Patents Examined by Tremesha S Willis
  • Flexible printed circuit board and corresponding secured connection method
    Patent number: 10561024
    Abstract: A flexible printed circuit board is proposed. The flexible printed circuit board includes at least one soldering element possessing a soldering face, accessible from a first face of the flexible printed circuit board, and a heating face, accessible from a second face of the flexible printed circuit board. Such a flexible printed circuit board includes a main part including the soldering element, and at least one foldable part, extending from the main part and being configured to pass: from a non-folded state, in which the at least one foldable part does not cover the heating face of the at least one soldering element; to a folded state in which the at least one foldable part covers the heating face of the at least one soldering element.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: February 11, 2020
    Assignee: INGENICO GROUP
    Inventors: Eric Philibert, Richard Allirot
  • Circuit board and method for manufacturing the same
    Patent number: 10555420
    Abstract: A method of manufacturing a circuit board includes: a single-sided copper-clad base is provided; a plurality of grooves are defined in the base facing away from the copper-clad side for receiving electronic elements, a depth of each of the grooves is equal to a thickness of the corresponding electronic element; the electronic elements are fixed into their respective grooves; a plurality of holes are defined in the laminating member to expose the electrodes of the electronic elements; an electroplated layer is formed on the surface of the embedded body, the electroplated layer is electrically connected with the electrodes of the electronic elements. A circuit board made by the method is also provided.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: February 4, 2020
    Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventors: Han-Pei Huang, Yong-Quan Yang
  • Bendable display device
    Patent number: 10551877
    Abstract: A display device includes a substrate having a first area, a second area, and a bending area disposed between the first area and the second area. An inner wiring is disposed in the first area. An outer wiring is disposed in the second area. An interlayer insulating layer covers the inner wiring and the outer wiring, and includes a first contact hole. A conductive layer is disposed on the interlayer insulating layer, and is connected to the inner wiring or the outer wiring through the first contact hole. An inorganic protective layer covers at least a portion of the conductive layer and includes an inorganic insulating material.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: February 4, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Hyungjun Park, Wonkyu Kwak
  • Method of forming a solder bump structure
    Patent number: 10553553
    Abstract: A method of the present invention includes preparing a substrate having a surface on which a electrode pad is formed, forming a resist layer on the substrate, the resist layer having an opening on the electrode pad, filling conductive paste in the opening of the resist layer; sintering the conductive paste in the opening to form a conductive layer which covers a side wall of the resist layer and a surface of the electrode pad in the opening, a space on the conductive layer leading to the upper end of the opening being formed, filling solder in the space on the conductive layer and removing the resist layer.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: February 4, 2020
    Assignee: International Business Machines Corporation
    Inventors: Toyohiro Aoki, Takashi Hisada, Eiji I. Nakamura
  • Stress relaxation substrate and textile type device
    Patent number: 10548219
    Abstract: The present invention provides a stress relaxation substrate for relaxing stress generated due to differences in the hardness of a circuit substrate and a cloth body. This stress relaxation substrate is disposed between a cloth body and a circuit board having a wiring, wherein the stress relaxation substrate includes a stress relaxation layer harder than the cloth body, and softer than the circuit board, an adhesive layer provided on one surface of the stress relaxation layer, and a conductive portion provided on the stress relaxation layer to be formed between a first surface and a second surface.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: January 28, 2020
    Assignee: JAPAN SCIENCE AND TECHNOLOGY AGENCY
    Inventors: Masao Nakajima, Ichiro Amimori, Osamu Sawanobori, Takao Someya
  • Multilayer stack with enhanced conductivity and stability
    Patent number: 10541065
    Abstract: An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers. Each respective conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: January 21, 2020
    Assignee: The Boeing Company
    Inventors: Patrick John Kinlen, Matthew Flack, Eric Alan Bruton
  • Multi-core cable for vehicle
    Patent number: 10538210
    Abstract: A multi-core cable for vehicle includes two power wires, two signal wires, two electric wires, and a sheath. The two power wires have the same size and are made of the same material. The two signal wires have the same size and are made of the same material, and a pair of the two signal wires is twisted and is configured a twisted pair of signal wires. The two electric wires have the same size and are made of the same material, and a pair of the electric wires is twisted and is configured as a twisted pair of electric wires. The two power wires, the twisted pair of signal wires and the twisted pair of electric wires are stranded.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: January 21, 2020
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Takaya Kohori, Hiroyuki Okawa
  • Process for fabricating printed circuit assembly and printed circuit assembly thereof
    Patent number: 10537024
