Patents Examined by Tho Duong
  • Patent number: 7013953
    Abstract: A waste heat recovery system includes: a tank; heat exchange pipes connected with one another in the form of a ā€˜Sā€™ shape in multiple steps inside the tank and having city water flow pipes bound up into a bundle; circulation leading plates mounted between the heat exchange pipes for inducing a flow of waste water; movable nozzles mounted on the circulation leading plates and connected with a high pressure water pipe for spraying high pressure water onto the surface of the heat exchange pipe or having a brush for cleaning the surface of the heat exchange pipe; a nozzle driving part for driving the movable nozzle by means of a driving motor; and waste water inlet and outlet for flowing hot waste water from the upper portion to the lower portion of the tank and city water inlet and outlet for flowing city water from the lower portion to the upper portion of the tank.
    Type: Grant
    Filed: March 4, 2004
    Date of Patent: March 21, 2006
    Inventor: A-Ra Jung
  • Patent number: 7011143
    Abstract: A modular fluid unit for cooling heat sources located on a rack, the modular fluid unit comprising: a heat exchanger in fluid communication a pump; and wherein the modular fluid unit is mountable within the rack and is configurable to be in fluid communication with a cold plate return manifold, a cold plate supply manifold, and an end-user fluid supply. A method for cooling electronic components in a rack, the method comprising: circulating a first liquid from a cold plate to one of a plurality of heat exchangers mounted within the rack; circulating a second liquid from a second liquid supply to the one of a plurality of heat exchangers; and transferring heat from the first liquid to the second liquid at the one of a plurality of heat exchangers.
    Type: Grant
    Filed: May 4, 2004
    Date of Patent: March 14, 2006
    Assignee: International Business Machines Corporation
    Inventors: Joseph P. Corrado, John F. Eberth, Steven J. Mazzuca, Roger R. Schmidt, Takeshi Tsukamoto
  • Patent number: 7007741
    Abstract: A heat spreader apparatus for cooling an electronic component and method of attachment. The heat spreader comprises a flexible wall that partially conforms to a non-matching mating surface of the component when pressure is applied to the surface of the flexible wall that is opposite the component. The pressure may be maintained against the flexible wall during use, or released once the flexible wall is maintained in its conforming location by an adhesive.
    Type: Grant
    Filed: October 18, 2002
    Date of Patent: March 7, 2006
    Assignee: Sun Microsystems, Inc.
    Inventors: Bidyut K. Sen, Scott Kirkman, Vadim Gektin
  • Patent number: 7000690
    Abstract: A heat exchanger, particularly a flat-tube heat exchanger for a motor vehicle, which includes two coolant boxes and a tube block with an inlet tube attached to one of the boxes and an outlet tube attached to another of the boxes, and wherein each tube extends at least in part along one longitudinal side of the associated box and has at least one radial opening which communicates with a side opening formed in the box.
    Type: Grant
    Filed: October 4, 2002
    Date of Patent: February 21, 2006
    Assignee: Behr GmbH & Co.
    Inventors: Holger Auchter, Thomas Fricker, Bruno Losch
  • Patent number: 7000689
    Abstract: A fluid connector for providing an inlet/outlet connection to a connecting grid of a heat exchanger is disclosed in which the connector has a tubular body formed with an integral outwardly directed flange by means of which a fluid tight connection to the connecting grid can be achieved. The flange may be sealed relative to an aperture in a plate of the connecting grid. Alternatively, the aperture may be provided with a structural ring and the flange sealed relative to the structural ring for adapting the aperture to the size and/or position of the flange. A set of structural rings may be provided for use of the connecting grid with different connectors. The structural ring may allow the connector to be detached without disassembling the connecting grid. The aperture may be closed by a blanking disc.
    Type: Grant
    Filed: March 5, 2002
    Date of Patent: February 21, 2006
    Assignee: APV North America, Inc.
    Inventors: Derek I Finch, Gary A Crawford, Neil E Jarman
  • Patent number: 7000685
    Abstract: In a cooling system for cooling a heating element mounted in a vehicle, a radiator is located at a position higher than a heat sink, which absorbs heat from the heating element. When the amount of heat generated from the heating element, which is detected by a sensor, is greater than a predetermined first value, a blower is operated. Further, when the detected amount of heat is greater than a predetermined second value that is higher than the predetermined first value, a pump is operated. When the detected amount of heat is equal to or less than the predetermined first value, the pump is stopped and the cooling water is circulated by a principle of heat siphon. Accordingly, power consumption of the pump is reduced. Further, power consumption of the cooling system is reduced or an increase in power consumption of the cooling system is restricted.
    Type: Grant
    Filed: May 24, 2004
    Date of Patent: February 21, 2006
    Assignee: DENSO Corporation
    Inventors: Yusuke Morishita, Yoshimitsu Inoue
  • Patent number: 6976532
    Abstract: Ceramic materials are converted to materials with anisotropic thermal properties by forming the ceramics into composites with carbon nanotubes dispersed therein and uniaxially compressing the composites in a direction in which a lower thermal conductivity is desired.
