Abstract: A solder paste for the mounting of electronic components and substrates contains a mixture of oxalic acid, adipic acid, and an amine component. An electronic component may be mounted on a substrate through the use of the solder paste. Also, a module may utilize the solder paste.
Type:
Grant
Filed:
December 12, 2014
Date of Patent:
October 8, 2019
Assignee:
Heraeus Deutschland GmbH & Co. KG
Inventors:
Jens Nachreiner, Joachim Wiese, Sebastian Fritzsche
Abstract: Disclosed is a method for generatively producing components by layer-by-layer building from a powder material by selective material bonding of powder particles by a high-energy beam. An eddy current testing is carried out concurrently with the material bonding. Also disclosed is an apparatus which is suitable for carrying out the method.
Type:
Grant
Filed:
July 8, 2014
Date of Patent:
October 1, 2019
Assignee:
MTU AERO ENGINES AG
Inventors:
Andreas Jakimov, Georg Schlick, Joachim Bamberg, Thomas Hess
Abstract: A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.
Type:
Grant
Filed:
July 24, 2017
Date of Patent:
September 24, 2019
Assignees:
DAIHEN CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
Abstract: The austenitic heat resistant steel of the embodiment contains: 24 to 50% by mass of Ni, 5 to 13% by mass of Cr, 0.1 to 12% by mass of Co, 0.1 to 5% by mass of Nb, 0.1 to 0.5% by mass of V, 1.90 to 2.35% by mass of Ti, 0.01 to 0.30% by mass of Al, 0.001 to 0.01% by mass of B, 0.001 to 0.1% by mass of C, and the balance being Fe and inevitable impurities.
Abstract: An iron powder for dust cores has an apparent density is 3.8 g/cm3 or more, a mean particle size (D50) is 80 ?m or more, 60% or more of powder with a powder particle size of 100 ?m or more has a mean grain size of 80 ?m or more inside the powder particle, an area ratio of inclusions to a matrix phase of the powder is 0.4% or less, and a micro Vickers hardness (testing force: 0.245 N) of a powder cross-section is 90 Hv or less. It is thus possible to obtain iron powder for dust cores in order to manufacture a dust core that has low hysteresis loss even after the iron powder is formed and subjected to strain relief annealing.
Abstract: A grain-oriented electrical steel sheet, on which magnetic domain refining treatment by strain application has been performed, has an insulating coating with excellent insulation properties and corrosion resistance. In a grain-oriented electrical steel sheet, linear strain having been applied thereto by irradiation with a high-energy beam, the linear strain extending in a direction that intersects a rolling direction of the steel sheet, an area ratio of irradiation marks within an irradiation region of the high-energy beam is 2% or more and 20% or less, an area ratio of protrusions with a diameter of 1.5 ?m or more within a surrounding portion of the irradiation mark is 60% or less, and an area ratio of exposed portions of steel substrate in the irradiation mark is 90% or less.
Abstract: An unoriented silicon steel having high magnetic conductivity and low iron loss at a working magnetic density of 1.0-1.5 T and method for manufacturing same. By proper deoxidation control in a RH refining and high-temperature treatment for a short time in a normalizing step, the method can reduce the amount of inclusions in the silicon steel and improve grain shape, so as to improve the magnetic conductivity and iron loss of the unoriented silicon steel at a magnetic density of 1.0-1.5 T.
Type:
Grant
Filed:
March 29, 2012
Date of Patent:
August 20, 2019
Assignee:
Baoshan Iron & Steel Co., Ltd.
Inventors:
Liang Zou, Bo Wang, Xiandong Liu, Aihua Ma, Shishu Xie, Hongxu Hei
Abstract: By using, as a raw material, a thick hot-rolled steel sheet having a chemical composition containing, by mass %, C: 0.02% or more and 0.10% or less, Si: 0.05% or more and 0.30% or less, Mn: 0.80% or more and 2.00% or less, and Nb: 0.010% or more and 0.100% or less and satisfying the condition that a carbon equivalent Ceq is 0.25% or more and 0.50% or less, a microstructure including a bainitic ferrite phase and/or a bainite phase, a high strength of 52 ksi or more in terms of yield strength and a high toughness of ?45° C. or lower in terms of fracture transition temperature vTrs, and satisfying the condition that the ratio of the average crystal grain size of the coarsest-grain portion to the average crystal grain size of the finest-grain portion is 2.0 or less in every portion in the wall thickness direction is obtained.
