Patents Examined by Timothy Thompson
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Patent number: 9892821Abstract: An electrical conductor including a substrate, a first conductive layer including graphene, and a second conductive layer including a conductive metal nanowire, wherein the first conductive layer and the second conductive layer are disposed on the substrate, wherein the first conductive layer is disposed between the substrate and the second conductive layer or on the second conductive layer, wherein the first conductive layer has a first surface facing the second conductive layer and a second surface which is opposite to the first surface, and wherein, in the first surface and the second surface, the graphene is p-doped with a p-type dopant.Type: GrantFiled: January 3, 2017Date of Patent: February 13, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hiesang Sohn, Weonho Shin, Yun Sung Woo
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Patent number: 9892823Abstract: A shielded electrical ribbon cable includes a plurality of conductor sets. Each conductor set is surrounded by a shield and includes two insulated conductors. First and second non-conductive polymeric layers are disposed on opposite sides of the cable. The polymeric layers include cover portions and pinched portions. The cover portions surround the plurality of conductor sets, and the pinched portions form pinched portions on each side of the cable. The cable includes a transition portion on each side of the cable. At least one of the polymeric layers has a radius of curvature of at least 50 microns across an entire width of the cable. For at least one of the polymeric layers, the ratio of the minimum radius of curvature in the cover portions to the minimum radius of curvature in the transition portions is from 2 to 15.Type: GrantFiled: May 16, 2017Date of Patent: February 13, 2018Assignee: 3M Innovative Properties CompanyInventors: Douglas B. Gundel, Rocky D. Edwards, Mark M. Lettang, Charles F. Staley
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Patent number: 9888559Abstract: A method for producing or disassembling an electronic assembly are provided. The assembly may have a heating device integrated into a substrate. The heating device can be heated via an external power supply during the assembly process so that, for example, solder connections of an electric component can be melted. The heating device can also be used when operating the electronic assembly, and the heating device can then be directly actuated by the component. For this purpose, an electric connection is then established between the component and the heating device, the connection not yet being provided during the thermal assembly process in order to protect the electronic components of the circuit from being damaged.Type: GrantFiled: June 17, 2015Date of Patent: February 6, 2018Assignees: SIEMENS AKTIENGESELLSCHAFT, NEUE MATERIALIEN BAYREUTH GMBHInventors: Ruediger Knofe, Bernd Mueller, Andrey Prihodovsky
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Patent number: 9887022Abstract: A stranded conductor contains a number of individual wires. The multiple identically designed individual wires are arranged about a central inner wire as outer wires. The individual wires form a composite which is encased by insulation, and the outer wires are uncompressed and have a non-round cross-section such that when seen in cross-section, the outer wires expand radially outwards starting from the inner wire. The composite of individual wires is not compressed such that the composite has a high alternate bending strength.Type: GrantFiled: May 4, 2016Date of Patent: February 6, 2018Assignee: LEONI Kabel Holding GmbHInventors: Markus Schill, Yuecel Sahiner, Wolfgang Stadler
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Patent number: 9887040Abstract: A multilayer electronic component includes a first capacitor including a first capacitor body and first and second external electrodes disposed on outer surfaces of the first capacitor body; and a second capacitor including a second capacitor body and third and fourth external electrodes disposed on outer surfaces of the second capacitor body and electrically connected to the first capacitor. The first and third external electrodes are connected to each other by a first metal terminal enclosing portions of a lower surface of the first external electrode to an upper surface of the third external electrode, and the second and fourth external electrodes are connected to each other by a second metal terminal enclosing portions of a lower surface of the second external electrode and an upper surface of the fourth external electrode.Type: GrantFiled: July 28, 2016Date of Patent: February 6, 2018Assignee: SAMSUNG ELECTRO-MECHANICS, CO. LTD.Inventors: Seung Hyun Ra, Yong Gyu Han
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Patent number: 9882364Abstract: Provided is a cable holding tool capable of reducing a size of a gap formed at a portion where soft members are sandwiching a cable to thereby increase air-tightness thereat. First sealing members (26a, 26b) having fluffs are attached to a first opposing surface of a soft member (25). Second sealing members (29a, 29b) having fluffs are attached to second opposing surfaces of soft members (28a, 28b). When a cable (17) is sandwiched between the first sealing members (26a, 26b) and the second sealing members (29a, 29b), the fluffs of the first sealing members (26a, 26b) and the fluffs of the second sealing members (29a, 29b) are in contact with each other.Type: GrantFiled: May 8, 2015Date of Patent: January 30, 2018Assignees: SUGATSUNE KOGYO CO., LTD., SANWA TECHNO CO., LTD.Inventors: Jun Sugasawara, Harunobu Kubota, Toshio Takino
