Patents Examined by Weiping Zhu
  • Patent number: 10894291
    Abstract: Provided is a method for manufacturing a sintered component having a hole formed therein, in which a sintered component having no defect, such as cracks, can be manufactured with good productivity and also a reduction in tool life accompanied by forming the hole can be suppressed. The method for manufacturing a sintered component includes a molding step of press-molding a raw material powder containing a metal powder and thus fabricating a green body; a drilling step of forming a hole in the green body using a candle-type drill and thus forming a thin-walled portion, of which a thickness Gt as measured between an inner circumferential surface of the hole and an outer surface of the green body is smaller than a diameter Gd of the hole; and a sintering step of sintering the green body after the drilling step.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: January 19, 2021
    Assignee: Sumitomo Electric Sintered Alloy, Ltd.
    Inventors: Yasunori Sonoda, Ryota Take
  • Patent number: 10889872
    Abstract: In one aspect, methods of foil ling tooling articles from tool steel powder compositions via additive manufacturing techniques are described herein. A method of forming a tooling article comprises consolidating powder alloy into the tooling article via an additive manufacturing technique and heat treating the tooling article to provide the tooling article hardness of 35 to 65 HRC. The tooling article can be formed of an alloy composition comprising 0.2-2 weight percent carbon, 0-1 weight percent manganese, 0-1.5 weight percent silicon, 0-0.3 weight percent nickel, 0-15 weight percent cobalt, at least two of chromium, molybdenum, tungsten and vanadium in a combined amount of 5-25 weight percent and the balance iron. As described herein, the method can further comprise hot isostatic pressing the tooling article prior to the heating treatment.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: January 12, 2021
    Assignee: KENNAMETAL INC.
    Inventors: Jason W. Goldsmith, Yingwei Wu
  • Patent number: 10888960
    Abstract: Provided is a solder alloy that contains 0.01 mass % or more and 0.1 mass % or less of Fe, 0.005 mass % or more and less than 0.02 mass % of Co, 0.1 mass % or more and 4.5 mass % or less of Ag, 0.1 mass % or more and 0.8 mass % or less of Cu, and the balance being Sn.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: January 12, 2021
    Assignee: KOKI Company Limited
    Inventors: Kazuhiro Yukikata, Mitsuyasu Furusawa, Kimiaki Mori
  • Patent number: 10888961
    Abstract: The joining material of the present invention is a joining material which contains a first metal powder and a second metal powder having a higher melting point than the first metal powder, in which the first metal powder is formed of Sn or an alloy containing Sn, the second metal powder is formed of a Cu—Ni alloy in which a proportion of Ni is 5 wt % or more and 30 wt % or less, a Cu—Ni—Co alloy in which a total of a proportion of Ni and a proportion of Co is 5 wt % or more and 30 wt % or less, or a Cu—Ni—Fe alloy in which a total of a proportion of Ni and a proportion of Fe is 5 wt % or more and 30 wt % or less, and a 90% volume grain size D90 of the second metal powder is 0.1 ?m or more.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: January 12, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yoshihiro Kawaguchi
  • Patent number: 10888959
    Abstract: The Cu core ball contains a Cu ball and a solder layer for covering a surface of the Cu ball. The Cu ball contains at least one element selected from Fe, Ag, and Ni in a total amount of 5.0 or more to 50.0 ppm by mass or lower, S in an amount of 0 or more to 1.0 ppm by mass or lower, P in an amount of 0 or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities. The Cu ball contains purity which is 99.995% or higher and 99.9995% by mass or lower, and sphericity which is 0.95 or higher. The solder layer includes Ag in an amount of more than 0 to 4.0% by mass or less, Cu in an amount of more than 0 to 3.0% by mass or less, and remainder of Sn.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: January 12, 2021
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Hiroyoshi Kawasaki, Shigeki Kondoh, Hiroki Sudo, Masato Tsuchiya, Takashi Yashima, Takahiro Roppongi, Daisuke Soma
  • Patent number: 10875098
    Abstract: A method of forming monodispersed metal nanowires comprising: forming a reaction mixture including a metal salt, a capping agent and an ionic additive in a reducing solvent; and reducing the metal salt to the monodispersed metal nanostructures.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: December 29, 2020
    Assignee: Cambrios Film Solutions Corporation
    Inventor: Pierre-Marc Allemand
  • Patent number: 10870150
    Abstract: A method of additive manufacture suitable for large and high resolution structures is disclosed. The method may include sequentially advancing each portion of a continuous part in the longitudinal direction from a first zone to a second zone. In the first zone, selected granules of a granular material may be amalgamated. In the second zone, unamalgamated granules of the granular material may be removed. The method may further include advancing a first portion of the continuous part from the second zone to a third zone while (1) a last portion of the continuous part is formed within the first zone and (2) the first portion is maintained in the same position in the lateral and transverse directions that the first portion occupied within the first zone and the second zone.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: December 22, 2020
    Assignee: SEURAT TECHNOLOGIES, INC.
