Patents Examined by Tim Phan
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Patent number: 6931722Abstract: A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is disclosed. The method includes forming an oxide layer on the set of second conductors; forming a solder mask on the oxide layer; forming a composite layer on the first set of conductors; and forming a solder layer on at least a portion of the third set of conductors.Type: GrantFiled: March 24, 2003Date of Patent: August 23, 2005Assignee: International Business Machines CorporationInventors: Edward L. Arrington, Anilkumar C. Bhatt, Edmond O. Fey, Kevin T. Knadle, John J. Konrad, Joseph A Kotylo, Jeffrey McKeveny, Jose A. Rios, Amit K. Sarkhel, Andrew M. Seman, Timothy L. Wells
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Patent number: 6920682Abstract: A mover assembly of a reciprocating motor includes: a mover body disposed at a gap between an inner stator and an outer stator; permanent magnets fixed at an outer circumferential surface of the mover body and reciprocally moved together with the mover body in a direction of an induction magnetic field between the inner stator and the outer stator; and a mixed member made of a fiber and a resin to cover and fix the permanent magnets. The permanent magnets are arranged at an outer circumferential face of the mover body, covered with the mixed member obtained by mixing a fiber and a resin, and hardened to be fixed. Therefore, the permanent magnets can be firmly and easily fixed at the mover body. In addition, by molding the mover body with a non magnetic and non-conductive material, leakage of the magnetic force of the permanent magnets can be prevented.Type: GrantFiled: March 24, 2001Date of Patent: July 26, 2005Assignee: LG Electronics Inc.Inventors: Bon-cheol Ku, Jin-Yoong Do, Hyung-Pyo Yoon, Si-Hang Jeon
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Patent number: 6920689Abstract: A interconnect structure is inexpensively manufactured and easily insertable into a socket. The interconnect structure is manufactured by forming a sacrificial substrate with cavities that is covered by a masking material having openings corresponding to the cavities. A first plating process is performed by depositing conductive material, followed by coupling wires within the openings and performing another plating process by depositing more conductive material. The interconnect structure is completed by first removing the masking material and sacrificial substrate. Ends of the wires are coupled opposite now-formed contact structures to a board. To complete the socket, a support device is coupled to the board to hold a tested integrated circuit.Type: GrantFiled: December 6, 2002Date of Patent: July 26, 2005Assignee: FormFactor, Inc.Inventors: Igor Y. Khandros, Gaetan L. Mathieu, Carl V. Reynolds
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Patent number: 6915557Abstract: A method of assembling a rotor structure for a spindle motor for use in an information recording and playback apparatus is provided in which pollution of the recording medium due to gases emitted from adhesives and the like used in the manufacturing process can be prevented. To be more specific, in an assembling process of securing a rotor yoke and a rotating magnet on a disc section, the rotor yoke, the rotating magnet, and the disc section is disposed one after another at predetermined positions of a centering jig used for centering the center of rotation of the rotating magnet and the center of rotation of the disc section. A pressing mechanism is then placed on the disc section to press the disc section, the rotor yoke, and the rotating disc so as to integrate them into one piece. At the same time, emitted gases are exhausted with an exhausting apparatus in a manner such that the direction of flow of the emitted gases is from the main surface of the disc section toward the rotor yoke.Type: GrantFiled: August 21, 2002Date of Patent: July 12, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventor: Shigeo Obata
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Patent number: 6915567Abstract: An housing of a meter unit is inserted from above into a meter unit support hole which is provided in the rear handle cover. Engagement claws of the housing are engaged with claw receiving portions of the rear handle cover, thereby prevent the housing from coming out. Male connector is provided beforehand in the rear handle cover, and inserting the housing of the meter unit into the meter unit support hole causes the female connector of the housing to be automatically connected to the male connector, thus completing the wiring work of the meter unit. The wiring work on the meter unit supported on the rear handle cover of the motorcycle can therefore be performed easily and reliably.Type: GrantFiled: October 29, 2001Date of Patent: July 12, 2005Assignee: Toyo Denso Co., Ltd.Inventors: Kazuhiko Nakao, Yukihiro Hayasaka, Hiroshi Sakamoto
