Abstract: Disclosed herein is an apparatus that includes a first shift register circuit including a plurality of first latch circuits coupled in series, and a second shift register circuit including a plurality of second latch circuits coupled in series. The first and second shift register circuits are cyclically coupled. Each of the first latch circuits is configured to perform the latch operation in synchronization with a rise edge of a first clock signal. Each of the second latch circuits is configured to perform the latch operation in synchronization with a fall edge of a first clock signal when a first selection signal is in a first state. One or more first latch circuits and one or more second latch circuits are configured to be bypassed when a second selection signal indicates a predetermined value.

Abstract: An integrated circuit (IC) memory controller is disclosed. The memory controller includes a receiver to receive a strobe signal and provide an internal strobe signal. An adjustable delay circuit delays an enable signal to generate a delayed enable signal. A gate circuit generates a gated strobe signal using the delayed enable signal that masks transitions of the internal strobe signal that occur prior to a valid region of the internal strobe signal. A sample circuit samples data using the gated strobe signal.

Abstract: A semiconductor memory apparatus includes an access line control circuit. The access line control circuit applies a selected bias voltage to a selected access line coupled with a target memory cell and applies a first unselected bias voltage to an unselected access line adjacent to the selected access line. A second unselected bias voltage is applied to an unselected access line not adjacent to the selected access line.

Abstract: Methods, systems, and devices for read threshold adjustment techniques for memory are described. A memory device may read a codeword from a memory array of the memory device using a read threshold having a first value. The memory device may increment one or more counters of the memory device based on reading the codeword. The counter may indicate a quantity of bits of the codeword that correspond to a first logic value. The memory device may detect an error, such as an uncorrectable error, in the codeword based on reading the codeword. The memory device may adjust the read threshold from the first value to the second value based on the quantity of bits indicated by the counter. The memory device may read the codeword using the read threshold having the second value.

Abstract: The invention relates to a method for detecting visible and infrared light using a medical imaging system, said medical imaging system comprising a camera module configured to receive a visible light signal and at least one infrared light signal from an object image. The medical imaging system for detecting visible and comprises an input for visible light for illuminating a tissue; an input for excitation light for exciting a fluorescence agent in the tissue; a camera module configured to receive a visible light signal and at least one infrared light signal from an object image in the tissue. The camera module comprises at least a first, second, and third optical path for directing light from the object image to a first, second, and third filter and sensor combination respectively. In any order, the first, second, and third filters are a green filter, an infrared filter, and a red/blue patterned filter comprising red and blue filters in alternating pattern.

Abstract: A semiconductor memory apparatus includes an access line control circuit. The access line control circuit applies a selected bias voltage to a selected access line coupled with a target memory cell and applies a first unselected bias voltage to an unselected access line adjacent to the selected access line. A second unselected bias voltage is applied to an unselected access line not adjacent to the selected access line.

Abstract: A memory control method, a memory storage device, and a memory control circuit unit are provided. The method includes: executing a single page encoding operation on first data stored in a first type physical unit to generate local parity data; executing a global encoding operation on second data stored in at least two of the first type physical unit, a second type physical unit, and a third type physical unit to generate global parity data; reading the second data from the at least two of the first type physical unit, the second type physical unit, and the third type physical unit in response to a failure of a single page decoding operation for the first data; and executing a global decoding operation on the second data according to the global parity data.

Abstract: According to one embodiment, a memory system includes a nonvolatile memory including a plurality of cell units, each of the plurality of cell units including a plurality of memory cells, and a memory controller. The memory controller is configured to: read first data from a first cell unit, using a first correction amount of a read voltage; identify an address of an error bit in the first data; update the first correction amount to a second correction amount, based on the first data and the address of the error bit of the first data; and read second data from a second cell unit different from the first cell unit, using a third correction amount based on the second correction amount.

Abstract: A memory controller includes a core processor and a built-in self-repair (BISR) logic circuit. The core processor includes a register file with a plurality of register values corresponding to repair commands that control a self-repair operation of a memory device. The BISR logic circuit receives at least one of the plurality of register values from the core processor and converts the at least one of the plurality of register values into at least one of the repair commands to output the least one of the repair commands to the memory device. The core processor transmits the at least one of the plurality of register values to the BISR logic circuit in response to a firmware instruction that is output from an external firmware coupled to the memory controller.

Abstract: A semiconductor device comprises a stack structure comprising decks each comprising a memory element level comprising memory elements, and a control logic level in electrical communication with the memory element level and comprising control logic devices. At least one of the control logic devices of the control logic level of one or more of the decks comprises at least one device exhibiting transistors laterally displaced from one another. A memory device, a thin film transistor control logic assembly, an electronic system, and a method of operating a semiconductor device are also described.

