Patents Examined by Tom Dunn
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Patent number: 6699812Abstract: Epoxidation catalyst based on titanium zeolite in the form of extruded granules. Use of this catalyst in the synthesis of epoxides, preferably 1,2-epoxy-3-chloropropane or 1,2-epoxypropane, by reacting an olefinic compound, preferably allyl chloride or propylene, with a peroxide compound, preferably hydrogen peroxide. Process for the preparation of an epoxide, preferably 1,2-epoxy-3-chloropropane or 1,2-epoxypropane, by reacting an olefinic compound, preferably allyl chloride or propylene, with a peroxide compound, preferably hydrogen peroxide, in the presence of the aforementioned catalyst.Type: GrantFiled: January 25, 2002Date of Patent: March 2, 2004Assignee: Solvay SAInventors: Michel Strebelle, Jean-Pierre Catinat
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Patent number: 6698496Abstract: A cooling arrangement for uniformly cooling an entirety of a die-casting metal mold is provided. Cooling oil is supplied from temperature controllers (9, 10) by pumps to respective coolant passages (A,B,C,D,E,F,G) through coolant supply circuits (5,6) and through manifolds (5B,6B) where the coolant is branched for cooling a predetermined portion of the metal mold (2). Then, the cooling oil discharged from the respective coolant passages (A,B,C,D,E,F,G) are returned to the temperature controllers (9,10) through coolant discharge passages (7,8) and is cooled by cooling device (11, 12). The cooled cooling oil is again supplied to the coolant supply circuits (5,6). The coolant passages (A through G) are grouped into two groups, and the temperature controllers and the coolant circulation circuits are also grouped into each group to perform coolant supply control and temperature control independently of each group.Type: GrantFiled: December 18, 2002Date of Patent: March 2, 2004Assignee: Ryobi Ltd.Inventors: Tomoyuki Takayama, Takuma Takahashi, Mutsumi Sano
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Patent number: 6696389Abstract: The invention relates to a method and a device for cleaning flowing gases. To reduce the total emissions, nitrogen oxides, especially NO and NOx, are extracted at least partially from the gas to be scrubbed, in the temperature range from 50 and 300° C., preferably between 50 and 150° C. To extract the nitrogen oxides, an intermediate storage medium is used that is composed of a storage material and a supporting material for the storage material. The intermediate storage medium having in particular a composition of the formal chemical formula Ag.CuAl2O4 in an Al2O3 matrix, with the composition being a spinel or being of the spinel type, and with the composition having characteristic spinel lines in the x-ray spectrum, where 0≦x<1.Type: GrantFiled: September 9, 1999Date of Patent: February 24, 2004Assignee: DaimlerChrysler AGInventors: Walter Boegner, Rolf-Dirc Roitzheim, Martin Hartweg, Andrea Seibold, Thomas Fetzer, Bernd Morsbach
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Patent number: 6696666Abstract: A system and method for processing a tubular member comprises a hollow tubular member, a laser and a media flow. The laser is constructed and arranged to transmit laser energy to the tubular member. The laser energy is transmitted to the tubular member through a fluid column according to a predetermined pattern. The media flow is injected into the lumen of the hollow tubular member.Type: GrantFiled: July 3, 2002Date of Patent: February 24, 2004Assignee: SciMed Life Systems, Inc.Inventors: Kenneth M. Merdan, Jan Weber
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Patent number: 6695200Abstract: Forming solder bumps each having a constant height by surely supplying onto each of electrode pads a solder ball corresponding to a predetermined volume while omitting Au plating performed on the electrode pads onto which the solder bumps are to be formed. For achieving the forming of the solder bumps, the adhesive film is formed instead of the Au plating, the adhesive film being used as an oxidation-preventing film and as film for temporarily fixing each of the solder balls, the solder balls being supplied by stencil mask or the vacuum adsorbing mask.Type: GrantFiled: October 10, 2002Date of Patent: February 24, 2004Assignee: Hitachi, Ltd.Inventors: Takamichi Suzuki, Yoshihide Yamaguchi, Noriyuki Oroku, Kosuke Inoue
