Patents Examined by Tim Phan
  • Patent number: 7043822
    Abstract: A method of manufacturing a commutator of a rotary electric machine includes a step of forming a first unitary material having nail portions, a step of forming a second unitary material for the commutator segments, a step of fixing the first unitary material and the second unitary material together to form a pre-commutator unit so that the nails extend radially outward from the periphery of the pre-commutator unit, a step of inserting the pre-commutator unit between a pair of dies so that the dies hold the nails without a gap, and a step of charging liquid resinous material into the inside of the dies to mold the pre-commutator unit.
    Type: Grant
    Filed: May 20, 2004
    Date of Patent: May 16, 2006
    Assignee: Denso Corporation
    Inventors: Masayuki Kobayashi, Eiji Iwanari
  • Patent number: 7043830
    Abstract: A sealing layer is provided on the surface of a substrate such as a semiconductor wafer. The sealing layer includes apertures which expose external contact locations for semiconductor dice formed on the wafer. Solder paste is deposited in the apertures and reflowed to form discrete conductive elements for attachment of the electronic devices to higher level circuit structures. The wafer is then divided or “singulated” to provide individual semiconductor dice having their active surfaces covered by the sealing layer. In this manner, the sealing layer initially acts as a stencil for forming the discrete conductive elements and subsequently forms a chip scale package structure to protect the semiconductor dice from the environment.
    Type: Grant
    Filed: February 20, 2003
    Date of Patent: May 16, 2006
    Assignee: Micron Technology, Inc.
    Inventor: Warren M. Farnworth
  • Patent number: 7040014
    Abstract: An object of the present invention is to provide a coil chip having a structure with which downsizing of the coil chip can be realized and a high inductance and a high Q can be obtained and to provide a method of producing such a coil chip. In order to attain the object, according to the present invention, there is provided a coil structure including a core member made of a material having low dielectric loss characteristics, a coil formed by metal plating and wound around the core member, and a layer functioning as a seed for metal plating provided between the core member and the coil.
    Type: Grant
    Filed: January 20, 2004
    Date of Patent: May 9, 2006
    Assignee: TDK Corporation
    Inventor: Shigeru Shoji
  • Patent number: 7040011
    Abstract: A wiring substrate is manufactured in short TAT. Wirings of the wiring substrate are formed by an exposure treatment using a photomask which has shade patterns each containing at least nano particles and a binder.
    Type: Grant
    Filed: January 15, 2002
    Date of Patent: May 9, 2006
    Assignee: Renesas Technology Corp.
    Inventors: Toshihiko Tanaka, Masaharu Kubo, Takashi Hattori
  • Patent number: 7036218
    Abstract: A method for producing a wafer interposer (210) for use in a wafer interposer assembly is disclosed. The wafer interposer (210) is produced by attaching solder bumps (140) to a lower surface of a support (120). First electrical terminals (130) are attached to an upper surface of the support (120) and substantially correspond to the solder bumps (140). First electrical pathways are provided that passes through the support (120) and connect the solder bumps (140) to the first electrical terminals (130). Second electrical terminals (310) are attached to the upper surface of the support (120). Second electrical pathways (320) connect the first electrical terminals (130) to the second electrical terminals (310).
    Type: Grant
    Filed: February 24, 2003
    Date of Patent: May 2, 2006
    Assignee: Eaglestone Partners I, LLC
    Inventor: John L. Pierce
  • Patent number: 7032290
    Abstract: A brush holder incorporates a terminal integral part, which has a coupling portion. The coupling portion couples the terminals with each other. The brush holder has a resin body and a plurality of terminals. The resin body has an opening. The terminals are embedded in the resin body. The terminals are coupled to each other by the coupling portion as an integral part before being embedded in the resin body. The coupling portion is exposed from the opening of the resin body. The terminals are separated from each other by cutting the coupling portion, which is exposed from the opening of the resin body. A coating member coats the opening of the resin body to insulate each terminal.
    Type: Grant
    Filed: March 19, 2003
    Date of Patent: April 25, 2006
    Assignee: ASMO Co., Ltd.
    Inventors: Yoshinobu Hirano, Kenji Obata, Masakuni Masuda
  • Patent number: 7032291
    Abstract: A method of manufacturing a stator winding includes a twisting step of U-shaped conductor segments having a pair of straight portions by moving the straight portions in the circumferential direction while restraining the turn portions of the U-shaped conductor segments in the axial direction by a pressing tool. After the previously twisted U-shaped conductor segments are inserted into slots of a stator core, the straight portions are bent in the circumferential direction. The pressing tool is constituted of a stationary top plate that has recesses into which the straight portions are inserted and a movable top plate that is movable to close the recesses after the straight portions are inserted in the recesses.
    Type: Grant
    Filed: June 17, 2003
    Date of Patent: April 25, 2006
    Assignee: Denso Corporation
    Inventors: Mitsuru Kato, Yasunori Kitakado, Motohiro Murahashi
  • Patent number: 7028385
    Abstract: Method for retrofitting an electric machine to reduce temperature rise therein. The method allows for removing at least a portion of an originally assembled coil support on a spider structure of the machine. The originally assembled coil support is configured to allow only axial flow to cooling air from a plurality of cooling vents in the armature of the machine. The method further allows for mounting a new coil support on the spider structure. The new coil support is configured to provide axial and radial routing to cooling air passing from the plurality of cooling vents. The air routed radially by the new coil support passes proximate the coil end turns and enables a reduction of temperature rise in the machine.
