Abstract: The present disclosure relates to a cable. An exemplary embodiment of the cable (2) comprises a plurality of conductors, wherein the conductors form several conductor groups (4, 6a-6d), in which respectively two or more of the plurality of conductors are stranded with one another. The several conductor groups (4, 6a-6d) are stranded overall around a common stranding center (1) and the conductors of at least two of the several conductor groups (4, 6a-6d; 4a-4d, 6a-6k) are stranded with one another with a different lay length.

Abstract: A substrate holding structure includes holding units and protrusions. The holding units are provided to a casing that includes an accommodating unit accommodating therein an inserted substrate, and hold an end part of the substrate accommodated in the accommodating unit on the insertion direction-entrance side of the substrate. The protrusions protrude from side wall surfaces that are wall surfaces of the casing along the insertion direction of the substrate, the wall surfaces being opposed to the side surfaces of the substrate, and are plastically deformed due to contact with the substrate to be inserted into the accommodating unit.

Abstract: A conductive component includes a first electrode pattern made of metal thin wires, and includes a plurality of first conductive patterns that extend in a first direction alternating with first non-conductive patterns. Each first conductive pattern includes break parts in portions other than intersection parts of the thin metal wires. The conductive component further includes a second electrode pattern made of thin metal wires, and includes a plurality of second conductive patterns that extend in a second direction orthogonal to the first direction and alternating with second non-conductive patterns. Each second conductive pattern includes break parts in portions other than intersection parts of thin metal wires.

Abstract: An epoxy resin composition according to one embodiment of the present invention comprises an epoxy resin, a curing agent, and an inorganic filler, and the inorganic filler includes boron nitride on which a metal oxide film is formed.

Abstract: A wiring board includes a base board and a plurality of wiring layers formed of a resin insulating film on the base board, wherein at least one of the wiring layers includes a fine wiring, a barrier film, which is not in contact with the fine wiring, is formed at a more outer side from the base board than the wiring layer including the fine wiring, and different types of resin insulating films are used for a wiring layer at an inner side of the barrier film close to the base board and a wiring layer at an outer side of the barrier film, respectively.

Abstract: A through conductor 11 provided in a through hole of a ceramic substrate includes a metal porous body 20, glass phases 17 and 19 formed in pores 16A to 16D of the metal porous body 20 and spaces 30 and 31 in the pores. A ratio of an area of the pores is 5 to 50 percent in a cross section of the through conductor 11. It is provided that the through conductor 11 is separated into a first part 11A on a side of the first main surface 11a and a second part 11B on a side of the second main surface 11b in a direction B of thickness of the ceramic substrate, a ratio of an area of glass phases occupying the pores in the first part 11A is higher than a ratio of an area of glass phases occupying the pores in the second part 11B. A ratio of an area of spaces occupying the pores in the first part 11A is lower than a ratio of an area of the pores occupying the pores in the second part 11B.

Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on first surface side of the laminate and first via conductors on second surface side of the laminate, and a solder resist layer interposed between the plate and the laminate and having openings formed such that the openings are exposing the first pads. The laminate has first surface on the first surface side and second surface on the second surface side on the opposite side and includes a first resin insulating layer forming the second surface of the laminate, and the first conductors are formed through the first insulating layer such that the first vias are tapering from the first surface side toward the second surface side of the laminate and have end surfaces recessed from the second surface of the laminate on the second surface side of the laminate.

Abstract: To reduce, when a single encapsulated circuit module has electronic components that are mutually influenced by their electromagnetic waves, the mutual influence, an embodiment provides an encapsulated circuit module M having a substrate 100 on which a number of electronic components 200 are mounted. An electronic component 200A is a high frequency oscillator. A metal side wall 320 of a partition member is provided on the substrate 100. One surface of the substrate 100 is entirely covered with a first resin 400 together with the electronic components 200 and the side wall 320. The first resin 400 is covered with a metal shield layer 600 for shielding electromagnetic waves. The electronic component 200A is surrounded by the side wall 320 and the shield layer 600.

Abstract: Embedded air gap transmission lines and methods of fabrication are provided. An apparatus having an air gap transmission line can include a first conductive plane, a core dielectric layer having a bottom surface in contact with the first conductive plane, a conductor having a bottom surface in contact with a top surface of the core dielectric layer, and a second conductive plane positioned over, and spaced apart from, a top surface of the conductor such that a gap separates the conductor from the second conductive plane. The top surface of the conductor is separated from the bottom surface of the second conductive plane by a first distance measured along an axis normal to the first conductive plane, and the bottom surface of the conductor is separated from the first conductive plane by a second distance greater than the first distance measured along the axis.

Abstract: A resin substrate includes a first portion including a plurality of resin sheets provided at one end in a stacking direction and a second portion including a plurality of resin sheets provided at the other end in the stacking direction. The thickness of the plurality of resin sheets is the same or substantially the same as the thickness of the first portion and the second portion. The density of planar conductor patterns of the first portion with respect to the volume of the first portion is lower than the density of planar conductor patterns of the second portion with respect to the volume of the second portion. The average of the diameters of the first interlayer connection conductor provided in the first portion is greater than the average of the diameters of the second interlayer connection conductor provided in the second portion.

