Abstract: An output buffer includes first and second input transistors, first and second output loads and a current source. The first and second input transistors have first current electrodes that are commonly coupled to each other and control electrodes that are respectively coupled to a first differential input signal and a second differential input signal. The first and second output loads are coupled between a first power supply voltage and the first and second input transistors, respectively, wherein an output terminal is coupled to a node where the first output load is coupled to the first input transistor. The current source is coupled between the first current electrodes of the first and second input transistors and a second power supply voltage, wherein the second output load has an impedance value substantially one half of an impedance value of the first output load. Therefore, a differential output signal may be outputted through a single output terminal.

Abstract: A circuit for enabling reading data in an asynchronous FIFO memory of an integrated circuit is described. The circuit comprises a memory storing data in a plurality of slots having a corresponding plurality of addresses. A write address counter stores a write address count, while a read address counter stores a read address count. Finally, a backup circuit receives a read address associated with data read from a slot of the plurality of slots. According to an alternate embodiment, a most significant bit circuit is coupled to an output of the write address counter for setting the most significant bit of the write address. A method of reading data stored in an asynchronous FIFO memory of an integrated circuit is also disclosed.

Abstract: There is disclosed a static random access memory (SRAM) device that stores an embedded program that is accessible when the SRAM device is powered up. The SRAM device comprises a plurality of storage cells, each of the storage cells comprises a data latch having an input and an output, wherein the data latch comprises a) a first inverter having an input coupled to the first I/O line and an output coupled to the second I/O line, and b) a second inverter having an input coupled to the second I/O line and an output coupled to the first I/O line. The storage cell also comprises a biasing circuit that forces at least one of the first and second I/O lines to a known logic state when power is applied to the SRAM device. The known logic state comprises one bit in the embedded program.

Abstract: A full-stress testable memory device having an open bit line architecture and a method of testing the memory device. The memory device of the invention includes dummy bit lines, and a voltage controller connected to the dummy bit lines. The voltage controller alternately provides a first variable control voltage and a second variable control voltage to the dummy bit lines during a test mode. In accordance with a method of testing the memory device, a fixed voltage is provided to the dummy bit lines of the edge sub-arrays during a normal operation mode. However, during a test mode, the fixed voltage being applied to the dummy bit line is replaced with a supply voltage and/or a ground voltage, so that all of the sub-arrays can be equally tested.

Abstract: A non-volatile semiconductor device has a memory cell array having electrically erasable programmable non-volatile memory cells, reprogramming and retrieval circuits that temporarily store data to be programmed in the memory cell array and sense data retrieved from the memory cell array. Each reprogramming and retrieval circuit has first and second latches that are selectively connected to the memory cell array and transfer data. A controller controls the reprogramming and retrieval circuits on a data-reprogramming operation to and a data-retrieval operation from the memory cell array. Each reprogramming and retrieval circuit has a multilevel logical operation mode and a caching operation mode. In the multilevel logical operation mode, re-programming and retrieval of upper and lower bits of two-bit four-level data is performed using the first and the second latches to store the two-bit four-level data in one of the memory cells in a predetermined threshold level range.

Abstract: The present invention provides a storage device including a first electrode, a plurality of second electrodes arranged opposite the first electrode across a gap, and a particle which is selectively placed in one of the gaps between the first electrode and the second electrodes and which is movable between the first electrode and the second electrode and between the adjacent second electrodes. A stored state is determined utilizing the presence of the particle.

Abstract: A logic device operates with reduced leakage current. Controllability is achieved by using a reference voltage to control the amount of leakage reduction. A method of temperature dependent reference voltage generation is given which maintains virtual supply in acceptable range to provide sufficient noise margin in logic devices including memory cells.

Abstract: A semiconductor device includes an interface which executes an interfacing process with a semiconductor memory, and a circuit which performs control to write serial data to the semiconductor memory while skipping a position of a defective column on the semiconductor memory.

Abstract: A decoding signal circuit is configured to generate a dual operation decoding signal that enables a read operation and a write operation to be performed in one clock cycle. The decoding signal circuit is configured such that a read decoding signal and a write decoding signal are generated and multiplexed together to form the dual operation decoding signal. The memory device receives a read address and a write address consecutively in one cycle to generate the dual operation decoding signal. A single operation, such as a read only operation or a write only operation, can be performed as well as the dual operation of performing the read operation and the write operation in the same cycle.

Abstract: A method and apparatus for regulating voltages in semiconductor devices. Trim bits are stored in a trim flash array, where the trim bits define a voltage value and where the voltage value is accessible once a control signal representing a word line signal is provided to the trim flash array reaches a selected voltage level. A refresh signal is provided to a voltage regulator in response to the control signal reaching the selected level, causing the voltage regulator to change its regulation value to that defined by the trim bits. A signal at a voltage level represented by the voltage value is provided to a memory array that is accessed based on the provided signal.

