Abstract: A control device controls a contact probe in synchronization with a pulse-controlled light having a predetermined wavelength, a measurement instrument measures a characteristic of a sample to be inspected or an analysis sample, and a circuit constant or a defect structure of the sample to be inspected is estimated based on a circuit model created by an electric characteristic analysis device configured to generate the circuit model based on a value measured by the measurement instrument and a detection signal of secondary electrons detected by the charged particle beam device.

Abstract: An example test station assembly of a cathodic protection monitoring assembly includes a face plate including a plurality of openings. In addition, the test station assembly includes a plurality of test posts to pass through the plurality of openings. Further, the test station assembly includes a plurality of electrically non-conductive identification indicators to connect to the plurality of test posts on the face plate. Each of the plurality of identification indicators including one or more identifying characteristics to identify a corresponding voltage source of a plurality of underground voltage sources associated with an at least partially buried structure, a cathodic protection system for the buried structure, or the cathodic protection monitoring assembly. Still further, the test station assembly includes a plurality of electrical conductors to electrically connect the plurality of test posts to the plurality of underground voltage sources.

Abstract: A system for detecting a faulty connection in an earth grid 104 is provided. The system includes a current injection device 102 to provide an input current with off grid frequency to the earth grid 104 through a reference riser 112. The riser under test 110 is connected with the earth grid 104 to receive the input current with off grid frequency and the earth grid 104. The system includes a first current measuring device that measures, at the riser under test 110, a first current that is received from the earth grid 104 and a second current measuring device that measures, at the riser under test 110, a second current that is received from the earth grid 104. The second current measuring device compares the first current and the second current to determine a faulty connection in the riser under test 110.

Abstract: An apparatus and a tool for installation of a measurement coil. The apparatus includes a tool and a holder. The tool includes a first portion and a second portion at least partially surrounding the first portion. The first portion is configured to receive a conductor and the second portion is configured to hold a measurement coil. The holder is configured to be detachably attached to the tool, wherein the holder is to be employed to install the tool holding the measurement coil onto a conductor. The first portion is configured to snap fit onto the conductor during installation, and the measurement coil at least partially surrounds the conductor when installed.

Abstract: A circuit for detecting a leakage current in a semiconductor element includes a setting circuit and a detector. The semiconductor element includes a first terminal at a high-potential-side of the semiconductor element, a second terminal at a low-potential-side of the semiconductor element, and a control terminal. The control terminal receives a signal for controlling a conduction state between the first terminal and the second terminal. The setting circuit sets a duration during which a charging current flows to the control terminal as an undetectable duration, in response to turning on the semiconductor element. The detector outputs a detected signal based on a condition that the leakage current flowing from the control terminal to the second terminal, after the undetectable duration has been elapsed.

Abstract: A method for checking a Design for Test (DFT) circuit includes: transmitting a control signal to the DFT circuit to determine test mode signals output by the DFT circuit, with the DFT circuit being configured to sequentially select multiple address latches according to the control signal to output the test mode signals; analyzing the test mode signals to determine whether the multiple address latches in the DFT circuit have an error; and outputting a simulation result report.

Abstract: Circuitry, systems, and methods for fault detection and reporting comprise a fault detection circuit configured to detect one or more fault conditions that cause a state change in a fault pin voltage representative of a transceiver failure. Once the state of the fault pin voltage changes, a transceiver input generates a fault detection code. In embodiments, in response to the transceiver input receiving a first signal, the fault detection code is shifted to a transceiver output that may communicate the fault detection code to a controller. Once the transceiver input receives a second signal, the fault pin voltage may be reset to clear the fault detection code before resuming operations, including detecting additional fault conditions as they arise.

Abstract: A system may include amplifier circuitry configured to drive an electromagnetic load with a driving signal and a processing system communicatively coupled to the electromagnetic load and configured to compensate for current-sensing error of the processing system caused by feedback circuitry of the amplifier circuitry.

Abstract: A system for testing an electronic circuit board test coupon, including a test chamber. The test chamber can have at least one port through which a port extension member holding a test coupon can be inserted, minimizing air flow between the interior space of the test chamber and the surrounding area to adequately maintain elevated heat and humidity conditions within the test chamber.

Abstract: A chip-on-film test board on which a chip-on-film is mounted according to an embodiment of the present disclosure includes a main board in which a test circuit configured to output a test pattern signal is formed, and a chip-on-film fixing part that fixes a position of the chip-on-film.

Abstract: A method for protecting, controlling, and monitoring electrical medium range switchgear comprising use of a Rogowski coil embedded in the outside of a cylinder or bottle of a switchgear and surrounding the Mains providing voltage and current and a capacitive or similar voltage divider, also surrounding the Mains and extending around the cylinder or bottle, and providing analog signals from those devices to an integrated circuit for conversion to digital signals, and then transmitting as output the digital signals to a data accumulator where the same are optionally time stamped and compared to one another, to a standard or to themselves at a different time.