Abstract: An electronic device may include a window member and a display module disposed on a rear surface of the window member. The display module may include a display panel with a non-bending region and a bending region, a first circuit substrate disposed on a rear surface of the display panel, a second circuit substrate electrically connecting the display panel to the first circuit substrate, a first adhesion member disposed on a rear surface of the first circuit substrate to combine the first circuit substrate with a first member different from the first circuit substrate, and a second adhesion member disposed on a rear surface of the second circuit substrate to combine the second circuit substrate with a second member different from the first circuit substrate.

Abstract: The present application discloses a flexible display apparatus bendable along a bending direction extending from a first portion of the flexible display apparatus to a second portion of the flexible display apparatus; the first portion bent towards the second portion when the flexible display apparatus is bent along the bending direction; including a plurality of chip on films arranged extending from the first portion to the second portion; each of the plurality of chip on films having a base film and an integrated circuit chip on the base film; and a flexible display panel connected to the plurality of chip on films. A longitudinal direction of the integrated circuit chip is substantially perpendicular to the bending direction.

Abstract: A circuit structure includes a circuit substrate surface having a circuit pattern; a plurality of bus bars are fixed to another surface of the circuit substrate with an interval therebetween; an electronic component straddles an interval between two adjacent bus bars, a first terminal is electrically connected to one bus bar and a second terminal is electrically connected to the circuit pattern; and a flexible sheet member is fixed to the bus bar to insulate the bus bar and the second terminal from each other, while electrically connecting the second terminal and the circuit pattern. The flexible sheet member includes: an adhesive layer fixed to the bus bar; a terminal conductor foil piece electrically connecting the second terminal and the circuit pattern; and an insulating layer that is interposed between the adhesive layer and the terminal conductor foil piece insulating the bus bar and the terminal conductor foil piece.

Abstract: A system includes a first blade including a first side of the first blade, a second side of the first blade, a front of the first blade, and a back of the first blade. The system further includes a second blade including a first side of the second blade, a second side of the second blade, a front of the second blade, and a back of the second blade. The system further includes a first side plane including a first physical communication channel configured to communicatively connect the first blade to the second blade via the first side of the first blade and the first side of the second blade.

Abstract: A flex circuit system according to an exemplary aspect of the present disclosure includes, among other things, a substrate, at least one bus bar mounted to the substrate and at least one voltage sense lead integrated with the substrate.

Abstract: In one or more embodiments, a substrate includes a patterned conductive layer and a reference layer. The patterned conductive layer includes a pair of first conductive traces, a pair of second conductive traces and a reference trace between the pair of first conductive traces and the pair of second conductive traces. The reference layer is above the patterned conductive layer and defines an opening.

Abstract: A method of forming an interconnect that includes providing a sacrificial trace structure using an additive forming method and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure is removed, and the continuous seed metal layer remains. An interconnect metal layer is formed on the continuous seed layer, and an electrically insulating material layer is formed on the interconnect metal layer. An electrically conductive support material is formed to encapsulate a majority of the interconnect metal layer, wherein the ends of the interconnect metal layer are exposed through opposing surfaces of the electrically conductive support material to provide an interconnect extending through the electrically conductive support material.

Abstract: A printed wiring board includes a first conductor layer forming an inner conductor layer, a second conductor layer forming a first outemiost conductor layer, a third conductor layer forming a second outermost conductor layer, insulating layers including first and second insulating layers, first via conductors connecting the first and second conductor layers, and second via conductors connecting the first and third conductor layers. The first conductor layer has thickness greater than thicknesses of the second and third conductor layers, the second conductor layer includes component mounting pads positioned to mount an electronic component on the second conductor layer and extending outside component mounting region corresponding to projection region of the component, and the first via conductors include a first set of the first via conductors formed directly underneath the component mounting region and a second set of the first via conductors formed on outer side of the component mounting region.

Abstract: A pad structure adapted to be disposed on a first package substrate and electrically connected to conductive contacts of a second package substrate includes a first conductive pad having a first top surface, a second conductive pad, a first leveling conductor and a second leveling conductor. The second conductive pad disposed aside the first conductive pad has a second top surface non-coplanar with the first top surface. The first leveling conductor disposed on the first conductive pad has a first leveling surface opposite to the first top surface. The second leveling conductor disposed on the second conductive pad and having a second leveling surface opposite to the second top surface is coplanar with the first leveling surface. The conductive contacts of the second package substrate are disposed on the first leveling conductor and the second leveling conductor. A manufacturing method of a pad structure is also provided.

Abstract: Exemplary embodiments are directed to pool cleaners that remove debris from water using a plurality of cyclonic flows, or that include a removable impeller subassembly, a check valve for a debris canister, a particle separator assembly having a handle that locks to the pool cleaner, a modular roller drive gear box, or a roller latch that secures a roller to the pool cleaner. Exemplary embodiments are also directed to the check valve and the roller latch themselves. Exemplary embodiments are directed to a filter medium for pool cleaners that includes embossments providing flow channels for water, and to roller assemblies for pool cleaners. Exemplary embodiments are directed to pool cleaners including alternative pump motor engagements. Exemplary embodiments are directed to pool cleaners power supplies that include a potted and contoured power board assembly, and to kickstands therefor. Exemplary embodiments are directed to a pool cleaner caddy, and removable wheels therefor.