Abstract: A laser marking apparatus and method having an energy source which is not substantially transmissible through the substrate of a semiconductor chip, or the substrate of the semiconductor chip is substantially opaque to the energy source for marking the surface of a semiconductor chip, are described herein.

Abstract: A machining device comprising five axial kinetic coordinate systems that can be controlled simultaneously, three axes of which are linear moving axes and two axes of which are rotary axes, with one axis of the five axes being provided with a tool rotating function, whereby said machining device is equipped with a cutting tool 51 and a friction stir welding tool 52. The current value observed when a large-diameter portion of said tool 52 contacts the work object is set in advance, and by observing the torque current of the rotary shaft of the tool 52 during friction stir welding, the insertion depth of the tool 52 can be controlled by maintaining the observed torque current above the preset current value, thus providing a good weld. A single device can provide both the cutting and the welding. Thus, it is possible to reduce equipment cost, installation space, plant area, lead time and production cost.

Abstract: There is provided a method for applying solder to an element on a surface of a substrate. The method comprises the steps of (a) placing a mold over the surface, where the mold includes a conduit that contains the solder, and (b) heating the solder to a molten state so that the solder flows from the conduit onto the element. The conduit enjoys two degrees of horizontal freedom with respect to the surface such that the conduit becomes substantially aligned with the element when the solder is in the molten state. There is also provided a system for applying solder to an element on a surface of a substrate.

Abstract: There is provided a reinforced superconducting tape. The reinforced tape includes a superconducting tape containing a superconducting ceramic material, a first metal reinforcing layer having a greater coefficient of thermal expansion than that of the superconducting tape, and a second metal reinforcing layer having a greater modulus of elasticity than the superconducting tape and the first reinforcing layer.

Abstract: A processing method for a ceramic green sheet and a laser beam machine used therefor, which can efficiently form a plurality of penetration holes having a desired shape and dimension at predetermined locations of the ceramic green sheet, are provided. By performing the steps of dividing a shaped laser beam into a plurality of laser beams by passing through a diffraction grating in order that an energy of the individual zero order diffracted beam becomes equivalent to, or less than, the threshold value for processing the ceramic green sheet, reflecting the divided laser beams with a galvanomirror, converging the reflected laser beams with an converging lens and radiating the laser beams to the ceramic green sheet, the ceramic green sheet is prevented from being processed by the zero order diffracted beam and the higher order diffracted beam so as to simultaneously form a plurality of penetration holes having a desired shape and dimension.

Abstract: Continuously adjustable focusing optics for use in laser-assisted direct metal deposition (DMD™) processes provide for adaptive deposition width to increase deposition rate while maintaining the dimensional tolerances. The focusing optics and method may be adapted for variable deposition road width under closed-loop feedback, so that complicated features may be fabricated with close tolerance, stress and microstructure control to improve the lead-time and design flexibility. The preferred embodiment uses adaptive mirror arrangements and beam movement for variable deposition width and geometry. Conceptually, an infinite number of mirror arrangements can be made to adapt to a particular deposit shape.

Abstract: An apparatus which selectively directs cutting debris in selected directions while a laser beam separates a workpiece in a multi-directional relation. The apparatus comprises a positionable member rotatable about the laser beam, a nozzle attachable to the positionable member, and a programmable logic controller integrated with the positionable member to selectively position the direction of the nozzle.

Abstract: This invention relates to a process for the preparation of anionic clay and boehmite-containing compositions. These compositions may also contain unreacted trivalent metal source and/or divalent metal source. The process involves subjecting a precursor mixture comprising a divalent metal source and a trivalent metal source to at least two aging steps, wherein at least once between two aging steps an aluminum source is added. An advantage of the invention is that the crystallinity of the boehmite in the composition can be tuned.

Abstract: A process for regenerating a zeolite catalyst comprises the following stages: (I) Heating a partially or completely deactivated catalyst to 250-600° C. in an atmosphere which contains less than 2% by volume of oxygen, (II) treating the catalyst at from 250 to 800° C., preferably from 350 to 600° C., with a gas stream which contains from 0.1 to 4% by volume of an oxygen-donating substance or of oxygen or of a mixture of two or more thereof, and (III) treating the catalyst at from 250 to 800° C., preferably from 350 to 600° C., with a gas stream which contains from more than 4 to 100% by volume of an oxygen-donating substance or of oxygen or of a mixture of two or more thereof.

Abstract: The present invention relates to the continuous production of nano-scale precious metal particles on SiH-containing support materials, the compositions themselves, and the use of these precious metal-containing compositions as catalyst. The continuous process according to the invention includes impregnating support materials and, after thermal activation, drying the support materials by spraying or by fluidized bed technology leads to form precious metal-containing support compositions that are active in the catalysis of oxidation reactions. The catalytically active precious metal-containing support compositions exhibit high selectivities and productivities and have very long catalyst service lives without deactivation. The invention also relates to a process for the oxidation of hydrocarbons in the presence of oxygen, a reducing agent and the precious-metal containing support compositions of the present invention.

