Patents Examined by Tho V Duong
  • Patent number: 11898810
    Abstract: A thermal transfer panel is provided for transferring thermal energy to or from an ambient environment. The thermal transfer panel includes a thermal radiating plate having a plurality of spaced elongate tabs and a thermal insulating plate having a plurality of elongate grooves. The thermal transfer panel is coupled to the thermal insulating plate to form a fluid flow channel. The tabs can include a plurality of apertures, wherein the thermal insulating plate is coupled to the thermal radiating plate, by a bonding agent or a portion of the thermal insulating plate being flowed into the apertures of the tabs so as to retain the thermal insulating plate relative to the thermal radiating plate. Couplers are provided for connecting the thermal transfer panels by fluidly connecting the fluid flow channels of one thermal transfer panel to the fluid flow channels of another thermal transfer panel, or a manifold, or a fluid distribution system.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: February 13, 2024
    Inventor: J. Parr Wiegel
  • Patent number: 11898811
    Abstract: A heat exchanger includes: a heat exchange core portion; and a tank portion connected to the heat exchange core portion. The heat exchange core portion has a connection plate that surrounds a part of the tank portion from an outer peripheral side. The connection plate has slit-shaped openings arranged along an edge of the connection plate in a first direction. A part of the connection plate between each of the openings and the edge is deformable into a concave shape toward the tank portion. A part of the openings has a widened portion at both ends in the first direction. A width dimension of the widened portion in a second direction from the opening to the edge is larger than that of the other portion of the opening.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: February 13, 2024
    Assignee: DENSO CORPORATION
    Inventors: Akira Hirano, Taichi Asano
  • Patent number: 11903172
    Abstract: Techniques for mitigating loss of vaporized working fluid in a two-phase immersion cooling system may be implemented using one or more supplemental condensers that facilitate condensation of vaporized working fluid when the immersion tank is open, and one or more vapor collection points that are in fluid communication with at least one supplemental condenser. One or more fluid displacement devices may be configured to create suction pressure at the one or more vapor collection points. One or more vents may be positioned in the door. The one or more vents may be configured to permit movement of air from outside the immersion tank into an interior portion of the immersion tank without permitting loss of vaporized working fluid. A directional blowing device may be configured to blow a gaseous substance against a computing device in a downward direction as the computing device is being pulled upward out of the immersion tank.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: February 13, 2024
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Nicholas Andrew Keehn, Ioannis Manousakis, Winston Allen Saunders, Husam Atallah Alissa, Eric Clarence Peterson
  • Patent number: 11892242
    Abstract: A multi-angle adjustable and transformable heat pipe includes a sealed case body. A working fluid is filled in the sealed case body. At least one capillary structure is disposed on an inner wall of the sealed case body. The sealed case body has a front section, a rear section and a transformable flexible middle section. The middle section is positioned between the front section and the rear section in connection therewith. The middle section is composed of multiple support sections and multiple knot sections. The support sections and the knot sections are alternately arranged. Two sides of each knot section are respectively connected with adjacent support sections, whereby the support sections can be adjusted by the same angle or different angles with the knot sections serving as fulcrums so that the heat pipe can be multi-angle adjusted and transformed and located.
    Type: Grant
    Filed: December 24, 2021
    Date of Patent: February 6, 2024
    Assignee: ASIA VITAL COMPONENTS (CHINA) CO., LTD.
