Abstract: A method of augmenting the separation of immiscible heavier and lighter components of an emulsion including the steps of conducting the emulsion into a treatment vessel, providing an AC voltage source, employing from the source an AC voltage of at least one selected frequency F1 to establish at least one electric filed within the vessel through which the emulsion passes, and cyclically modulating the AC voltage with a method of modulation selected from: (a) amplitude modulation; (b) frequency modulation; and (c) combined amplitude and frequency modulation.

Abstract: Lightweight and reactive metals can be produced from ore, refined from alloy, and recycled from metal matrix composites using electrolysis in electrolytes including an ionic liquid containing a metal chloride at or near room temperature. Low electric energy consumption and pollutant emission, easy operation and low production costs are achieved.

Abstract: Methods for electrodeposition of copper on a noble metal layer of a work piece are provided. An exemplary method includes exposing the noble metal layer to an electrodeposition composition. The electrodeposition composition comprises a copper salt, a suppressor, an accelerator and an electrolyte. The electrodeposition of copper on a surface of the noble metal layer is initiated by application of a predetermined current density to the work piece. The electrodeposition of copper is terminated upon the occurrence of a predetermined event.

Abstract: Pulse reverse electrolysis of acid copper solutions is used for applying copper deposits of a controlled hardness for applications such as producing printing cylinders. The benefits include improved production capacity. Hardness of the deposit is controlled by varying at least one factor selected from the group consisting of (i) cathodic pulse time, (ii) anodic pulse time, (iii) cathodic pulse current density, and (iv) anodic pulse current density. Preferably the ratio of cathodic pulse time to anodic pulse time is varied.

Abstract: An electroplating system (30) and process makes electrical current density across a semiconductor device substrate (20) surface more uniform during plating to allow for a more uniform or tailored deposition of a conductive material. The electrical current density modifiers (364 and 37) reduce the electrical current density near the edge of the substrate (20). By reducing the current density near the edge of the substrate (20), the plating becomes more uniform or can be tailored so that slightly more material is plated near the center of the substrate (20). The system can also be modified so that the material that plates on electrical current density modifier portions (364) of structures (36) can be removed without having to disassemble any portion of the head (35) or otherwise remove the structures (36) from the system. This in-situ cleaning reduces the amount of equipment downtime, increases equipment lifetime, and reduces particle counts.

Abstract: The invention relates to a method for darkening a superficial layer of a workpiece which contains zinc by anodic oxidation. The workpiece is oxidized in a soaking bath containing an aqueous solution comprised of a hydroxide and of a nitrate. The anodic oxidation may be carried out in an aqueous solution containing NH.sub.4 NO.sub.3 or NaNO.sub.3, and having a pH value ranging from 8 to 14, at a dipping bath temperature (T) ranging from 15 to 45.degree. C., and with a current density (i) ranging from 3.times.10.sup.?4 to 0.5 A/cm.sup.2. The workpiece is placed in the soaking bath at the beginning of the anodic oxidation after the voltage has already been applied.

Abstract: An electroplating bath medium for electroplating articles with a tin-cobalt, tin-nickel, or tin-cobalt-nickel alloy comprises: at least one tin salt; an alloying metal salt comprising a cobalt salt and/or a nickel salt; a complexant comprising a hydroxycarboxylic acid or alkali metal salt thereof such as a sodium or potassium gluconate or heptonate complexant; boric acid; and a bath soluble substituted phenolic compound. The current regime applied to the plating bath can include time intervals of direct current and of pulsed current in order to selectively control the deposition of tin by activation or diffusion control.

Abstract: Composite coating compositions, composite metallic coatings derived from these compositions, and methods of forming the composite coating compositions and composite metallic coatings, wherein the compositions and coatings comprise particles of at least one quasicrystalline metal alloy and at least one elemental metal. The methods include electrocodepositing suspended quasicrystalline metal alloy particles and dissolved metal ions onto a substrate. Preferably, the substrate is disposed in an aqueous bath containing at least one dissolved metal ion species and at least one suspended quasicrystalline metal alloy powder species. The compositions and coatings enhance the wear, friction, hardness, corrosion, and non-stick characteristics of the substrate.

Abstract: The present invention is directed to methods and compositions for depositing a noble metal alloy onto a microelectronic workpiece. In one particular aspect of the invention, a platinum metal alloy is electrochemically deposited on a surface of the workpiece from an acidic plating composition. The plated compositions when combined with high-k dielectric material are useful in capacitor structures.

