Patents Examined by Tuan T. Dinh
  • Patent number: 11221513
    Abstract: An electronic device includes display layers such as liquid crystal display layers and a backlight unit that provides illumination for the display layers. The backlight unit includes light-emitting diodes that emit light into the edge of a light guide film. To minimize the inactive area of the display, the light-emitting diodes are tightly spaced to approximate a line light source instead of point light sources. Color and/or luminance compensation layers are incorporated at various locations within the backlight structures to ensure that the backlight provided to the display layers is homogenous. A thin-film transistor layer of the display is coupled to a printed circuit board by a flexible printed circuit. The flexible printed circuit has additional solder mask layers to improve robustness, encapsulation, and traces with a varying pitch.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: January 11, 2022
    Assignee: Apple Inc.
    Inventors: Supriya Goyal, Yuxi Zhao, Xinsheng Chu, Chan Hyuk Park, Min Tao, Wenyong Zhu
  • Patent number: 11217131
    Abstract: The present disclosure relates to the field of circuit testing technologies and discloses a flexible circuit board and a test fixture. The flexible circuit board comprises: a flexible body which has a first crimping portion and an extension portion, the first crimping portion being used to be laminated with a second crimping portion of a substrate to be tested; a first electrically connected structure which is located on a first side of the flexible body, arranged on the first crimping portion, and used to be laminated with a second electrically connected structure on the second crimping portion; a support structure which is located on the first side of the flexible body and includes a first support portion and a second support portion; the first support portion is arranged on the extension portion and configured to support the extension portion in the laminating state.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: January 4, 2022
    Assignee: WUHAN TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventors: Huijian Xia, Ning Xu
  • Patent number: 11219122
    Abstract: A sensor unit includes a physical quantity sensor, a connecter to be coupled to the outside, a board on which the physical quantity sensor and the connecter are installed, and a container accommodating the board. The board is provided with a first region in which the connecter is installed, a second region in which the physical quantity sensor is installed, and a coupling region disposed between the first and second regions and having a sectional area S3 that is smaller than a sectional area S1 of the first region and a sectional area S2 of the second region in a sectional view as seen in a direction orthogonal to a direction in which the first region and the second region are arranged, and a region in the second region of the board on the coupling region side is attached to the container via a fixation member.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: January 4, 2022
    Inventors: Kenta Sato, Yasushi Yoshikawa
  • Patent number: 11217519
    Abstract: A flexible display panel and a display device are provided. The flexible display panel includes a bending region and a display region. The bending region includes a plurality of metal wirings; each metal wiring is in long strip shape and includes a metal strip; a plurality of openings are defined through the metal strip. In the width direction of the metal strip, a ratio of a minimum distance from a point of an edge of the one of the openings to a neighboring side of the metal strip to a minimum width of the metal strip ranges from 0.1 to 0.7. A wiring structure of the bending region can prevent a stress concentration of the bending region, enhance a strength during a bending process, and avoid a breakage of the metal wiring.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: January 4, 2022
    Inventor: Xuesi Qin
  • Patent number: 11206731
    Abstract: A communication module includes: a substrate; a supplementary substrate disposed to surround an electronic element mounted on a lower surface of the substrate; a molding material configured to seal an electronic element mounted on an upper surface of the substrate; and a shielding layer disposed on a side surface and an upper surface of the molding material, a side surface of the supplementary substrate, and a side surface of the substrate. The supplementary substrate includes: a plurality of first pads disposed on an upper surface of the supplementary substrate; a plurality of second pads disposed on a lower surface of the supplementary substrate; a plurality of vias connecting the plurality first pads to the plurality of second pads; and a ground pad disposed on the side surface of the supplementary substrate. The ground pad includes an extender connected to a corresponding first pad and a corresponding second pad.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: December 21, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Bo Hyun Seo
