Patents Examined by Tim Phan
  • Method of forming a bond pad structure
    Patent number: 7146722
    Abstract: A bond pad structure comprising two bond pads, methods of forming the bond pad structure, an integrated circuit die incorporating the bond pad structure, and methods of using the bond pad structure are provided. Each of the bond pads comprise stacked metal layers, at least one lower metal layer and an upper metal layer. When the two pads are connected by a conductive material, they function as a single pad. The lower metal layer of one of the bond pads forms an extension that extends beneath the upper metal layer of the other of the bond pad. The lower metal extension functions to block the etching of a dielectric layer that is put down over the upper metal layers and the underlying substrate, for example, during a passivation etch to form the bond pad opening, to protect the substrate from damage.
    Type: Grant
    Filed: March 14, 2003
    Date of Patent: December 12, 2006
    Assignee: Micron Technology, Inc.
    Inventor: Guy Perry
  • Method of assembling a balanced high speed generator rotor
    Patent number: 7146707
    Abstract: An improved apparatus and method of having a pair of end caps on a rotor assembly of a multi-pole high-speed generator is provided for use with a turbine engine. The rotor assembly provides improved balancing and/or cooling during generator operation. The rotor assembly includes a plurality of poles and at least one support wedge positioned between each of the poles. The rotor assembly is mounted on a shaft. An annular flange of the end caps restrains the support wedges in the rotor assembly for improved balancing and maintaining concentricity. The end caps may also include a manifold for circulating a cooling medium through the shaft to and from the support wedges to cool the generator.
    Type: Grant
    Filed: February 23, 2004
    Date of Patent: December 12, 2006
    Assignee: Honeywell International, Inc.
    Inventors: Gerald Eugene Tornquist, Raymond Walter Borden, James D. Lengel, Gregor L. McDowall, Kieran P. J. Doherty
  • Method of making an electric motor
    Patent number: 7146706
    Abstract: An electric motor has a field assembly, such as a stator, for a dynamoelectric machine has field coils that are wound to a net shape. Lead wires are brought out from the ends of each field coil. The field coils are insulated with insulating sleeves or insulating slot liners. The field coils are assembled with stator core pieces, such as pole pieces and return path pieces, into the stator. The stator core pieces are formed prior to being assembled with the field coils. In an aspect of the invention, the pole pieces and return path pieces are separately formed and then assembled together with the field coils, which have also been separately formed.
    Type: Grant
    Filed: September 3, 2004
    Date of Patent: December 12, 2006
    Assignee: Black & Decker Inc.
    Inventors: Hung T. Du, Brandon L. Verbrugge, Earl M. Ortt, Michael J. Agnes, Michael A. Zemlok, Robert G. Kusmierski, David J. Smith
  • Method of improving the overall operating efficiency of an electric motor-powered assembly
    Patent number: 7143502
    Abstract: A submersible robotic pool cleaner is provided with an integral sealed rechargeable battery and an inductive charging assembly, a first portion of which is mounted in the pool cleaner housing and during the charging, receives a second separate portion that is connected by a cable to a conventional power source. The pump motor drive shaft is treated with a specialized anti-friction lubricant composition to minimize frictional energy losses where the shaft contacts the seal(s) and any shaft bearing(s), to maximize efficiency and minimize the power consumption of the pump motor assembly and permit the pool cleaner to completely traverse the surfaces to be cleaned within the fully-charged power capacity of the battery.
    Type: Grant
    Filed: February 9, 2004
    Date of Patent: December 5, 2006
    Assignee: Aquatron, LLC
    Inventors: Joseph Porat, Igor Fridman
  • Method for assembly of an automotive alternator stator assembly with rectangular continuous wire
    Patent number: 7143501
    Abstract: A method of forming a stator core assembly for an electric machine includes providing a stator core having a plurality of radially extending slots, forming a flat wire pack having a plurality of continuous electrical wires, shaping the flat wire pack into a substantially cylindrical shape, and engaging the substantially cylindrically shaped flat wire pack with the stator core such that the continuous electrical wires are interlaced within the slots of the stator core.