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Patent number: 6915556Abstract: This process for assembling conductive segments (16) of a rotor or stator winding of a rotary electrical machine comprises the stages consisting in inserting the conductive segments (16) in slots arranged in a core (12) of the rotor or of the stator in such a way that the conductive segments project beyond the latter by their free ends, and in welding the conductive segments in pairs by their projecting free ends to form a winding (14) around the rotor or the stator. The conductive segments each being formed by a wire of electrically conductive material covered with a layer of electrically insulating material, the layer of electrically insulating material is eliminated, in the zone in which the conductive segments are welded, by the means used to weld the latter. Application to the assembly of conductive segments of a rotor or stator winding of a motor-vehicle alternator.Type: GrantFiled: February 28, 2002Date of Patent: July 12, 2005Assignee: Valeo Equipements Electriques MoteurInventors: Romaric Lenoir, Sébastien Arrighi, Denis Even, Thierry Hevia
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Patent number: 6912781Abstract: A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a set of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the conductors of the component are routed through the lead channels. A set of insertable lead terminals, adapted to cooperate with the specially shaped lead channels, are received and captured within the lead channels, thereby forming an electrical connection between the lead terminals and the conductors of the electronic component(s). A method of fabricating the device is also disclosed.Type: GrantFiled: September 11, 2002Date of Patent: July 5, 2005Assignee: Pulse Engineering, Inc.Inventors: Timothy J. Morrison, Aurelio J. Gutierrez, Thomas Rascon
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Patent number: 6910258Abstract: A method is disclosed for fitting a rotor enclosure over at least one assembly of field windings mounted on a rotor core, said method comprising the steps: applying a force to elastically reduce a circumference of the at least one assembly of field windings mounted on the rotor core, where the reduction in circumference is greater than a circumference reduction due to just eliminating clearances between adjacent end-turns of windings; generating a clearance between the field windings and the rotor enclosure due to the application of the force; axially sliding the rotor enclosure over the at least one assembly of field windings while the circumference is reduced, and releasing the force to allow the circumference of the at least one assembly of field windings to expand and cause the enclosure to tightly fit on the at least one assembly of field windings.Type: GrantFiled: October 3, 2003Date of Patent: June 28, 2005Assignee: General Electric CompanyInventors: Yu Wang, Richard Nils Dawson, Christopher Anthony Kaminski, Robert John Nygard, James Pellegrino Alexander
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Patent number: 6910257Abstract: A production method of a polyphase sequentially joined-segment coil of a rotary electric machine and a product produced by the same are provided. A production machine includes pairs of tines working to catch heads of conductor segments when they are twisted using rings. The tines are designed to be rotatable about an axis of the rings following rotation of the rings to absorb stress acting on insulating coating on the heads of the segments to minimize rubbing of the insulating coatings, thereby ensuring a desired degree of electrical insulation of the stator coil.Type: GrantFiled: June 24, 2003Date of Patent: June 28, 2005Assignee: Denso CorporationInventors: Tetsuya Gorohata, Youichi Kamakura, Hitoshi Hirano
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Patent number: 6907659Abstract: A method for manufacturing and packaging an integrated circuit includes following steps: pressure a continuous pin material and a base board area at first; then cut off pin material into several pin units, accommodate each pin units into respective position in a mould, and ejecting plastic into the mould gap to shape a pin unit, then remove waste part of the pin material after removing down the mould parts; put four pin units and a base board into a rectangle mould, then eject plastic again into mould gap, after that cut off waste part of the base board to attain an IC socket; stick an IC chip on top of the base board of the IC socket and wire it. Finally, cover and stick a panel on the IC socket to finish the whole IC packaging procedures.Type: GrantFiled: February 5, 2003Date of Patent: June 21, 2005Assignee: Advanced Connection Technology Inc.Inventor: Ching-Shun Wang