Abstract: A processor coupled to a NAND memory device comprising an n by m array of dies having n channels performs error recovery message scheduling and read error recovery on the dies by receiving indications of read errors responsive to attempted execution of a read command on a destination die and creates an error recovery message or instruction in response to the indication. The processor determines the destination die of the error recovery message and sends the error recovery message to a die queue based on the determined destination die. The n×m die queues can each be further divided into p priority queues, and error recovery messages are sent to the appropriate die priority queue based on a priority associated with the error recovery message. The processor fetches error recovery messages from a head of each die priority queue and performs read error recovery at the destination die.

Abstract: Methods, systems, and devices for power regulation for memory systems are described. In one example, a memory system, such as a memory module, may include a substrate, and an input/output component coupled with the substrate and operable to communicate signals with a host system. The memory system may also include one or more memory devices coupled with the substrate and the input/output component and operable to store data for the host system. A memory device of the one or more memory devices may include a power management component in its package with one or more memory dies. The power management component may be coupled with the one or more memory dies, and feedback component, and may be operable to provide one or more supply voltages for the one or more memory dies based on one or more voltages associated with the memory system.

Abstract: Integrated circuit devices might include a controller configured to cause the integrated circuit device to apply a first voltage level to a first conductor while applying a second voltage level to a second conductor, apply a third voltage level to the first conductor while applying a fourth voltage level to the second conductor, and apply a fifth voltage level to the first conductor while applying the second voltage level to the second conductor. The second voltage level might correspond to a target voltage level for the second conductor. A difference between the third voltage level and the first voltage level might have a polarity opposite the polarity of a difference between the fourth voltage level and the second voltage level, and the same polarity of a difference between the fifth voltage level and the first voltage level. The fifth voltage level might correspond to a target voltage level for the first conductor.

Abstract: A method for testing a memory chip including: performing an electrical die sorting (EDS) test on the memory chip; performing a package test when the EDS test is passed; performing a module test when the package test is passed; performing a mounting test when the module test is passed; and setting the memory chip to a mirroring mode through a fusing operation when the EDS test, tire package test, tire module test or the mounting test is failed.

Abstract: Memory devices, system, and methods for operating the same are provided. The memory device can comprise a non-volatile memory array and control circuitry. The control circuitry can be configured to store a value corresponding to a number of activate commands received at the memory device, update the value in response to receiving an activate command received from a host device, and trigger, in response to the value exceeding a predetermined threshold, a remedial action performed by the memory device. The control circuitry can be further configured to store a second value corresponding to a number of refresh operations performed by the memory device, update the second value in response to performing a refresh operation, and trigger, in response to the value exceeding a second predetermined threshold, a second remedial action performed by the memory device.

Abstract: A memory device for sensing memory cell in a memory array includes at least one first memory cell, a first sensing amplifier, a first multiplexer circuit, a plurality of first reference cells, and a controller. The first sensing amplifier is coupled to the at least one first memory cell. An output terminal of the first multiplexer circuit is coupled to the reference terminal of the first sensing amplifier. Each of the first reference cells is coupled to each input node of the first multiplexer circuit. The controller is coupled to a control terminal of the first multiplexer circuit. The first sensing amplifier comprises an output terminal and a reference terminal. The controller controls the first multiplexer circuit to select one of the first reference cells as a selected reference cell to couple to the reference terminal of the first sensing amplifier when each read operation to the at least one first memory cell is performed.

Abstract: A write protection circuit for memory and a display apparatus are provided. The write protection circuit includes an interference signal absorbing circuit connected with a data writing triggering terminal to absorb a first level signal when the receiving of the first level signal by the data writing triggering terminal is detected.

Abstract: An electronic device includes a command generation circuit configured to generate a refresh command and a driving control signal, which are enabled during an all-bank refresh operation, according to a logic level combination of an internal chip selection signal and an internal command address. The electronic device also includes a buffer control circuit configured to generate, from the refresh command and the driving control signal, a first buffer enable signal for enabling a first group of buffers and a second buffer enable signal for enabling a second group of buffers.

Abstract: Various embodiments of the present disclosure are directed towards a method for memory repair using a lookup table (LUT)-free dynamic memory allocation process. An array of memory cells having a plurality of rows and a plurality of columns is provided. Further, each memory cell of the array has multiple data states and a permanent state. One or more abnormal memory cells is/are identified in a row of the array and, in response to identifying an abnormal memory cell, the abnormal memory cell is set to the permanent state. The abnormal memory cells include failed memory cells and, in some embodiments, tail memory cells having marginal performance. During a read or write operation on the row, the one or more abnormal memory cells is/are identified by the permanent state and data is read from or written to a remainder of the memory cells while excluding the abnormal memory cell(s).

Abstract: The present technology includes a method of operating a controller that controls a semiconductor memory device including a plurality of memory blocks. The method includes receiving a read request for data included in any one memory block among the plurality of memory blocks from a host, and controlling the semiconductor memory device to read data corresponding to the read request using a read-history table. The read-history table includes read voltages used for a plurality of read pass operations for the any one memory block, respectively.