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: December 20, 2005
    Assignee: The Regents of the University of California
    Inventors: Guodong Zhan, Joshua D. Kuntz, Amiya K. Mukherjee
  • Patent number: 6968890
    Abstract: In one exemplary embodiment of the present invention, a heat sink having an embedded heat pipe and fins attached to opposite sides of the base plate. In an alternative embodiment, the base plate includes a main heat pipe and auxiliary heat pipes coupled to the main heat pipe. The fins are aligned with the auxiliary heat pipes.
    Type: Grant
    Filed: June 11, 2003
    Date of Patent: November 29, 2005
    Assignee: Apple Computer, Inc.
    Inventor: Nayana V. Ghantiwala
  • Patent number: 6966358
    Abstract: A system is provided including a cooling station with a fluid reservoir containing a cooling fluid, a circulating pump, and a first fluid circuit including first couplers. A portable computer has a second fluid circuit with second couplers coupling to first couplers thereby coupling the first and second fluid circuits when the portable computer and the cooling station are docked. Fluid is circulated in the first and second fluid circuits when docking is detected. An interface connector, fan, and a controller are further provided, the controller configured to detect docking and activate the circulating pump and de-activate the fan when docking is detected. The fluid includes one or more of: water, ethylene glycol, propylene glycol, and oil.
    Type: Grant
    Filed: January 27, 2004
    Date of Patent: November 22, 2005
    Assignee: Gateway Inc.
    Inventor: Mark Rapaich
  • Patent number: 6962192
    Abstract: A heat dissipation assembly includes a printed circuit board (70) with a heat-generating device (74) mounted thereon, a heat sink (60) mounted on the heat-generating device for dissipating heat therefrom, a retaining device (1) and a locating member (50). The retaining device includes a pair of spaced pressing portions (14) pressing on the heat sink, and a pair of pivot portions (34) pivotally engaged with the pressing portions respectively. The locating member includes a baseplate (52) located at an underside of the printed circuit board, and four pins (54) extending from the baseplate. The pins pass through the printed circuit board and the heat sink. Two of the pins are engaged by the pressing portions, and the other two pins are engaged by the pivot portions when the pivot portions are pivotally moved toward the printed circuit board.
    Type: Grant
    Filed: June 14, 2004
    Date of Patent: November 8, 2005
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hsieh Kun Lee, Tao Li, Jin Song Feng
  • Patent number: 6955212
    Abstract: A water-cool radiator module comes with a supporting part having a shell body; the shell body includes a fan and a water tank; the water tank is connected to a cold water pipe and a hot water pipe; an extended section of the cold water pipe and hot water pipe is connected to a cold waterhead; the shell body includes several radiating holes at one end; such that in an application, the supporting part is inserted into a slot on the computer case and the shell body is mounted onto the slot; the cold water in the cold waterhead of a heat-generating electronic component is circulated to the shell body through the hot water pipe; the fan blows air to radiate heat to the outside through the radiating holes; and the cooled fluid flows from the water tank to the cold waterhead through the cold water pipe.
    Type: Grant
    Filed: April 20, 2004
    Date of Patent: October 18, 2005
    Assignee: ADDA Corporation
    Inventor: Hsin Mao Hsieh
  • Patent number: 6948554
    Abstract: A heat dissipation assembly includes a heat sink (20), a backplate (50), a pair of posts (60) and a fastener (10). The heat sink is attached on a CPU (30) which is mounted on a PCB (40). The backplate is disposed below the PCB. The fastener includes a main body (14) spanning on the heat sink, a resilient member (16) and an operating member (12). The posts extends through the backplate and engaged with the main body. Before the fastener is activated, the resilient member and the operating member squeezes the main body therebetween. When the fastener is activated, the operating member is above the main body. The resilient member resiliently presses the heat sink toward the CPU and the main body with opposite directional forces. The posts are consequently forced by the main body to urge the backplate against the PCB.
    Type: Grant
    Filed: December 15, 2003
    Date of Patent: September 27, 2005
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hsieh Kun Lee, Dongyun Lee, Zhijie Zhang, Fei Huang
  • Patent number: 6942016
    Abstract: This invention provides a heat pipe including a plurality of pipe parts for performing at least one of absorption of heat and radiation of heat through an outer surface, which are adjacent toward one direction, a flat part including a heat transfer plane created in a flat form for performing at least one of absorption of heat from and radiation of heat into outer space, created on a part of the outer surface of each of the plurality of pipe parts to be integrated with each of the pipe parts, and a fin in a flat form continuing without an uneven part from the heat transfer plane included in the flat part for providing an heat transfer plane further extended from the heat transfer plane toward an adjacent pipe part.
