Abstract: Certain embodiments of the disclosure relate to an electronic device including a substrate having a shielding structure. The electronic device may include a first substrate, a second substrate, and a third substrate. The second substrate may include a first metal pattern connected to ground and including multiple first slits formed by removing a portion of the first metal pattern, each of the first slits having a cross shape, a second metal pattern connected to the ground and including multiple second slits formed by removing a portion of the second metal pattern, each of the second slits having the cross shape, and multiple ground vias extending through at least a portion of the second substrate so as to connect the first metal pattern of the first metal layer to the second metal pattern of the second metal layer. Various other embodiments are also disclosed.

Abstract: The semiconductor circuit breaker includes a semiconductor switch unit connected to an AC circuit, and a phase control unit that controls conduction and non-conduction of the semiconductor switch unit by the control signal. The phase control unit includes an accident detection unit to detect an accident based on a current detected from the AC circuit, a zero point detection unit to detect a current zero point based on the current detected from the AC circuit, and a control signal output unit to output the control signal for setting the semiconductor switch unit to be non-conductive when the accident detection unit detects the accident or when the zero point detection unit detects the current zero point in response to a command to cut off the current.

Abstract: An electronic module having at least two electronic components mounted on a substrate. The electronic components are covered by a dielectric material. The dielectric material has a recess between adjacent electronic components. The surface of the recess facing at least one electronic component is coated with a conductive layer while the opposite surface to that coated recess surface is substantially free of a conductive layer. Also disclosed is a process for making the above-specified electronic module.

Abstract: A semiconductor storage device according to an embodiment includes a housing and a board, a controller, and a semiconductor memory component. The housing includes a first wall portion, a second wall portion, a third wall portion, and a fourth wall portion. The first wall portion and the second wall portion are separatable from each other. The third wall portion and the fourth wall portion are separatable from each other.

Abstract: A surface mounted assembly is provided and includes a surface mounted device, a cable and a circuit board. The circuit board includes a first outer side and a second outer side opposite to first outer side, and a conductive hole structure. The cable is inserted into the conductive hole structure from the first outer side of the circuit board and affixed with and electrically connected to the conductive hole structure to locate a terminal of the cable between the first outer side and the second outer side of the circuit board. The surface mounted device is mounted on the second outer side of the circuit board. An electrical connecting component of the surface mounted device and the terminal of the cable are affixed with and electrically connected to the conductive hole structure and electrically connected to each other by the conductive hole structure. Furthermore, an endoscope is provided.

Abstract: A module includes a substrate including a first main surface, a first component mounted on the first main surface, a first sealing resin including a first upper surface, the first component being sealed with the first sealing resin, a first shield film that covers at least a part of the first upper surface of the first sealing resin, and a second shield film that covers a side surface of the first sealing resin and a side surface of the substrate. A step portion lower than the first upper surface of the first sealing resin is provided on an outer periphery of the first sealing resin. The first shield film and the second shield film are electrically connected to each other on a side surface below the step portion.

Abstract: Terminal connection routing on top of a substrate surface connects to component terminals to and from PMIC devices and provides a novel structure to connect surface mount technology (SMT) passive device terminals on an SMT layer (such as a Cu bar mesh) that uses the 3D space available near to components to lower resistance/lower inductive path and provides a shorter path, SIP form factor reduction, a component placement density increase, creates an additional PDN layer for connectivity and, if the routing is encapsulated in a mold, protects the metal in the connection from oxidation. Methods are presented for providing a substrate, attaching a first device to a first surface of the substrate near a center of the substrate, attaching a second device to the first surface of the substrate near an edge of the substrate, and connecting a connection located on the first surface of the substrate between the first device and the second device.

Abstract: A high-frequency module (1) includes a substrate (10), a first electronic component (30) and a second electronic component (40) mounted on a main surface (10a) of the substrate (10). The substrate (10) has a protruding portion (20) projecting from the main surface (10a), the first electronic component (30) is mounted in a region of the main surface (10a) different from a region in which the protruding portion (20) is provided, and the second electronic component (40) is mounted on the protruding portion (20).

Abstract: A method includes preparing a substrate including a display area and a non-display area disposed adjacent to the display area, forming first panel magnetic patterns overlapping the non-display area and extending in a first direction on the substrate, forming first film magnetic patterns extending in the first direction on a film, inputting a first magnetism to the first panel magnetic patterns so that the first panel magnetic patterns have a first magnetic property, inputting a second magnetism to the first film magnetic patterns so that the first film magnetic patterns have a second magnetic property, and aligning the film on the substrate so that the first film magnetic patterns overlap the first panel magnetic patterns in a plan view.

Abstract: An electronic device including an interposer is provided.

Abstract: A system-in-package includes a function circuit and a protection circuit that protects the function circuit by preventing an instantaneous transient voltage from being applied to the function circuit. Here, the protection circuit includes a TVS diode and a capacitor. The TVS diode includes an anode that receives a ground voltage and a cathode that is connected to a first external connection terminal. The capacitor includes a first terminal that is connected to a second external connection terminal electrically separated from the first external connection terminal and a second terminal that receives the ground voltage.

