Patents Examined by Tu Hoang
  • Patent number: 7224258
    Abstract: The present invention is directed to a thick film patterned resistor on a substrate and to a method of forming it. The method involves providing a substrate with opposed surfaces, where one surface is coated with a layer of a resistor composition. A photoresist is applied over the layer of the resistor composition, and a desired pattern in the photoresist is formed, where the pattern leaves certain regions of the resistor composition layer uncovered by the photoresist. The resistor composition layer which is uncovered by the photoresist is etched under conditions effective to leave a mass of loosely bound resistor particles at regions of the resistor composition which are not covered by photoresist. The mass of resistor particles is then removed from the substrate to produce a thick film patterned resistor on the substrate.
    Type: Grant
    Filed: September 27, 2004
    Date of Patent: May 29, 2007
    Assignee: OhmCraft, Inc.
    Inventors: Timothy S. Barge, Franklyn M. Collins
  • Patent number: 7224257
    Abstract: A physical quantity sensing element according to the invention includes an insulating layer and a sensing layer. The sensing layer is configured to generate an electrical signal as a function of a physical quantity applied thereto and has a surface that includes a first and a second area. The first area is completely covered with the insulating layer so that the physical quantity is to be applied to both the insulating layer and the sensing layer through the first area; the second area is exposed to an application direction of the physical quantity without being covered with the insulating layer and being subject to application of the physical quantity. With such a structure, easy and reliable electrical connection of the physical quantity sensing element with external devices and circuits is ensured. In addition, several practical methods of fabricating the physical quantity sensing element according to the invention are also provided.
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: May 29, 2007
    Assignee: Denso Corporation
    Inventor: Kenji Morikawa
  • Patent number: 7221253
    Abstract: A fusible resistor and method of fabricating the same is provided. The fusible resistor has a very low resistance of 20 to 470 m?. by depositing thin films as a fusible element made of a material with low resistivity such as copper having a temperature coefficient of over 2,000 ppm/° C. The fusible resistor comprises a resistor body, a fusible element layer formed to surround the resistor body, caps formed to surround ends of the fusible element layer, lead wires attached to the caps, and an insulating layer for insulating the fusible element layer and the caps from outside. The thus-fabricated fusible resistor performs all functions of a use without generating excessive heat.
    Type: Grant
    Filed: July 9, 2002
    Date of Patent: May 22, 2007
    Assignee: Smart Electronics Inc.
    Inventors: Young Sun Kim, Doo Won Kang, Gyu Jin Ahn, Jin Seok Noh
  • Patent number: 7221254
    Abstract: A resistor, including a resistive element made of a metal plate, has a low resistance resulting from connection terminal electrodes formed on both ends of the lower surface of the resistive element. The object thereof is to achieve weight reduction and lower costs by reducing the height of the resistor. To achieve the above object, the ends of the lower surface of the resistive element are provided with recesses for accommodating the connection terminal electrodes, while at least the intermediate area of the lower surface of the resistive element between the connection terminal electrodes is covered with an insulator. Alternatively, a recess may be formed in the middle of the lower surface of the resistive element for using the ends of the lower surface as a pair of connection terminal electrodes, the recess being internally covered with an insulator.
    Type: Grant
    Filed: June 12, 2003
    Date of Patent: May 22, 2007
    Assignee: Rohm Co., Ltd.
    Inventor: Torayuki Tsukada
  • Patent number: 7218201
    Abstract: A high-voltage resistor element which is superior to heat resistance, dielectric breakdown strength, vibration resistance and durability performance, and is advantageous to maintenance, inspection, adjustment, replacement and repair, is made up of: a cylindrical outer tube made of metal; a resistive heat-generating wire in a coiled shape tensionally extending between inner ends of electrode rods inserted respectively from both ends of the outer tube; an insulating material filing up a space between the resistive heat-generating wire with the electrode rods and the internal surface of the outer tube and fired; and insulating sleeves extractably encasing and anchored in the portions adjacent to the both ends of the outer tube penetratingly bridging between arrangement boards.