Abstract: A transformer-based anomaly detection apparatus includes: an encoder unit including n encoding blocks having a pyramid structure, and extracting respective multi-scale feature maps having the pyramid structure through respective encoding blocks; a spatio-temporal transformer unit having n spatio-temporal transformers, and generating each multi-scale spatio-temporal attention map in which a temporal feature and a spatial feature for the feature map extracted from each encoding block are emphasized through each spatio-temporal transformer; and a decoder unit including n decoders having a reverse pyramid structure, and generating a prediction frame by using outputs of the multi-scale spatio-temporal attention map and a previous layer decoder through n decoders, and an abnormal event is detected by using the prediction frame.

Abstract: In one example, an integrated circuit comprises a die. The die has a first surface and a second surface, the second surface opposite to the first surface. The die also includes: a first contact on the first surface and a second contact on the second surface; a through silicon via having a first end and a second end, the first end coupled to the first contact and the second end coupled to the second contact; and a scan cell having a control input, a response input, and a stimulus output, the response input coupled to the first end and the stimulus output coupled to the second end.

Abstract: A sensor device includes: a sensor element, outputting a signal; a first determination circuit, outputting an initialization signal containing a signal level corresponding to a determination result as to whether detection of a physical quantity has matched two consecutive times; a second determination circuit, including a counter which is able to, while initializing a count value if the detection of the physical quantity does not occur two consecutive times, continue counting if the detection of the physical quantity occurs two consecutive times until a set number of times is reached, the second determination circuit outputting an output latch signal containing a signal level corresponding to whether a consecutive match occurs until the set number of times is reached; and an output register, switching a signal level of an output signal supplied to an output terminal according to a change in the signal level of the output latch signal.

Abstract: Apparatuses, systems, methods, and computer program products for massively independent testers systems are disclosed. An apparatus includes a controller, a substrate, a device interface board, multiple tester modules mounted on the substrate, and/or one or more interface buses. One or more components for tester modules are mounted on a device interface board. Tester modules are configured to perform both independent functional and parametric tests. One or more interface buses are in communication with a controller, multiple tester modules, and/or a device interface board to provide one or more of power and a communication link.

Abstract: The present invention discloses an in-situ testing system for semiconductor device in aerospace irradiation environment. The present invention includes a static testing unit, a static testing channel, a dynamic testing unit, a dynamic testing channel, and a channel switching control unit; the static testing unit is connected to the device under test through the static testing channel, and is used to output static testing signals and display the static testing data of the device under test; the dynamic testing unit is connected to the device under test through the dynamic testing channel, and is used to output dynamic testing signals and display the dynamic testing data of the device under test; the channel switching control unit is connected to the static testing channel and the dynamic testing channel, respectively. This invention can achieve static, dynamic, and degradation testing of third-generation semiconductor device in aerospace irradiation environment.

Abstract: A system and method for performing production testing on high power semiconductor devices is disclosed. The system includes signal generators, RF meters, sockets, couplers and connectors which also function as switches when connected to an external cable. A calibration process is executed which allows the controller to create a correlation between measurements taken by the RF meter and the actual voltages, and power levels present at the device under test. By performing this calibration, it is possible to perform production testing of devices much more quickly and reliably.

Abstract: Systems, apparatuses and methods provide for technology that monitors a component. A monitoring apparatus includes a sensor to monitor a state of a component, a power circuit to convert an electromagnetic signal to electrical power, a capacitor bank coupled to the power circuit and to the sensor to receive electrical power from the power circuit and to supply electrical power to the sensor, and a wireless readout to convert data from the sensor into a wireless communication signal. A method of monitoring a component includes coupling a sensor to a component, the sensor configured to monitor a state of the component, applying power to the sensor from a capacitor bank, and storing data obtained from the sensor, where the data relates to a state of the component. The method can include charging the capacitor bank via a power circuit, where the power circuit converts an electromagnetic signal to electrical power.

Abstract: A current detection device includes a main busbar and a semiconductor chip. A detected current flows through the main busbar. The semiconductor chip is spaced apart from the main busbar. The semiconductor chip includes a branch busbar, a detection part, and an output part. The branch busbar is connected in parallel with the main busbar. The detection part is arranged adjacent to the branch busbar and detects a first magnetic field generated based on a branch current flowing from the main busbar to the branch busbar. The output part calculates and outputs a current value based on the first magnetic field detected by the detection part.

Abstract: A semiconductor device includes a semiconductor die having a surface and sensing circuitry at a sensing region of the surface. A tubular wall of a metal material has an inner sidewall around the sensing region to provide a sensing cavity that extends from the surface of the semiconductor die to an opening at a distal edge thereof. The tubular wall includes a proximal portion and a distal flange portion. The proximal portion extends longitudinally from the surface. The distal flange portion extends radially outwardly from the proximal portion a first distance and radially inwardly from the proximal portion a second distance that is less than the first distance.