    Type: Grant
    Filed: May 29, 2003
    Date of Patent: December 5, 2006
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Eric D. Bramson, Kirk E. Neet, Steven J. Yockey
  • Method of manufacturing an electric motor
    Patent number: 7140090
    Abstract: A technique for securing a conduit box to a housing of an electric motor is disclosed. The technique includes forming a hollow extension from a surface of the conduit box. The conduit box is placed on a motor frame so that the hollow extension is inserted into a hole in the motor frame that passes into the hollow interior of the motor frame. The hollow extension is plastically deformed inside the motor housing to a greater width than the diameter of the hole in the motor housing so that the conduit box cannot be removed from the motor housing. A stator is placed in the motor housing and wiring is routed from the stator to the interior of the wiring box through a passageway formed by the hollow extension.
    Type: Grant
    Filed: October 10, 2003
    Date of Patent: November 28, 2006
    Assignee: Reliance Electric Technologies, LLC
    Inventors: Donald H. Williams, Richard L. Boyd, W. Alan Ewing
  • Method of developing an electronic module
    Patent number: 7134194
    Abstract: An electronic module and method that enable circuitry required by one form of the module (e.g., a developmental unit) to be omitted in a second form of the module (e.g., a production unit), without necessitating additional changes in the module. The electronic module includes a motherboard, a multichip module (MCM) mounted to the motherboard, and a circuit unit connected to the MCM. The circuit unit comprises a flexible substrate, instrumentation circuitry mounted on the flexible substrate, and a connector coupled to the flexible substrate. The flexible substrate has signal lines that electrically communicate with the MCM, the instrumentation circuitry, and the connector. A portion of the flexible substrate is located between the MCM and the motherboard and permits electrical communication therebetween. The instrumentation circuitry does not occupy space on the motherboard.
    Type: Grant
    Filed: November 13, 2003
    Date of Patent: November 14, 2006
    Assignee: Delphi Technologies, Inc.
    Inventors: Scott D. Brandenburg, Todd P. Oman, Micheal E. Miller
  • Fluxless bumping process
    Patent number: 7134199
    Abstract: A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and wherein the solder structure includes an outer layer including tin oxide. Producing a plasma from at least one of CF4 and SF6, and exposing the solder structure to the plasma. Heating the solder structure and cooling the same to provide a solder bump on the semiconductor device.
    Type: Grant
    Filed: June 13, 2002
    Date of Patent: November 14, 2006
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chao-Yuan Su, Chia-Fu Lin, Hsin-Hui Lee, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen, Wen-Chang Kuo, Yue-Ying Jian
  • Method for making an inkjet-head chip structure
    Patent number: 7134187
    Abstract: A structure of inkjet-head chip and a method for making the same are disclosed. Driven by the need of making a thin insulator layer to lower the working power of the inkjet-head chip, we separately manufacture a passivation layer and a second conductive layer. The passivation layer and the second conductive layer have to be formed from different materials. The defining means for the passivation layer and the second conductive layer have high selectivity and do not overetch or damage the structure of inkjet-head chip.
    Type: Grant
    Filed: June 3, 2004
    Date of Patent: November 14, 2006
    Assignee: Industrial Technology Research Institute
    Inventors: Chien-Hung Liu, Jian-Chiun Liou, Chi-Ming Huang, Chia-Cheng Chiao, Chun-Jung Chen
  • Process for implementing conductive tracing layout in touch panel
    Patent number: 7131188
    Abstract: The touch panel comprises two conductive substrates arranged in parallel and secured to each other with a gap existing between the conductive substrates The process for implementing a conductive tracing layout in a touch panel includes steps of forming a first conductive layer on at least one of the conductive substrates; forming a first photo-resist layer on the first conductive layer; removing a specified portion of the first photo-resist layer to form a first specified mask on a specified portion of the first conductive layer; and removing the first conductive layer except the specified portion of the first conductive layer to form a first conductive tracing layout.