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Patent number: 6691909Abstract: An apparatus and method for ultrasonically welding workpieces that reduces sonotrode adhesion during the ultrasonic welding process. The sonotrode includes a contact surface wherein a fluid is deposited on the contact surface prior to the welding process. The fluid may be applied in different ways, including providing an aperture in the contact surface of the sonotrode. In addition, the sonotrode may be cooled below the dew point of the surrounding atmosphere thus causing moisture to form on the contact surface of the sonotrode. Cooling the sonotrode to a temperature above the dew point also reduces sonotrode adhesion during the ultrasonic welding process.Type: GrantFiled: October 10, 2001Date of Patent: February 17, 2004Assignee: Ford Global Technologies, LLCInventors: Jan Birger Skogsmo, Larry Van Reatherford, Oludele Olusegun Popoola, Ray Jahn, Vijitha Senaka Kiridena
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Patent number: 6693258Abstract: A polycrystalline thin film of good quality is obtained by improving a crystallization process of a semiconductor thin film using laser light. After conducting a film forming step of forming a non-single crystal semiconductor thin film on a surface of a substrate, an annealing step is conducted by irradiating with laser light to convert the non-single crystal semiconductor thin film to a polycrystalline material. The annealing step is conducted by changing and adjusting the cross sectional shape of the laser light to a prescribed region. The semiconductor thin film is irradiated once or more with a pulse of laser light having an emission time width from upstand to downfall of 50 ns or more and having a constant cross sectional area, so as to convert the semiconductor thin film contained in an irradiated region corresponding to the cross sectional area to a polycrystalline material at a time. At this time, the energy intensity of laser light from upstand to downfall is controlled to apply a desired change.Type: GrantFiled: February 4, 2002Date of Patent: February 17, 2004Assignee: Sony CorporationInventors: Yukiyasu Sugano, Masahiro Fujino, Michio Mano, Akihiko Asano, Masumitsu Ino, Takenobu Urazono, Makoto Takatoku
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Patent number: 6691908Abstract: Articles to be brazed are preheated to an increased temperature in a preheating process and the temperature of the articles to be brazed is measured. Conversion data obtained and stored for different combinations of articles to be brazed is referred to on the basis of the measured temperature and a time for which brazing filler metal supply nozzles are kept in a wait state is set on the basis of the conversion data to define the timing for supplying the brazing filler metal wires (S40). A heating burner moves forward and then a timer starts counting the time for which the nozzles are kept in the wait state (S42). When the nozzle wait timer has counted the set time and expired, the brazing filler metal supply nozzles move forward and supply the wires to braze the articles (S43 to 45). In this way, the articles to be brazed, heated by the heating burner, are at an increased temperature suitable for brazing at the time when the brazing filler metal wires are supplied.Type: GrantFiled: July 18, 2001Date of Patent: February 17, 2004Assignee: Daishin Industrial Co., Ltd.Inventors: Kazutaka Ishida, Mitsuo Takahashi
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Patent number: 6691911Abstract: There is provided a method of hermetically sealing electronic parts, comprising the step of bonding a base having semiconductor devices mounted thereon and a cap together via a solder. The solder is composed, by weight, of 78% or more but less than 79.5% Au, and the balance Sn. It is particularly preferred that the bonding is performed with the use of a solder composition composed, by weight, of 78% or more but 79% or less Au, and the balance Sn as the solder and furthermore through plating the cap with gold.Type: GrantFiled: June 13, 2002Date of Patent: February 17, 2004Assignee: Tanaka Kikinzoku Kogky K.K.Inventors: Shozaburo Iwai, Masaru Kobayashi, Osamu Sawada
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Patent number: 6693055Abstract: The present invention relates to a method for the preparation of a zeolite-substrate composite comprising a patterned zeolite monolayer or multilayer on a substrate, which comprises forming a pattern of a linking compound on the substrate by a selective irradiation with a UV ray, a selective application of a linking compound or a blocking compound, or a selective deposition of a metal, and combining zeolite particles on the portion whereon the linking compound is patterned. The substrate is selected from a group consisting of a substrate having surface hydroxyl groups, a metal capable of being reacted with thiol or amino groups, and a polymeric material having various surface functional groups. The present invention also relates to a zeolite-substrate composite comprising a patterned zeolite monolayer or multilayer on a substrate prepared by said method.Type: GrantFiled: June 28, 2002Date of Patent: February 17, 2004Assignee: Sogang University CorporationInventors: Kyung-Byung Yoon, Goo-Soo Lee, Kwang Ha, Yun-Jo Lee, Yu-Sung Chun, Yong-Soo Park