    Type: Grant
    Filed: December 18, 2003
    Date of Patent: May 15, 2007
    Assignee: Kouken Company, Limited
    Inventor: Kesafumi Matsumoto
  • Patent number: 7215236
    Abstract: An electrical component having a base body includes a layer stack of mutually overlapping, electrically conductive electrode layers that are separated from one another by electrically conductive ceramic layers. The electrically conductive ceramic layers are composed of a ceramic whose specific electrical resistance exhibits a negative temperature coefficient. The electrically conductive ceramic layers are produced of ceramic green films that are sintered in common with the electrode layers, and outside electrodes that are electrically conductively connected to the electrode layers are arranged at two opposite outside surfaces of the base body. A method for the manufacture of the component and to the employment of the component is also provided.
    Type: Grant
    Filed: April 25, 2001
    Date of Patent: May 8, 2007
    Assignee: EPCOS AG
    Inventors: Ingrid Rosc, legal representative, Berrit Ines Rosc, legal representative, Jördis Brit Rosc, legal representative, Franz Schrank, Gerald Kloiber, Friedrich Rosc, deceased
  • Patent number: 7215235
    Abstract: A conductive substrate with a resistance layer comprising a substantially flat high conductivity substrate roughening treated on its surface by a resistance component and provided with a resistance layer by the resistance component so as to enable the interface between the high conductivity substrate and resistance component layer to be substantially flattened, enable acquisition of a thin film resistance layer with a stable resistance after dissolving away the high conductivity substrate, and able to maintain the peel strength with the insulating support, and a resistance board using the same.
    Type: Grant
    Filed: April 8, 2004
    Date of Patent: May 8, 2007
    Assignee: Furukawa Circuit Foil Co., Ltd
    Inventors: Akira Matsuda, Yuuji Suzuki, Hideo Otsuka, Yuuki Kikuchi, Sadao Matsumoto
  • Patent number: 7212096
    Abstract: A pressure sensor header for a pressure transducer includes a header shell having a sensor cavity formed therein, a sensor element disposed in the sensor cavity, a fluid medium disposed in the sensor cavity, an isolation diaphragm closing the sensor cavity, and a joining arrangement disposed at an interface of the isolation diaphragm and the header shell, the joining arrangement joining the isolation diaphragm with the header shell. The isolation diaphragm is an integral unit comprising a thin membrane surrounded by a thicker outer ring. The joining arrangement has a recessed female joining element formed in one of the outer ring of the isolation diaphragm and the header shell, and a protruding male joining element formed on the other one of the outer ring of the isolation diaphragm and the header shell, the male joining element received in the female joining element.
    Type: Grant
    Filed: June 14, 2004
    Date of Patent: May 1, 2007
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Adam Kane
  • Patent number: 7209028
    Abstract: A position sensor comprises a resistive element positionable on a first surface. A pair of leads are on the resistive element, the pair of leads adapted to supply a first voltage, such as by being grounded. An intermediate lead is positioned on the resistive element between the pair of leads, the intermediate lead being adapted to provide a second voltage. A contact element is positionable on a second surface, the contact element adapted to contact at least a portion of the resistive element to detect a voltage at a contact position, the detected voltage being related to the position or movement of the second surface relative to the first surface. In another version, a position sensor comprises a resistive element comprising first and second resistive strips. A plurality of leads are positioned on each resistive strip to provide a voltage to each resistive strip.
