Abstract: A heat exchanger incorporates a metal hydride heat exchanger and mitigates the fluid mixing process, and thus greatly improves the heat transfer efficiency and heat recovery processes. The metal hydride heat exchanger has a container for the metal hydride that has a large aspect ratio. A plurality of high aspect container for the metal hydride may be coupled with a manifold.

Abstract: Techniques for mitigating loss of vaporized working fluid in a two-phase immersion cooling system may be implemented using one or more supplemental condensers that facilitate condensation of vaporized working fluid when the immersion tank is open, and one or more vapor collection points that are in fluid communication with at least one supplemental condenser. One or more fluid displacement devices may be configured to create suction pressure at the one or more vapor collection points. One or more vents may be positioned in the door. The one or more vents may be configured to permit movement of air from outside the immersion tank into an interior portion of the immersion tank without permitting loss of vaporized working fluid. A directional blowing device may be configured to blow a gaseous substance against a computing device in a downward direction as the computing device is being pulled upward out of the immersion tank.

Abstract: A microchannel heat exchanger comprising: at least one high temperature heat exchanging plate and at least one low temperature heat exchanging plate stacked in an alternating sequence, wherein an inlet of high temperature fluid and an outlet of high temperature fluid are disposed in order to pass the high temperature fluid through each said high temperature heat exchanging plate, and an inlet of low temperature fluid and an outlet of low temperature fluid are disposed in order to pass the low temperature fluid through each said low temperature heat exchanging plate, wherein the high temperature heat exchanging plate comprising the high temperature microchannel and the low temperature heat exchanging plate comprising the low temperature microchannel, wherein said channels have a length extending in the flow direction of fluids, and the side wall of each said channel has a symmetric wavy pattern with the center line of each said channel as a symmetric axis, wherein the high temperature heat exchanging plate and

Abstract: The embodiments of the disclosure provide an immersion liquid cooling device and a liquid cooling system. The liquid cooling device includes a cabinet comprising a first cavity and a second cavity integrated on a side wall of the first cavity; and a heat exchange module adapted to be inserted into the second cavity via an opening on the second cavity, and comprising a heat exchanger, a coolant driving device and a guiding assembly, the heat exchanger being configured to cool the first coolant with the second coolant, the coolant driving device being configured to drive the first coolant to circulate between the second cavity and the first cavity, and the guiding assembly comprising a liquid flow channel configured to guide the first coolant from the coolant driving device to the heat exchanger.

Abstract: A ground testable spacecraft heat pipe has a spacecraft heat pipe thermally connected for conduction of heat through a heat acquisition cold plate to a heat acquisition riser of a bubble pump heat pipe, enabling a plug-slug flow of heated fluid into a separator, with heated liquid flowing downward through a hear rejection downcomer to a heat rejection pipe section mounted on a heat rejection cold plate for conduction of heat to a bottom end of the spacecraft heat pipe, the now-cooled liquid flowing through a heat rejection riser to an outlet in a condenser that receives the heated vapor from the separator through a vapor condensation conduit, the condenser holding the cooled fluid and vapor condensate that exits the condenser through a heat acquisition downcomer to restart the cycle.

Abstract: A plate heat exchanger includes a head, a housing, a frame, a pack, a follower, and a first tie bar. The housing has a driving mechanism. The frame is disposed between the head and housing. The pack includes a plurality of heat exchange plates. The follower is configured to slide along the frame and compress the pack between the follower and the head. The follower has a nut with internal threads. The first tie bar is disposed between the head and the housing. The first tie bar has external threads configured to mate with the internal threads of the nut. The driving mechanism is configured to rotate the first tie bar and the follower is configured to translate along the first tie bar in response to rotation of the first tie bar. A first telescoping cover is disposed between the head and the follower. The first telescoping cover is configured to cover the first tie bar and control the ingress and egress of fluid coming into contact with the first tie bar disposed within the first telescoping cover.

Abstract: A heat exchanger core includes: a plurality of internal passages; and a header passage communicating with the plurality of internal passages. An inner wall of the header passage has greater surface roughness than passage walls of the plurality of internal passages.

Abstract: An inner spiral grooved tube includes: a tube body; and grooves and fins aligned in an inner circumferential direction of the tube body, wherein the grooves and the fins are formed in a spiral along a longitudinal direction, an outer diameter is 3 mm or more and 10 mm or less, a number of the fins is 30 to 60, made of a metal, a cross sectional shape of each of the fins has a rectangular shape having an apex angle of 0±10°, a ratio h/f is 0.90 or more and 3.40 or less, h being a fin height and f being fin width, a ratio c/f is 0.50 or more and 3.80 or less, c being a fin spacing, and an average of the ratio h/f and the ratio c/f is 0.8 or more and 3.3 or less.

Abstract: An integrated vapor chamber includes a metallic top cover, a metallic bottom cover, a working space, capillary structures and a working fluid in the working space. The top cover includes oppositely an outer heat-dissipating surface and an inner condensation surface surrounded by a top frame. The inner condensation surface has parallel top grooves and protrusive supporting structures. The bottom cover includes oppositely an outer heat-absorption surface having recessed spaces for accommodating electronic elements and an inner evaporation surface surrounded by a bottom frame. The inner evaporation surface has parallel bottom grooves. The working space is an airtight space formed by engaging the top frame and the bottom frame with the inner condensation surface to face the inner evaporation surface, the top grooves to overlap individually the bottom grooves, the supporting structures to contact individually at the inner evaporation surface among the bottom grooves.