Abstract: A module component includes a substrate having a first principal surface, a semiconductor substrate disposed on the first principal surface of the substrate, multiple terminals, and a resin layer. The terminals include multiple reference-potential terminals, which are electrically connected to the reference potential, and multiple signal terminals, which are disposed adjacent to at least one of the reference-potential terminals in the direction along an end portion of the substrate and which are supplied with a signal. In a plan view in the direction perpendicular to the first principal surface of the substrate, in at least one of the reference-potential terminals, the support portion is disposed between an end surface of the connection portion and the end portion of the substrate, and, in at least one of the signal terminals, the end surface of the connection portion is disposed between the support portion and the end portion of the substrate.

Abstract: According to one embodiment, a semiconductor storage device includes a board, a first electronic device mounted on the board, at least one second electronic device mounted on the board, and a heat dissipator. At least a portion of the second electronic device overlaps at least one of the board and the first electronic device in a first direction that is a thickness direction of the board. The heat dissipator includes a first member that includes a first portion located between the first electronic device and the second electronic device in the first direction, and a second member that includes a portion located between the first member and the second electronic device in the first direction. The second member is smaller in coefficient of thermal conductivity than the first member.

Abstract: A memory card includes a case and an integrated circuit package disposed in the case. The case includes a first case edge, a second case edge connected to the first case edge, a third case edge connected to the second case edge, a fourth case edge connected to the third case edge and the first case edge, and a first recessed groove formed in the second case edge, the first recessed groove being spaced apart from the first case edge and inwardly recessed. The integrated circuit package is disposed in an upper portion of the case between the first case edge and a first horizontal line that extends in a direction from a top end of the first recessed groove in the second case edge to the fourth case edge.

Abstract: A data storage device including a first printed circuit board (PCB) and a second PCB. The first PCB includes a controller, an interface configured to interface with a host device, and a first connector. The second PCB includes a non-volatile memory and a second connector. The second connector is configured to couple to the first connector to establish a communication connection between the controller and the non-volatile memory.

Abstract: Disclosed in the present disclosure is a hard disk fixing device, including: a seating, which includes a base fixed on a main board and a first pair of elastic buckles perpendicular to the base and arranged at two sides thereof; a first supporting seat, which includes a main body and an extending portion extending from the main body, wherein the extending portion may be snap-fitted between the first pair of elastic buckles, a first guiding slot is provided inside the main body and a through hole is provided in a side surface of the main body, and the first guiding slot is in communication with the through hole; a first adjusting fastener, which includes a sliding rod and a limiting rod connected to the sliding rod.

Abstract: Provided a filter and a redistribution layer structure including the same. The capacitor includes a first electrode, a second electrode, a third electrode, a dielectric layer, and a conductive through via. The second electrode is disposed above the first electrode. The third electrode is disposed between the first electrode and the second electrode. The dielectric layer is disposed between the first electrode and the third electrode and between the second electrode and the third electrode. The conductive through via penetrates the dielectric layer and the third electrode to be connected to the first electrode and the second electrode, and is electrically separated from the third electrode. The first electrode and the second electrode are signal electrodes, and the third electrode is a ground electrode.

Abstract: An electronic circuit board includes a printed circuit board and first and second electronic components. The printed circuit board includes a first insulating layer, a second insulating layer attached to the first insulating layer and in which is formed an open cavity, and a second conductive layer attached to the second insulating layer. The second conductive layer is treated to form a surface solder pad. The first electronic component is housed in the open cavity of the second insulating layer. The second electronic component is placed on the second insulating layer without overlapping with the open cavity. The first electronic component and the second electronic component each include a termination soldered on the surface solder pad, the surface solder pad being shared by the first and second electronic components.

Abstract: A magnetic erasing device including a magnet that includes an S pole and an N pole extending along an axial direction of the magnet, and a rotation mechanism for rotating the magnet in a housing around an axis of the magnet, wherein lines of magnetic force generated around the axis of the magnet during rotation of the magnet are designed to be applied to magnetic particles in the microcapsules to erase a visible image on a magnetic panel when the axis of the magnet is spaced from a surface of the magnetic panel by a predetermined distance.

Abstract: Disclosed is an EMI shielding material. The EMI shielding material includes a resin material and metal particles mixed with each other, and the surface of the metal particles has an insulating protective layer. Further disclosed is a communication module product, including a module element arranged on a substrate, and the periphery of the module element that requires EMI shielding is filled with said shielding material. Further disclosed is an EMI shielding process, including the following steps: a. preparing a communication module on which a module element is provided; and b. applying said shielding material to a region of the module element that needs to be EMI shielded on the communication module. The shielding material shields a chip region in a wrapping manner, that is, the shielding material wraps and shields all six surfaces or six directions of the chip, and provides shielding between chips.