Abstract: The invention relates to an electrochemical gas generator including a substrate for providing a surface for electrode deposition, a first electrode deposited on the surface for providing an electrical connection with a conducting medium, a second electrode deposited on the substrate for generating a gas, and a plurality of members extending from at least one side of the first electrode placed alternately with a plurality of extensions protruding from at least one side of the second electrode for improving generator efficiency.

Abstract: A method and apparatus for transmitting electrical signals and fluids to and/or from a microelectronic workpiece. An apparatus in accordance with one embodiment of the invention includes a shaft rotatable about a shaft axis and having a first end with a first electrical contact portion toward the first end, a second end opposite the first end, and an internal channel along the shaft axis between the first and second ends. The shaft can further have at least one first hole toward the first end with the first hole extending radially from the channel to an external surface of the shaft. The shaft can still further have at least one second hole toward the second end with the second hole extending from the channel to the external surface. A housing rotatably receives the shaft and has an aperture coupleable to a fluid source and/or fluid sink.

Abstract: A gap of a thin-film magnetic head is formed of NiP. The P content of the NiP gap layer is controlled to be within the range of 11 mass percent to 14 mass percent so that the gap layer is nonmagnetic.

Abstract: A method and apparatus for transmitting electrical signals and fluids to and/or from a microelectronic workpiece. An apparatus in accordance with one embodiment of the invention includes a shaft rotatable about a shaft axis and having a first end with a first electrical contact portion toward the first end, a second end opposite the first end, and an internal channel along the shaft axis between the first and second ends. The shaft can further have at least one first hole toward the first end with the first hole extending radially from the channel to an external surface of the shaft. The shaft can still further have at least one second hole toward the second end with the second hole extending from the channel to the external surface. A housing rotatably receives the shaft and has an aperture coupleable to a fluid source and/or fluid sink.

Abstract: A film of zinc oxide electrochemically deposited from an aqueous solution is subjected to heat treatment at a temperature equal to or higher than 150° C. and equal to or lower than 400° C. in a nitrogen or inert gas atmosphere that contains oxygen, thereby obtaining a zinc oxide film that is low in electric resistance without impairing the light transmittance of the zinc oxide film.

Abstract: Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first conductive element can have multiple electrical contacts, of identical or different configurations, or may be in the form of a conductive pad, and can contact or otherwise electrically interconnect with the substrate surface over substantially all of the substrate surface. Upon application of a potential between the first and second conductive elements while the electrolyte makes physical contact with the substrate surface and the second conductive element, the conductive material is deposited on the substrate surface. It is possible to reverse the polarity of the voltage applied between the anode and the cathode so that electro-etching of deposited conductive material can be performed.

Abstract: A method for an electroplating cell which includes providing an anode chamber with at least two concentric anodes including an inner anode and an outer anode; generating a computer generated model with a simulation computer program; and selecting at least one current ratio from the computer generated model, with the computer generated model having a plurality of current ratios from which the at least one current ratio is selected and the one current ratio being a ratio of an inner electrical current to an outer electrical current. The method further includes applying the inner electrical current to the inner anode and the outer electrical current to the outer anode and adjusting the inner and outer electrical currents to incorporate the one current ratio. The generating of the computer generated model with the simulation computer program includes using a first iterative loop to determine a potential field in the anode chamber.

Abstract: A method of producing metal particles through electrolysis. A cathode having a plurality of active zones on a surface thereof is at least partially immersed in a reaction solution. The cathode is spaced from an anode also at least partially immersed in the reaction solution. A voltage potential is applied between the anode and cathode. Metal particles form on the active zones of the cathode. In order to promote the formation of good quality particles, a turbulent flow of the solution is maintained past one or more the active zones, and the current density in the active zones is maintained greater than about 5 kA/m2. The particles may be dislodged from the cathode after they have achieved a desired size.

Abstract: An electrokinetic device is capable of operating for extended periods of time, e.g. days to a week, without producing significant gaseous byproducts and without significant evolution of the pump fluid. Features of the electrokinetic device include: the electrodes in the electrokinetic device are capacitive with a capacitance of at least 10?4 Farads/cm2; at least part of the inner surfaces of the electrodes have an area greater than the effective area of the porous dielectric material; at least part of the inner surfaces of the electrodes have a current flux less than 20 microamperes/cm2; and at least part of the inner surfaces of the electrodes have a current flux that varies by less than a factor of two. The electrokinetic device can have one or several of these features in any combination.

Abstract: A method of making a microstructure includes the steps of providing a circuit board that includes a dielectric layer and a conductor layer formed on the dielectric layer, forming a metal structure on the circuit board such that the metal structure extends through the dielectric layer, and removing at least a portion of the dielectric layer adjacent to the conductor layer and the metal structure to result in the microstructure.

Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.