    Inventor: Chun-Lin Mao
  • Patent number: 11892239
    Abstract: A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a first condenser and a second condenser configured to condense the operating fluid, a liquid pipe configured to connect the evaporator and the first condenser and second condenser, a first vapor pipe configured to connect the evaporator and the first condenser; and a second vapor pipe configured to connect the evaporator and the second condenser. The liquid pipe includes a first liquid pipe having a first flow path and connected to the first condenser, a second liquid pipe having a second flow path and connected to the second condenser, and a third liquid pipe having a third flow path connecting to the first flow path and the second flow path and connected to the evaporator.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: February 6, 2024
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Patent number: 11885571
    Abstract: A pulsating vapor chamber has an inner board, a first outer board, a second outer board, an asymmetric loop, and a working fluid. The inner board has a first surface and a second surface. The first and second outer boards are mounted on the first surface and the second surface of the inner board respectively. The asymmetric loop is located between the first and second outer boards and has multiple channels communicating with each other in sequence. A part of the channels are formed between the first outer board and the inner board, and the remaining channels are formed between the second outer board and the inner board. With the asymmetric loop, even if the vapor chamber is disposed horizontally, pressure may be changed by different amount in the channels so that the working fluid is still able to oscillate or circulate.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: January 30, 2024
    Assignee: Cooler Master Co., Ltd.
    Inventor: Jen-Chih Cheng
  • Patent number: 11885577
    Abstract: An air thermal conditioning system, for at least one of heating air and cooling air, which includes a cross-flow heat exchanger array. The cross-flow heat exchanger array includes a plurality of planar membrane heat exchangers disposed in parallel with a space separating adjacent planar membrane heat exchangers. Each of the planar membrane heat exchangers include a first sheet; a second sheet coupled to the first sheet; and at least one fluid chamber defined by the first and second sheets, with the at least one fluid chamber extending between first and second ends of the planar membrane heat exchangers and opening to a first and second port at the first and second ends respectively.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: January 30, 2024
    Assignee: Other Lab, LLC
    Inventors: Peter Lynn, Saul Griffith, Sam Sarcia, Brent Ridley, Shara Maikranz, James McBride, Vincent Domenic Romanin, Keith Pasko
  • Patent number: 11881574
    Abstract: A device for removal of heat from a plurality of heat sources includes a first manifold to receive a working fluid, and a plurality of elongated intermediate frame members each in thermal communication with at least one of the plurality of heat sources. Each intermediate frame member includes a microchannel in fluid communication with the first manifold to receive the working fluid from the first manifold. Each elongated intermediate frame member includes a slot extending along a longitudinal axis of the heat transfer device. The device further includes a second manifold spaced from the first manifold and in fluid communication with the plurality of intermediate frame members to receive the working fluid from each microchannel in the plurality of intermediate frame members. The second manifold is configured to transfer the working fluid away from the plurality of heat sources.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: January 23, 2024
    Assignee: Aavid Thermal Corp.
    Inventors: Ryan J. McGlen, Kevin V. Lynn
  • Patent number: 11879689
    Abstract: A pump assisted heat pipe may combine the low mass flow rate required of latent heat pipe transfer loops with a hermetically sealed pump to overcome the typical heat pipe capillary limit. This may result in a device with substantially higher heat transfer capacity over conventional pumped single-phase loops, heat pipes, loop heat pipes, and capillary pumped loops with very modest power requirements to operate. Further, one or more embodiments overcome the gravitation limitations in the conventional heat pipe configuration, e.g., when the heat addition zone is above the heat rejection zone, the capillary forces are required to transfer the liquid from the heat rejection zone to the heat addition zone against gravity.