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Patent number: 6688513Abstract: In a process for producing longitudinally welded tubes, a metal strip, which is continuously pulled from a supply, is gradually formed into a slit tube and the longitudinal slit of said slit tube is welded. The metal strip (2) is pulled through a plurality of drawing dies (8, 9, 10, 11) arranged one behind the other and having a diameter that decreases in production direction, and in each of the drawing dies (8, 9, 10, 11) is increasingly bent in circumferential direction. The slit tube is closed in a last forming step (15) immediately in front of the welding point.Type: GrantFiled: June 14, 2001Date of Patent: February 10, 2004Assignee: NexansInventors: Klaus Porcher, Friedrich Harten
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Patent number: 6689195Abstract: A process is described for the manufacture of crystalline molecular sieve layers with good para-xylene over meta-xylene selectivity's good para-xylene permeances and selectivities. The process requires impregnation of the support prior to hydrothermal synthesis using the seeded method and may be undertaken with pre-impregnation masking. The crystalline molecular sieve layer has a selectivity (&agr;x) for para-xylene over meta-xylene of 2 or greater and a permeance (Qx) for para-xylene of 3.27×10−8 mole(px)/m2.s.Pa(px) or greater measured at a temperature of ≧250° C. and an aromatic hydrocarbon partial pressure of ≧10×103 Pa.Type: GrantFiled: June 20, 2002Date of Patent: February 10, 2004Inventors: Marc Henri Carolina Anthonis, Anton-Jan Bons, Harry William Deckman, Jonas Hedlund, Wenyih F. Lai, Jacobus Anna Josephus Peters
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Patent number: 6685080Abstract: A method for reworking a ball grid array (BGA) of solder balls including one or more defective solder balls on an electronic component workpiece using a single-ball extractor/placer apparatus having a heatable capillary tube pickup head optionally augmented with vacuum suction. A defective solder ball is identified, extracted by the pickup head and disposed of. A nondefective solder ball is picked up by the pickup head, positioned on the vacated attachment site, and thermally softened for attachment to the workpiece. Flux may be first applied to the replacement solder ball or to the vacated attachment site. The extractor/placer apparatus may be automated to locate, extract and replace defective balls for completion of a fully operable BGA.Type: GrantFiled: October 20, 2000Date of Patent: February 3, 2004Assignee: Micron Technolgy, Inc.Inventors: Kwan Yew Kee, Chew Boon Ngee, Keith Wong Bing Chiang
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Patent number: 6684935Abstract: An apparatus and method for pressure casting a battery part wherein at least one of the mold members forming the surfaces of an internal battery part cavity are displaced with respect to one another to reduce the volume of the mold cavity formed between the two parts to thereby intensify the pressure sufficiently high pressure so as to inhibit the formation of cracks and tears in a cast part.Type: GrantFiled: July 23, 2002Date of Patent: February 3, 2004Assignee: Water Gremlin CompanyInventor: Robert W. Ratte
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Patent number: 6686560Abstract: A laser enclosure is provided including a laser chamber for a robotic laser and a load/un-load region. A partition is positioned between the laser chamber and the load/unload region that is effective in preventing the passage of laser light from the laser chamber to the load/unload region. The partition includes a stationary and a rotary partition that is rotated about a central rotary partition axis by a partition drive. At least one pair of opposing workpiece supports can be mounted on the rotary partition. A light-tight sealing region seals the interface between the rotary and stationary partitions from the passage of laser light.Type: GrantFiled: March 8, 2002Date of Patent: February 3, 2004Assignee: Motoman, Inc.Inventors: Vanon D. Pratt, Erik Harrison Nieves, Todd Stucker