Abstract: A heat tracing assembly for heating a product in a process pipe including a compression layer formed of a conductive material and one or more tracing tubes for the flow of a heat source. The compression layer is positioned around the process pipe with the tracing tubes at least partially disposed within the compression layer. The compression layer may be formed of a plurality of interlocking longitudinal panels for optimizing the transfer and distribution of heat from the tracing tubes to the process pipe.

Abstract: A heat pipe including: a heat receiving chamber; a heat dissipation chamber; a tubular connecting pipe; and wicks. Each of the heat receiving chamber and the heat dissipation chamber has, when viewed from a first direction, a greater width in a second direction than a width of the connecting pipe in the second direction. The wicks are formed side by side at least in the second direction. The wicks are formed in a groove shape on inner wall surfaces of the heat receiving chamber, the heat dissipation chamber, and the connecting pipe. At least one of the wicks has a bent portion on the heat receiving chamber side, which is bent in the second direction in the heat receiving chamber and the heat dissipation chamber. The heat receiving chamber, the heat dissipation chamber, the connecting pipe. The wicks are integrally formed by laminating and shaping using a metal powder.

Abstract: The present disclosure comprises an evaporative cooling assembly (200) for cooling an apparatus (220), and a method for cooling an apparatus (220). The evaporative cooling assembly comprises a refrigerant tank (202), the refrigerant tank (202) containing refrigerant (204). The apparatus also comprises a first evaporator (210) configured to be positioned proximal to the apparatus (220), and a second evaporator (216) positioned to cool the refrigerant tank (202). Each of the first evaporator (210) and the second evaporator (216) are in fluid communication with the refrigerant tank (202), and the second evaporator (216) is positioned downstream of the first evaporator (210). The method for cooling a heated apparatus (220) comprises passing a refrigerant (204) from a refrigerant tank (202) to a first evaporator (210), which is located proximal to the apparatus (220).

Abstract: A loop heat pipe evaporator includes a porous primary wick, and a nonporous envelope unseparatingly surrounding the primary wick. The primary wick and the envelope are of one-piece construction.

Abstract: Disclosed herein are apparatus for a cooler device includes a manifold constructed at least partially of silicon oxide. The manifold includes an array of inlet channels and an array of outlet channels. Each inlet channel has a first depth. The array of outlet channels are interlaced with the array of inlet channels, Each outlet channel has a second depth that is larger than the first depth. Each of the array of outlet channels has a pair of sidewalls separating each outlet channel from adjacent inlet channels of the array of inlet channels.

Abstract: A heat exchanger includes an inlet header in which a first inlet space and a second inlet space are formed, a plurality of first inlet-side heat exchanger tubes that are connected to the first inlet space, a plurality of second inlet-side heat exchanger tubes that are connected to the second inlet space, a return header in which a plurality of first return spaces connected to the first inlet-side heat exchanger tubes, respectively, and a plurality of second return spaces connected to the second inlet-side heat exchanger tubes, respectively, are formed, and a plurality of outlet-side heat exchanger tubes that are connected to the first and second return spaces, respectively, wherein a communication path that enables a first return space on a bottom side among the first return spaces and a second return space on a top side among the second return spaces to communicate is formed in the return header.

Abstract: The disclosed technology includes systems and methods of managing temperature distributions of phase change material. The disclosed technology can include a system comprising a platform having a passageway therethrough. The platform can include a density that is less than a density of the phase change material when in a solid phase and greater than a density of the phase change material when in a liquid phase. The system can further include a whip rod disposed at least partially in the passageway of the platform.

Abstract: Package lids with carveouts configured for processor connection and alignment are described. Lid carveouts are configured to align and mechanically secure a cooling device to the package lid by receiving protrusions of the cooling device. Because the lid carveouts ensure precise alignment and orientation of a cooling device relative to a package lid, the lid design enables targeted cooling of discrete portions of the lid. Lid carveouts are further configured to expose one or more connectors disposed on a surface that supports package internal components. When contacted by corresponding connectors of a cooling device, the lid carveouts enable direct connections between the package and the attached cooling device. By creating a direct connection between package components and an attached cooling device, the lid carveouts enable a high-speed connection for proactive and on-demand cooling actuation.

Abstract: Systems, apparatus and methods for independently reducing temperature and humidity of air in a controlled space to meet separate temperature and humidity control set points.

Abstract: A heat pipe is provided having a hollow body defining an interior vapor space, evaporator and condenser regions, a wick structure lining an inner wall of the hollow body, and a working fluid disposed in the hollow body, wherein a path for the working fluid in liquid state extends from the condenser region toward the evaporator region or wherein the wick structure extends along a direction from a first end of the hollow body toward the second end, and wherein the wick structure includes first and second regions that extend along the path or direction and that each have wick particles defining respective pore sizes that are different from one another.

Abstract: Support assemblies are described herein for use with heat exchanges, wherein the assemblies are deflector and grid support assemblies having a grid support structure formed of a series of interconnected strips and having a peripheral exterior configured to be positioned within an interior surface of a heat exchanger such that the grid support structure substantially extends across a transverse cross-section of the interior of a the tube heat exchanger, wherein the grid support has a first grid support surface and an opposite second grid support surface longitudinally spaced from the first grid surface, the grid support structure defines a plurality of passageways extending therethrough from the first to the second grid support surface, the passageways being configured to support longitudinally extending tubes of a heat exchanger passing substantially perpendicularly to the first grid support surface through the passageways from the first grid surface to the second grid surface without substantially obstructin