Abstract: An electric cable is provided having a plurality of insulated power conductors, a pilot and ground wire assembly and a saddle positioned between the plurality of insulated power conductors with the pilot and ground assembly being positioned within the saddle, where the saddle is constructed from a semi-conductive polymer. An inner sheath surrounds the saddle and the plurality of insulated power conductors, where the inner sheath is constructed from a semi-conductive polymer and where the inner sheath, saddle and the plurality of conductors form a flat cable. An outer insulating sheath disposed around the outside of the inner sheath.

Abstract: A shielded cable includes signal wires each having a signal conductor covered by an insulator, and a shield conductor comprising a metal foil resin tape spirally and overlappingly wrapped around the two signal wires, wherein an edge portion of the metal foil resin tape is folded back so that the metal foil therein is oriented outward, thereby bringing metal foils, which are arranged on lower and upper sides in the overlapping part of wrapping of the metal foil resin tape, into electrical contact with each other. The shielded cable includes two drain wires provided outside the metal foil resin tape and configured to be in electrical contact with an exposed part of the outwardly folded-back metal foil, which is exposed out of the overlapping part.

Abstract: A printed circuit board (PCB) having an improved waterproof structure for preventing corrosion of a substrate is disclosed. A plurality of screen-printed protrusions is provided at the PCB surface. The plurality of protrusions allow water to be formed in waterdrops so that the waterdrops can flow to the outside of the PCB. The PCB is arranged to have a tilted structure for facilitating discharge of the water. The tilted structure discharges waterdrops to a lower side of the PCB. The PCB and a PCB assembly having the same are applicable to electronic appliances such as a washing machine.

Abstract: A via conductor connected to a mounting electrode near a corner portion of a circuit substrate is provided in a position in a corresponding mounting electrode, located closer to the center of the circuit substrate. Thus, concentration of a stress in a portion of the via conductor is effectively reduced, and a break, a chip, or a crack is prevented from occurring to the circuit substrate. Even if the portion located closer to the corner portion of the mounting electrode is peeled from the circuit substrate, the electrical characteristics of the circuit module are secured because disconnection between the corresponding mounting electrode and the via conductor is prevented.

Abstract: A wiring substrate includes an insulating layer including a projection and a wiring layer on the projection. The wiring layer includes a first metal layer on an end face of the projection and a second metal layer on the first metal layer. The width of the end face of the projection is different from at least one of the width of the first metal layer and the width of the second metal layer. An inner wall surface and a bottom surface of a depression around the projection are roughened surfaces.

Abstract: A linked cable assembly includes: (1) a pair of stripped shielded cable assemblies, each including: (a) a stripped cable including: an inner conductive core, an inner insulator surrounding the core, an inner shield surrounding the inner insulator, a sheath surrounding the inner shield; (b) a ring compressed directly against the inner shield. (2) a connector assembly electrically linking the shielded cables and including: a conductive shield housing, an insulator disposed within the shield housing, a conductive busbar contacting the insulator, but not the shield housing.

Abstract: The present disclosure relates to a multilayer carrier foil, a core structure formed using the multilayer carrier foil, printed circuit boards, and electronic devices. The multilayer carrier foil comprises: (a) a copper carrier layer having a release side and a laminate side, the laminate side of carrier layer optionally having nodules; (b) a chromium release layer applied to the copper carrier layer; (c) an intermediate copper layer applied to the chromium release layer; (d) an anti-migration layer applied to the intermediate copper layer of (c); and (e) an ultra-thin copper layer applied to the anti-migration layer of (d). The disclosure further relates to methods of making the multi-layer carrier foil, the core structure, and printed circuit boards.

Abstract: Provided is a touch panel. The touch panel includes a substrate and an electrode member disposed on the substrate. The electrode member includes a base material for electrode having first and second surfaces opposite to each other, a first electrode disposed on the first surface, and a second electrode disposed on the second surface.

Abstract: A wire harness assembly includes a housing defining an interior volume which extends into the housing along an axis and also defines an outer surface having a retention protuberance extending outward therefrom. A seal is received within the interior volume and a wire extends through the seal into the interior volume. A seal includes skirt segments which extend from the seal retainer wall such that each of the skirt segments is positioned laterally to the outer surface and such that one of the skirt segments is a lock arm having a lock aperture which captures the retention protuberance therein, thereby retaining the seal retainer to the housing. A flex limiting strap joins the lock arm to an adjacent one of the skirt segments and limits the extent to which the lock arm flexes away from the axis.

Abstract: An electric wire protecting device is used in order to be capable of being installed in a narrow wiring area like one in a small aircraft, and to minimize a risk of an electric arc inside electric wire bundles at low costs. To this end, the electric wire protecting device includes: power wire groups each of which is an assembly of one or more power wires at the same potential; a tape for binding the power wire groups at different potentials from one another into one bundle at a constant pitch; and a spacer extending in a direction of extension of the power wire groups, and inserted in boundaries between the power wire groups.