    Type: Grant
    Filed: June 19, 2003
    Date of Patent: November 7, 2006
    Assignee: TPO Displays Corp.
    Inventors: Hong-Yu Lin, Yi-Hung Tsai
  • Method of making a heater element for a seat assembly
    Patent number: 7131187
    Abstract: A heating element that can be incorporated into a molded foam article closely adjacent to the outer cover sheet without showing any evidence that a heating element is encapsulated within the foam portion of the article and provides essentially the same relatively softness and “feel” that would be obtained if the heating element was not part of the article.
    Type: Grant
    Filed: June 19, 2002
    Date of Patent: November 7, 2006
    Assignee: Check Corporation
    Inventors: Robert Check, William R. Parnis, Thomas A. Stuef
  • Method for assembling supporting disk of motor rotor
    Patent number: 7131182
    Abstract: An assembly method and fixture for assembling a supporting disk of a motor rotor according to the invention is based on an “adjusting, and fixing” concept. A functional axis fixture and an adjusting axis fixture, which can match with each other for holding the supporting disk and the rotor, are first prepared. The functional axis of the supporting disk is aligned with the geometric axis of the functional axis fixture, and the geometric axis of the rotor is aligned with the geometric axis of the adjusting axis fixture. By engaging the functional axis fixture and the adjusting axis fixture, the functional axis of the supporting disk is aligned with the geometric axis of the rotor. Therefore, the bias and concentricity can be precisely controlled and improved.
    Type: Grant
    Filed: May 2, 2003
    Date of Patent: November 7, 2006
    Assignee: Delta Electronics, Inc.
    Inventors: Dung-Chang Yeh, Yung-Ping Lin
  • Process for producing a multi-layer printed wiring board
    Patent number: 7127812
    Abstract: A board 20 is provided with a Cu film 30 as a conformal mask, in which are formed a register mark 30b and an opening 3a through which a via hole is formed. A camera senses this register mark 30b so that the position of the board 30 is determined. A laser beam is directed to the approximate position of the opening 30a, so that the opening 26a through which the via hole is drilled is formed. The accuracy of the position of the opening of the via hole depends on the accuracy of the position of the opening 30a in the Cu film 30 as the conformal mask. Therefore, the via hole can be formed at an adequate position despite the low accuracy of the position for laser irradiation.
    Type: Grant
    Filed: April 4, 2003
    Date of Patent: October 31, 2006
    Assignee: IBIDEN Co., Ltd.
    Inventors: Yasuji Hiramatsu, Motoo Asai, Naohiro Hirose, Takashi Kariya
  • Method of manufacturing rotor of electric motor
    Patent number: 7120986
    Abstract: In a method of manufacturing a rotor of an electric motor to be arranged inside a stator, a permanent magnet is formed in a ring-shape, and a rotating shaft and the permanent magnet are concentrically arranged in a mold. Then, a rubber material in a fluid state is poured into a space between the permanent magnet and the rotating shaft to vulcanize and mold a cushioning member having predetermined hardness. The permanent magnet and the rotating shaft are integrally coupled through the cushioning member.
    Type: Grant
    Filed: July 3, 2003
    Date of Patent: October 17, 2006
    Assignee: Fujitsu General Limited
    Inventors: Tomonori Kojima, Toshiaki Tanno, Ken Maeyama, Hiroshi Okutsu
  • Method for manufacturing multilayer wiring board
    Patent number: 7121000
    Abstract: A method of manufacturing a multilayer wiring board according to the present invention comprises the step of heating and pressurizing a stacked product to be integrated in a state in which a plurality of double-sided wiring boards (10) having a wiring pattern (12) formed on both surfaces of an insulating layer (11) are laminated through a prepreg (1) obtained by impregnating a resin porous film with a thermosetting resin. The present invention is advantageous to mass production because a gap for forming an insulating layer can easily be controlled, and furthermore, can provide thinner layers of the whole board and is also advantageous to the flattening of the surface of the board.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: October 17, 2006
    Assignee: Nitto Denko Corporation
    Inventors: Toshiyuki Kawashima, Nobuharu Tahara, Kenichi Ikeda
  • Manufacturing method of layered core
    Patent number: 7120985
    Abstract: A method of manufacturing a layered core. The method includes the steps of: arranging a first plurality of yoke parts to define a first configuration magnetic pole sheet layer having first and second oppositely facing sides; arranging a second plurality of yoke parts to define a second configuration pole sheet layer having third and fourth oppositely facing sides; stacking the first plurality of yoke parts upon the second plurality of yoke parts so that the second side of the first configuration magnetic pole sheet layer is placed against the third side of the second configuration magnetic pole sheet layer; providing a circumferentially opening first female connector on a first yoke part; providing a first male connector on a second yoke part; and directing the first male connector into the first female connector.
