Abstract: Disclosed herein are thermal heads and corresponding test systems for independently controlling a one or more components while testing one or more devices under test. In some embodiments, a thermal head comprises a plurality of adapters, one or more heaters, and one or more thermal controllers for independently controlling temperatures of the components. The thermal controllers may control the temperatures of at least some of the components independently such that thermal control of one component does not affect the thermal control of the other component. In some embodiments, the thermal control is by way of one or more cold plates, and the thermal head comprises one or more cold plates. Embodiments of the disclosure further include independent control of one or more forces using one or more force mechanisms.

Abstract: The present invention provides an information providing apparatus including a determining unit configured to determine an added value to be provided to a user of a portable electric power supply device including a storage battery that stores electric power to be supplied to electrical equipment detachably connected, wherein in a case where a kind of the electrical equipment is a specified kind of electrical equipment, the determining unit determines the added value to be provided to the user in such a manner that the added value to be provided to the user is higher than an added value in a case where the kind of the electrical equipment is not the specified kind of electrical equipment.

Abstract: A method for the onsite calibration of a Rogowski sensor to be calibrated, includes the steps of: cause the sensor to be calibrated to be positioned on a reference phase, or cause a reference sensor to be positioned on the phase to be calibrated; acquiring a calibration current measurement produced by the sensor to be calibrated, a reference current measurement produced by the reference sensor, and a reference voltage measurement on the phase on which are positioned the reference sensor to be calibrated following the positioning step; and using the calibration current measurement, the reference current measurement and the reference voltage measurement to produce calibration parameters of the sensor to be calibrated.

Abstract: An apparatus for positioning and retaining a current transformer, such as a Rogowski coil, about a conductor includes at least two members, a coupling mechanism, and a non-conductive securing structure. Each member of the apparatus includes a respective retention structure configured to receive a respective section of the Rogowski coil. The coupling mechanism is configured to movably deploy at least one of the apparatus members relative to the other and around the conductor, which may be a distribution transformer power node. The securing structure is configured to engage the conductor and retain the apparatus members in fixed positions relative to the conductor and to each other.

Abstract: A circuit for measuring an unknown resistance of a resistive element comprises a sensor circuit to generate a differential voltage dependent on the resistance of the resistive element and a reference circuit to generate a differential reference voltage and a sigma-delta converter comprising a first stage, wherein a first capacitor is selectively coupled to one of the output terminals of the sensor circuit and a second capacitor is coupled to one of the output terminals of the reference circuit. The circuit generates logarithmically compressed values.

Abstract: A multi-chip system includes a plurality of chips and a monitoring and calibration system. The plurality of chips include at least a first chip and a second chip, wherein an output port of the first chip is connected to an input port of the second chip via a chip-to-chip connection, the first chip transmits an output signal to the second chip via the chip-to-chip connection, and the second chip processes an input signal that is derived from the output signal transmitted via the chip-to-chip connection. The monitoring and calibration system calibrates a chip setting of at least one of the first chip and the second chip for pulse width calibration of the input signal.

Abstract: The present disclosure describes techniques for detecting foreign objects. In some aspects, an apparatus for detecting objects is provided. The apparatus includes a plurality of sense circuits, each of the plurality of sense circuits including a primary sense coil having a first terminal and a second terminal, a secondary sense coil having a first terminal and a second terminal, and a capacitor having a first terminal and a second terminal. The first terminal of the capacitor is electrically connected to the second terminals of each of the primary sense coil and the secondary sense coil. The apparatus further includes a driver circuit electrically connected to the first terminal of the primary sense coil of each of the plurality of sense circuits. The apparatus further includes a measurement circuit electrically connected to the first terminal of the secondary sense coil of each of the plurality of sense circuits.

Abstract: The present application provides a detecting method of an operating state of a power supply and a detecting apparatus, where the power supply includes a primary circuit, a transformer and a secondary circuit. The secondary circuit includes a secondary current detecting unit, a temperature detecting unit and a secondary controlling unit. Firstly the secondary current detecting unit detects a current value of the secondary circuit, then the secondary controlling unit compares the current value of the secondary circuit with a preset current threshold. When the current value of the secondary circuit is less than or equal to the preset current threshold, the temperature detecting unit detects a temperature value of the power supply and the secondary controlling unit determines the operating state of the power supply according to the acquired temperature value of the power supply.

Abstract: A system and method introduce a variable thermal resistance to test and burn in apparatus. The system and method provide an efficient design for more accurate temperature control of integrated circuits. A system for testing integrated circuit (IC) packages comprises a plurality of IC testing socket bases arranged on a testing board and configured to receive a plurality of IC packages. A plurality of IC testing socket lids are arranged to attach to the testing board. Each IC testing socket lid comprises a temperature sensor to thermally contact the IC package and measure a surface temperature of the IC package, a heat sink is placed into either proximity to or directly in contact with the IC package, and an electronic controller to receive signals from the temperature sensor.

