Abstract: The invention provides an apparatus that separates solder from solder dross, comprising first and second rolls and a fixture. The first roll has a substantially cylindrical surface and is rotatable about a first longitudinal axis. The second roll has a substantially cylindrical surface and is rotatable about a second longitudinal axis parallel to the first longitudinal axis. The fixture is coupled to the first and second rolls and spaces the second roll apart from the first roll by a first distance, such as 0.001 to 0.015 inches, the first distance sufficient to separate a solder-dross mixture directed between the first roll and the second roll into a liquid solder and a dross powder when the first and second rolls are rotated in opposite directions.

Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the present invention also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The present invention also contemplates the replacement of the fixed clamp with another, or second, independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.

Abstract: A method for reducing adhesive build-up on ultrasonic bonding surfaces of ultrasonic bonding systems is disclosed. The method includes providing an ultrasonic bonding surface. A pad is provided proximate to, and in fluid contact with, the ultrasonic bonding system. A fluid is conducted to the pad such that the fluid is applied is intermittently or continuously applied to at least a portion of the ultrasonic bonding surface.

Abstract: A method of monitoring a ball forming process in a wire bonder. A glow discharge parameter between an electrode on the wire bonder and an end of a wire mounted on the wire bonder on which the ball is being formed is monitored. The monitored parameter is compared with a reference value to determine whether the ball formed is satisfactory.

Abstract: A hydrogenation catalyst of the general formula AB(y)C(z) wherein A is a support comprising of a salt of a Group II A metal or zeolite, B is a noble metal selected from Pt or Pd, y=0.2 to 10%, C is nickel and z=0 to 15.0%, with the proviso that when B is Pt, z=0.

Abstract: The present invention relates to a catalytic composition which comprises an ERS-10 zeolite, a metal of group VIII, a metal of group VI and optionally one or more oxides as carrier. According to a preferred aspect, the catalytic composition also contains a metal of group II B and/or III A. The catalytic system of the present invention can be used in the upgrading of hydrocarbon mixtures having boiling ranges within the range of C4 to 250° C., preferably mixtures of hydrocarbons which boil within the naphtha range, containing impurities of sulfur, i.e. in hydrodesulfuration with the contemporaneous skeleton isomerization of olefins contained in these hydrocarbons, the whole process being carried out in a single step.

Abstract: A cutting tool 60 cuts along the butted portion between two members 10, 20. A filling material 30 is inserted to the gap 40 formed by said cutting, and a roller 70 presses protrusions 12 and 22 to crimp said protrusions 12 and 22 so as to fix said filling material to position. Next, friction stir welding is performed to the protrusions 12, 22 and the filling material 30 using a rotary tool 80. In another example, instead of cutting, the filling material can be welded and filled to the gap. In yet another example, cutting can be performed so as to approximate the two members before performing the friction stir welding step.

Abstract: A soldering device and method includes the steps of forming a solder melting pot by assembling plural trowel members, supplying a solder tip to the solder melting pot, and sequentially repeating the operation for supplying the molten solder to the respective soldering point. In the improvement, an additional heating portion which comes close to the solder melting pot is formed near or with the trowel members, and the soldering point to which molten solder has already been supplied by the prior molten solder supplying operation is additionally heated during the supplying operation of the next soldering point. The trowel members are used to simultaneously perform the operation for supplying the molten solder and another operation for additionally heating the soldering point to which the molten solder has been supplied. A plurality of points to be soldered aligned at predetermined intervals are efficiently soldered.

Abstract: A process for manufacturing a strip of aluminium or an aluminium alloy for electrolytically roughened lithographic printing plates, in which the alloy is continuously cast as a strip and then rolled to final thickness, is such that the cast strip is rolled to final thickness with a thickness reduction of at least 90% without any further heating. The resultant microstructure in the region close to the surface of the strip leads to improved electrolytic etching behaviour.

Abstract: There is provided a system and method for ablating a surface of a work-piece comprising a radiation source for providing an ablating beam and a plurality of adjustable reflective masks having predetermined mask patterns thereon. The reflective masks are sequentially positioned relative to said radiation source and in the path of said ablating beam for reflecting said ablating beam onto the surface of the work-piece to ablate the work-piece.

Abstract: The invention relates to a spherical catalyst composition comprising a Group VI metal component and optionally a Group VIII metal component on a carrier, which catalyst has a particle size of 0.5-7 mm, a total pore volume of 0.5-1.3 ml/g, an average pore diameter of 15-30 nm, and a % PV(>100 nm) of 2-30%, there being substantially no difference in density between the core region of the carrier particles and their surface regions. The catalyst is particularly suitable for use in non-fixed bed processes for the hydroprocessing of heavy hydrocarbon feeds. It has high hydrodesulfurization and hydrodemetallization activity in combination with a high abrasion resistance.