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Patent number: 6904674Abstract: A printed wiring board, particularly, an interposer 20 for a chip scale package, comprising an outer insulator layer 22 having outer electrodes 31, a conductor layer 21, and an inner insulator layer 23 having inner electrodes 27, the electrodes 31 and/or 27 having been formed by electroplating using, as a negative electrode, a metal plate 32 that has been provided on the outer insulator layer 22 and removed after the electroplating. Having no plating leads, the printed wiring board has the electrodes in an orderly array at a fine pitch and a high density.Type: GrantFiled: April 11, 2002Date of Patent: June 14, 2005Assignee: Nitto Denko CorporationInventors: Kazunori Mune, Hirofumi Fujii, Satoshi Tanigawa
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Patent number: 6901649Abstract: A stator winding includes a plurality of winding sub-portions in each of which a strand of wire formed from a continuous wire is wound so as to alternately occupy an inner layer and an outer layer in a slot depth direction within slots at intervals of a predetermined number of slots and form a lap winding having two turns in each lap, the strands of wire folding over outside the slots at end surfaces of a stator core, four of the strands of wire constituting the winding sub-portions being housed so as to line up in each of the slots in a slot depth direction, turn portions formed by folding the strands of wire over outside the slots at a first end surface of the stator core being disposed circumferentially to form two rows in a radial direction, and turn portions formed by folding the strands of wire over outside the slots at a second end surface of the stator core being disposed circumferentially to form two layers in an axial direction.Type: GrantFiled: August 8, 2002Date of Patent: June 7, 2005Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Hideo Imori, Yoshihito Asao
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Patent number: 6898842Abstract: Disclosed is a method for manufacturing a continuous-length switch that comprises first and second electrodes. The method comprises covering at least a first surface of a first electrode with an insulating material. Then, a portion of the insulating material from the first surface of the first electrode is removed so as to provide an exposed portion of the first electrode. And then, a second electrode is placed on the insulating material and over the exposed portion of the first electrode.Type: GrantFiled: August 7, 2002Date of Patent: May 31, 2005Assignee: Tokyo Sensor Co., Ltd.Inventors: Takeshi Kasahara, Uhei Arakawa, Toshiaki Horikoshi, Takaki Natsugiri
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Patent number: 6895660Abstract: The present invention discloses a manufacturing method of an over-current protection device, characterized in that the PTC plaque is conducted by punching under frozen state to form the over-current protection devices so as to reduce the heating and temperature rising in the PTC plaque due to punching and temperature difference between the metal foil and the conductive composite material. Relatively, the deformation and stress of the over-current protection device caused by punching will also be reduced. Therefore, there is no need for additional process to increase the temperature sensitivity and electrical property stability of the over-current protection device.Type: GrantFiled: December 30, 2002Date of Patent: May 24, 2005Assignee: Polytronics Technology CorporationInventors: Edward Fu-Hua Chu, David Shau-Chew Wang, Chih-Ming Yu
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Patent number: 6895667Abstract: Methods for patterning a metal over a substrate and devices formed using the methods are disclosed. A patterned die having at least one raised portion and having a metal layer over the die is pressed onto a thin metal film over a substrate, such that the metal layer over the raised portion of the patterned die contacts portions of the thin metal film. Pressure is then applied such that the metal layer and the thin metal film cold-weld to one another. The patterned die is removed, such that the portions of the metal layer cold-welded to the thin metal film break away from the die and remain cold-welded to the thin metal film over the substrate, in substantially the same pattern as the patterned die.Type: GrantFiled: April 13, 2001Date of Patent: May 24, 2005Assignee: The Trustees of Princeton UniversityInventors: Stephen R. Forrest, Changsoon Kim