  • Patent number: 11187946
    Abstract: A display device includes: a display substrate including an upper surface, a lower surface facing the upper surface, and a side surface connected to the upper surface and the lower surface; a plurality of drivers disposed on the side surface of the display substrate; and a connection wiring film attached to the side surface of the display substrate, and electrically connecting the drivers.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: November 30, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Changsoo Lee, Byoungsun Na
  • Patent number: 11191198
    Abstract: A shield package is disclosed including: a package in which an electronic component is mounted on a substrate, the electronic component being sealed with sealing material; and a shield layer including a first layer and a second layer that are sequentially laminated on the package, in which the first layer made from a conductive resin composition having 100 parts by mass of a binder component, 400 parts by mass to 1800 parts by mass of metal particles, and 0.3 part by mass to 40 parts by mass of a curing agent, the metal particles include at least spherical metal particles and flaky metal particles, and the second layer made from a conductive resin composition containing a binder component, metal particles haying an average particle diameter of 10 nm to 500 nm, metal particles having an average particle diameter of 1 ?m to 50 ?m, and a radical polymerization initiator.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: November 30, 2021
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Hiroaki Umeda, Kazuhiro Matsuda, Hajime Nakazono, Hidetoshi Noguchi
  • Patent number: 11184975
    Abstract: According to one embodiment is a flexible circuit comprising a flexible base, a conductive polymer supported by the base, and an integrated circuit component having an elongated electrical contact, wherein the elongated electrical contact penetrates into the conductive polymer, thereby providing a robust electrical connection. According to methods of certain embodiments, the flexible circuit is manufactured using a molding process, where a conductive polymer is deposited into recesses in a mold, integrated circuit components are placed in contact with the conductive polymer, and a flexible polymer base is poured over the mold prior to curing. In an alternative embodiment, a multiple-layer flexible circuit is manufacturing using a plurality of molds.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: November 23, 2021
    Assignee: CARNEGIE MELLON UNIVERSITY
    Inventors: Alexandros Charalambides, Carmel Majidi
  • Patent number: 11177191
    Abstract: An independent loading mechanism for use with a CPU connector includes a metallic frame cooperating with a back plate module to sandwich a printed circuit board therebetween. A plurality of screw nut units are provided around the four corners of the frame. A plurality of hollow spacers are secured to the corresponding through holes of the frame so as to allow the corresponding screw nut units moveable relative to the frame along the vertical direction within a range larger than a thickness of the frame, thus avoiding improper interference between the screw nut units and the corresponding screw posts of the back plate module during sequential screwing.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: November 16, 2021
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Shan-Yong Cheng, Fang-Jwu Liao, Ting-Yao Hung
  • Patent number: 11178760
    Abstract: According to one embodiment, a printed circuit board includes a base substrate, a first pad located on the base substrate, a second pad located on the base substrate alongside the first pad with respect to a first direction X with a gap therebetween and a solder resist covering the base substrate and including a cavity portion in a position overlapping the first pad and the second pad, the solder resist including a first protruding portion projecting in a second direction crossing the first direction and a second protruding portion projecting in the second direction on an opposite side to the first protruding portion, and the first protruding portion and the second protruding portion each overlap the gap, an end of the first pad on a gap side, and an end of the second pad on a gap side.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: November 16, 2021
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
    Inventors: Kiyokazu Ishizaki, Nobuhiro Yamamoto
  • Patent number: 11178753
    Abstract: Bus bars are soldered to a wiring pattern of a printed board to which the bus bars are connected, and the bus bars are screwed to the printed board. Tips of bolts passing through holes in the bus bars and holes in the punted board may be tightened using nuts. The holes in the printed board may be electrically connected to the wiring pattern.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: November 16, 2021
    Assignee: SANYO Electric Co., Ltd.
