Abstract: The electronic package includes a substrate that includes a plurality of dielectric layers and conductive routings between the plurality of dielectric layers; wherein the substrate further includes a plurality of thermal finned vias that electrically connect the conductive routings within the substrate to one another; and an electronic component mounted on the substrate, wherein the finned via transfers heat from the electronic component to the substrate and electrically connects the conductive routings within the substrate to the electronic component.

Abstract: An electric connection box includes a frame, a lower cover that covers the lower surface of the frame, and at least one block that is attached in the frame and disposed at a position along a peripheral wall of the frame. An electric wire that is connected to a component attached to the block out of the blocks is drawn horizontally from the block toward inside the frame.

Abstract: An insulating protector (15) includes a wire routing section (70), and the wire routing section (70) includes a placement wall (71) having a placement surface (76) on which voltage detection wires (23) are to be placed. The placement wall (71) is formed with a projecting section (77) projecting from the placement surface (76), and a wire mounting section (81) on which the voltage detection wires (23) are to be mounted via a flexible hinge (80) is formed on the tip of the projecting section (77). The voltage detection wires (23) are mounted on the wire mounting section (81) with the wire mounting section (81) oriented to extending in a direction along the placement surface (76). The wire mounting (81) is oriented to extend in a direction intersecting the placement surface (76) by bending the hinge (80) after the voltage detection wires (23) are mounted on the wire mounting section (81).

Abstract: An exterior member having a tubular form which accommodates and protects a conductive path, the exterior member includes at least one conductive path holding part which holds the conductive path. The at least one conductive path holding part is configured in a protruding part in an inner surface of the tube, and in a recessed part in an outer surface of the tube. In the recessed part, one or a plurality of protrusions are formed which protrude outward. The protrusions are configured in forms having elasticity.

Abstract: A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.

Abstract: A wire harness includes a wire portion having three wires arranged in the same direction, connectors connected to both end portions of the wire portion, a middle portion installed in an intermediate position of the wire portion between the connectors, a wire-side surge reducing section provided in the wire portion, a connector-side surge reducing section provided in each of the connectors, and a middle portion-side surge reducing section provided in the middle portion.

Abstract: Provided herein is a method for manufacturing a conductive transparent substrate, the method including forming a plurality of main electrodes on the substrate such that the main electrodes are distanced from one another; and forming a connecting electrode that electrically connects two or more main electrodes such that the plurality of main electrodes are grouped into a plurality of group electrodes that are electrically disconnected from one another, thereby producing a conductive transparent substrate with excellent transmittance in a process of high yield.

Abstract: A circuit board includes: a first surface and a second surface opposite to the first surface; a through hole extending between the first surface and the second surface; a conductor covering an inner wall surface of the through hole, a first end and a second end of the conductor being terminated inside the through hole; and a wire connected to the conductor, wherein a sum of a length from a contact portion where the conductor contacts a connector pin inserted in the through hole to the first end of the conductor, and a length from a wire connecting portion where the conductor is connected to the wire to the second end of the conductor is 0.5 mm or less.

Abstract: A ground connection structure includes: a shield projecting portion being a part of a shield layer of a shield wire projected outside of an exterior covering to be exposed; an annular member for grounding disposed in a position surrounding an outer circumference of the shield wire and including a housing chamber having an opening along an annular shape of the annular member for grounding and being configured to house the shield projecting portion and a ground wire inserted from the opening; and a push-in member inserted from the opening and housed in the housing chamber after insertion of the ground wire and the shield projecting portion to bring the shield projecting portion and the ground wire into close contact with each other. The annular member for grounding includes locking claws configured to project into the housing chamber and lock the push-in member inserted into the housing chamber.

Abstract: A cable splitter includes a main body. The main body includes a top wall and an end portion. The top wall defines a splitting slot, a first guide slot, a second guide slot running through the top wall. The end portion includes a first guide arm and a second guide arm extending from the end portion and corresponding to the first guide slot and the second guide slot.