    Abstract: A process for fabricating a printed circuit assembly is presented. The process includes providing a first base substrate having a first surface and a second surface opposite to the first surface; providing a flexible circuit layer including a first region having a first set of signal traces and a second region having a second set of signal traces, wherein the first region and the second region are separated by a first intermediate region; disposing the first region of the flexible circuit layer on the first surface of the first base substrate; bending the flexible circuit layer at the first intermediate region to surround a thickness side of the first base substrate; and disposing the second region of the flexible circuit layer on the second surface of the first base substrate. A printed circuit assembly is also presented.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: January 14, 2020
    Assignee: General Electric Company
    Inventor: Joseph Alfred Iannotti
  • Display apparatus
    Patent number: 10522785
    Abstract: A display apparatus includes a substrate having a bending area between a first area and a second area, wherein the substrate is bent in the bending area, a display portion on an upper surface of the substrate and positioned in the first area, and a protective film on a lower surface of the substrate and including a protective film base and an adhesive layer. The protective film base includes a plurality of cavities.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: December 31, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Hyojin Kim, Yoongyeong Bae, Ilseob Yoon, Seongchae Jeong, Inae Han, Gyoowan Han
  • Circuit board
    Patent number: 10524353
    Abstract: To enhance the isolation between signal lines for transmitting high-frequency signals included in a circuit board. A circuit board includes a plurality of signal lines for transmitting high-frequency signals, a ground electrode positioned between the plurality of signal lines and spaced apart from each of the plurality of signal lines, and a plurality of via conductors connected to the ground electrode. When the circuit board is seen in plan view, the ground electrode has a protruded and recessed area in at least a section of an outer edge thereof, the protruded and recessed area outwardly protruded and inwardly recessed. The plurality of via conductors is positioned in the protruded and recessed area so as to match with a protruded and recessed shape of the protruded and recessed area.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: December 31, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takeshi Kogure
  • Security apparatus
    Patent number: 10520985
    Abstract: A security apparatus for securing a portable electronic device to an immovable object includes a locking head having a base and a plurality of engagement portions extending from the base. The plurality of engagement portions is configured to be inserted into an aperture of the portable electronic device. The locking head also includes a linear portion positioned between the plurality of engagement portions and extending from the base. The linear portion is twistable about its length to move the plurality of engagement portions radially outward. The security apparatus further includes a security device attached to the locking head and configured to engage the immovable object.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: December 31, 2019
    Assignee: ACCO Brands Corporation
    Inventors: John Hung, Ryan White, Guillermo Andres, David Thomas Dobson, Jacque Gagne
  • Via fill substrate, production method therefor, and precursor therefor
    Patent number: 10517178
    Abstract: A method for producing a via-filled substrate includes a metal film forming step of forming a metal film containing an active metal on a hole part wall surface of an insulating substrate having a hole part, a filling step of filling a conductor paste having a volume change rate before and after firing of ?10 to 20% in the hole part in which the metal film is formed, and a firing step of firing the insulating substrate in which the conductor paste is filled.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: December 24, 2019
    Assignee: Mitsuboshi Belting Ltd.
    Inventors: Osamu Mamezaki, Yoko Hayashi
  • High frequency circuit
    Patent number: 10512153
    Abstract: A printed wiring board includes conductor layers, a core layer having an opening, and a build-up layer. A high frequency device placed within the opening is installed such that a mirror surface is thermally connected to a conductor layer for heat dissipation facing the opening from a lower surface side of the core layer, and terminals on the terminal surface are electrically connected to conductor layers formed on an upper surface side of the core layer.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: December 17, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hidenori Ishibashi, Kiyoshi Ishida, Eigo Kuwata, Yukinobu Tarui, Hideharu Yoshioka, Hiroyuki Aoyama, Masaomi Tsuru
  • Electronic device, thin film transistor, array substrate and manufacturing method thereof
    Patent number: 10510558
    Abstract: Disclosed are an electronic device and the manufacturing method thereof, a manufacturing method of a thin film transistor, and an array substrate and manufacturing method thereof. The manufacturing method of an electronic device includes: forming a metallic structure on a base substrate; forming an oxygen-free insulating layer on the metallic structure and the base substrate; and forming an insulating protective layer on the oxygen-free insulating layer. The manufacturing method of the electronic device protects a metallic structure by forming an oxygen-free insulating layer, not containing oxygen elements, on the metallic structure, and hence prevents the metallic structure from being oxidized.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: December 17, 2019
    Assignee: BOE Technology Group Co., Ltd.