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Patent number: 9882367Abstract: A device for conducting electrical direct current, wherein the device includes at least one bus bar and at least one electrically conducting edge element that is connected to the bus bar in an electrically conducting manner and has a lower electrical conductivity than the bus bar, where the edge element is arranged on a lateral outer face of the bus bar and extends along the bus bar.Type: GrantFiled: April 27, 2015Date of Patent: January 30, 2018Assignee: Siemens AktiengesellschaftInventor: Haakon Torgersen
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Patent number: 9881739Abstract: A multilayer ceramic capacitor provided in a multilayer printed wiring board includes a ceramic body with a plurality of ceramic layers and internal electrodes stacked, and an external electrode including a base layer that includes a sintered metal containing a metal and glass and a plated layer provided on the surface of the base layer, which is provided on an end surface of the ceramic body to be connected to the internal electrodes. The external electrode includes a principal surface portion disposed on a principal surface of the ceramic body. The outermost layer of the plated layer includes a Cu plated layer. The ratio of arithmetic mean roughness (Ra) at the surface of the ceramic body/arithmetic mean roughness (Ra) at the surface of the external electrode satisfies a condition: about 0.06?the arithmetic mean roughness (Ra) at the surface of the ceramic body/the arithmetic mean roughness (Ra) at the surface of the external electrode?about 0.97.Type: GrantFiled: September 28, 2015Date of Patent: January 30, 2018Assignee: Murata Manufacturing Co., Ltd.Inventor: Takehisa Sasabayashi
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Patent number: 9883591Abstract: A microelectronic system includes a printed circuit board and a semiconductor package mounted on the printed circuit board. The printed circuit board includes a laminated core having an internal conductive layer and a build-up layer. The build-up layer includes a top conductive layer. Microvias are disposed in the build-up layer to connect the top conductive layer with the internal conductive layer. A power/ground ball pad array is disposed in the top conductive layer. The power/ground ball pad array includes power ball pads and ground ball pads arranged in an array with a fixed ball pad pitch P. The power/ground ball pad array includes a 4-ball pad unit area comprised of only one ground ball pad and three power ball pads, or comprised of only one power ball pad and three ground ball pads. The 4-ball pad unit area has a rectangular shape and a dimension of about 2P×2P.Type: GrantFiled: February 14, 2017Date of Patent: January 30, 2018Assignee: MEDIATEK INC.Inventors: Sheng-Ming Chang, Chia-Hui Liu, Shih-Chieh Lin, Chun-Ping Chen
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Patent number: 9875823Abstract: A flat cable includes a dielectric element assembly including a plurality of dielectric layers laminated on each other in a direction of lamination, and a linear signal line provided in the dielectric element assembly. The dielectric element assembly includes at least one section bent in a plurality of places defining a zigzag shape when viewed in a plan view in the direction of lamination. In the zigzag section of the dielectric element assembly, any portions of the dielectric element assembly that are not adjacent across a bending line do not overlap when viewed in a plan view in the direction of lamination.Type: GrantFiled: September 24, 2014Date of Patent: January 23, 2018Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Satoshi Sasaki
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Patent number: 9875822Abstract: An aluminum alloy conductor wire has a composition comprising Mg: 0.1-1.0 mass %, Si: 0.1-1.20 mass %, Fe: 0.01-1.40 mass %, Ti: 0-0.100 mass %, B: 0-0.030 mass %, Cu: 0-1.00 mass %, Ag: 0-0.50 mass %, Au: 0-0.50 mass %, Mn: 0-1.00 mass %, Cr: 0-1.00 mass %, Zr: 0-0.50 mass %, Hf: 0-0.50 mass %, V: 0-0.50 mass %, Sc: 0-0.50 mass %, Co: 0-0.50 mass %, Ni: 0-0.50 mass %, and the balance: Al and inevitable impurities, where Ti, B, Cu, Ag, Au, Mn, Cr, Zr, Hf, V, Sc, Co and Ni are arbitrary additive components of which at least one component may be contained or none of the components may be contained. A density of a compound having a particle size of 0.5-5.0 ?m and containing Fe is 1 to 300 particles/10000 ?m2.Type: GrantFiled: November 16, 2016Date of Patent: January 23, 2018Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.Inventors: Sho Yoshida, Ryosuke Matsuo, Shigeki Sekiya, Kengo Mitose
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Patent number: 9871363Abstract: An assembly for use with an oil-filled cable termination includes a cable gland, a cable received in the cable gland, a stress cone received around the cable and spaced apart from the cable gland, and a seal system around the cable between the cable gland and the stress cone. The seal system includes: a first oil seal layer surrounding an upper portion of the cable gland and a portion of the cable between the cable gland and the stress cone, with the first oil seal layer being spaced apart from the stress cone; a second oil seal layer surrounding the first oil seal layer and extending between the cable gland and the stress cone; and a third oil seal layer surrounding the second oil seal layer and extending between the cable gland and the stress cone.Type: GrantFiled: March 16, 2017Date of Patent: January 16, 2018Assignee: TE CONNECTIVITY CORPORATIONInventors: Alexander R. Czibur, Mahmoud Seraj
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Patent number: 9872391Abstract: Capacitor structures having multiple layers of vertically interdigitated metal plates.Type: GrantFiled: January 28, 2014Date of Patent: January 16, 2018Assignee: Telefonaktiebolaget L M Ericsson (publ)Inventors: Bo Zhou, Kun Liu, Junyou Chen, Yang Ji