    Inventors: Hideyuki Sasao, Takashi Imasato
  • Patent number: 11171126
    Abstract: Systems and devices for enabling the use of SIP subsystems to make a configurable system having a unique interconnecting scheme creates appropriate connections between the SIP components and/or subsystems such that desired characteristics and features for the configurable system are provided.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: November 9, 2021
    Assignee: OCTAVO SYSTEMS LLC
    Inventors: Masood Murtuza, Gene Alan Frantz, Neeraj Kumar Reddy Dantu
  • Patent number: 11166364
    Abstract: An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: November 2, 2021
    Assignee: TACTOTEK OY
    Inventors: Antti Keränen, Tomi Simula, Mikko Heikkinen, Jarmo Sääski, Pasi Raappana, Minna Pirkonen
  • Patent number: 11166391
    Abstract: An electronic module, more particularly a control module or sensor module for a motor vehicle transmission, has a circuit board having a first side and a second side facing away from the first side, electronic components arranged on the first side, and a casting compound arranged on the first side. The casting compound covers the electronic components. The circuit board has a through-hole connecting the first side to the second side. A sensor element covering the through-hole is arranged on the first side of the circuit board.
    Type: Grant
    Filed: May 14, 2018
    Date of Patent: November 2, 2021
    Assignee: Robert Bosch GmbH
    Inventor: Uwe Liskow
  • Patent number: 11166363
    Abstract: An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: November 2, 2021
    Assignee: TACTOTEK OY
    Inventors: Antti Keränen, Tomi Simula, Mikko Heikkinen, Jarmo Sääski, Pasi Raappana, Minna Pirkonen
  • Patent number: 11153967
    Abstract: A high-frequency module (1) includes a component (3a) mounted on an upper surface (2a) of a substrate (2), a second sealing resin layer (4) stacked on the upper surface (2a) of the substrate (2), a component (3b) mounted on a lower surface (2b) of the substrate (2), a first sealing resin layer (5) stacked on the lower surface (2b) of the substrate (2), and a first terminal assembly (6) and a second terminal assembly (7) that are mounted on the lower surface (2b) of the substrate (2). The first terminal assembly (6) is mounted on a four-corner portion of the substrate (2) and includes a connection conductor (6a) thicker than a connection conductor (7a) of the second terminal assembly (7).
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: October 19, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Shinichiro Banba
  • Patent number: 11116072
    Abstract: An apparatus is described. The apparatus includes a semiconductor chip having cross-talk noise cancellation circuitry disposed between a disturber trace and a trace to be protected from cross-talk noise emanating from the disturber trace. The trace is to be coupled to a receiver disposed on a different semiconductor chip.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: September 7, 2021
    Assignee: Intel Corporation
    Inventors: Jun Liao, Zhen Zhou, James A. McCall, Jong-Ru Guo, Xiang Li, Yunhui Chu, Zuoguo Wu
  • Patent number: 11114782
    Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: September 7, 2021
    Assignee: Unimicron Technology Corp.
    Inventors: Tzyy-Jang Tseng, Pei-Wei Wang, Ching-Ho Hsieh, Shao-Chien Lee, Kuo-Wei Li
  • Patent number: 11114372
    Abstract: An integrated circuit includes a main body having a top and a bottom; and upper pins placed on the top of the main body, and lower pins placed on the bottom of the main body, in which each of the upper pins has a first protruding portion protruding toward outside from a side or the top of the main body, and each of the lower pins has a second protruding portion protruding toward outside from the side or the bottom of the main body.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: September 7, 2021
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Jungjae Kim, Heejung Hong, Soondong Cho, Hyungjin Choe
  • Patent number: 11102882
    Abstract: A Printed Circuit Board (PCB) includes a via extending through at least one layer of the PCB. The PCB may also include a first catch pad connected to the via and located within a first metal layer of the PCB. The first catch pad may have a first size. The PCB may further include a second catch pad connected to the via and located within a second metal layer of the PCB. The second catch pad may have a second size greater than the first size. The second catch pad may overlap horizontally with a portion of a metallic feature in the first metal layer to obstruct light incident on a first side of the PCB from transmission to a second side of the PCB through a region of dielectric material near the via.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: August 24, 2021
    Assignee: Waymo LLC
    Inventors: Augusto Tazzoli, Blaise Gassend