    Inventor: Meili Wang
  • Glazing equipped with an electrically conductive device possessing an improved resistance to temperature cycling tests
    Patent number: 10512169
    Abstract: A glazing includes at least one substrate, one portion of which includes an electrically conductive element, the conductive element including a connector made of chromium-containing steel, which connector is soldered with a solder based on tin, silver and copper to an electrically conductive track, wherein the electrically conductive track, which is formed by fritting a silver paste including a mixture of silver powder and glass frit, has a resistivity measured at 25° C. lower than or equal to 3.5 ??·cm and a porosity level lower than 20%, the porosity level being measured by scanning electron microscopy from a cross section through the portion of the substrate including the electrically conductive track and having been polished beforehand by ion milling.
    Type: Grant
    Filed: December 8, 2016
    Date of Patent: December 17, 2019
    Assignee: SAINT-GOBAIN GLASS FRANCE
    Inventors: Katja Werner, Bernhard Reul, Klaus Schmalbuch, Camille Dassonville, Clément Briquet, Juliette Jamart
  • Mounting structure and multilayer capacitor built-in substrate
    Patent number: 10510489
    Abstract: A mounting structure includes a circuit board including one principal surface on which a multilayer capacitor is mounted. The circuit board includes a first insulating layer, and a second insulating layer having a Young's modulus smaller than that of the first insulating layer. The second insulating layer is closer to the one principal surface than the first insulating layer. A multilayer capacitor built-in substrate includes a circuit board, a multilayer capacitor on one principal surface of the circuit board, and a resin layer on the one principal surface of the circuit board and embedding the multilayer capacitor. The circuit board includes a first insulating layer, and a second insulating layer having a Young's modulus smaller than that of the first insulating layer. The second insulating layer is closer to the one principal surface than the first insulating layer.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: December 17, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Tadateru Yamada, Isamu Fujimoto, Kazuo Hattori, Masaru Takahashi
  • Wristwatch with flexible circuit board installed through band portion
    Patent number: 10503121
    Abstract: There is provided an electronic device including: a first segment and a second segment linked to each other in a rotationally movable manner; a flexible circuit board installed throughout the first segment and the second segment in interiors of the first segment and the second segment; a loosening portion formed by the flexible circuit board being pushed out while being bent in the second segment; and a support unit configured to maintain a direction of pushing-out of the loosening portion to a fixed direction.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: December 10, 2019
    Assignee: SONY CORPORATION
    Inventors: Kentaro Matsunaga, Tatsuhito Aono
  • Electronics board mounting system
    Patent number: 10496137
    Abstract: Apparatuses and associated methods for mounting PCBs and other electronics boards in portable medical equipment and/or other portable and non-portable electronic devices are disclosed herein. In some embodiments, the technology disclosed herein can provide PCB mounting systems that isolate the PCB from detrimental shock, vibration, and/or strain, while also providing electrical ground paths that greatly reduce EMI and other electrical disturbances. Some embodiments of the mounting systems described herein include both elastomeric (e.g., rubber) components and resilient metallic grounding members that, when assembled together, provide favorable shock mounting as well as robust electrical grounding without the inconvenience of using separate shock mounts, grounding straps, etc.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: December 3, 2019
    Assignee: FUJIFILM SONOSITE, INC.
    Inventor: Ken Dickenson
  • Anisotropic conductive film and method for manufacturing the same
    Patent number: 10494549
    Abstract: An anisotropic conductive film (ACF) including a base film, a support unit on the base film, the support unit defining at least one opening, at least one conductive particle in the opening, and an adhesive layer on the support unit and the conductive particle.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: December 3, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Minseok Kim, Yeonil Kang, Sunwoong Kim, Youngmin Cho, Yunhwan Jo
  • Touch panel
    Patent number: 10492295
    Abstract: A conductive component includes: a first electrode pattern which is made of metal thin wires, the first electrode pattern including a plurality of first conductive patterns that extend in a first direction. Each first conductive pattern includes, at least, inside thereof, a sub-nonconduction pattern that is electrically separated from the first conductive pattern. An area A of each first conductive pattern and an area B of each sub-nonconduction patterns satisfy a relation of 5%<B/(A+B)<97%. The conductive component may be included in a conductive sheet and a touch panel to provide a high detection accuracy.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: November 26, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Hiroshige Nakamura, Tadashi Kuriki