Abstract: In one embodiment, portions of a plurality of solder balls are placed within a frame and in registered alignment with individual bond pads over a substrate. While the ball portions are within the frame, the balls are bonded to their associated bond pads. In another embodiment, a frame is provided having a plurality of holes sized to receive individual balls. Individual balls are delivered into the holes from over the frame. The balls are placed into registered alignment with a plurality of individual bond pads over a substrate while the balls are in the holes. The balls are further bonded. In another embodiment, a frame is provided having a hole. A solder ball is provided having an outer surface. The ball is retained within the hole in an ambient processing environment which is generally uniform over the entirety of the ball's outer surface. While the ball is within the hole, the ball is bonded.

Abstract: A printed circuit board soldering process where a number of pockets containing solder are filled to overflowing with solder and then raised to immerse the terminals to be soldered. The solder pot and the pockets are protected by an atmosphere of hot inert gas introduced under a cover plate which has openings, corresponding to the location of the terminals, through which the pockets pass.

Abstract: A cutting tool 60 cuts along the butted portion between two members 10, 20. A filling material 30 is inserted to the gap 40 formed by said cutting, and a roller 70 presses protrusions 12 and 22 to crimp said protrusions 12 and 22 so as to fix said filling material to position. Next, friction stir welding is performed to the protrusions 12, 22 and the filling material 30 using a rotary tool 80. In another example, instead of cutting, the filling material can be welded and filled to the gap. In yet another example, cutting can be performed so as to approximate the two members before performing the friction stir welding step.

Abstract: A system and method having applications in semiconductor areas for accurate die placement on a substrate that takes into account any positional offset from the reference position due to variations caused by thermal change and other nonrandom systemic effects. The system includes an offset alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the substrate, and an optical detector to receive an indirect image of a bottom surface of the die through the alignment tool, such that the die is accurately positioned on the substrate based on the indirect image received by the optical detector. The method comprises the steps of providing a cornercube offset alignment tool having a plurality of total internal reflection surfaces below a vision plane of the die, and receiving an indirect image of the die tool through the cornercube offset tool.

Abstract: There are provided a method of soldering a lead-free solder which lowers a melting point of the lead-free solder and prevents deterioration of a joining strength at a portion joined by the lead-free solder, and a joined object soldered with the use of the soldering method. The lead-free solder as an alloy of tin with no lead contained is melted, and ultrasonic vibration is acted at least either to the join object to be joined by the lead-free solder or to the lead-free solder when the molten lead-free solder is solidified. Therefore crystals of contained components in the lead-free solder are made fine and the contained components are prevented from being segregated at a joining interface of the joined object, so that the joining strength at the joining interface can be increased.

Abstract: A wire fixing jig for arranging and fixing covered wires when intersection portions thereof are welded. The jig has a jig body on which the covered wires are arranged, supporting portions for supporting the covered wires are formed around the intersection portions to be welded. These portions are located at a predetermined pitch from a corresponding one of the intersection portions, at both sides in the longitudinal direction thereof and for ensuring a space that allows a core part of each of the intersection portions, which are pressurized when welded, to spread out, and through holes through which welding device is inserted when the intersection portions of the covered wires are welded to each other.

Abstract: The invention includes an aluminum-comprising physical vapor deposition target bonded to an aluminum-comprising backing plate to a bond strength of greater than 10,000 pounds/in2. The invention also includes a method of bonding a first aluminum-comprising mass to a second aluminum-comprising mass. The first aluminum-comprising mass has a first surface, and the second aluminum-comprising mass has a second surface. The first and second masses are pressed together to bond the first mass to the second mass. Additionally, the invention includes a method of bonding a physical vapor deposition target material to a backing plate material. The target material and backing plate material are joined in physical contact with one another. The target material and backing plate material are then compressed under a load that progresses sequentially.

Abstract: There is provided a zeolite bound zeolite catalyst which does not contain significant amount of non-zeolitic binder and can be tailored to optimize its performance and a process for converting hydrocarbons utilizing the zeolite bound zeolite catalyst. The zeolite bound zeolite catalyst comprises core crystals containing first crystals of a first zeolite and optionally second crystals of a second zeolite having a composition, structure type, or both that is different from said first zeolite and binder crystals containing third crystals of a third zeolite and optionally fourth crystals of a fourth zeolite having a composition, structure type, or both that is different from said third zeolite. If the core crystals do not contain the second crystals of the second zeolite, then the binder crystals must contain the fourth crystals of the fourth zeolite. The zeolite bound zeolite finds application in hydrocarbon conversion processes, e.g.

Abstract: The present invention is a method for bonding gold wire to gold bond pads at temperatures lower than 125 degrees Celsius, and more particularly at room temperature, defined to be 25 degrees Celsius. By applying compressive force and ultrasonic energy, an intermetallic bond can be formed between a gold wire and a gold bond pad without elevating the temperature. Furthermore, the present invention uses ultrasonic energy with frequencies low enough to be in the range of commercially available wire bonders.

Abstract: The present invention concerns the improvement of the supercurrent carrying capabilities, i.e. the increase of critical current densities, of bicrystalline or polycrystalline superconductor structures, especially of high-Tc superconductors. By providing an appropriate predetermined dopant profile across the superconductor structure, in particular within or in the vicinity of the grain boundaries, the space-charge layers at the grain boundaries are reduced and thereby the current transport properties of the superconductor significantly improved. Simultaneously, the influence of magnetic fields on the critical current densities is significantly reduced, which in turn enhances the overall supercurrent carrying capabilities while keeping the supercurrent transport properties of the grains at good values.