    Inventors: James A. DeMuth, Erik Toomre, Francis L. Leard, Kourosh Kamshad, Heiner Fees, Eugene Berdichevsky
  • Patent number: 10865467
    Abstract: The use of a specific molybdenum-silicon-boron alloy and a particular production process in which powder is used makes it possible to achieve components which have a particular fiber-matrix structure and can be used for high-temperature applications and can also be produced inexpensively.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: December 15, 2020
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Michael Ott, Sebastian Piegert
  • Patent number: 10851440
    Abstract: Novel metallic systems and methods for their fabrication provide high temperature machine parts formed of a consolidated nano-crystalline metallic material. The material comprises a matrix formed of a solvent metal having a melting point greater than 1,250° C. with crystalline grains having diameters of no more than about 500 nm, and a plurality of dispersed metallic particles formed on the basis of a solute metal in the solvent metal matrix and having diameters of no more than about 200 nm. The particle density along the grain boundary of the matrix is as high as about 2 nm2 of grain boundary area per particle so as to substantially block grain boundary motion and rotation and limit creep at temperatures above 35% of the melting point of the consolidated nano-crystalline metallic material. The machine parts formed may include turbine blades, gears, hypersonics, radiation shielding, and other high temperature parts.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: December 1, 2020
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Kristopher Allen Darling, Scott Martin Grendahl, Laszlo John Kecskes, Kiran N. Solanki, Heather Ann Murdoch, Thomas Lee Luckenbaugh, Anthony James Roberts, Billy Chad Hornbuckle
  • Patent number: 10843273
    Abstract: The present invention relates to methods of purifying nanostructures. The nanostructures may be silver nanowires.
    Type: Grant
    Filed: November 11, 2016
    Date of Patent: November 24, 2020
    Assignee: QUANTUM CHEMICAL TECHNOLOGIES (SINGAPORE) PTE. LTD.
    Inventors: Kai Hwa Chew, Meng Kiong Lim, Yong Ling Wu, Hui Huang
  • Patent number: 10843260
    Abstract: A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: November 24, 2020
    Assignees: DAIHEN CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Ryusuke Tsubota, Jyunichi Tanaka, Yohei Oka, Takayuki Nakamoto, Takahiro Sugahara, Mamoru Takemura, Sohei Uchida
  • Patent number: 10843265
    Abstract: A method of additive manufacture is disclosed. The method may include restricting, by an enclosure, an exchange of gaseous matter between an interior of the enclosure and an exterior of the enclosure. The method may further include running multiple machines within the enclosure. Each of the machines may execute its own process of additive manufacture. While the machines are running, a gas management system may maintain gaseous oxygen within the enclosure at or below a limiting oxygen concentration for the interior.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: November 24, 2020
    Assignee: SEURAT TECHNOLOGIES, INC.
    Inventors: James A. DeMuth, Erik Toomre, Francis L. Leard, Kourosh Kamshad, Heiner Fees, Eugene Berdichevsky
  • Patent number: 10843266
    Abstract: A method of additive manufacture is disclosed. The method may include creating, by a 3D printer contained within an enclosure, a part having a weight greater than or equal to 2,000 kilograms. A gas management system may maintain gaseous oxygen within the enclosure atmospheric level. In some embodiments, a wheeled vehicle may transport the part from inside the enclosure, through an airlock, as the airlock operates to buffer between a gaseous environment within the enclosure and a gaseous environment outside the enclosure, and to a location exterior to both the enclosure and the airlock.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: November 24, 2020
    Assignee: SEURAT TECHNOLOGIES, INC.
