Abstract: An electronic fuse based-protection circuit system, including a plurality of electronic fuse based-protection circuits, where each electronic fuse based-protection circuit is electrically connected to a power supply and a load through an input terminal and an output terminal respectively and includes a sampling resistor, a MOSFET switch, and a logic control branch circuit. The sampling resistor is electrically connected to the input terminal and has a sampling terminal. The MOSFET switch is electrically connected to the sampling terminal and the output terminal. The logic control branch circuit obtains a sampling voltage of the sampling resistor between the input terminal and the sampling terminal and an on-off judging voltage by amplifying the sampling voltage. When the on-off judging voltage is greater than a reverse-bias voltage of the logic control branch circuit, an off signal is then transmitted to the MOSFET switch, to turn off the MOSFET switch.

Abstract: In order to relieve the stress on the substrates in a 3D stacked electronic assembly, a substrate frame is divided into a plurality of frame sections that are separated by spaces between the frame sections. These separations allow the substrates to expand/contract in response to temperature variations and other environmental conditions, and generally allow the substrates to move in one or more axial directions. The separations between the substrate portions are design-specific for each substrate design. The placement of IC packages on either side of the substrate is analyzed to identify areas of maximal warpage through physical measurements, physical model simulations, or using a trained neural network. The spaces in the substrate frame are then be placed next to or aligned with the areas of maximal warpage to reduce the stress on the substrate.

Abstract: A display panel includes a cover window, an ink layer formed with a multi-layer structure on a rear surface of the cover window and directly adhered to a middle frame, and an adhesive layer disposed on the rear surface of the cover window and overlapping with the ink layer, and at least one layer of the multi-layer structure of the ink layer includes a conductive material. An electric charge generated by the cover window is distributed to the middle frame via the ink layer and discharged by the middle frame to prevent a shift phenomenon, a green phenomenon, or both in the display panel.

Abstract: A system for power delivery network (“PDN”) isolation includes a multi-layer printed circuit board (“PCB”) in which a power distribution layer has a root conductive region and two or more branch conductive regions fanning out from the root conductive region. Each branch conductive region is insulated from other branch conductive regions by a non-conductive region. Each branch conductive region has at least one power delivery connection. Each of various electronic circuits mounted on the PCB and sharing the same PDN may be shorted to one of the branch conductive regions.

Abstract: A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more lower notches extending upward from the lower side. The metal member further includes a plurality of foot portions. All of the plurality of foot portions extend backward from the lower side.

Abstract: An electronic device including an interposer is provided.

Abstract: A flexible polarizer and a flexible touch display device. The flexible polarizer includes: a support protective layer; a linear polarized layer provided on the side of the support protection layer and comprising an acidic substance; a retardation layer provided on the side of the linear polarized layer distant from the support protection layer, and bonded to the linear polarized layer by means of a first bonding layer; and a block layer provided on the side of the retardation layer distant from the linear polarized layer. The block layer is bonded to a flexible touch display panel of the flexible touch display device by means of the second bonding layer. The block layer is used for blocking the acidic substance in the linear polarized layer from permeating into the flexible touch display panel.

Abstract: A member for semiconductor manufacturing apparatus includes: an upper plate that has a wafer placement surface, contains no electrode, and is a ceramic material plate; an intermediate plate that is provided on a surface of the upper plate, opposite to the wafer placement surface, that is used as an electrostatic electrode, and that is a conductive material plate; and a lower plate that is joined to a surface of the intermediate plate, opposite to the surface on which the upper plate is provided, and that is a ceramic material plate.

Abstract: An electronic apparatus including a compression molding board and a connection pad is provided. The compression molding board has a device bonding area and a bending area formed by compression molding. The device bonding area is different from the bending area. The connection pad is disposed on the device bonding area of the compression molding board.

Abstract: An electronic control device includes a plurality of drive control components and a substrate. The plurality of drive control components are grouped into systems. Each of systems is configured to control a control target independently. The substrate is divided into areas, corresponding to the systems, on which at least a part of the drive control components is mounted by each of the systems, and has layers stacked.

