Abstract: Embodiments are directed to a method for manufacturing a smoke detector, comprising: manufacturing a substrate that comprises a guard ring configured to surround an ion chamber collector plate pin connection point, a surface mount component connection point, and a trace coupling the ion chamber collector plate pin connection point and the surface mount component connection point, and coupling a surface mount component to the substrate at the surface mount component connection point.

Abstract: An object of the present invention is to provide a power module having high reliability. The power module according to the present invention, includes a circuit body and a case housing the circuit body. The case has a first case member including a first base plate and a second case member including a second base plate. The first case member has a first side wall portion formed in an arrangement direction of the first base plate and the second base plate. The second case member has a second side wall portion formed in the arrangement direction, the second side wall portion coupling to the first side wall portion. The first side wall portion and the second side wall portion are formed so as to have the sum of lengths of the first side wall portion and the second side wall portion in the arrangement direction smaller than the thickness of the circuit body. The first case member has a deforming portion smaller than the first base plate and the second base plate in rigidity.

Abstract: The wiring board of the present disclosure includes an insulating layer, and a wiring conductor existing so as to be adjacent to both main surfaces of the insulating layer; the insulating layer includes at least two particle-containing resin layers containing insulating particles in an insulating resin, and a particle-free resin layer formed of an insulating resin; and the particle-free resin layer is interposed between the particle-containing resin layers.

Abstract: In systems where insulating deposits form during normal operation, electrodes are configured with a preformed dielectric thereon, wherein the preformed dielectric is formed with a geometric feature that preforms a triple junction. These triple junctions enhance low level discharge activity to facilitate localized breakdown of the deposits and maintain electrode conductivity.

Abstract: A wire harness which is wired in an automobile for electrical connection includes one or a plurality of electrical pathways. The electrical pathway includes a plurality of division electrical pathways and one or a plurality of conductive linking members which link the division electrical pathways, and the linking member includes a body part and connecting ends that are located at the two ends of the body part. Further, the linking member is formed as a member whose rigidity is lower than that of the division electrical pathways and is adjustable and bendable in predetermined directions.

Abstract: A power conversion device possesses a capacitor module, a power module, a circuit board on which a control circuit is mounted and which has a ground layer formed in a control circuit mounting region, a noise shielding plate, and a metal housing. The circuit board is above the capacitor module, and the noise shielding plate faces the control circuit mounting region between the circuit board and the capacitor module, in which the noise shielding plate has a plurality of connection parts to be electrically connected to the metal housing. A first end part on the power module side of the noise shielding plate is on the power module side more than a second end part on the power module side of the ground layer, and the connection part which is the closest to the first end part is provided on the power module side more than the second end part.

Abstract: A flexible cable includes an outer sheath at an outermost portion. The outer sheath includes an inner layer made of an elastomer containing polypropylene resin, and an outer layer surrounding the inner layer and made of polypropylene resin.

Abstract: A flexible circuit board includes a base material including a first surface and a second surface opposite the first surface, the base material including a conductor layer, a first insulating film covering the first surface of the base material and formed with a first opening, a first insulating member formed inside the first opening and formed with a connection port to expose the conductor layer, the first insulating member having a thermal expansion coefficient smaller than that of the first insulating film, a second insulating film covering the second surface of the base material and formed with a second opening overlapping at least a portion of the first opening in a plan view, and a second insulating member formed inside the second opening and having a thermal expansion coefficient smaller than that of the first insulating film.

Abstract: A wire cable assembly, such as those used in electric or hybrid electric vehicles, having a plurality of shielded wire cables that are spliced together is presented. The assembly includes a splicing device having a generally planar bus bar formed of a conductive material, wherein the exposed core conductors of the shielded wire cables are welded to the bus bar, thereby electrically interconnecting the exposed core conductors. A conductive sleeve encloses bus bar and interconnects the shield conductors of the shielded wire cables, providing shielding for the exposed core conductors and continuity for the shield conductors. An outer insulator enclosing the conductive sleeve. A method of splicing shielded wire cables using such a device is also presented herein.

Abstract: Modular printed circuit board (PCB) structures and methods of producing them are described herein. In some embodiments, a PCB structure may include a first PCB module including first structures on one or more layers of the first PCB module. The PCB structure may further include a second PCB module including second structures on one or more layers of the second PCB module. The PCB structure may additionally include a middle layer between the first PCB module and the second PCB module. The middle layer electrically coupling, without connectors, one or more of the first structures aligned with one or more of the second structures.

Abstract: A transparency including a conductive mesh is disclosed. The conductive mesh is formed by a plurality of inkjet printed electrically conductive lines on a polymer film or a glass, polyacrylate, polycarbonate, or polyurethane substrate, wherein at least one inkjet printed electrically conductive line intersects at least one other inkjet printed electrically conductive line. A flying vehicle including a transparency including a conductive mesh is also disclosed. Additionally, a method of preparing a transparency by laminating a polymer film and a substrate together, wherein a conductive mesh is formed on the polymer film by a plurality of inkjet printed electrically conductive lines, is also disclosed.

