Abstract: A display panel includes a base having a first surface and a second surface disposed oppositely; a flexible printed circuit board disposed on a first surface of the base and bent toward a second surface of the base; and a mechanical strengthening element disposed on a second surface of the base and at least positioned at regions of the second surface corresponding to two side edges of the flexible printed circuit board.

Abstract: A flexible circuit board, and an optical transceiver assembly and an optical module that have such flexible circuit board. The flexible circuit board includes a substrate body, a transmission metal layer formed on at least one surface of the substrate body, a strengthening layer formed on the transmission metal layer, and a surface metal layer formed on a portion of an outer surface of the strengthening layer. The surface metal layer constitutes a securing portion for securing and connecting to an external element. A portion of the flexible circuit board that is not covered by the surface metal layer constitutes a connecting portion that connects to the securing portion. The surface metal layer is electrically connected to the transmission metal layer.

Abstract: A printed circuit board comprises a first mounting surface, a second mounting surface, and a piezoelectric transformer. The piezoelectric transformer has a piezoelectric substance, external electrodes, and a frame substrate. The second mounting surface has a projection region. There is a first region from a first location, where an end portion further from the output electrode out of end portions of the input electrode is projected onto the second mounting surface in the projection region, to a second location, where an end portion closer to the output electrode out of the end portions of the input electrode is projected onto the second mounting surface, the first region being a mounting allowed region where an electronic component is mounted.

Abstract: According to one embodiment, an interposer substrate for switching wiring lines, includes a substrate body having through holes penetrating from a first main surface thereof to a second main surface, through-conductive portions provided respectively in the through holes, grouped into first groups and second groups different from the first groups, first wiring lines each provided on the first main surface and for a respective one of the first groups, second wiring lines each provided on the second main surface and for a respective one of the second groups, first terminals provided on the first main surface and connected respectively to the first wiring lines, and second terminals provided on the second main surface and connected respectively to the second wiring lines.

Abstract: A multi-core cable for vehicle includes two power wires, two signal wires, two electric wires, and a sheath. The two power wires have the same size and are made of the same material. The two signal wires have the same size and are made of the same material, and a pair of the two signal wires is twisted and is configured a twisted pair of signal wires. The two electric wires have the same size and are made of the same material, and a pair of the electric wires is twisted and is configured as a twisted pair of electric wires. The two power wires, the twisted pair of signal wires and the twisted pair of electric wires are stranded.

Abstract: A security apparatus for securing a portable electronic device to an immovable object includes a locking head having a base and a first linear element extending from the base. The first linear element is configured to be inserted into the aperture of the portable electronic device. The locking head also has a movable engagement element coupled to an end of the first linear element opposite from the base. The movable engagement element is configured to be inserted into the aperture of the portable electronic device with the first linear element. The movable engagement element is movable to a position in which the movable engagement element is perpendicular to the first linear element to secure the locking head to the portable electronic device. The security apparatus also includes a security device attached to the locking head and configured to engage the immovable object.

Abstract: A conductive component includes a first electrode pattern made of metal thin wires, and includes a plurality of first conductive patterns that extend in a first direction alternating with first non-conductive patterns. Each first conductive pattern includes break parts in portions other than intersection parts of the thin metal wires. The conductive component further includes a second electrode pattern made of thin metal wires, and includes a plurality of second conductive patterns that extend in a second direction orthogonal to the first direction and alternating with second non-conductive patterns. Each second conductive pattern includes break parts in portions other than intersection parts of thin metal wires.

Abstract: A high-frequency circuit board includes a first circuit structure, a second circuit structure, and a dielectric layer formed on the second circuit structure. The first circuit structure includes a first substrate layer and at least one first circuit layer. The at least one first circuit layer is formed on at least one surface of the first substrate layer. At least one receiving cavity is defined in the first substrate layer. A second circuit structure is embedded in the receiving cavity. The second circuit structure includes a second substrate layer, at least one second circuit layer embedded in the second substrate layer, and a plurality of support columns formed on the second substrate layer. A portion of the dielectric layer is filled into gaps between an inner wall of the receiving cavity and the second circuit structure. The support columns are embedded in the dielectric layer.

Abstract: An object of the present invention is to provide a lead wire having a conductor that is hardly pulled out from the lead wire during the peeling process or the like while being formed of carbon fibers. In the present invention, a belt-shaped conductor formed of a plurality of carbon fibers are included in a lead wire having a circular cross section.

Abstract: A composite circuit board includes an insulation layer, an inner circuit layer, a first conductive layer and a second conductive layer embedded in the insulation layer, a third conductive layer and a fourth conductive layer formed on opposite surfaces of the insulation layer. The third conductive layer electrically connects with the first conductive layer. The fourth conductive layer electrically connects with the second conductive layer. The inner circuit layer is in a middle portion of the insulation layer. The first conductive layer and the second conductive layer respectively forms on opposite sides of the inner circuit layer. The insulation layer forms a plurality of first through holes between the first conductive layer and the inner circuit layer, a plurality of second through holes between the second conductive layer and the inner circuit layer.