    Type: Grant
    Filed: August 29, 2002
    Date of Patent: October 17, 2006
    Assignee: Mitsui High-tec, Inc.
    Inventor: Atsuo Nouzumi
  • Method of mounting a light fixture to a vertical wall
    Patent number: 7117591
    Abstract: A siding block comprising an electrical junction box and a cover for mounting a light fixture to the exterior of a building. The electrical junction box includes a back wall, a front peripheral wall, and a recessed area within the back wall having one or more removable wall sections within the recessed area. One or more of the removable wall sections can be removed and an electrical cable connector inserted therein to provide strain relief attachment of an electrical cable therein. The electrical junction box includes two or more posts integral with and extending from the front peripheral wall and including fastener-accepting portions. The cover includes a central opening and a rear peripheral wall surrounding the central opening.
    Type: Grant
    Filed: August 4, 2004
    Date of Patent: October 10, 2006
    Assignee: Arlington Industries, Inc.
    Inventor: Thomas J. Gretz
  • Method for manufacturing an armature for a dynamo-electric machine having offsetting and overlapping coils
    Patent number: 7114236
    Abstract: A method for manufacturing an armature including securing a core to the shaft having a plurality of slots extending in the axial direction formed on the outer circumferential surface thereof, forming a coil composed of a plurality of coil portions by simultaneously winding wires a plurality of turns around a pair of slots separated by a predetermined number of slots and offsetting each of the coil portions one slot at a time in the circumferential direction of the core, securing a commutator to the shaft having a plurality of segments, adjacent coil portions having a slot along one side thereof, and electrically connecting segments which should have the same electric potential by means of equalizing connectors so that each pairs of the segments that should have the same electric potential has a substantially equal electrical potential.
    Type: Grant
    Filed: April 29, 2004
    Date of Patent: October 3, 2006
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Toshinori Tanaka, Kyouhei Yamamoto, Akihiro Daikoku, Akihiko Imagi, Yoshio Yoshikuwa, Mitsuyuki Tsumura
  • Method for forming an annular stator assembly
    Patent number: 7111380
    Abstract: A stator assembly that may be rounded into an annular form is disclosed that includes a plurality of stator segments where each stator segment defines a yoke portion and a stator tooth and a containment structure configured to position the stator segments relative to one another such that the stator segments do not physically touch one another and such that no magnetic circuit between adjacent stator segments is formed. Also disclosed is a method for forming a segmented stator, involving the steps of positioning a plurality of stator segment in a containment structure such that no magnetic circuit between adjacent stator segments is formed, forming a winding coil about at least some of the stator segments; and deforming the containment structure to form an annular stator and to establish a magnetic circuit between adjacent stator segments.
    Type: Grant
    Filed: April 30, 2003
    Date of Patent: September 26, 2006
    Assignee: Emerson Electric Co.
    Inventors: Kent A. Sheeran, Payman Rassoolkhani, Paul G. Michaels
  • Process for manufacturing a circuit board
    Patent number: 7103971
    Abstract: A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.
    Type: Grant
    Filed: February 18, 2005
    Date of Patent: September 12, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takeshi Suzuki, Satoru Tomekawa, Yoshihiro Kawakita, Yasushi Nakagiri, Fumio Echigo