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Patent number: 6892443Abstract: A high precision power resistor having the improved property of reduced resistance change due to power is disclosed. The resistor includes a substrate having first and second flat surfaces and having a shape and a composition; a resistive foil having a low TCR of about 0.1 to about 1 ppm/° C. and a thickness of about 0.03 mils to about 0.7 mils cemented to one of the flat surfaces with a cement, the resistive foil having a pattern to produce a desired resistance value, the substrate having a modulus of elasticity of about 10×106 psi to about 100×106 psi and a thickness of about 0.5 mils to about 200 mils, the resistive foil, pattern, type and thickness of cement, and substrate being selected to provide a cumulative effect of reduction of resistance change due to power. The present invention also provides for a method of producing a high precision power resistor.Type: GrantFiled: November 25, 2002Date of Patent: May 17, 2005Assignee: Vishay IntertechnologyInventors: Joseph Szwarc, Reuven Goldstein
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Patent number: 6892452Abstract: A Dry-Film resist formed of, for example, a photosensitive film is stacked on the electroconductive material and these portions, other than a projection electrode formation area, formed on a wiring board's electrode serving as a portion of a circuit pattern are masked with a mask. After this, the wiring board is exposed to light and, after the removal of the mask, a development process is performed, thus eliminating the Dry-Film resist on the wiring board at the portion other than the projection electrode formation area. Then the electroconductive material of the wiring board is etched under an etching process to provide a projection electrode having a bump with a pointed tapering end in vertical cross-section. Finally, the wiring board is exposed to a Dry-Film resist elimination solution to remove remaining Dry-Film resist from the projection electrode. And a plating process is performed on the electroconductive material to form a plated layer and hence complete the projection electrode.Type: GrantFiled: April 26, 2001Date of Patent: May 17, 2005Assignee: DDK Ltd.Inventors: Yasuo Fukuda, Masakatsu Nagata, Shoji Iwasaki, Osamu Nakao
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Patent number: 6889425Abstract: Method for producing a resistive heating element by coating a substrate with an electrically insulating material from the gaseous phase, depositing an electrically conducting material from the gaseous phase onto the layer of insulating material deposited onto the substrate, wherein the layer of conducting material deposited onto the layer of insulating material is subsequently partially mechanically removed thereby forming at least one conductor path. The substrate is machined before depositing the insulating material thereby forming at least one recess provided for receiving the conductor path. The layers of insulating material and conducting material are deposited onto the mechanically processed substrate. Finally, the layer of conducting material is evenly removed until at least the conducting material has been completely removed from the elevated regions of the substrate delimiting the recess of the conductor path, thereby forming the conductor path.Type: GrantFiled: February 25, 2003Date of Patent: May 10, 2005Assignee: Sintec Keramik GmbH & Co. KGInventor: Ulrich Goetz
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Patent number: 6889420Abstract: An electric machine such as a direct current motor or generator in which a stator is formed using a set of electrically conductive blade structures disposed about an inner axis of a stator core. Electrical interconnections between the conductive blades are provided by a set of disks connected to the ends of the blades. The disks are formed preferably from an insulating substrate material having electrically conductive pads formed thereon to provide circuit interconnections between the blades. A desired path for current flow is provided by arranging the blades and conductive pads on the disks appropriately in the desired number of turns and phases. The conductive blades and conductive portions of the interconnect disks are formed, in a preferred embodiment, from a material such as a copper and molybdenum laminate.Type: GrantFiled: October 30, 2002Date of Patent: May 10, 2005Inventor: Robert M. Jones
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Patent number: 6889419Abstract: A method of making composite electric machine components. Magnetic segments and non-magnetic segments are separately formed to green strength, and then arranged adjacent to each other in a desired magnetic pattern. A small amount of powder material is added in-between the segments, and the whole assembly is then sintered to form a sinterbonded composite component of high structural integrity.Type: GrantFiled: April 16, 2002Date of Patent: May 10, 2005Assignee: Delphi Technologies, Inc.Inventors: Frederick B. Reiter, Jr., Tom L. Stuart