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Patent number: 6681981Abstract: Novel prefabricated modular structural members for use in low cost construction of relatively small residential, institutional and commercial buildings with high degrees of resistance to damage by fire, hurricanes, earthquakes, moisture, etc., are disclosed. A structural member of this class basically consists of two spaced shell panels and an intermediate core. The core is a triangulated wire frame composed of a plurality of zig-zag shaped wire trusses having their sets of top and bottom apexes anchored to associated sets of longitudinal and transverse chords and the respective proximate inside faces of the shell panels. A fixture is provided which includes posts for holding the wires before they are welded. The posts and a coupling member such as a welding gun can move with respect to each other to form the joints between the wires.Type: GrantFiled: January 12, 2001Date of Patent: January 27, 2004Assignee: IBI, Inc.Inventor: Richard Paroly
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Patent number: 6682852Abstract: Concave portions and convex portions are formed on a peripheral surface of a thin metal sheet by applying a pressing force thereto while the metal sheet is being embossed; pores are each formed on an apex of each of the concave portions and convex portions and burrs each projecting outward from a peripheral edge of each of the pores are generated by the pressing force; the metal sheets having the concave portions and convex portions formed thereon are layered on each other; the burr at the apex of each convex portion of a lower-layer metal sheet is interlocked with the burr at the apex of each concave portion of an upper-layer metal sheet adjacent to the lower-layer metal sheet to integrate the metal sheets with each other; and an active substance is charged into spaces between the upper-layer metal sheet and the lower-layer metal sheet through an aperture at the apex of each of the concave portions and convex portions.Type: GrantFiled: August 13, 2002Date of Patent: January 27, 2004Assignee: Katayama Special Industries, Ltd.Inventor: Hirofumi Sugikawa
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Patent number: 6683279Abstract: A dual-electrode arc welding apparatus includes a body assembly adapted to be coupled to a source of electric power and directing two wire electrodes through a nozzle assembly to an associated workpiece at a working end of the apparatus. The body assembly is provided at a distal end with an adapter which channels the electrodes respectively through passages of a tip assembly in electrical contact with the adapter and the body assembly for conducting electric power to the electrodes. The tip assembly is removable from the adapter without removing the nozzle assembly and, upon removal of the nozzle assembly, the adapter is removable from the body assembly. The tip assembly may include a single tip body with dual passages therethrough or two discrete tips separately mounted on the adapter by either threaded engagement therewith or by being slidably received in externally threaded nipples and secured by collet nuts. Similarly, the adapter may be collet-mounted or threadedly engaged with the body assembly.Type: GrantFiled: December 27, 2001Date of Patent: January 27, 2004Inventor: Delford A. Moerke
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Patent number: 6680278Abstract: The invention is directed to a method of synthesising silicoaluminophosphate molecular sieves using synthesis templates that contain at least one dimethylamino moiety. The use of dimethylamino moiety containing templates results in good quality SAPO molecular sieves of CHA framework type.Type: GrantFiled: June 12, 2002Date of Patent: January 20, 2004Assignee: ExxonMobil Chemical Patents, Inc.Inventors: Guang Cao, Matu J. Shah
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Patent number: 6679417Abstract: An efficient and effective process for manufacturing of hardened aluminum components is achieved by coordinating the material preparation steps with the forming steps. The resulting product is a hardened aluminum component with desirable strength characteristics. The process includes initial heating of sheet material in order to prepare it for further processing. The sheet material is then quenched to promote appropriate material conditioning. A product forming sub-process is then undertaken in a relatively short period of time following the quenching. The product forming is done while the material is in a relatively ductile condition, thus easing forming operations, and avoiding product spring-back problems. Lastly, the component is naturally aged, to provide the final hardening operations. The resulting product has very desirable strength characteristics, due to the combined forming and hardening process.Type: GrantFiled: June 7, 2001Date of Patent: January 20, 2004Assignee: Tower Automotive Technology Products, Inc.Inventors: Lawrence M. Dziadosz, Clarence W. Fulton