou Asano, Tsunenori Takeuchi, Osamu Suzuki
  • End surface capillary structure of heat pipe
    Patent number: 7040382
    Abstract: A heat pipe includes a pipe member, a bottom lid and a wick structure. The pipe member includes a plurality of longitudinal grooves radially arranged on an inner sidewall thereof. The bottom lid covers a bottom end of the pipe member. The wick structure includes the grooves and sintered powders attached to an inner surface of the bottom lid. Thereby, the sintered powders does not need to be attached to the inner wall of the pipe member so that an axial bar is no more need. Such that, the damage caused by removal of the axial bar are prevented and the fabricating process of the heat pipe is simplified.
    Type: Grant
    Filed: July 6, 2004
    Date of Patent: May 9, 2006
    Inventor: Hul-Chun Hsu
  • Heat dissipation device
    Patent number: 7040384
    Abstract: A heat dissipation device includes a heat sink, a fan adapter and a fan. The fan adapter has two opposing sidewalls straight arranged thereof, a top wall disposed horizontally and connecting the two sidewalls, an inlet formed in a front thereof, an oblique reduced cross-sectional area portion extending backwardly from a rear thereof, and an outlet formed in a rear of the oblique reduced cross-sectional area portion. The fan adapter encloses the heat sink; the fan disposes on the inlet of the fan adapter. Whereby heat around electrical components, on which the heat dissipation device is arranged, can be carried out by a fluid flows passing through the oblique reduced cross-sectional area portion.
    Type: Grant
    Filed: January 27, 2004
    Date of Patent: May 9, 2006
    Assignee: Molex Incorporated
    Inventor: Tseng Shiang-Chich
  • Telecommunication device including a housing having improved heat conductivity
    Patent number: 7040383
    Abstract: A telecommunication device includes a housing formed by gas-assist injection molding and having an inner wall, outer wall and a hollow space formed therebetween and receiving therein gas refrigerant. The hollow space has a plurality of vertical channels wherein the gas refrigerant cools the internal of the housing by natural convection within the vertical channels. A movable wall is disposed in the vertical channel for controlling a pressure rise occurring upon a temperature rise.
    Type: Grant
    Filed: August 15, 2002
    Date of Patent: May 9, 2006
    Assignee: NEC Corporation
    Inventor: Takashi Oyamada
  • Polymer with solder pre-coated fillers for thermal interface materials
    Patent number: 7036573
    Abstract: A thermal interface material made of a binder material and a fusible filler.
    Type: Grant
    Filed: February 8, 2002
    Date of Patent: May 2, 2006
    Assignee: Intel Corporation
    Inventors: Paul A. Koning, Fay Hua, Carl L. Deppisch
  • Heat sink
    Patent number: 7036574
    Abstract: A heat sink arrangement for modular electronic and/or opto-electronic equipment is provided. The equipment module is inserted into an interface and a heat sink is pivotably arranged so as to be brought into contact with the inserted module. The equipment module may have an angled, or partially angled, so as to assist in bringing the module in contact with the heat sink.
    Type: Grant
    Filed: March 24, 2004
    Date of Patent: May 2, 2006
    Inventors: Andrew Lee Thompson, Kim Leeson
  • Twin fin arrayed cooling device with liquid chamber
    Patent number: 7028757
    Abstract: A cooling device for dissipating heat from a component is disclosed. The cooling device includes a core with a plurality of twin fins connected with the core and a liquid chamber in thermal communication with the component. The liquid chamber includes a reservoir with a liquid therein and the core includes a cavity with a liquid therein. A heat pipe is connected with the liquid chamber and with the core and the heat pipe is in contact with the liquid in the reservoir and the liquid in the cavity so that waste heat in the liquid chamber is thermally communicated to the core and is dissipated by an air flow over the twin fins and the core.
    Type: Grant
    Filed: October 21, 2004
    Date of Patent: April 18, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Shankar Hegde
  • Heat transfer device and method of making same
    Patent number: 7028759
    Abstract: A capillary structure for a heat transfer device, such as a heat pipe is provided having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles and one or more vapor vents are defined in the capillary structer. In this way, a network of capillary passageways are formed between the particles and vapor-vents through the capillary structure so as to aid in the transfer of working fluid by capillary action, while the plurality of fillets provide enhanced thermal transfer properties between the plurality of particles so as to greatly improve over all heat transfer efficiency of the device. A method of making the capillary structure according to the invention is also presented.
    Type: Grant
    Filed: January 27, 2004
    Date of Patent: April 18, 2006
    Assignee: Thermal Corp.
    Inventors: John H. Rosenfeld, Donald M. Ernst
  • Integrated circuit heat pipe heat spreader with through mounting holes
    Patent number: 7028760
    Abstract: A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles of the wick.
    Type: Grant
    Filed: March 1, 2005
    Date of Patent: April 18, 2006
    Assignee: Thermal Corp.
    Inventors: Peter M. Dussinger, Thomas L. Myers, John H. Rosenfeld, Kenneth L. Minnerly