Abstract: There are provided a coil component and a board for mounting the same. The coil component includes a magnetic body including first and second coil portions disposed on one surface of a substrate and disposed linearly, based on a central portion of the magnetic body, and third and fourth coil portions disposed on the other surface of the substrate and disposed linearly, based on the central portion of the magnetic body; and first to fourth external electrodes disposed on an external surface of the magnetic body and connected to the first to fourth coil portions. The first coil portion and the third coil portion have a first core portion, and the second coil portion and the fourth coil portion have a second core portion. A peripheral portion disposed outwardly of the first to fourth coil portions has greater permeability than that of the first and second core portions.

Abstract: An object of the present invention is to provide an anisotropic conductive member capable of achieving excellent conduction reliability and a multilayer wiring substrate using the same. The anisotropic conductive member of the present invention includes an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each of the conductive paths has a protrusion which protrudes from the surface of the insulating base, and an end of the protrusion of each of the conductive paths is exposed or protrudes from the surface of the pressure sensitive adhesive layer.

Abstract: Electrical distribution systems and methods comprising a first cable-to-box connector which accepts electrical wires, a first electrical box having a first and a second coupler to connect to the cable-to-box connector; intra-box circuits built in one or more of a plurality of walls of the first electrical box and connecting the first and the second coupler; and a concavity defined by the plurality of walls of the first electrical box that receives a first electrical insert.

Abstract: An aluminum alloy wire rod has a composition including Mg: 0.10-1.0 mass %, Si: 0.10-1.20 mass %, Fe: 0.01-1.40 mass %, Ti: 0.000-0.100 mass %, B: 0.000-0.030 mass %, Cu: 0.00-1.00 mass %, Ag: 0.00-0.50 mass %, Au: 0.00-0.50 mass %, Mn: 0.00-1.00 mass %, Cr: 0.00-1.00 mass %, Zr: 0.00-0.50 mass %, Hf: 0.00-0.50 mass %, V: 0.00-0.50 mass %, Sc: 0.00-0.50 mass %, Co: 0.00-0.50 mass %, Ni: 0.00-0.50 mass %, and the balance: Al and incidental impurities, Mg/Si mass ratio being 0.4 to 0.8. The aluminum alloy wire rod has a tensile strength of greater than or equal to 200 MPa, an elongation of greater than or equal to 13%, a conductivity of 47% IACS, and a ratio (YS/TS) of 0.2% yield strength (YS) to the tensile strength (TS) of less than or equal to 0.7.

Abstract: A printed circuit board and a method of manufacturing a printed circuit board are provided. The printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer, a solder resist layer disposed on one surface of the insulating layer, the solder resist layer having a cavity of a through-hole shape to expose a part of the circuit layer from the insulating layer, and a metal post embedded in the solder resist layer and exposed to outside via an opening of the solder resist layer, and the metal post includes a first post metal layer, a post barrier layer, and a second post metal layer disposed in that order.

Abstract: Some aspects of this disclosure generally are related to improving the robustness of a flexible circuit structure, for example, by providing fault-tolerant electrical pathways for flow of electric current through the flexible circuit structure. In some embodiments, such fault tolerance is enhanced by way of a conductive mesh provided between an adjacent pair of resistive elements. Some aspects are related to improved voltage, current, or voltage and current measurement associated with various pairs of adjacent resistive elements at least when the various pairs have differing distances between them.

Abstract: The present invention relates to a self-winding modular linear unit, which comprises: a center connection portion, a left connection portion horizontally connected to the center connection portion, and a right connection portion horizontally connected to the center connection portion, wherein the left connection portion includes a left extending portion extending downwardly from the left connection portion and forming a left connection space with the center connection space. The right connection portion includes a right extending portion extending upwardly from the right connection portion, and forming a right connection space with the center connection portion. When the left extending portion is embedded into the right connection space or the right extending portion is embedded into the left connection space, the present invention achieves self-winding.

Abstract: An object of the present invention is to provide a printed wiring board in which conductive layers formed on two surfaces of a base layer that contains a fluororesin as a main component are reliably connected to each other through a via-hole. A printed wiring board according to an embodiment of the present invention includes a base layer containing a fluororesin as a main component, a first conductive layer stacked on one surface of the base layer, a second conductive layer stacked on the other surface of the base layer, and a via-hole that is formed along a connection hole penetrating the base layer and at least one of the first conductive layer and the second conductive layer in a thickness direction and that electrically connects the first conductive layer and the second conductive layer to each other. At least a part of an inner circumferential surface of the base layer in the connection hole has a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more.

Abstract: A bus bar for solar cell component is provided. The bus bar includes a first copper ribbon, a second copper ribbon, a third copper ribbon and a fourth copper ribbon connected end-to-end. A first diode electrically bridges the first and the second copper ribbon; a second diode electrically bridges the second and the third copper ribbon; and a third diode electrically bridges the third and the fourth copper ribbon. A first electrical energy output terminal is formed at an end of the first copper ribbon corresponding to the second copper ribbon, and a second electrical energy output terminal is formed at an end of the fourth copper ribbon corresponding to the third copper ribbon.