    Type: Grant
    Filed: September 6, 2002
    Date of Patent: September 13, 2005
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takashi Kobayashi, Takehide Nomura
  • Patent number: 6907918
    Abstract: A heat pipe is provided having a vessel with a closed first end, a second end, and a wick on an inner surface that defines a passageway. A convex wall is positioned at the second end so as to block the passageway. The convex wall is deformable so as to move from a first position wherein a portion of the wall is convex to a second position wherein the portion of the wall is concave. The convex wall may include at least one stress concentrator so that upon an application of a force to the convex wall, the stress concentrator causes the convex wall to buckle. A method for forming a heat pipe is also provided comprising coating the interior surface of the vessel with a wicking material and partially saturating the wick with a working fluid. The vessel is then partially evacuated. A portion of the vessel is pinched-off so as to seal the vessel.
    Type: Grant
    Filed: February 10, 2003
    Date of Patent: June 21, 2005
    Assignee: Thermal Corp.
    Inventors: Matthew Connors, Arthur H. Good
  • Patent number: 6899161
    Abstract: The present invention provides methods for heat absorption and thermally protected enclosures for containing heat sensitive devices, which include a heat absorption composition including polyoxymethylene polymer.
    Type: Grant
    Filed: April 3, 2003
    Date of Patent: May 31, 2005
    Assignee: Honeywell International, Inc.
    Inventors: Jane Ren, Christopher E. Osuch, Richard A. Olzak
  • Patent number: 6880622
    Abstract: An air guide for a cooling tower that prevents the air discharged from the cooling tower from flowing back into the cooling tower, and facilitates smooth circulation of outside air inside the cooling tower. The air guide is coupled to a side surface of the cooling tower, and has a length corresponding to a width of the side surface. The air guide includes an air-inflow prevention wall having a curved cross section extending downwardly and outwardly. The air guide further includes an air inlet portion defined at a lower end of the air-inflow prevention wall, and an extension portion extending from the lower end of the air-inflow prevention wall toward the cooling tower.
    Type: Grant
    Filed: February 24, 2004
    Date of Patent: April 19, 2005
    Assignee: Kyung In Machinery Co., Ltd.
    Inventor: Jae Byeong Gu
  • Patent number: 6874573
    Abstract: A composition for use as a thermal interface material in a heat-generating electronic device is provided. The composition comprises a blend of nitrile rubber and carboxyl-terminated butadiene, carboxyl-terminated butadiene nitrile or a mixture thereof, and conductive filler particles.
    Type: Grant
    Filed: July 31, 2003
    Date of Patent: April 5, 2005
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Andrew Collins, Chih-Min Cheng
  • Patent number: 6827131
    Abstract: An apparatus of water-cooled heat sink comprising a motor means comprising a motor seat having a room pivoting with a first magnet which both end of it have two rods, a first rod and a second rod, over the room and at the front of first magnet having a coil at the outside of room; a fan means comprising a fan seat and a plurality of cooling blades wherein the fan seat couples to the first rod and the cooling blades couple to the front of first rod of motor seat, the fan seat has a circular hollow room depositing a second magnet in it; a water-cooled means comprising a seat, a plurality of water-cooled blades and a pipeline.
    Type: Grant
    Filed: July 21, 2003
    Date of Patent: December 7, 2004
    Inventor: Neng Chao Chang
  • Patent number: 6820685
    Abstract: A heat exchanger coil assembly is made up of arrays of substantially equally spaced apart serpentine circuits located in the coil assembly region of the conduit, with adjacent circuits being arranged in a parallel offset fashion in which adjacent return bends are overlapping. The tubes have an effective diameter of D. Depression areas are provided at the points of overlap to locally reduce the diameter at the overlap. This provides a circuit-to-circuit with a density D/S>1.0, preferably greater than 1.02, where S is the spacing between adjacent circuits and D is the effective diameter of the tubes.
    Type: Grant
    Filed: February 26, 2004
    Date of Patent: November 23, 2004
    Assignee: Baltimore Aircoil Company, Inc.
    Inventors: Thomas P. Carter, David A. Aaron, Frank T. Morrison
  • Patent number: 6808014
    Abstract: A cooling device for an electronic apparatus, comprising: a heat generating element attached within a first housing; a heat receiving jacket, being connected with said heat generating element, and being attached within said first housing; a second housing being rotatably supported on said first housing; a first heat exchanger attached within said second housing, for exchanging heat between an outside; and a liquid driving means for supplying a cooling liquid to said heat receiving jacket, wherein a portion of a pipe for connecting between said heat receiving means, said first heat exchanger, and said liquid driving means is made of a flexible tube made of a resin, and further wherein, a second heat exchanger and an ion exchanger are provided in a part of said pipe, said second housing is received within said second housing, and said ion exchanger is received within said second housing.
    Type: Grant
    Filed: May 1, 2003
    Date of Patent: October 26, 2004
    Assignee: Hitachi, Ltd
    Inventors: Rintaro Minamitani, Shigeo Ohashi, Yoshihiro Kondo, Yuji Yoshitomi, Takashi Naganawa, Masato Nakanishi, Tsuyoshi Nakagawa