    Type: Grant
    Filed: March 14, 2005
    Date of Patent: April 24, 2007
    Assignee: Immersion Corporation
    Inventors: Allen R. Boronkay, Bruce M. Schena, Christopher J. Hasser
  • Patent number: 7205880
    Abstract: A trimmer resistance component of the present invention has a trimmer resistor constructed of a p-type diffusion layer formed on the surface of an n-type epitaxial layer. A first electrode is connected to a portion located on one end side of this trimmer resistor, while a first connection portion, a second connection portion and a third connection portion of the second electrode are connected to portions located on the other end side. By cutting a portion of the first connection portion and a portion of the second connection portion by laser trimming, a resistance value between the first electrode and the second electrode can be trimmed without changing a parasitic capacitance between the trimmer resistor and the n-type epitaxial layer.
    Type: Grant
    Filed: November 23, 2004
    Date of Patent: April 17, 2007
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Naoki Fukunaga
  • Patent number: 7202771
    Abstract: Two sensor units are formed from magnetoresistive material. Elements of the first sensor unit have a total anisotropy field in a first direction. Elements of the second sensor unit have a total anisotropy field in a second direction. An integral coil sets a direction of magnetization in the elements of the first and second sensor units. An output of the first sensor unit is representative of magnetic field components perpendicular to the first direction and an output of the second sensor is representative of magnetic field components perpendicular to the second direction.
    Type: Grant
    Filed: March 8, 2006
    Date of Patent: April 10, 2007
    Assignee: Honeywell International, Inc.
    Inventor: Michael J. Bohlinger
  • Patent number: 7202770
    Abstract: The present invention provides overvoltage circuit protection. Specifically, the present invention provides a voltage variable material (“VVM”) that includes an insulative binder that is formulated to intrinsically adhere to conductive and nonconductive surfaces. The binder and thus the VVM is self-curable and may be applied to an application in the form of an ink, which dries in a final form for use. The binder eliminates the need to place the VVM in a separate device or for separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid (FR-4) laminate, a polyimide or a polymer. The VVM can also be directly applied to different types of substrates that are placed inside a device.
    Type: Grant
    Filed: April 8, 2003
    Date of Patent: April 10, 2007
    Assignee: Littelfuse, Inc.
    Inventors: Edwin James Harris, Scott Davidson, David Perry, Steven J. Whitney
  • Patent number: 7199336
    Abstract: A protection structure of a ceramic resistor heating module, and more particularly a protection structure of a heating module, which utilizes a ceramic resistor having a positive temperature coefficient and is consisted of cooling fins, includes insulation layers that are heat-insulated. Using the insulation layers, electricity and external hazardous substances such as acids, alkalis and salt are shielded to accomplish all-round protection.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: April 3, 2007
    Inventor: Chia-Hsiung Wu
  • Patent number: 7197061
    Abstract: A molten material can be heated, melted and directly solidified in a single vessel. Induction heating and melting of the molten material is achieved by magnetically coupling the field produced by current flow in a plurality of induction coils surrounding the vessel with either the molten material in the vessel, or a susceptor surrounding molten material in the vessel. Current flow is selectively removed from the plurality of induction coils, and a cooling medium surrounding the vessel, such as water flowing through hollow induction coils, solidifies the molten metal into a highly purified crystalline solid.
    Type: Grant
    Filed: April 14, 2004
    Date of Patent: March 27, 2007
    Assignee: Inductotherm Corp.
    Inventors: Oleg S. Fishman, Joseph T. Belsh, Bernard M. Raffner, Prabhu N. Satyen
  • Patent number: 7193499
    Abstract: A chip resistor includes a resistor element in the form of a chip, and at least two electrodes formed on the resistor element. The resistor element includes an upper surface, a lower surface, and two end surfaces extending between the upper and the lower surfaces and spaced from each other. The two electrodes are provided on the lower surface of the resistor element. Each of the end surfaces of the resistor element is formed with a conductor film integrally connected to a corresponding one of the electrodes. The conductor film is made of copper, for example, and is higher in solder-wettability than the resistor element.
    Type: Grant
    Filed: April 27, 2004
    Date of Patent: March 20, 2007
    Assignee: Rohm Co., Ltd.