Abstract: A method for manufacturing connection structure, the method includes arranging a first composite on a first surface of a first member where a first electrode is located and arranging conductive particles on the first electrode, arranging a second composite on a region other than the first electrode of the first surface, arranging the first surface and a second surface of a second member where a second electrode is located, so that the first electrode and the second electrode are opposed to each other, pressing the first member and the second member, and curing the first composite and the second composite.

Abstract: An interposer includes an insulating element body, a wiring electrode inside the element body, a signal terminal electrode at the top surface of the element body and connected to a flat cable with a conductive bonding material interposed therebetween, and a ground terminal electrode. A through-hole penetrates through the element body to allow a bar-shaped metal fixing member to be inserted. A metal fixing member connecting electrode to be electrically connected to a metal fixing member is provided at at least one of the top surface of the element body and an inner wall of the through-hole. Predetermined signal terminal electrodes are electrically connected by the wiring electrode. The ground terminal electrode and the metal fixing member connecting electrode are electrically connected.

Abstract: A method of the present invention includes preparing a substrate having a surface on which a electrode pad is formed, forming a resist layer on the substrate, the resist layer having an opening on the electrode pad, filling conductive paste in the opening of the resist layer; sintering the conductive paste in the opening to form a conductive layer which covers a side wall of the resist layer and a surface of the electrode pad in the opening, a space on the conductive layer leading to the upper end of the opening being formed, filling solder in the space on the conductive layer and removing the resist layer.

Abstract: An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers. Each respective conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance.

Abstract: The present disclosure relates to a PCB laminated structure, including a first substrate; a second substrate disposed to overlap with the first substrate on the top and bottom; and an interposer assembly provided between the first substrate and the second substrate to allow electromagnetic connection between the first and second substrates, wherein the interposer assembly includes a housing configured to form a closed region along a top surface circumference of the first substrate and a bottom surface circumference of the second substrate to support the first and second substrates; a signal via connected to the first and second substrates, respectively, to transmit electromagnetic signals between the first substrate and the second substrate; and a ground via connected to the housing to serve as a ground, and spaced a set distance from the signal via at one side of the signal via.

Abstract: A printed circuit board includes additional stitching vias placed at strategic location within a connection matrix, which provides additional isolation and further accommodates high-speed communication capabilities. The stitching vias have a variable length or depth, depending on related structures within the circuit board, so as to avoid any interference with underlining escape routing, or alternative signal transmission structures. More specifically, these stitching vias help to eliminate cross-talk in the via field caused by the close proximity of signal carrying structures. Further, differential signal communication is better accommodated based upon this reduction in cross-talk.

Abstract: A flexible circuit board, and an optical transceiver assembly and an optical module that have such flexible circuit board. The flexible circuit board includes a substrate body, a transmission metal layer formed on at least one surface of the substrate body, a strengthening layer formed on the transmission metal layer, and a surface metal layer formed on a portion of an outer surface of the strengthening layer. The surface metal layer constitutes a securing portion for securing and connecting to an external element. A portion of the flexible circuit board that is not covered by the surface metal layer constitutes a connecting portion that connects to the securing portion. The surface metal layer is electrically connected to the transmission metal layer.

Abstract: An electronic component 100 includes: a circuit board module 104 which is composed of a plurality of layers, and in which a primary circuit 120 and secondary circuits 122, 124 are each formed using wring patterns of a first layer L1 to an eighth layer L8; and a magnetic core 106 which magnetically couples the primary circuit 120 and the secondary circuits 122, 124. The circuit board module 104 includes: cutout portions 104b which are formed in a cutout shape from side edge portions toward an inner side and which position the magnetic core 106 at a predetermined attachment position in a state of housing the magnetic core 106; and widened portions 104c which continue from the cutout portions 104b and are formed in a cutout shape from the side edge portions toward the inner side of the circuit board module 104, and which are formed on sides of the magnetic core 106 so as to be larger than a width W1 for housing of the cutout portions 104b.

Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.

Abstract: A transmission cable to reduce radiated electromagnetic radiation includes a first conductor with current flowing in a positive direction, a second conductor with a current flowing in a negative direction, where the negative direction is opposite the positive direction and the current in the first conductor equal to the current in the second conductor, a third conductor with current flowing in the positive direction and a fourth conductor with a current flowing in the negative direction. The current in the third conductor is equal to the current in the fourth conductor. The first conductor, the second conductor, the third conductor, and the fourth conductor are arranged in a symmetrical square pattern and the conductors are each on a corner of the square pattern. The first conductor is opposite the third conductor and adjacent to the second conductor and the fourth conductor.