    Inventors: James A. DeMuth, Erik Toomre, Francis L. Leard, Kourosh Kamshad, Heiner Fees, Eugene Berdichevsky
  • Patent number: 10836000
    Abstract: A flux includes a rosin resin, an activator, a thixotropic agent, and a solvent. The solvent includes 30% by mass or more and 60% by mass or less monovalent alcohol with respect to a total mass amount of the flux. The monovalent alcohol has 18 or more and 24 or less of carbon atoms in one molecule.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: November 17, 2020
    Assignee: TAMURA CORPORATION
    Inventors: Masanori Shibasaki, Jun Sugimoto, Isao Sakamoto
  • Patent number: 10837074
    Abstract: A method for manufacturing a high strength galvanized steel sheet and a high strength galvanized steel sheet are provided. A base steel sheet having a chemical composition comprising C: 0.03% to 0.35%, Si: 0.01% to 0.50%, Mn: 3.6% to 8.0%, Al: 0.001% to 1.000%, P?0.10%, S?0.010%, and the balance comprising Fe and incidental impurities, on a percent by mass basis, is subjected to annealing and galvanization treatment, wherein the maximum steel sheet temperature in an annealing furnace is 600° C. or higher and 700° C. or lower, the steel sheet transit time in a temperature region of the maximum steel sheet temperature of 600° C. or higher and 700° C. or lower is specified to be 30 seconds or more and 10 minutes or less, and the dew point in an atmosphere is specified to be ?45° C. or lower.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: November 17, 2020
    Assignee: JFE STEEL CORPORATION
    Inventors: Yusuke Fushiwaki, Yoshiyasu Kawasaki, Yasunobu Nagataki
  • Patent number: 10818831
    Abstract: A method for producing a thermoelectric object for a thermoelectric conversion device is provided. A starting material which has elements in the ratio of a half-Heusler alloy is melted and then cooled to form at least one ingot. The ingot is homogenized at a temperature of 1000° C. to 1400° C. for a period of time t, wherein 0.5 h?t<12 h or 24 h<t<100 h. The homogenized ingot is crushed and ground into a powder. The powder is cold-pressed and sintered at a maximum pressure of 1 MPa for 0.5 to 24 h at a temperature of 1000° C. to 1500° C.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: October 27, 2020
    Assignee: VACUUMSCHMELZE GMBH & CO. KG
    Inventors: Michael Mueller, Alberto Bracchi, Joachim Gerster
  • Patent number: 10808292
    Abstract: Provided is a method of manufacturing an HPF part comprising: preparing a steel sheet comprising C: 0.18% to 0.25%, Si: 0.1% to 1.0%, Mn: 0.9% to 1.5%, P: 0.03% or less, S: 0.01% or less, Al: 0.01% to 0.05%, Cr: 0.05% to 0.5%, Ti: 0.01% to 0.05%, B: 0.001% to 0.005%, N: 0.009% or less, and a balance of Fe and impurities; heating the steel sheet at 550° C. to 850° C. followed by maintaining at 640° C. to 680° C., and immersing the steel sheet in a hot dip aluminum plating bath, and a balance of Al and impurities; cooling the plated steel sheet at 15° C./s or faster; heating the cooled hot dip aluminum plated steel sheet at 880° C. to 930° C. followed by maintaining for a certain time; and hot forming the alloyed hot dip aluminum plated steel sheet and quenching at a range of 300° C. or lower at the same time.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: October 20, 2020
    Assignee: POSCO
    Inventors: Il-Ryoung Sohn, Dae-Chul Bae, Heung-Yun Kim
  • Patent number: 10807162
    Abstract: A system for additive metal manufacturing, including a deposition mechanism, a translation mechanism mounting the deposition mechanism to the working volume, and a stage. A method for additive metal manufacturing including: selectively depositing a material carrier within the working volume; removing an additive from the material carrier; and treating the resultant material.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: October 20, 2020
    Assignee: Mantle Inc.
    Inventors: Stephen T. Connor, Theodore C. Sorom, James R. Groves
  • Patent number: 10807164
    Abstract: An nitrogen solid solution titanium sintered compact includes a matrix made of a titanium component having an ?-phase, nitrogen atoms dissolved as a solute of solid solution in a crystal lattice of the titanium component, and metal atoms dissolved as a solute of solid solution in the crystal lattice of the titanium component.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: October 20, 2020
    Assignee: HI-LEX CORPORATION
    Inventor: Katsuyoshi Kondoh
  • Patent number: 10792731
    Abstract: The present disclosure provides systems and methods for the formation of three-dimensional objects. A method for forming a three-dimensional object may comprise alternately and sequentially applying a stream comprising a binding substance to an area of a layer of powder material in a powder bed, and generating at least one perimeter of the three-dimensional object in the area. The stream may be applied in accordance with a model design of the three-dimensional object. The at least one perimeter may generated in accordance with the model design.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: October 6, 2020
    Assignee: 3DEO, INC.
    Inventors: Payman Torabi, Matthew Petros