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Patent number: 9868407Abstract: A wire harness has at least one electrically conducting path and an exterior member accommodating the electrically conducting path to protect the electrically conducting path. The exterior member has a heat reflecting portion provided at at least a portion of an outer surface of the exterior member to reflect external heat.Type: GrantFiled: March 9, 2015Date of Patent: January 16, 2018Assignee: YAZAKI CORPORATIONInventors: Shinichi Inao, Hideomi Adachi, Takeshi Ogue, Tatsuya Oga, Masaaki Suguro, Yoshiaki Ozaki, Hiroyuki Yoshida
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Patent number: 9865374Abstract: A multi-core cable includes a plurality of coaxial wires, each coaxial wire including a center conductor whose sectional area is 0.0006 mm2 to 0.25 mm2, a wrapping tape configured to cover all of the plurality of coaxial wires, and a sheath configured to cover the wrapping tape. The sheath is configured by a resin material coated with polyparaxylylene or fluorine resin in a thickness of 0.5 ?m to 3.0 ?m.Type: GrantFiled: January 30, 2017Date of Patent: January 9, 2018Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Tatsunori Hayashishita, Kazuhiro Sato
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Patent number: 9865379Abstract: A thermal sleeve and method for protecting a temperature sensitive electronic member against exposure to heat. The thermal sleeve includes a tubular wall with an inner surface bounding an inner cavity extending along a central longitudinal axis between open opposite ends and a reflective outer surface. The thermal sleeve includes a positioning member constructed of a separate piece of material from the tubular wall, with an annular portion attached to the tubular wall and at least one resilient finger extending radially inwardly from the annular portion. The at least one finger extends radially inwardly along a plane from the fixed end along an arcuate path to a free end configured for abutment with a wiring harness attached to the temperature sensitive electronic member. The free end of the finger is radially expandable along the plane toward the annular portion to automatically adjust to an outer envelop of said wiring harness.Type: GrantFiled: August 3, 2016Date of Patent: January 9, 2018Assignee: Federal-Mogul Powertrain LLCInventor: Nicholas DePompeo
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Patent number: 9867277Abstract: Representative implementations of devices and techniques provide improved electrical performance of components, such as chip dice, for example, disposed on different layers of a multi-layer printed circuit board (PCB). In an example, the components may be embedded within layers of the PCB. An insulating layer located between two component layers or sets of layers includes a conductive portion that may be strategically located to provide electrical connectivity between the components. The conductive portion may also be arranged to improve thermal conductivity between points of the PCB.Type: GrantFiled: October 18, 2012Date of Patent: January 9, 2018Assignee: Infineon Technologies Austria AGInventors: Martin Standing, Andrew Roberts
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Patent number: 9867297Abstract: According to one embodiment, a storage device includes an enclosure, and a circuit board assembly in the enclosure. The circuit board assembly includes a first circuit board, a second circuit board opposed to the first circuit board, a third circuit board opposed to the second circuit board, a first connector connecting the first and second circuit boards to each other, a second connector connecting the second and third circuit boards to each other, and is offset to the first connector in a plane direction, a first spacer between the first and second circuit boards, and a second spacer between the second and third circuit boards. The first spacer includes a support body at a position opposed to the second connector and in contact with the first and second circuit boards.Type: GrantFiled: February 22, 2016Date of Patent: January 9, 2018Assignee: TOSHIBA MEMORY CORPORATIONInventors: Akitoshi Suzuki, Yoshiharu Matsuda
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Patent number: 9859697Abstract: A watertight electrical compartment for use in an irrigation device can include a compartment body with a chamber, a sealing section mounted with one or more sealing rings, and external threads. A sealing cap mate with the sealing section and/or the sealing rings to seal the chamber. A cap retainer can be advanced over at least a portion of the sealing cap and can have internal threads to be screwed onto the external threads of the compartment body. The cap retainer can also have a stopping feature to keep the sealing cap in its sealed position. The watertight electrical compartment can be used in a wireless flow sensor assembly, a battery operated irrigation controller, and/or a battery-operated central controller device, to provide irrigation control, and/or sensor information, without the need for AC power.Type: GrantFiled: July 11, 2016Date of Patent: January 2, 2018Assignee: Hunter Industries, Inc.Inventor: Michael F. Paul
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Patent number: 9860994Abstract: A circuit board having a substrate, a first metal layer, a second metal layer and a solder mask layer. The first metal layer and the second metal layer with unequal surface areas spacedly arranged on the substrate and respectively providing a first solderable region and a second solderable region with equal surface areas. The solder mask layer having an opening and covered on the substrate, the first metal layer and the second metal layer to expose the first solderable region and the second solderable region. Besides, the first metal layer further provides a window abutted to the first solderable region, and the opening exposes a first blank region and a second blank region. Thus, the problem of unequal solder regions due to offset of the solder mask layer can be avoided, and improving the yield rate of the fabrication process.Type: GrantFiled: December 2, 2015Date of Patent: January 2, 2018Assignee: Universal Global Technology (Shanghai) Co., Ltd.Inventors: Wan-Chen Chan, Chun-Chi Chiu, Hsun-Fa Li