    Inventor: Torayuki Tsukada
  • Patent number: 7193500
    Abstract: An integrated circuit includes a bilayer thin film resistor in which the lower layer is a seed layer that controls the crystal structure of the upper layer. The thickness of the lower layer and the thickness of the upper layer may be chosen to form a resistor with a TCR having a design value.
    Type: Grant
    Filed: September 20, 2004
    Date of Patent: March 20, 2007
    Assignee: International Business Machines Corporation
    Inventors: Anil K. Chinthakindi, Anita Madan, Kenneth J. Stein, Kwong Hon Wong
  • Patent number: 7193498
    Abstract: Temperature sensors are produced by first producing temperature sensing elements each having electrodes on its mutually oppositely facing main surfaces, next forming a lead frame comprising a linearly elongated base part and a plurality of pairs of planar lead parts extending perpendicularly from said base part, twisting each of these planar lead parts such that each of the pairs has top end parts which face each other with a gap therebetween, inserting one of the temperature sensing elements between the mutually facing top end parts of each pair in the corresponding gap and electrically connecting the electrodes on the inserted temperature sensing element individually to the top end parts of the corresponding pair, and cutting each of the planar lead parts from said base part to form lead terminals of specified lengths for the temperature sensors.
    Type: Grant
    Filed: May 22, 2006
    Date of Patent: March 20, 2007
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Tetsuya Kawamoto, Hideki Yamada, Hiroyuki Kobayashi, Minoru Shimada, Kingo Ohmura, Asami Wakabayashi
  • Patent number: 7190252
    Abstract: An electrical resistor is provided with a resistive element and terminations extending from opposite ends of the resistive element. The terminations are folded under the resistive element, with a thermally conductive and electrically insulative filler being sandwiched and bonded between the resistive element and the terminations. The terminations provide for mounting of the resistor to an electronic circuit assembly. The intimate bond between the resistive element, filler and terminations allow for enhanced dissipation of heat generated in the use of the resistive element, so as to produce a resistor which operates at a lower temperature, and improves component reliability.
    Type: Grant
    Filed: February 25, 2005
    Date of Patent: March 13, 2007
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Clark L. Smith, Thomas L. Veik, Todd L. Wyatt, Thomas L. Bertsch, Rodney Brune, William Mac Arthur
  • Patent number: 7190250
    Abstract: Environmental sensors and other bodies, together with associated lead wires, are mounted to a oxidizable substrate for high temperature applications by means of a reacted borosilicate mixture (RBM) that secures the body relative to the substrate via of an oxide interface formed between the RBM and substrate during a high temperature reaction process. An oxide interface is also formed with oxidizable bodies to provide further mounting strength. The RBM is a B2O3—SiO2 mixture, with the B2O3 portion a function of the reaction temperature and desired bonding strength and viscosity.
    Type: Grant
    Filed: February 8, 2005
    Date of Patent: March 13, 2007
    Assignee: Heetronix
    Inventor: James D. Parsons
  • Patent number: 7187264
    Abstract: A foil-type switching element comprises a first carrier foil and a second carrier foil arranged at a certain distance from each other by means of a spacer 10. The spacer 10 comprises at least one recess 12 defining an active area of the switching element. At least two electrodes and a layer of pressure sensitive material are arranged within the active area of the switching element between the first and second carrier foils in such a way that, in response to a pressure acting on the active area of the switching element, the first and second carrier foils are pressed together against the reaction force of the elastic carrier foils and an electrical contact is established between the at least two electrodes via the pressure sensitive material. The active area comprises an inner region 14 and a number of outer regions 18, the inner region having a generally convex shape and the outer regions extending outwardly from said inner region.
    Type: Grant
    Filed: February 20, 2003
    Date of Patent: March 6, 2007
    Assignee: IEE International Electronics & Engineering S.A.
    Inventors: Werner Bieck, Dries Chabach, Yves Decoster, Robert Ollett, Alain Schumacher