Abstract: An EEPROM cell includes first and second assist gates on opposite sides of a charge retaining insulating layer. Current in the EEPROM memory cell flows between inversion layers, which are created in response to a bias applied to the assist gates. The insulating layer can include silicon nitride, which is provided between layers of silicon dioxide above the channel region, such that these layers can constitute a dielectric stack, which can be fabricated to occupy a relatively small area.

Abstract: A semiconductor integrated circuit device includes a plurality of sense amplifier line pairs, a plurality of sense amplifier latch circuits respectively connected to the sense amplifier line pairs, and a sense amplifier driver circuit which supplies a sense amplifier activation signal to the sense amplifier latch circuits. The sense amplifier driver circuit is provided for each of the plurality of sense amplifier latch circuits and supplies the sense amplifier activation signal to each of the plurality of sense amplifier latch circuits.

Abstract: A non-volatile memory cell includes a switch able resistor memory element in series with a switch device. An array of such cells may be programmed using only positive voltages. A method for programming such cells also supports a direct write of both 0 and 1 data states without requirement of a block erase operation, and is scaleable for use with relatively low voltage power supplies. A method for reading such cells reduces read disturb of a selected memory cell by impressing a read bias voltage having a polarity opposite that of a set voltage employed to change the switch able resistor memory element to a low resistance state. Such programming and read methods are well suited for use in a three-dimensional memory array formed on multiple levels above a substrate, particularly those having extremely compact array line drivers on very tight layout pitch.

Abstract: An optoelectronic device is disclosed with a light source, a wave guide and a first signal line, wherein a cell is formed at the intersection between the wave guide and the first signal line. The cell includes a light activated switch and an output device. The optoelectronic device may be an optoelectronic memory wherein the output device is a storage unit. Alternatively the optoelectronic device may be an optoelectronic display device wherein the output device is a light emitting device or a liquid crystal device.

Abstract: A circuit and method for producing a read clock signal in a semiconductor memory device from an input clock signal to ensure that the read access time does not exceed the clock cycle time. One of a plurality of delay amounts is selected to be imposed on the input clock signal depending on the frequency of the clock signal.

Abstract: An CMOS image sensor includes a photodiode region generating electrical charges in response to incident light received thereat. In one example, the CMOS image sensor further includes first and second transfer gates adapted to prevent or substantially prevent the electrical charges from overflowing into a floating diffusion region or a storage diffusion region located on opposite sides of the photodiode region. In this example, a read diffusion region is formed in the semiconductor substrate on an opposite side of the storage diffusion region relative to the photodiode region and a reset diffusion region is formed in the semiconductor substrate on an opposite side of the floating diffusion region relative to the photodiode region. The read diffusion region may be electrically connected to the floating diffusion region by a connection line.

Abstract: A power transistor has a semiconductor volume including a plurality of transistor cells connected in parallel, a laterally oriented, highly conductive semiconductor layer buried below the transistor cells in the semiconductor volume, and at least one connection, via which the buried semiconductor layer can be contact-connected from the top side of the power transistor. At least one connection is formed within a trench extending from the top side of the power transistor towards the buried semiconductor layer.

Abstract: An electronic device includes a memory cell that utilizes a bi-directional low impedance, low voltage drop full pass gate to connect a bit cell to a bit write line during a write phase, and during a read phase the full pass gate can remain off and a high input impedance read port can acquire and transmit the logic state stored by the memory cell to another subsystem. The full pass gate can be implemented by connecting a P type metal semiconductor field effect transistor (PMOS) in parallel with an NMOS device and driving the gates of the transistors with a differential signal. When a write operation requires a current to flow in a first direction, the PMOS device provides a negligible voltage drop, and when the write operation requires current to flow in a second or the opposite direction, the NMOS device can provide a negligible voltage.

Abstract: A device including a command decoder to receive a compound command, a timer to begin operating if the compound command includes an activate command and a precharge command, the timer to begin operating at substantially the same time as the activate command is issued, and control logic coupled to the command decoder to precharge bit lines no earlier than when the timer reaches a target time period.

Abstract: A semiconductor memory such as a dynamic RAM having memory mats each divided into a plurality of units or sub-memory mats. Each sub-memory mat comprises: a memory array having sub-word lines and sub-bit lines intersecting orthogonally and dynamic memory cells located in lattice fashion at the intersection points between the intersecting sub-word and sub-bit lines; a sub-word line driver including unit sub-word line driving circuits corresponding to the sub-word lines; a sense amplifier including unit amplifier circuits and column selection switches corresponding to the sub-bit lines; and sub-common I/O lines to which designated sub-bit lines are connected selectively via the column selection switches. The sub-memory mats are arranged in lattice fashion.