    Type: Grant
    Filed: March 16, 2022
    Date of Patent: January 23, 2024
    Assignee: TRIAD NATIONAL SECURITY, LLC
    Inventors: Robert S. Reid, Robert A. Zimmerman, Cody M. Williams, Morgan T. Biel, Stephen J. Obrey, Todd A. Jankowski, Justin Simpson, Martin J. Ward, Lydia Wermer
  • Patent number: 11879696
    Abstract: A sectional radiator seal arrangement including a sectional radiator having a core and a bonnet, a nozzle defined by a cylindrical sidewall extending from and in fluid communication with the bonnet and the core, the nozzle configured for creating a seal with a radiator tank and a sleeve formed from a corrosion resistant material fitted about a portion of the cylindrical sidewall of the nozzle. A retaining compound can be provided between the sleeve and the radiator tank for preventing an ingress of coolant at the seal and into contact with either the nozzle or the bonnet. A method of reducing corrosion of the radiator seal also is provided.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: January 23, 2024
    Assignee: Bearward Engineering Limited
    Inventors: Martin Smith, George Wilson-Fitzgerald
  • Patent number: 11874068
    Abstract: A vapor chamber has: a container in which a cavity portion is formed in an inside; a wick structure provided in the cavity portion; a working fluid enclosed in the cavity portion; a vapor flow path which is formed in the cavity portion and through which the working fluid in a gas phase flows; and a hydrogen occlusion metal that is disposed in the cavity portion and absorbs hydrogen at 350° C. or lower and does not release hydrogen at 350° C. or lower, the hydrogen occlusion metal being coated in a region in contact with the working fluid in an inner surface of the cavity portion and/or the wick structure.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: January 16, 2024
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshikatsu Inagaki, Hirofumi Aoki
  • Patent number: 11873469
    Abstract: A portable assembly for cooling the contents of a fermentation vessel is provided. In one embodiment, the assembly comprises an insulated, cylindrical enclosure having a fixed bottom and a removable lid. A flexible heat exchanger is cylindrically disposed within the enclosure and encircles the fermentation vessel. In one embodiment, the flexible heat exchanger is connected to a vessel containing thermally conductive fluid by flexible tubes that extend outside the enclosure. In one embodiment, a heating element is used to heat the fermentation vessel.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: January 16, 2024
    Inventor: Steven Dee Wayne Webber
  • Patent number: 11859923
    Abstract: The disclosure discloses a cooling system and an automatic coolant injection method for the cooling system. The cooling system includes a heat exchanger; a converter; a liquid cooling pipeline; a coolant tank with a liquid-level sensor; an injection pump for injecting coolant from the coolant tank into the liquid cooling pipe; and a control unit. When liquid level of the coolant tank reaches an upper threshold, the injection pump injects coolant into the liquid cooling pipeline. When pressure of the coolant in the liquid cooling pipe reaches an upper static liquid pressure threshold, the control unit turns off the injection pump, and executes the turning-on and turning-off operations of the circulation pump with a preset circulation period. The circulation pump forces the coolant to circulate in the liquid cooling pipeline when being turned on.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: January 2, 2024
    Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Tao Yang, Jun Chen, Jingxian Kuang, Dong Wang, Shunxi Huang, Qiquan Chen
  • Patent number: 11858309
    Abstract: A vehicle thermal management system, may include an HVAC subsystem including a first compressor and a first refrigeration cycle including a first refrigerant loop fluidly connected to the first compressor; a battery cooling subsystem including a battery coolant loop fluidly connected to a battery pack; a powertrain cooling subsystem including a powertrain coolant loop fluidly connected to a powertrain component; a second refrigeration cycle including a second compressor, a condenser located on the downstream side of the second compressor, and a second refrigerant loop fluidly connected to the condenser; a refrigerant chiller mounted between the first refrigeration cycle and the second refrigeration cycle and configured to transfer heat between the first refrigeration cycle and the second refrigeration cycle; and a battery chiller mounted between the second refrigeration cycle and the battery coolant loop and configured to transfer heat between the second refrigeration cycle and the battery coolant loop.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: January 2, 2024
    Assignees: Hyundai Motor Company, Kia Corporation, DOOWON CLIMATE CONTROL CO., LTD
    Inventors: Jae Hyun Song, Tae Han Kim, Hong Rok Shim, Chul Min Kim, Gang Jong Lee
  • Patent number: 11859916
    Abstract: A flow path member for a heat exchanger includes: an inner cylinder capable of housing a heat recovery member through which a first fluid can flow; an outer cylinder having a feed port capable of feeding a second fluid and a discharge port capable of discharging the second fluid, the outer cylinder being disposed so as to be spaced on a radially outer side of the inner cylinder such that a flow path for the second fluid is formed between the outer cylinder and the inner cylinder; a feed pipe connected to the feed port; and a discharge pipe connected to the discharge port. The feed port and the discharge port are provided so as to be located in a distance of less than half the circumference of the outer cylinder in a circumferential direction.