Type:
Grant
Filed:
July 8, 2014
Date of Patent:
August 20, 2019
Assignee:
JFE Steel Corporation
Inventors:
Sota Goto, Shunsuke Toyoda, Takatoshi Okabe
Abstract: A method for the manufacture of a component of defined geometry from two or more materials using a powder bed ALM process includes providing a bed of a first powdered material, selectively fusing portions of the first powdered material to build up a first three dimensional portion of the component geometry and fusing a powder containment bund from the first material to contain unfused first powdered material. A bed of a second powdered material is deposited onto the powder containment bund and selectively fused to build up a second three dimensional portion of the component geometry. Unfused first powdered material can subsequently be removed from a first side of the bund and unfused second powder from a second side of the bund. Remaining parts of the bund which do not form part of the defined geometry of the component can be removed to provide the net shape component.
Abstract: A solder paste whereby metal does not flow out of a joint during a second or subsequent reflow heating stage. The solder paste exhibits high joint strength at room temperature and at high temperatures, excels in terms of temporal stability, exhibits minimal void formation, and can form highly cohesive joints. The solder paste comprises a powdered metal component and a flux component, the powdered metal component comprising: a powdered intermetallic compound that comprises copper and tin and has metal barrier layers covering the surfaces thereof and a solder powder including tin as a main component. Neither the powdered intermetallic compound nor the solder powder contains a copper-only phase, inhibiting the elution of copper ions into the flux.
Abstract: Iron-based metallurgical powders comprising vanadium are described, as well as compacted articles made thereof. These articles have improved mechanical properties.
Type:
Grant
Filed:
April 6, 2016
Date of Patent:
July 16, 2019
Assignee:
Hoeganaes Corporation
Inventors:
Christopher T. Schade, Bruce Lindsley, Thomas F. Murphy, Wing-Hong Chen
Abstract: The disclosure relates to an apparatus for manufacturing a metallic component, and corresponding methods. The apparatus may include a build plate with a build surface and an aperture. The apparatus may also include an actuator operable to translate a metallic component such that an end portion of the metallic component is positioned within the aperture of the build plate and below the build surface. The apparatus may further include a seal coupled within the aperture of the build plate and configured to engage the end portion of the metallic component. The aperture of the build plate, the seal, and the end portion of the metallic component may cooperate to form a powder bed to hold metallic powder therein. The apparatus may also include an external heat control mechanism operable to form a predetermined temperature profile of the end portion of the component to prevent cracking of the component.
Type:
Grant
Filed:
August 27, 2015
Date of Patent:
July 9, 2019
Assignee:
General Electric Company
Inventors:
William Thomas Carter, Mark Kevin Meyer, Andrew David Deal, Mark Allen Cheverton, Samar Jyoti Kalita, Michael Francis Xavier Gigliotti
Abstract: The present disclosure relates to a production of a high-strength steel sheet with excellent combination of strength and ductility, and a method of manufacturing the same. In accordance with a method of manufacturing a high-strength steel sheet, the method may include: heating a steel sheet which can have a residual austenite upon cooling, to form an austenite; primary cooling the austenitized steel sheet to T1 for a bainite region and subjecting to a primary isothermal transformation; and secondary cooling the primary isothermal transformed steel sheet to T2, which is lower than T1 by 50° C. ore more, for a bainite region, and subjecting to a secondary isothermal transformation.
Type:
Grant
Filed:
December 16, 2015
Date of Patent:
July 9, 2019
Assignee:
KOREA INSTITUTE OF MACHINERY AND MATERIALS
Abstract: The invention provides rare earth-free permanent magnetic materials and methods of making them. The materials can be used to produce magnetic structures for use in a wide variety of commercial applications, such as motors, generators, and other electromechanical and electronic devices. Magnets fabricated using the materials can be substituted for magnets requiring rare earth elements that are costly and in limited supply. The invention provides two different types of magnetic materials. The first type is based on an iron-nickel alloy that is doped with one or more doping elements to promote the formation of L10 crystal structure. The second type is a nanocomposite particle containing magnetically hard and soft phases that interact to form an exchange spring magnetic material. The hard phase contains Fe or FeCo, and the soft phase contains AlMnC.
