Abstract: The present invention detects contact bouncing in a contactor by measuring contact voltage fluctuations caused by the bouncing power delivery contacts controlled by the contactor. When these fluctuations are detected, a circuit causes a pull-in coil of the contactor to be temporarily re-energized to re-establish a higher magnetic field needed to pull and maintain the power delivery contacts into proper position, which eliminates the bouncing. Because of the high power required by the pull-in coil, the time that the pull-in coil is actuated is limited in order to avoid thermal damage to the coil or other electronic components. After the pull-in coil is activated to move the power delivery contacts into proper position, a lower magnetic field hold coil is instead energized to maintain the power delivery contacts in place.

Abstract: Disclosed herein is an electronic circuit module that includes a circuit board, an electronic component mounted on an upper surface of the circuit board, and a mold member that covers the upper and side surfaces of the circuit board. The lower area of the side surface of the circuit board is exposed so as not to be covered with the mold member.

Abstract: According to various embodiments, a power converter circuit is disclosed. The power converter circuit includes at least two vertically stacked printed circuit boards (PCBs) comprising a top PCB and a bottom PCB. The power converter circuit further includes at least one multiphase coupled inductor placed between the top PCB and the bottom PCB. The top PCB is coupled to the bottom PCB via at least one conductive winding of the multiphase coupled inductor. The power converter circuit further includes at least one circuit module placed above the top PCB and at least one power source placed below the bottom PCB. The multiphase coupled inductor is configured to deliver current vertically from the bottom PCB to the top PCB.

Abstract: An electric circuit board includes an insulating substrate, a metal plate, and a brazing material with which the insulating substrate and the metal plate are joined together. The metal plate has a side surface over which recessed portions are scattered. The side surface of the metal plate has lines in regions around the recessed portions. The metal plate is made of copper or a copper alloy. The brazing material has a side surface that is continuous with the side surface of the metal plate. The brazing material is a silver-copper brazing alloy. A ratio of copper on the side surface of the brazing material is higher than a copper component ratio of the silver-copper brazing alloy.

Abstract: The radio frequency module includes a mounting board, a first metal member, and a second metal member. The first metal member and the second metal member are disposed on the mounting board. The first metal member has a longitudinal direction along a first direction in plan view from a thickness direction of the mounting board. The second metal member has a longitudinal direction along a second direction in plan view from the thickness direction of the mounting board. The first or second metal member is placed between a first electronic component and a second electronic component. The first metal member has a first recessed portion. The second metal member has a through hole and a second recessed portion. The through hole passes through the second metal member in the direction intersecting with the second direction. The second recessed portion faces and is in contact with the first recessed portion.

Abstract: Memory devices may include a substrate supporting at least one semiconductor device thereon. The substrate may include an interface located proximate to an end of the substrate and sized, shaped, and configured to provide external electrical connection to the at least one semiconductor device. Hook-shaped engagement structures may be located proximate to, and laterally outward from, the interface, the engagement structures extending laterally beyond a longitudinal remainder of a lateral periphery of the substrate trailing the engagement structures. The end of the substrate may lack screw keep-outs. A carrier may include posts shaped, positioned, and configured to be positioned in throats of the hook-shaped engagement structures to secure the end of the substrate to the carrier. Sidewalls may extend longitudinally from a crossbar for placement along the remainder of the lateral periphery of the substrate.

Abstract: A method for manufacturing an electromagnetic shield housing for shielding an electronic component on a printed circuit board comprises providing a metallic lid with a shielding chamber at an underside for accommodating and covering the electronic component on the printed circuit board; filling the shielding chamber with an RF-absorber material; and removing RF-absorber material from the shielding chamber until the electronic component fits into the shielding chamber while a ceiling and lateral walls of the shielding chamber remain covered with RF-absorber material.

Abstract: A semiconductor storage device such as an SSD includes a pliable printed circuit board (PCB) having semiconductor memory devices mounted by solder balls on first and second opposed major surfaces. The memory devices are mounted so as to be staggered and/or partially overlapping with each other on the first and second surfaces of the PCB in at least one direction. The staggered arrangement allows the PCB to flex upon warping of the memory devices mounted on the PCB.

Abstract: An electronic device having a frame for coupling a plurality of thermal management devices to the printed circuit board is provided. The electronic device includes a first chip package mounted to the PCB and a second chip package mounted to the PCB. The frame is secured to the PCB, and the frame has a first aperture disposed over the first chip package and a second aperture disposed over the second chip package. The plurality of thermal management devices coupled to the frame includes a first thermal management device contacting an IC die of the first chip package through the first aperture and a second thermal management device contacting an IC die of the second chip package through the second aperture.

Abstract: A display device includes: a display module slid in a first direction; and a panel storage container including a guide rail guiding a sliding operation of the display module in the first direction. The display module is engaged with the guide rail in a second direction intersecting the first direction, and the guide rail includes: a first flat portion adjacent to an upper surface of the panel storage container; a second flat portion adjacent to a lower surface of the panel storage container; and a bent portion adjacent to a side surface of the panel storage container and connecting the first flat portion and the second flat portion to each other. The bent portion includes: a first bent portion bent at a first radius of curvature; and a second bent portion bent at a second radius of curvature greater than the first radius of curvature.

