Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.

Abstract: In a high-frequency module provided with a shield member between components, improvement in the degree of freedom in design such as arrangement of components or the like is achieved while preventing damage to a wiring board. A high-frequency module (1a) includes a multilayer wiring board (2), a plurality of components (3a) and (3b) mounted on an upper surface (20a) of the multilayer wiring board (2), and a shield member (5) for shielding between the component (3a) and the component (3b), in which the shield member (5) is formed in a flat plate shape, with a plurality of metal pins (5a) each stacked in a thickness direction of the sealing resin layer (4) such that a length direction is made to be substantially parallel to the upper surface (20a) of the multilayer wiring board (2), and a resin molded portion (5b) for fixing the metal pins (5a).

Abstract: Intraluminal ultrasound imaging device, systems and methods (e.g., method of fabricating the device) are provided. In some embodiments, the intraluminal ultrasound imaging device includes a flexible elongate member configured to be positioned within a body lumen of a patient, and an ultrasound scanner assembly disposed at a distal portion of the flexible elongate member and configured to obtain imaging data of the body lumen. The ultrasound scanner assembly includes a flexible substrate, a first under-bump metallization (UBM) layer over the flexible substrate, a first solder feature over the first UBM layer, and a first electronic component electrically connected to the first solder feature.

Abstract: A Printed Circuit Board (PCB) includes a via extending through at least one layer of the PCB. The PCB may also include a first catch pad connected to the via and located within a first metal layer of the PCB. The first catch pad may have a first size. The PCB may further include a second catch pad connected to the via and located within a second metal layer of the PCB. The second catch pad may have a second size greater than the first size. The second catch pad may overlap horizontally with a portion of a metallic feature in the first metal layer to obstruct light incident on a first side of the PCB from transmission to a second side of the PCB through a region of dielectric material near the via.

Abstract: An electrical device includes a housing part and a cover part, the cover part being connected to the housing part, in particular with the aid of screws, the cover part in particular covering an opening of the housing part. A first circuit board is connected to the cover part, and an elastically preloaded sheet-metal part, in particular an elastically preloaded tab section of a sheet-metal part, presses at least one heat-generating component, in particular a controllable semiconductor switch, in the direction of the cover part, in particular for the purpose of dissipating heat from the heat-generating component into the environment via the cover part.

Abstract: A process for conformally coating passive surface mount components soldered to a printed circuit substrate of a lidless flip-chip ball grid array package includes affixing a stiffener ring to the substrate before forming a conformal coating on the passive surface mount components. The stiffener ring is affixed to the substrate so that the plurality of passive surface mount components and the integrated circuit die are contained within an opening formed by the stiffener ring. After affixing the stiffener ring to the substrate, the conformal coating is formed on the passive surface mount components. The conformal coating extends over each of the passive surface mount components, around a periphery of each of the passive surface mount components, and under each of the passive surface mount components. A product made according to the process is also disclosed.

Abstract: A system board is provided that includes a connector. The connector includes a pinfield. The pinfield includes a set of differential signal conductors to correspond to pins of a set of differential signaling pairs; a set of one or more auxiliary signal conductors to carry auxiliary signals; and a plurality of thru-hole ground vias adjacent to a particular one of the auxiliary signal conductors in the set of auxiliary signal conductors.

Abstract: An electrical junction box including: bus bars; a circuit board of which one side opposes the bus bars; a conductive portion that is provided on the one side of the circuit board, and is exposed from the other side of the circuit board; an opening that is provided in parallel with the conductive portion in the circuit board, and from which a portion of the bus bars is exposed; a switching element that is arranged on the other side of the circuit board, and of which an input terminal or an output terminal is connected to the conductive portion; and a conductive piece that is arranged straddling a portion of the bus bars and the conductive portion.

Abstract: The present disclosure provides a foldable support, and a display device. The foldable support includes at least two metal layers, where at least one of the at least two metal layers is provided with a plurality of recessed portions at the at least one bending region; and a buffer structure located at at least one of the following positions: a position between two adjacent metal layers and a position in a plurality of the recessed portions of the at least one of the at least two metal layers.

Abstract: Method and apparatus for producing RFID transponders (400) arranged on a carrying substrate, comprising:providing a first substrate (100), the first substrate having at least one antenna element (101) arranged thereon, and preferably several antenna elements arranged sequentially thereon along a longitudinal extension of the first substrate, each antenna element being formed by an electrically conductive pattern; providing a second substrate (200), the second substrate (200) having at least one RFID strap, each RFID strap comprising an IC (202) and at least one contact pad (201) coupled to the IC, and preferably several RFID straps being arranged sequentially along a longitudinal extension of the second substrate; and electrically connecting an antenna element (101) on the first substrate to the at least one contact pad on the second substrate by bringing said first and second substrates together, thereby bringing said antenna element in mechanical contact with said at least one contact pad, and heating the c

Abstract: A voltage regulator module with a vertical layout structure includes a circuit board assembly, an electroplated region and a magnetic core assembly. The circuit board assembly includes a printed circuit board and at least one switch element. The printed circuit board includes a first surface, a second surface, a plurality of lateral surfaces, an accommodation space and a conductive structure. The switch element is disposed on the first surface. A conduction part is formed on the second surface. The conductive structure is perpendicular to the printed circuit board and disposed within the accommodation space. The electroplated region is formed on the corresponding lateral surface, arranged between the conduction part and the first surface, and electrically connected with the conduction part and the switch element. The magnetic core assembly is accommodated within the accommodation space. Consequently, an inductor is defined by the conductive structure and the magnetic core assembly collaboratively.