Abstract: This document describes techniques and systems for leakage screening based on power prediction. In particular, the described systems and techniques estimate, during a silicon manufacturing process, use-case power (e.g., low power, ambient power, high power, gaming power) to apply leakage screening for apart (e.g., a chip package). In some aspects, measurable silicon parameters (e.g., leakage values, bin values, processor sensor values) may be used for use-case power prediction. Using the described techniques, a maximum allowable predicted use-case power can be determined and used for leakage screening regardless of an individual rail leakage or voltage bin assignment.

Abstract: A current detection circuit includes an operational amplifier, a current sense amplifier including a first resistor and a second resistor, and a level shifter. The first resistor is provided between one end of a shunt resistor and a first input node of the operational amplifier. The second resistor is provided between the other end of the shunt resistor and a second input node of the operational amplifier. The level shifter controls voltages of the first input node and the second input node by controlling, according to a voltage at the one end of the shunt resistor, currents supplied to the first input node and the second input node.

Abstract: According to one embodiment, a sensor includes a base, and a first structure body. The base includes semiconductor dement including the first dement electrode. The first structure body includes a first conductive member and a coil. The first conductive member is electrically connected with the first element electrode. The coil is provided around the first conductive member in a first plane crossing a first direction from the base to the first structure body.

Abstract: A wafer inspection system is provided. The wafer inspection system includes: a transfer region in which a transfer device is arranged; an inspection region in which test heads for inspecting a substrate are arranged; and a maintenance region in which the test heads are maintained. The inspection region is located between the transfer region and the maintenance region, a plurality of inspection rooms accommodating the test heads are adjacent to each other in the inspection region, and the test heads are configured to be unloaded from the inspection region to the maintenance region.

Abstract: A method for performing temperature control of a mounting base on which a substrate is to be mounted. A substrate mounting surface of the mounting base is divided in the radial direction into a plurality of regions, and a heater is provided to each of the plurality of regions. The method includes: a step for performing feedback control that adjusts the operation amount of the heater in the centermost region of the plurality of regions of the substrate mounting surface such that the centermost region is at a set temperature; and a step for performing feedback control that adjusts the operation amount of the heater in an outside region that is further to the outside than the centermost region of the plurality of regions of the substrate mounting surface such that the temperature difference between the outside region and the region that is adjacent to the outside region on the inside in the radial direction is a preset value.

Abstract: An example test system includes a test socket for testing a DUT, a lid for the test socket, and an actuator configured to force the lid onto the test socket and to remove the lid from the test socket. The actuator includes an upper arm to move the lid, an attachment mechanism connected to the upper arm to contact the lid, where the attachment mechanism is configured to allow the lid to float relative to the test socket to enable alignment between the lid and the test socket, and a lower arm to anchor the actuator to a board containing the test socket. The actuator is configured to move the upper arm linearly towards and away from the test socket and to rotate the upper arm towards and away from the test socket.

Abstract: An example test system includes test sites for testing devices under test (DUTs), where the test sites include a test site configured to hold a DUT for testing. The test system includes a thermal control system to control a temperature of the DUT separately from control over temperatures of other DUTs in other test sites. The thermal control system includes a thermoelectric cooler (TEC) and a structure that is thermally conductive. The TEC is in thermal communication with the DUT to control the temperature of the DUT by transferring heat between the DUT and the structure.

Abstract: Systems, apparatuses, and methods are described for calibration of a current transformer. In some examples, one or more electrical elements may be affected in order to set a calibration of the current transformer. A calibration circuit of the current transformer may be permanently or non-permanently affected according to a calibration code in order to set the calibration of the current transformer. For example, one or more fuses may be burned to lock in a certain configuration of the current transformer.

Abstract: A method for determining an electric current includes sending the electric current to be measured through a shunt arrangement that includes at least three identical resistors. The at least three identical resistors are thermally coupled to a common base plate and are electrically interconnected such that the electric current is at least partially divided such that a first local current through a first resistor is not equal to a second local current through a second resistor. The method also includes measuring, at the shunt arrangement, a first voltage and a second voltage via which the voltage dropping across a first resistor and across a second resistor are directly or indirectly determinable, and determining the electric current via the first voltage and the second voltage. A heating in the shunt arrangement generated by the electric current is at least partially taken into account in the determining the electric current.

Abstract: The present invention relates to a multistory electronic device testing apparatus, which mainly comprises a feeding and binning device, a multi-axis transfer device, a chip-testing device and a main controller. The feeding and binning device includes an upper module and a lower module. The chip-testing device includes a plurality of testing units arranged vertically. The main controller not only controls the feeding, binning and testing operations, but also controls the multi-axis transfer device to transfer an electronic device to be tested or a tested electronic device between the feeding and binning device and the chip-testing device. Accordingly, the three-dimensional arrangement of the feeding and binning module and the testing device is realized, and the accommodating capacity and the testing capacity for the electronic devices to be tested and the tested electronic devices can be increased.

Abstract: A device binning and/or matching process includes measuring with a testing device currents and/or voltages of a device with respect to time, determining with the testing device binning and/or matching criteria for the device based on transfer data generated from the device currents and/or the voltages measured with respect to time, and outputting with the testing device the binning and/or matching criteria for the device. A system and power module are also disclosed.