Abstract: A high-frequency module includes a module substrate having main surfaces, one or more module components disposed on the main surface, a resin member covering the main surface, and a metal shield layer covering a top surface of each of the resin member and the one or more module components, and set to ground potential. A sub-module component, which is one of the one or more module components, has a sub-module substrate having main surfaces, a first circuit component disposed on the main surface, one or more second circuit components disposed on the main surface, a resin member covering the main surface, and a side surface shield layer covering a side surface of each of the resin member and the sub-module substrate, and set to the ground potential. An end surface on a top surface side of the side surface shield layer contacts the metal shield layer.

Abstract: An electronic device mountable in an electrical motor and a method for manufacturing an electronic device mountable in an electrical motor are provided. The electronic device includes a printed circuit board with a hole for mounting a semiconductor package which includes an integrated magnetic sensing device, the semiconductor package including leads and reinforcement material. The semiconductor package is mounted in the hole with the leads soldered to the printed circuit board. A gap is present between the semiconductor package and the printed circuit board. The reinforcement material is at least covering part of the leads and at least part of the printed circuit board.

Abstract: A stacked electronic structure, including a substrate, wherein electronic devices are disposed on the substrate, and a molding body encapsulates the electronic devices, wherein a first thermal conductive layer is disposed on a first electronic device, and a second thermal conductive layer is disposed on a second electronic device, wherein a magnetic device comprising a magnetic body is disposed over a top surface of the molding body, wherein at least one third thermal conductive layer is disposed on the magnetic body, and the first thermal conductive layer and the second thermal conductive layer are respectively connected with the at least one third thermal conductive layer for dissipating heat.

Abstract: An electronic device is provided. The electronic device includes a substrate having an edge and a peripheral area adjacent to the edge, a first inorganic insulating layer disposed on the first substrate, an organic insulating layer disposed on the first inorganic insulating layer and including a recess in the peripheral area, and a second inorganic insulating layer disposed on the organic insulating layer and in the recess. In a top view, the recess extends in a first direction parallel to the edge of the substrate. In a cross-sectional view, the recess has a bottom portion adjacent to the substrate, and a width of the bottom portion of the recess is greater than a thickness of the organic insulating layer.

Abstract: An electronic fuse based-protection circuit system, including a plurality of electronic fuse based-protection circuits, where each electronic fuse based-protection circuit is electrically connected to a power supply and a load through an input terminal and an output terminal respectively and includes a sampling resistor, a MOSFET switch, and a logic control branch circuit. The sampling resistor is electrically connected to the input terminal and has a sampling terminal. The MOSFET switch is electrically connected to the sampling terminal and the output terminal. The logic control branch circuit obtains a sampling voltage of the sampling resistor between the input terminal and the sampling terminal and an on-off judging voltage by amplifying the sampling voltage. When the on-off judging voltage is greater than a reverse-bias voltage of the logic control branch circuit, an off signal is then transmitted to the MOSFET switch, to turn off the MOSFET switch.

Abstract: In order to relieve the stress on the substrates in a 3D stacked electronic assembly, a substrate frame is divided into a plurality of frame sections that are separated by spaces between the frame sections. These separations allow the substrates to expand/contract in response to temperature variations and other environmental conditions, and generally allow the substrates to move in one or more axial directions. The separations between the substrate portions are design-specific for each substrate design. The placement of IC packages on either side of the substrate is analyzed to identify areas of maximal warpage through physical measurements, physical model simulations, or using a trained neural network. The spaces in the substrate frame are then be placed next to or aligned with the areas of maximal warpage to reduce the stress on the substrate.

Abstract: A display panel includes a cover window, an ink layer formed with a multi-layer structure on a rear surface of the cover window and directly adhered to a middle frame, and an adhesive layer disposed on the rear surface of the cover window and overlapping with the ink layer, and at least one layer of the multi-layer structure of the ink layer includes a conductive material. An electric charge generated by the cover window is distributed to the middle frame via the ink layer and discharged by the middle frame to prevent a shift phenomenon, a green phenomenon, or both in the display panel.

Abstract: A system for power delivery network (“PDN”) isolation includes a multi-layer printed circuit board (“PCB”) in which a power distribution layer has a root conductive region and two or more branch conductive regions fanning out from the root conductive region. Each branch conductive region is insulated from other branch conductive regions by a non-conductive region. Each branch conductive region has at least one power delivery connection. Each of various electronic circuits mounted on the PCB and sharing the same PDN may be shorted to one of the branch conductive regions.

Abstract: A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more lower notches extending upward from the lower side. The metal member further includes a plurality of foot portions. All of the plurality of foot portions extend backward from the lower side.

Abstract: An electronic device including an interposer is provided.