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: January 2, 2024
    Assignee: NGK INSULATORS, LTD.
    Inventors: Tatsuya Akahani, Tatsuo Kawaguchi, Makoto Yoshihara
  • Patent number: 11859850
    Abstract: A heat exchanger for exchanging heat between first and second duct portions of a ventilation system includes first and second heat pipe portions in the first and second duct portions, respectively. Each heat pipe portion can be a heat pipe subassembly including one or more vertical heat pipes fluidly coupled to top and bottom headers, which are respectively connected to the top and bottom headers of the other subassembly to form a refrigerant loop. One or more flow restrictors can block air flow through a respective section of the first or second duct portion. The blocked section can be operatively aligned with a segment of the respective heat pipe portion along which there is a low probability of refrigerant phase change. Each flow restrictor can be an adjustable damper. The damper(s) can be selectively opened and closed as the ventilation system switches between heating and cooling modes.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: January 2, 2024
    Assignee: Heat-Pipe Technology, Inc.
    Inventors: Marcus D'Arcy, Onieluan Tamunobere
  • Patent number: 11857947
    Abstract: A method includes: providing an absorber material including: a casing; and superabsorbent particles arranged therein, and using the absorber material to absorb and/or distribute liquids in an actively and/or passively cooled current-carrying system including an actively and/or passively cooled power storage system. The casing has at least two plies arranged in a planar fashion on one another. Regions of the at least two plies are connected to one another by at least one seam such that the casing is segmented in a form of pockets separated from one another. At least some of the pockets have the superabsorbent particles.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: January 2, 2024
    Assignee: CARL FREUDENBERG KG
    Inventors: Ulrich Schneider, Markus Weber, Sarah Senne
  • Patent number: 11852421
    Abstract: A heat pipe with micro tubes includes of a solid heat conductor provided therein with two or more parallel micro tubes. The micro tubes are filled with a working medium which exchanges heat through phase change. Two ends of the heat conductor are sealed and at least one of the ends is provided with a sealing strip of gradually shrinking shape that is formed from cold welding.
    Type: Grant
    Filed: May 1, 2021
    Date of Patent: December 26, 2023
    Inventors: Yaohua Zhao, Kairong Zhang
  • Patent number: 11855270
    Abstract: A heat exchanger may include a perforated plate having a plurality of openings sandwiched between a first plate and a second plate. The first plate may have a first plate central planar surface, a first plate peripheral wall extending from an internal face of the first plate central planar surface towards the second plate, and an inlet permitting fluid flow on to the internal face of the central planar surface. The second plate may have a second plate central planar surface, a second plate peripheral wall extending from an internal face of the second plate central planar surface towards the first plate, and an outlet permitting fluid to exit the heat exchanger. The first plate, the second plate and the perforated may be coupled and define a fluid passage for flow of a heat exchanger fluid from the inlet to the outlet.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: December 26, 2023
    Assignee: DANA CANADA CORPORATION
    Inventors: Elmer Galvis, Farbod Vakilimoghaddam
  • Patent number: 11846470
    Abstract: A cooling device includes a partitioning board abutting inner faces of two boards, respectively. A chamber is defined between the partitioning board and one of the two boards. Another chamber is defined between the partitioning board and another of the two boards and intercommunicates with the chamber via an intercommunication port and a backflow port of the partitioning board. A pump drives a working fluid to circulate in the two chambers. Two welding channels are formed on outer faces of the two boards and surround the two chambers, respectively. The smallest distance between a channel bottom face of each annular welding channel and the inner face of a respective board having the annular welding channel is smaller than that between the inner and outer faces of the respective board. The two boards are coupled to the partitioning board along the annular welding channels by laser welding.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: December 19, 2023
    Assignee: SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD.
    Inventors: Alex Horng, Ming-Tsung Li, Chi-Ting Yeh