    Type: Grant
    Filed: July 26, 2002
    Date of Patent: April 18, 2006
    Assignee: General Electric Company
    Inventors: Michael Camillo Radomile, Peter Gerard Kloecker
  • Patent number: 7020948
    Abstract: The stacked core assembly apparatus, which can perform assembly at a high speed while keeping strength of an angle indexing apparatus, comprises a press machine 1, a non-synchronous transmitting apparatus 10 and an angle indexing apparatus 7. The non-synchronous transmitting apparatus 10 transforms a constant revolution of the press machine 1 into a variable revolution. The angle indexing apparatus 7 is connected to the non-synchronous transmitting apparatus 10 via a coupling device 20, and is connected to a rotatably stacking cavity device 51 of a press die 5.
    Type: Grant
    Filed: June 11, 2002
    Date of Patent: April 4, 2006
    Assignees: Yamada Dobby Co., Ltd., Minebea Co., Ltd.
    Inventors: Kuniyasu Shirai, Takuya Sato
  • Patent number: 7013555
    Abstract: The present invention discloses a method of providing an integral thermal interface on an interface surface of a heat dissipation device, such as a heat sink. In accordance with the present invention, the phase change material is applied directly onto the interface surface of the heat sink to form an integral interface layer directly on the heat sink during the manufacturing process. This process includes the steps of providing a heat dissipating device having an interface surface, liquefying the phase change material at a controlled temperature so as to decrease the material viscosity to a flowable form, applying the liquefied phase change material directly onto the mating surface of the heat dissipating device either by directly dispensing the material, screen printing or stencil printing and cooling the material causing it to cure on the surface of the heat dissipating device.
    Type: Grant
    Filed: August 20, 2002
    Date of Patent: March 21, 2006
    Assignee: Cool Shield, Inc.
    Inventor: Kevin A. McCullough
  • Patent number: 7013560
    Abstract: A substrate comprises at least a semi-finished substrate, a circuit line, a contact and a solder mask layer. The circuit line and the contact are formed on the semi-finished substrate. The circuit line and the contact are connected together non-integrally. The solder mask layer is formed over the semi-finished substrate to cover the circuit line. The solder mask layer has an opening in which the contact is formed.
    Type: Grant
    Filed: November 14, 2003
    Date of Patent: March 21, 2006
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventor: Po-Chih Liu
  • Patent number: 7010849
    Abstract: A pin having a voltage probe pin-head is provided. The pin includes a pin-head having a substantially flat surface at one end and a pin-head tip at an opposing end, the substantially flat surface is configured to attach to a resistor, and the pin-head tip contacts an electrical test point. The pin also has a neck-like portion that extends between a shaft and the pin-head, wherein the neck-like portion is shorter than the shaft and has a diameter that is smaller than a diameter of a cross-section of the shaft.
    Type: Grant
    Filed: April 18, 2002
    Date of Patent: March 14, 2006
    Assignee: Agilent Technologies, Inc.
    Inventor: David Nelson Kimbley
  • Patent number: 7010846
    Abstract: Each tooth of a stator core has circumferential projections at an inner tooth edge and circumferential notches at a base portion adjacent to a core back. A width of the teeth at the base portion is larger than a width of the same at the tooth edge. Therefore, the magnetic reluctance of the teeth does not increase. In addition, a plurality of the magnetic strips can be formed from a long and thin magnetic sheet. This increases the yield percentage of the magnetic strip and reduces a manpower of manufacturing the magnetic strip. Further, the notches make it easy to wind the magnetic strip into a cylindrical core.
    Type: Grant
    Filed: February 24, 2003
    Date of Patent: March 14, 2006
    Assignee: Denso Corporation
    Inventor: Shigenobu Nakamura
  • Patent number: 7007375
    Abstract: A semiconductor component includes adjustment circuitry configured to adjust selected physical and electrical characteristics of the component or elements thereof, and an input/output configuration of the component. The component includes a semiconductor die, a substrate attached to the die, and terminal contacts on the substrate. The adjustment circuitry includes conductors and programmable links, such as fuses or anti-fuses, in electrical communication with the die and the terminal contacts. The adjustment circuit can also include capacitors and inductance conductors. The programmable links can be placed in a selected state (e.g., short or open) using a laser or programming signals. A method for fabricating the component includes the steps of forming the adjustment circuitry, and then placing the programmable links in the selected state to achieve the selected adjustment.
