Abstract: Systems, apparatuses, semiconductor products and methods for circuit testing, specifically non-contact circuit testing are provided that allow for the wireless, non-contact testing of an electrical component. For example, non-contact circuit testing is performed using a non-contact testing apparatus that include a circuit cover with a conductive material and an oscilloscope. The circuit cover is places over an electrical component to form a parallel plate capacitor with electrical component. The parallel plate capacitor is formed with an air dielectric between the electrical component and the circuit cover. An electrical signal is initiated at the electrical component to cause a voltage through the parallel plate capacitor. An oscilloscope probe is used to measure the voltage of the parallel plate capacitor to determine a connectivity of the electrical component without contacting the electrical component.

Abstract: A method for inter-turn fault detection in a current transformer (CT). The method includes obtaining a first inter-turn fault index of the CT, obtaining a second inter-turn fault index of the CT, and detecting an inter-turn fault in the CT based on the first inter-turn fault index and the second inter-turn fault index. Obtaining the first inter-turn fault index includes coupling an AC power supply to a secondary winding of the CT, measuring an electric current passing through the AC power supply, obtaining a hysteresis curve of the CT from the electric current, and calculating the first inter-turn fault index according to the hysteresis curve. Obtaining the second inter-turn fault index includes injecting an AC current to a primary winding of the CT, measuring an open-circuit voltage waveform of the secondary winding, and calculating the second inter-turn fault index according to the open-circuit voltage waveform.

Abstract: The present disclosure is directed to an inspection tool having an integrated optical laser unit and atomic force probe unit with a detector unit. The inspection tool further includes a processor unit that is coupled to the optical laser unit and the atomic force probe unit and performs a fault location analysis for a device under test. In addition, the present disclosure to methods for inspecting a device under test for defects using an inspection tool having an integrated optical laser unit and atomic force probe unit that includes a detector unit.

Abstract: A method for monitoring the status of an apparatus, wherein an analog signal is converted into a digital signal with an analog-digital converter operating within a measuring range, signal portions of the analog signal extending beyond the measuring range are cut in the digital signal, a spectral analysis is applied to the digital signal to determine which frequency potions the analog signal possesses in a frequency spectrum and conclude a malfunction of the apparatus when the analog signal exceeds the measuring range, where when the analog signal extending beyond the measuring range is in the digital signal, this event is detected and determined as a number, where a signal quality is provided which is used to assess whether known damage frequencies can still be identified from determined frequency portions of the frequency spectrum, although additional overcontrol portions in the frequency spectrum occur as a result of possibly cut signal portions.

Abstract: An electronic component handling apparatus pressing the DUT against a socket electrically connected to a tester, includes: a first receiver that receives, from the tester, a first signal indicating a detection value of a temperature detection circuit; a calculator that calculates a temperature of the DUT based on the first signal; a calibrator that calibrates the calculated temperature; a second receiver that receives, from the tester, a second signal that causes the calibrator to start a first calibration; and a temperature adjuster that adjusts the temperature of the DUT. The second receiver receives the second signal before the tester turns on the DUT, once the second signal is received, the calibrator calculates a first calibrated temperature by executing the first calibration with respect to the calculated temperature, and the temperature adjuster adjusts the temperature of the DUT based on the first calibrated temperature.

Abstract: A detector for, and a method of, detecting analytes in gases in described. The detector comprises a sorbent for sorbing therein and/or thereon and/or desorbing therefrom, an analyte included in a gas exposed thereto, at a zeroth temperature, pressure (T0, P0), a controller arranged to change the zeroth temperature, pressure (T0, P0) to a first temperature, pressure (T1, P1) according to a first equation, to desorb and/or sorb at least some of the analyte; and a sensor arranged to sense at least some of the analyte and to output a response corresponding to the sensed analyte. The response comprises and/or is a characteristic response of the analyte.

Abstract: To provide voltage detection device capable of reducing variations and errors in detection voltage caused by influence of configuration of pattern wiring and temperature when detecting voltages applied to a plurality of resistance elements connected in parallel. Voltage detection device includes resistance unit including a plurality of resistance elements connected in parallel, differential amplifier circuit, first connection portion having two wiring portions connecting positions different from each other in one end portion of resistance unit and input terminal of differential amplifier circuit, and second connection portion having two wiring portion connecting positions different from each other in other end portion of resistance unit and input terminal of differential amplifier circuit. Voltage detection device configures to detect voltage applied to resistance unit based on voltage of output terminal of differential amplifier circuit.

Abstract: A power supply system includes modular power supply modules interconnected via a wire harness. The power supply system can be installed in one or more electrical cabinets in a manufacturing facility, for example, among other possible applications. The wire harness includes a fault bus and a synchronization bus, and the individual power supply modules detect and report faults as well as synchronize operation, such as pre-charging, via communication using the wire harness.

Abstract: A radio frequency antenna measurement system (10) of the present invention includes a receiving antenna (14) that receives a radiated radio wave from an on-chip radio frequency antenna (AUT). The receiving antenna (14) includes a waveguide (14A) in which a connector (14B) for outputting a reception signal to the power sensor (15) is integrally formed at a rear end. Accordingly, in a state where a microscope (MS) necessary for position adjustment of a feed probe (12) is installed, it is possible to construct a reception system that receives the radiated radio wave from the AUT and measures a radiation characteristic on a stage (11), and to measure the radiation characteristic such as a gain and radiation pattern of the AUT with high accuracy.