Abstract: A method for forming a miniaturized shaped component. Bulk superplastic material is contacted with a flat rotating surface of a rotating tool to frictionally heat the bulk superplastic material with the bulk superplastic material positioned between the flat rotating surface of the tool and a microfabricated tool die. The bulk superplastic material is forced into the microfabricated die once the bulk superplastic material is heated to a temperature between a glass transition temperature and a crystallization temperature.

Abstract: The invention relates to a soldering apparatus, including a vessel for containing and heating molten solder, transporting means for transporting objects for soldering to the vessel and removing said objects, at least one tube extending substantially vertically above the soldering vessel, pump means for feeding molten solder to the underside of the tube, and moving means for moving into at least the vicinity of each other the underside of the printed circuit board for soldering and the upper side of the tube, wherein an outflow opening is arranged in each of the tubes at some distance from the upper side of said tubes. By arranging the outflow opening at some distance from the upper side of the tube the outflowing solder flow will no longer contact the printed circuit board and the components present thereon thus allowing more freedom in the design of the printed circuit board and the placing of the components thereon.

Abstract: Drilling holes in structures using two different lasers allows a precise hole to be formed quickly. While one laser cuts a hole quickly, a second laser precisely shapes the hole. One useful application of such a method is drilling holes in multilayered structures such as Printed Wiring Boards (PWBs). One laser can precisely remove a first layer (copper) and a portion of a second layer (dielectric material). During this removal the shape of the hole is precisely formed. A second laser can remove the remaining portion of the second layer, exposing a third layer (copper). The use of the second laser can allow rapid removal of the remaining portion of the second layer. When cutting through a PWB, the second laser can be of a type that minimally damages the third copper layer.

Abstract: This invention relates to a process for depositing one or more catalytically reactive metals on a carrier, said process comprising selecting a carrier and depositing a catalytically effective amount of one or more catalytically reactive metals on the carrier, the deposition effected by submersing the carrier in an impregnation solution wherein the hydrogen ion activity of the impregnation solution has been lowered. The invention further relates to catalysts made from the process.

Abstract: A method of wave soldering a circuit board while avoiding reflow of a solder joint on the topside of the board from heat conducted from the solder wave through at least one via in the board in heat conducting relation with the topside solder joint, comprises subjecting the circuit board to a solder wave and absorbing heat being conducted from the solder wave through the at least one via with an endothermic material in the via hole which undergoes a heat absorbing reaction. The heat absorbing reaction of the endothermic material is preferably a phase change, such as melting. The melted endothermic material is retained in the via hole during wave soldering by capillary forces and a cap on the lower end of the via hole. A disclosed method of making the circuit board includes locating the endothermic material in the via hole by inserting a preform of the endothermic material into the via hole or hot dispensing the endothermic material into the via hole.

Abstract: The present invention relates to a new and improved device adapted for mounting semiconductor components to substrates. More particularly, the device includes a housing and a first member rotatably mounted to the housing. A first interface is formed between the first member and the housing. The device also has a second member mounted in the first member and movable in an axial direction relative to the first member between a first position and a second position. The second member has an engaging mechanism at an end thereof for engaging a semiconductor component. A second interface is formed between the first and second members. The device is also provided with a supplying mechanism for supplying pressurized air to the first and second interfaces so as to form a first air bearing at the first interface and a second air bearing at the second interface.

Abstract: Methods for making and using dissipative ceramic bonding tool tips for wire bonding electrical connections to bonding pads on integrated circuit chips and packages. The method of using the dissipative ceramic bonding tool tip includes dissipating charge while bonding to avoid damaging delicate electronic devices by a sudden surge of accumulated charge. The method of making the tool tip includes affecting its conductivity so that it conducts electricity at a rate sufficient to prevent charge buildup, but not sufficient to overload the device being bonded. For best results, a resistance in the tip assembly itself should range from 5×104 or 105 to 1012 ohms. In addition, the tips must also have specific mechanical properties to function satisfactorily.

Abstract: A rectangular alkaline storage battery includes an electrode plate which can be easily prepared and has a high packing density of active material and volumetric energy density. A connected negative electrode plate with hydrogen-absorbing alloy negative electrode plates is bent into a U-shaped form at a central portion (connecting portion). A composite positive electrode plate is then sandwiched by the hydrogen-absorbing alloy negative electrode plates with a separator made of an unwoven polypropylene fabric provided interposed therebetween to prepare an electrode plate unit. Two such electrode plate units are then laminated to form a group of electrode plates.

Abstract: A laser beam delivery system for ablating a desired array of features in an object to be processed. The imaging system comprises a laser, a shaping apparatus for shaping the laser beam into a plurality of separate laser beams, first and second repeat positioners for redirecting the beams, a converging mechanism for converging the laser beams through a clear aperture of a reflective mirror of the first repeat positioner, and a focusing member for focusing the laser beams at a desired one of a plurality of holographic imaging segments. Each one of the holographic imaging segments, comprising the holographic imaging lens, forms a desired formation in a surface of the object to be processed. A number of the components are housed within a rotatable module and a rotational drive is connected to the rotatable module to facilitate rotation thereof relative to the optical axis.