Abstract: A battery powered device (100) utilizing a rechargeable battery (135) comprises a ball bearing (300) having a first diameter for receiving a current and a housing (200) having an opening (405) formed therethrough in which the ball bearing (300) is situated, wherein the opening (405) has a second diameter of less than the first diameter. The battery powered device (100) further comprises a spring (305) situated in the opening (405) in contact with the ball bearing (300) and a spring cap (310) fastened to the housing (200) for forcibly holding the spring (305) in contact with the ball bearing (300). A conductive element is coupled between the spring and the rechargeable battery such that the current received by the ball bearing (300) is supplied to the rechargeable battery (135) via the spring (310).

Abstract: A transfer molded high lead count plastic semiconductor package is described. The packaged IC chip is mounted upon a suitable leadframe and the bonding pads wire bonded to the leadframe fingers. To avoid wire shorting, due to wire sweep during transfer molding, the wires are first coated with an insulative material.

Abstract: A personal computer comprises a housing having a bottom wall. A plurality of functional components are arranged side by side on the bottom wall of the housing. A fixture plate is arranged on top of the functional components and secured to the functional components and the bottom wall by means of screws. The functional components are held between the fixture plate and the bottom wall.

Abstract: An electronic control apparatus in which each device unit is detachably mounted on an open front portion of a box-shaped main body by a press-and-clamp engaging mechanism. A nail plate is formed on both side faces of a terminal block. By engaging the nail plates with engaging holes formed in a unit main body, the terminal block can be attached to the unit main body and connected to a unit circuit board at the same time. A triangular color segment is attached to an indicator portion of each device unit for identification of its type. A palm-top type program setting unit is connected to a processing unit through lead wires. The inside circuitry of the setting unit is exposed by sliding its operation section.

Abstract: A printed chip-on-board substrate is for mounting a high-power semiconductor chip. As a construction for efficiently releasing or dissipating heat to be generated in the semiconductor chip, the printed substrate has a printed interconnected substrate and a metal plate bonded on a back side of the substrate. The printed interconnected substrate is constructed by forming an interconnected layer on a surface of the substrate. At a mount area where the semiconductor chip is to be mounted, an opening is formed reaching the metal plate. The metal plate covers the opening on the side of the back side and is formed with a thickness capable of providing rigidity sufficient to support thereon at least the semiconductor chip to be mounted.

Abstract: A terminal structure includes a portion of a flexible printed circuit board and a plurality of metal terminals each consisting of a slender, elongate metal plate. The circuit board has a plurality of electrically conductive patterns provided on a resin film, a prescribed portion of the board having a connector insertion portion of a width substantially the same as that of an insertion hole of a connector. The plurality of metal terminals are placed in parallel on the flexible printed circuit board in such a manner that distal ends thereof are situated adjacent a distal end of the connector insertion portion, and each metal terminal is fixedly bonded to a respective one of the electrically conductive patterns provided on the flexible printed circuit board.

Abstract: A package is formed of a plurality of laminated insulation plates respectively having windows formed in the central portions thereof. Metallized patterns are formed on the surface of at least one of the insulation plates. The semiconductor chip is received in a space defined by the windows of the insulation plates. The semiconductor chip and the metallized patterns are electrically connected to each other via bonding wires. Bumps are arranged as external terminals of the semiconductor chip in a grid form on the surface of one of the insulation plates which lies on the rear surface side of the package. The bumps are electrically connected to the metallized patterns via through holes formed in the insulation plates.