Type:
Grant
Filed:
July 16, 2012
Date of Patent:
June 25, 2019
Assignees:
Northeastern University, Carnegie Mellon University
Abstract: A method of printing solder paste on a substrate through minute apertures in a mask member, in which the solder paste is supplied to the apertures of the mask member under less than atmospheric pressure and has a viscosity so that the solder paste is filled in the apertures under atmospheric pressure. It is preferable that the solder paste has a viscosity of 50 through 150 Pa·s and a thixotropic ratio of 0.3 through 0.5. Further, the solder paste is obtained by mixing a flux containing solvent having a boiling point such that volatilization thereof is suppressed under the less than atmospheric pressure and solder powders. It is preferable that in the flux, the solvent having the boiling point of 240° C. or more is used and the solvent is octanediol.
Abstract: Disclosed herein are copper-containing (Cu-containing) conductive pastes, copper (Cu) electrodes formed by firing the Cu-containing conductive paste over a substrate, and articles comprising a structural element with such Cu electrodes, wherein, the Cu-containing conductive paste contains a powder mixture of Cu, Ge, and B particles dispersed in an organic medium.
Abstract: A high-carbon hot rolled steel sheet with excellent hardenability and small in-plane anisotropy, and a method for manufacturing the steel sheet are provided. The steel sheet has a chemical composition including, by mass %, C: 0.20 to 0.48%, Si: not more than 0.1%, Mn: not more than 0.5%, P: not more than 0.03%, S: not more than 0.01%, sol. Al: not more than 0.10%, N: not more than 0.005% and B: 0.0005 to 0.0050%, the balance including Fe and inevitable impurities. The steel sheet includes a microstructure containing ferrite and cementite. The cementite has an average grain size of not more than 1.0 ?m. The steel sheet has an in-plane anisotropy of r value, ?r, of not more than 0.1 in absolute value.
Abstract: In a solder alloy consisting essentially of tin, silver, copper, bismuth, antimony, indium, and nickel, the content ratio of the silver is 0.05 mass % or more and below 0.2 mass %; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is above 4.0 mass % and 10 mass % or less; the content ratio of the antimony is 0.005 mass % or more and 8 mass % or less; the content ratio of the indium is 0.005 mass % or more and 2 mass % or less; the content ratio of the nickel is 0.003 mass % or more and 0.4 mass % or less; and the content ratio of the tin is the remaining ratio and the mass ratio (Bi/Ni) of the bismuth content with respect to the nickel content is 35 or more and 1500 or less.
Abstract: A solder alloy suitable for high temperature environments, such as for example electronic systems used in an oil or gas well where the temperature may be in the region of 175° C., the solder alloy having a Silver weight % in the range of 3.5 to 7.0, a Copper weight % in the range of 1.0 to 4.0, and an Antimony weight % in the range of 1.0 to 3.0. Other embodiments are described and claimed.
Type:
Grant
Filed:
May 4, 2016
Date of Patent:
May 21, 2019
Assignee:
Halliburton Energy Services, Inc.
Inventors:
Andrew Albert Hrametz, Alexander T. Duncan
Abstract: In accordance with an exemplary embodiment, a high-strength brass alloy includes, by mass %, about 1.3% to about 2.3% of aluminum (Al), about 1.5% to about 3.0% of manganese (Mn), about 1% maximum of iron (Fe), about 1% maximum of nickel (Ni), about 0.4% maximum of tin (Sn), about 0.5% to about 2.0% of silicon (Si), about 57% to about 60% of copper (Cu), less than about 0.1% of lead (Pb), and the balance of zinc (Zn) and inevitable impurities, with the proviso that the ratio of Si/Mn is in the range of about 0.3 to about 0.7, and with the further proviso that the “zinc equivalent” content according to the following formula: ZnEq=Zn+Si*10?Mn/2+Al*5 is from about 51% to about 58%.