Abstract: An electronic device module includes: a substrate; a sealing portion disposed on the substrate; at least one electronic device mounted on the substrate and embedded in the sealing portion; and a roof wiring at least partially disposed on a surface of the sealing portion and electrically connecting the substrate to the at least one electronic device or electrically connecting electronic devices, among the at least one electronic device, to each other. The roof wiring includes: a surface wiring disposed on one surface of the sealing portion; and at least one post wiring connecting the surface wiring to the substrate or to the at least one electronic device, and wherein at least a portion of a circumferential surface of the at least one post wiring is bonded to the surface wiring.

Abstract: Electronic device fastening systems that enable one or more electronic devices to be reliably and quickly secured on a host board and electronic systems made of the same. In a specific exemplary embodiment, a retainer clip spans across the width of one or more electronic devices, engages with the board and snaps into place. The clip includes one or retaining posts such that when the clip engages the board, the one or more retaining posts align and engage with a predefined mounting feature of a corresponding one of the one or more electronic devices, thereby securing the electronic device in place to restrict horizontal, lateral, and vertical movement of the electronic device.

Abstract: An apparatus includes a substrate, one or more integrated circuit dies on the substrate, and a stiffener affixed to the substrate. One or more sections of the stiffener may includes a magnetic material. The apparatus further includes an inductive circuit element comprising one or more conductive structures wrapped around the magnetic material. In some examples where a first coil is wrapped around a first section of the stiffener, and a second coil is wrapped around a second section of the stiffener, current supplied to the first coil generates at the second coil a current that is further transmitted to the one or more semiconductor dies.

Abstract: An object of the present invention is to decrease the resistance of a power supply line, to suppress a voltage drop in the power supply line, and to prevent defective display. A connection terminal portion includes a plurality of connection terminals. The plurality of connection terminals is provided with a plurality of connection pads which is part of the connection terminal. The plurality of connection pads includes a first connection pad and a second connection pad having a line width different from that of the first connection pad. Pitches between the plurality of connection pads are equal to each other.

Abstract: A capacitor loop substrate assembly includes a substrate with a loop shape, one or more capacitors or other electronic components on the substrate, and an opening in the substrate to allow the capacitor loop substrate assembly to be coupled to an integrated circuit package, such as a package including a die. Interconnects and/or contacts for interconnects are formed in an integrated circuit package to couple the capacitor loop substrate assembly to the integrated circuit package.

Abstract: Disclosed herein are integrated circuit (IC) package supports and related apparatuses and methods. For example, in some embodiments, an IC package support may include a layer of dielectric material; a conductive pad at least partially on a top surface of the layer of dielectric material; and a layer of material on side surfaces of the conductive pad, wherein the layer of material does not extend onto the top surface of the layer of dielectric material. Other embodiments are also disclosed.

Abstract: A fabrication process for soft-matter printed circuit boards is disclosed in which traces of liquid-phase Ga—In eutectic (eGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically-aligned columns of eGaIn-coated ferromagnetic microspheres that are embedded within an interfacial elastomer layer.

Abstract: An inverter apparatus includes a main circuit substrate, an EMC filter substrate, a control substrate, and a panel. The main circuit substrate is configured to convert electric power and includes an output terminal through which the electric power is output from the inverter apparatus. The EMC filter substrate is provided on the main circuit substrate and configured to reduce propagation of electromagnetic noise. The EMC filter substrate includes a first input terminal through which the electric power is input to the inverter apparatus. The control substrate is provided on the EMC filter substrate so that the EMC filter substrate is sandwiched between the main circuit substrate and the control substrate. The control substrate is configured to control the main circuit substrate. The panel is provided on the control substrate so that the control substrate is sandwiched between the EMC filter substrate and the panel.

Abstract: A circuit module (100) includes: a substrate (10) including a plurality of inner conductors (2); a first electronic component arranged on one main surface (S1) of the substrate (10); a first resin layer (40) provided on the one main surface (S1) and configured to seal the first electronic component; a plurality of outer electrodes (B1) provided on another main surface (S2) of the substrate (10) and including a ground electrode; a conductor film (50) provided at least on an outer surface of the first resin layer (40) and a side surface (S3) of the substrate (10) and connected to the ground electrode with at least one of the plurality of inner conductors (2) interposed therebetween; and a resin film (60).