Abstract: An assembly and method provides improved electromagnetic interference shielding, particularly where the assembly includes a shield with a shield opening. The shield opening may be provided to permit the escape of thermal energy from an electronic component on a substrate under the shield or to receive at least a part of a thermal pad, electronic component, or conductive chassis. The assembly includes a first conductive gasket disposed around the shield opening, and a second conductive gasket disposed radially outward from the first conductive gasket. The first conductive gasket and the second conductive gasket have one or more gasket characteristics including a respective first characteristic and second characteristic that are of the same type but have different values. The first characteristic and the second characteristic may be one or more of different attenuation frequency ranges, compression amounts, compressive forces, and dimensions.

Abstract: A thin high-voltage insulted electric wire which comprises a conductor and an insulating layer covering the conductor, said insulating layer comprising both an ethylene-acrylic ester copolymer resin and polyethylene. The insulating layer is made of a composition which exhibits a reciprocal of the product of tensile break strength (?f) (MPa) and tensile break elongation (?), 1/(?f·?), of 4.8×10?2 or less [wherein ?f refers to the tensile break strength of the insulating layer and ? refers to the tensile break elongation thereof], a storage elastic modulus (E) of 520 MPA or more, and a D hardness of 45 or more.

Abstract: The present invention provides a micropackaged device comprising: a substrate for securing a device; a corrosion barrier affixed to said substrate; optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device; and an encapsulation material layer configured to encapsulate the micropackaged device.

Abstract: A power cable (C1), or power umbilical, comprising a number of electric high power cables (10) for transfer of large amounts of electric power/energy; filler material (2, 3, 4, 5, 6) in the form of stiff elongate plastic elements; the number of electric high power cables (10) and stiff elongate plastic elements (2, 3, 4, 5, 6) being gathered in a twisted bundle by means of a laying operation; a protective sheath (1) that encompasses the electric cables and the filler material; and at least one longitudinally extending channel (6) is provided for forced flow transportation of a cooling agent through said power cable/umbilical in order to cool down the electric high power cables (10) and their insulation material from a critical temperature value of about 90° C.

Abstract: A car connection system guides at least one supply cable between two cars and has a support part for mounting the supply cable. The support part has a separate connection point to which the supply cable can be electrically connected, and the support part is secured to an end closure. The car connection system is characterized in that the supply cable is configured as a spiral cable and extends about a cable longitudinal axis in a helical manner, the support part is rigid, and a clamping part is secured to the support part in order to relieve tension and mechanically support the supply cable.

Abstract: Continuously transposed conductor (“CTC”) cables are described. A CTC cable may include a plurality of electrically insulated strands connected in parallel at their ends. Additionally, each strand may include one or more conductors and an extruded insulation layer formed at least partially around the one or more conductors.

Abstract: There are provided an insulating film, a printed circuit board including the insulating film, and a method of manufacturing the printed circuit board. The insulating film includes a first insulating material; a second insulating material; and a metal thin film disposed between the first insulating material and the second insulating material.

Abstract: A power distributor including a first conductive coupling device electrically coupled to a bare-wire non-terminating section of a first conduit. A second conductive coupling device is electrically coupled to a terminating end of a second conduit. The first conduit is a larger gauge than the second conduit. A fuse electrically connects the first conductive coupling device and the second conductive coupling device. A housing encases the first and second conductive coupling devices and the fuse.

Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns comprising: dual diameter first and second signal vias forming a differential signal pair, the first and second signal vias being configured to accept contact tails of signal conductors of a connector; dual diameter ground shadow vias adjacent to each of the first and second signal vias, wherein the dual diameter shadow ground vias have a reversed diameter configuration with respect to the dual diameter first and second signal vias; and ground vias configured to accept contact tails of ground conductors of the connector.

Abstract: The cable management container includes a breadbox-like container with a lid that follows the contours of the container. The container includes a front wall, rear wall, side walls, a bottom wall, a top wall, and a sleeve. The top wall also functions as the lid. The bottom wall supports a receptacle array. The receptacle array includes a plurality of power outlets into which multiple electrical plugs may be organized and plugged into connection with an external power source. The container further includes at least one aperture on one of the sides of the container through which electrical cords may be threaded as well as an external power cord.