    Type: Grant
    Filed: March 31, 2003
    Date of Patent: March 7, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Aaron M. Schoenfeld, David J. Corisis, Tyler J. Gomm
  • Patent number: 7003867
    Abstract: A core includes a ring body and a plurality of teeth. The teeth extend radially outward form the outer circumference of the ring body. The core is formed by assembling a first core member and a second core member. Each core member has part of the teeth the number of which is half the total number of the teeth. Each tooth includes a tooth body about which the coil is wound, and a magnetism converging portion provided at the distal end of the tooth body. The tooth height of each tooth body gradually increases from a distal section to a proximal section of the tooth body. The tooth width gradually decreases from the distal section to the proximal section. The wire is wound about each of the teeth of the first and second core members. Then, the first and second core members are assembled to form the core. Accordingly, a rotor core having a high coil accommodation efficiency and a high coil space factor is obtained.
    Type: Grant
    Filed: October 15, 2003
    Date of Patent: February 28, 2006
    Assignee: Asmo Co., Ltd.
    Inventors: Toshio Yamamoto, Atsuo Okamoto, Takerou Totsuka, Akiyoshi Katou
  • Patent number: 7000307
    Abstract: An armature for a brush commutated electric motor having a distributed coil winding arrangement for reducing brush arcing and electro-magnetic interference (EMI). The winding pattern involves segmenting each coil into first and second subcoil portions with differing pluralities of turns. Each subcoil portion is wound around separate pairs of spaced apart slots of a lamination stack. Adjacent coils are wound such that one subcoil portion of each is wound in a common slot to therefore form an overlapping arrangement of each pair of adjacently coils. The winding pattern serves to “shift” the resultant magnetic axes of each coil in such a manner so as to significantly reduce brush arcing and the EMI resulting therefrom. The reduction in EMI is sufficient to eliminate the need for EMI reducing components, such as chokes, which have typically been required to maintain EMI to acceptably low levels.
    Type: Grant
    Filed: July 3, 2003
    Date of Patent: February 21, 2006
    Assignee: Black & Decker Inc.
    Inventor: Ren Hong Wang
  • Patent number: 6996902
    Abstract: A circuit board includes an electrical insulator layer formed of a reinforcer sheet with density distribution in its in-plane direction, an electrical conductor filled in a plurality of inner via holes provided in the electrical insulator layer in its thickness direction, and a wiring layer connected to the electrical conductor. The inner via holes provided in a high-density portion of the reinforcer sheet are formed to have a smaller cross-section than the inner via holes provided in a low-density portion of the reinforcer sheet. In this manner, it is possible to provide a circuit board that can achieve a high-density wiring and an inner via connection resistance with less variation, when a base material including a reinforcer sheet with density distribution in its in-plane direction such as a glass-epoxy base material is used for an insulator layer.
    Type: Grant
    Filed: March 14, 2003
    Date of Patent: February 14, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takeshi Suzuki, Toshihiro Nishii, Satoru Tomekawa, Fumio Echigo
  • Patent number: 6993828
    Abstract: A metal resistor and a method for manufacturing the resistor are provided. A first insulation film is formed on a substrate, a photosensitive film is applied on the insulation film, and an insulation film pattern is formed by patterning the insulation film. After a metal thin film is formed among the insulation film pattern and on the photosensitive film, with removing the photo-sensitive film is a metal thin film pattern formed among the insulation film pattern. On the metal thin film pattern and the insulation film pattern is a second insulation film formed and at the pad region of the metal thin film pattern is a lead wire connected, after that, a metal thin film resistor is manufactured with forming a preservation film on and around the lead wire.
    Type: Grant
    Filed: February 22, 2002
    Date of Patent: February 7, 2006
    Assignee: Inostek Inc.
    Inventors: Jo-Woong Ha, Seung-Hyun Kim, Dong-Yeon Park, Dong-Su Lee, Hyun-Jung Woo
  • Patent number: 6993830
    Abstract: A method of manufacturing a key top for a push-button switch according to the present invention includes forming a hot-melt adhesive layer on a resin key top so as to have a shape corresponding to a display portion for displaying a letter, symbol, or other indicia, and transferring a metallic thin film layer onto the hot-melt adhesive layer. Therefore, the metallic thin film layer is not damaged due to coating of the hot-melt adhesive layer, and positioning of the display portion is unnecessary. Further, when a transfer resin layer is formed on the metallic thin film layer, oxidation of the metallic thin film layer or damages thereto can be prevented.
    Type: Grant
    Filed: November 13, 2002
    Date of Patent: February 7, 2006
    Assignee: Polymatech Co., Ltd.
    Inventors: Masanori Shimizu, Kazuo Kikuchi
  • Patent number: 6993829
    Abstract: In a method of producing a centralized distribution unit of a thin brushless motor for a vehicle having superior waterproof-ness and airtight-ness functions, and high dielectric strength, an insulating holder is provided with bearing recesses. Bus bars are bent from a substantially linear shape into a substantially annular shape, and inserted into holding grooves formed in the insulating holder. The insulating holder and bus bars are disposed in a molding cavity, and distal ends of holder supports that project from an inner wall of the molding cavity are engaged with the bearing recesses of the insulating holder. Resin is supplied into the molding cavity to form an insulation layer that covers the bus bars and an entire periphery of the insulating holder.
    Type: Grant
    Filed: October 28, 2002
    Date of Patent: February 7, 2006
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Makoto Kobayashi, Izumi Suzuki