Abstract: An electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The electronics assembly further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.

Abstract: An electronic device includes a main printed circuit board (PCB) assembly comprising a bottom PCB and a semiconductor package mounted on an upper surface of the bottom PCB. The semiconductor package includes a substrate and a semiconductor die mounted on a top surface of the substrate. The semiconductor die and the top surface of the substrate are encapsulated by a molding compound. A top PCB is mounted on the semiconductor package through first connecting elements.

Abstract: A circuit module includes: a multilayer board having a plurality of first through-holes each penetrating at least one layer thereof; a plurality of high frequency components disposed in the plurality of first through-holes, respectively; and a plurality of shield parts individually surrounding the plurality of high frequency components. The multilayer board has a second through-hole penetrating at least a layer in which each high frequency component is disposed. Each of the plurality of shield parts includes a first conductor, a second conductor, and a third conductor. The first conductor and the second conductor sandwich the high frequency component in a lamination direction of the multilayer board. The third conductor is disposed in the second through-hole.

Abstract: Provided is a foldable display device. The foldable display device includes a flexible display panel, a flexible cover plate and a flexible printed circuit. The flexible display panel includes a first foldable region and a first side edge. The first foldable region includes a first sub-region, and a part of the first side edge is a boundary of the first sub-region. The flexible cover plate is bonded to a first surface of the flexible display panel and includes a second foldable region. An orthographic projection of the second foldable region on the first surface is within the first foldable region, the second foldable region is bonded to the first foldable region, and the orthographic projection of the second foldable region on the first surface is not overlapped with the first sub-region.

Abstract: A circuit system and method of manufacturing a printed circuit board includes providing an integrated circuit package mounted on a first side of a printed circuit board and a power regulator connected to power terminals of the integrated circuit package through a cutout in the printed circuit board. The power regulator draws power from the printed circuit board by way of side pins around a periphery of the cutout.

Abstract: The present disclosure provides a flexible battery, a circuit board and an electronic device, belonging to the technical field of batteries. The flexible battery of the present disclosure includes a flexible encapsulation structure, a plurality of battery cells and a crack detection wiring. The flexible encapsulation structure has a battery area and a peripheral area surrounding the battery area. The battery area includes a plurality of rigid areas and a plurality of bending areas alternately arranged along a first direction. The plurality of battery cells are arranged in a one-to-one correspondence with the plurality of rigid areas. In a corresponding rigid area, the battery cell is cladded in the flexible encapsulation structure. The crack detection wiring is located in the peripheral area and at least partially extends along the first direction. The crack detection wiring is cladded in the flexible encapsulation structure.

Abstract: A module is provided that includes a wiring substrate having a major surface, a plurality of components mounted on the major surface, and a conductor incorporated resin body mounted on the major surface. Moreover, the conductor incorporated resin body is disposed between the plurality of components and includes a conductor pattern therein that is grounded.

Abstract: An electric grid includes feed-ins, loads, and a distribution grid, which is arranged therebetween. The distribution grid comprises at least one busbar and at least one device for opening or closing a DC circuit. The at least one device includes an electric switch for opening or closing the DC circuit, a fault current detector, a trigger unit, a precharging device, and a control unit for automatically closing the electric switch after the precharging process. The electric switch opens the DC circuit via the trigger unit if a fault current is detected by the fault current detector, and the precharging device restores the voltage on the busbar prior to closing the electric switch.

Abstract: A component carrier and a method of manufacturing a component carrier are disclosed. The component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, an interposer embedded in the stack and having a plurality of vertically extending electrically conductive through connections, and electrically conductive structures in the stack laterally on both sides of the interposer.

Abstract: A shock resistant body comprises a non-metallic lattice structure having a first region with a first foam density in a first region and a second foam density in a second region that is lower from the first foam density. The first region has solid lattice members of a larger cross-sectional area than those in the second region and the first region has smaller interstices between solid lattice members than those in the second region.