Abstract: A voltage tracking circuit includes a first, second, third and fourth transistor. The first transistor is in a first well, the first transistor including a first source terminal and a first body terminal that are coupled to a first voltage supply. The second transistor includes a second source terminal being coupled to the first drain terminal, a second gate terminal being coupled to a pad voltage terminal and configured to receive a pad voltage. The third transistor is in a second well, and includes a third gate terminal coupled to the first voltage supply, and a third body terminal coupled to a first node. The fourth transistor includes a fourth drain terminal coupled to the third source terminal, a fourth gate terminal coupled to the third gate terminal and the first voltage supply, and a fourth source terminal coupled to the pad voltage terminal.

Abstract: A display device includes a display layer including an active area in which a plurality of pixels is arranged and a peripheral area located adjacent to the active area. The display layer includes a transistor disposed in the active area and including a gate, a source, and a drain, a first crack line disposed in the peripheral area and surrounding a portion of the active area in a plan view, and a second crack line disposed in the peripheral area under the first crack line. The first crack line is insulated from the second crack line.

Abstract: Provided are a Rogowski-type current sensor capable of being flexibly deformed and easily mounted even when a clearance is narrow, an inverter, and a method of mounting a Rogowski-type current sensor. A main body of a Rogowski-type current sensor is formed from a belt-shaped flexible wiring board. The main body includes a measuring portion in which a Rogowski coil is formed in a length direction by a conductive pattern. When measuring a current flowing through a wiring of a measurement target, the main body is mounted such that it is bent in an annular shape to surround the wiring of the measurement target, and front surfaces (first main surfaces) are overlaid with each other so as to surround the wiring of the measurement target.

Abstract: Disclosed herein are systems and methods for controlling temperature(s) using a thermal control assembly (TCA) and a coldplate. The TCA comprises independently controllable thermal zones for controlling its top surface temperature. The thermal zones may be heater zones, cooling zones, or both. Energy input to the TCA may be selectively applied by, e.g., a thermal controller, such that different sets of thermal zones receive the energy at different times. In some embodiments, the energy input to the TCA may be selectively applied to two more independently controllable heater zones at the same time, the energy input to the TCA may be selectively applied to two or more independently controllable cooling zones at the same time, or both. In some aspects, less than all thermal zones may be activated at the same time, providing a higher power density for the thermal zones for a given energy input to the TCA.

Abstract: According to one embodiment, a sensor includes an element portion including a first element. The first element includes a first magnetic element, a first conductive member, and a first magnetic portion. The first magnetic element includes a first magnetic layer and a first opposing magnetic layer. A length of the first magnetic element along a second direction crossing a first direction from the first magnetic layer to the first opposing magnetic layer is longer than a length of the first magnetic element along a third direction crossing a plane including the first direction and the second direction. The first conductive member includes a first conductive portion and a first other conductive portion. A direction from the first other conductive portion to the first conductive portion is along the second direction. A direction from the first magnetic portion to the first magnetic element is along the second direction.

Abstract: An alignment method and an alignment device thereof are provided. The alignment method includes: providing a wafer including wafer coordinate information. Two probes are respectively aligned with two bonding pads on a dicing road of the wafer, and an image capture device is used to assist the two probes to obtain actual wafer information. The wafer coordinate information is then compared with the actual wafer information to determine whether the two probes are accurately aligned with the two bonding pads on the dicing road, respectively. When an alignment position of the two probes is determined, the positions of any chips and bonding pads on the wafer can be determined.

Abstract: An asynchronous capacitance-to-digital conversion is described that allows for very low-power operation when during inactive periods (when no conductive object is in contact or proximity to the sensing electrodes). Asynchronous operation of a capacitance-to-digital converter (CDC) provides for capacitance-to-digital conversion without the use of system resources and more power intensive circuit elements.

Abstract: A battery classification apparatus includes a profile generating unit configured to obtain battery information about capacity and voltage of a battery and generate a differential profile representing a corresponding relationship between the capacity and a differential voltage based on the capacity and the voltage, and a control unit configured to obtain the differential profile from the profile generating unit, detect a plurality of peaks in the obtained differential profile, and classify the battery into any one of a plurality of preset groups based on a plurality of classification conditions preset for the number of the plurality of detected peaks and the differential voltage.

Abstract: The electronic wave leakage measurement system according to the present invention is a system for measuring the electronic wave leakage of an electronic wave shielding structure. The system comprising a signal generator for generating an electronic wave generation signal; a transmitting antenna for transmitting the electronic wave towards a wall surface of the electronic wave shielding structure by receiving the signal from the signal generator; a receiving antenna capable of beam steering and comprising N individual antenna modules for receiving the electronic wave that has passed through the wall surface of the electronic wave shielding structure; and a signal analyzer that analyzes and displays the received electronic wave signal from the receiving antenna.

Abstract: A heating structure and a wafer test device are provided. The heating structure includes: a heating base, provided with a heating element inside the heating base; a mounting component, disposed above the heat base and including a plurality of mounting stations arranged at intervals; and a plurality of insulating thermo-conductive blocks. Each of the plurality of insulating thermo-conductive blocks is disposed at one corresponding mounting station of the plurality of mounting stations and protrudes from the mounting component for contacting a clamp of the wafer test device.

Abstract: There is disclosed in one implementation a method of or for use in or for detecting, measuring and/or determining at least one variable or characteristic in a space, such as a well, container or vessel. In one implementation the method comprises: transmitting a first electromagnetic signal from a first position to a feature within the space; receiving a second electromagnetic signal at a second position after reflection of the transmitted first electromagnetic signal from the feature; transmitting a third electromagnetic signal from a third position to a calibration feature within the space; receiving a fourth electromagnetic signal at a fourth position after reflection of the transmitted third electromagnetic signal from the calibration feature.