Abstract: A wire harness assembling method includes a step (a) of attaching an interference suppressing member to at least a part of an elongated reinforcement, the reinforcement being arranged on a back side of an instrument panel of a vehicle and extending in a width direction of the vehicle; and a step (b) of arranging a wire harness so that the wire harness faces the reinforcement with the interference suppressing member interposed between the wire harness and the reinforcement, the step (b) being performed after the step (a).

Abstract: A cable for power distribution applications includes a plurality of wires bundled into the cable. The plurality of wires typically is comprised of interior wires and peripheral wires with the peripheral wires surrounding the interior wires. At least one wire is coated with a high emissivity coating that includes at least 10 weight percent aluminum oxide and a metal oxide other than aluminum oxide. Characteristically, the wire coated with the high emissivity coating has an emissivity greater than about 0.5 in the infrared region of the electromagnetic spectrum and a surface area at least 50 times greater than the surface area of a bare wire prior to being coated with the high emissivity coating.

Abstract: A mounting cable includes: a coaxial cable including: a core wire made of a conductive material; an internal insulator covering an outer periphery of the core wire; a shield covering an outer periphery of the internal insulator; and a jacket covering an outer periphery of the shield with an insulator, the coaxial cable having one end portion on which the core wire, the internal insulator and the shield are exposed; a cable fixing unit that fixes one end portion of the exposed core wire and has a connection surface on which an end face of the core wire is exposed; and a conductor having one end electrically and mechanically connected to the exposed shield and having the other end fixed to the cable fixing unit. An end portion of the conductor is exposed on the connection surface of the cable fixing unit.

Abstract: An insulated electric wire and a method of producing the electric wire are provided. The insulated electric wire includes: a copper wire; and an insulating coating formed on a surface of the copper wire by an electrodeposition method. A cross section shape of the insulated electric wire including the insulating coating is in a hexagonal shape, a chamfered part that suppresses swelling of the insulating coating is formed on each corner part of a hexagonal cross section of the copper wire, a length of the chamfered part is ? to 1/20 of a length of a flat part of the hexagonal cross section, and a void ratio in a wound state is 5% or less.

Abstract: A tether may include a core, a hybrid layer surrounding the core, and a jacket surrounding the hybrid layer. The hybrid layer may include a plurality of strength members, and a plurality of electrical conductor bundles. Each electrical conductor bundle of the plurality of electrical bundles may include a compliant element, a plurality of electrical conducting elements surrounding the compliant element, and an insulating layer surrounding the plurality of electrical conducting elements.

Abstract: There is provided a method for manufacturing a flexible film comprising carbon nanotube interconnects, the method comprising: providing a first substrate; forming and patterning a catalyst layer on the substrate; forming vertically aligned electrically conducting carbon nanotube bundles from the catalyst; providing a second substrate opposite the first substrate and in contact with the carbon nanotube bundles such that a gap is formed between the first and second substrates; providing a flowing curable polymer in the gap between the first substrate and the second substrate such that the gap is filled by the polymer; curing the polymer to form a flexible solid; and removing the first substrate and the second substrate to provide a flexible polymer film comprising carbon nanotube interconnects connectable on respective sides of the film.

Abstract: Components may have substrates with metal traces that form mating contacts. The components may be bonded together using anisotropic conductive adhesive bonding techniques. During bonding, conductive particles may be concentrated over the contacts by application of magnetic or electric fields or by using a template transfer process. Gaps between the contacts may be at least partially free of conductive particles to help isolate adjacent contacts. Polymer between the substrates may attach the substrates together. The conductive particles may be embedded in the polymer and crushed or melted to short opposing contacts together.

Abstract: A wire overmold device including a carrier body having a distal end and a proximal end, a wire cap configured to engage the distal end of the carrier body, at least one of a jacketed cable and one or more wires at least partially enclosed between the wire cap and the carrier body, and an overmold formed over the proximal end of the carrier body and at least portions of the wire cap and the distal end of the carrier body, wherein the wire cap and the distal end of the carrier body protrude from the overmold.

Abstract: Provided is a cable including: at least two signal cables formed of first and second signal cables for differential transmission; a third cable for ground; a fourth cable for power supply; a metal sheet adapted to cover the first and second signal cables; a coating material adapted to house the first and second signal cables covered with the metal sheet, and the third and fourth cables; and a magnetic powder-mixed resin filled into an inner space of the coating material and prepared by mixing magnetic powder with a resin.

Abstract: An electronic component (1) and an electronic device (100) comprising one or more such components (1). The electronic component (1) comprises a stack (4) of layers arranged on a flexible substrate (3). Said stack comprises an electrically active part (4a) and a protective layer (11) for protecting the electrically active part against scratches and abrasion. Said electrically active part comprises a bottom electrode layer (5) and a top electrode layer (9) and at least one insulating or semi-insulating layer (7) between said electrodes. The stack further comprises a buffer layer (13), arranged between the top electrode layer (9) and the protective layer (11). The buffer layer (13) is adapted for at least partially absorbing a lateral dimensional change (?L) occurring in the protective layer (11) and thus preventing said dimensional change (?L) from being transferred to the electrically active part (4a), thereby reducing the risk of short circuit to occur between the electrodes.