Abstract: A method of reducing the area of MCMs that are integral to a flexible carrier is provided. A locally complex area, i.e. multilayer MCM carrier is constructed on a flex carrier, along with other components to form a subsystem. The flex carrier provides the interface between the MCM and the system that is utilizing the function. Also, the flex carrier will receive non-complex portions of the function, e.g. low I/O devices, not required to be mounted on the complex area (MCM) of the subsystem. The locally complex functional area will contain the high performance DCA mounted components, such as custom ASICs, processors, high frequency analog parts and other high I/O chips. The MCM on flex is constructed by obtaining an appropriate flexible carrier, such as a dielectric material having electrically conductive signal lines circuitized on both sides.

Abstract: The device comprises at least one printed circuit board (11,12) on which is fixed a heightening board (15) comprising at least one opening (16) for forming with the surface of the printed circuit board (12) located in facing relation to the opening, the bottom and the lateral walls of a cavity (17) for at least one integrated circuit (18) connected with the printed circuit carried by the board defining the bottom of the cavity by means of conductive wires (19). The cavity containing the integrated circuit is filled with a resin (22) completely covering the integrated circuit. The printed circuit board (11,12) is cut on its periphery along a line of through holes (23) provided with a metal coating (24) and connected to printed conductors of the board, metallized grooves (23,24) resulting from the cutting constituting connection terminals of the device.

Abstract: A pressure-contact type semiconductor device with pressure-contact electrodes for external connection is disclosed. The pressure-contact electrodes are mounted through an insulating material on a metal substrate having semiconductor elements mounted thereon side-by-side. The pressure-contact electrodes are wire-bonded to the terminals of the semiconductor elements. Flexible insulating sheets are inserted between the metal substrate and the pressure-contact electrode and between the pressure-contact electrodes respectively. The insulating sheets are fixed onto the metal substrate and the pressure-contact electrodes through an adhesive.

Abstract: An improved electrical component package comprises a component attached to a substrate by a plurality of multisolder interconnections. Each interconnection comprises a preformed spacer bump composed of a first solder alloy, preferably a lead-base tin alloy containing greater than 90 weight percent lead. The spacer bump is directly metallurgically bonded to a metallic electrical contact of the component and rests against a corresponding metallic electrical contact of the substrate, but is not bonded thereto. Each interconnection further comprises a sheath portion formed of a second compositionally distinct solder alloy having a liquidus temperature less than the first alloy solidus temperature. A preferred second solder is a tin-lead alloy comprising between about 30 and 50 weight percent lead and the balance tin or indium.

Abstract: A cabinet system is provided formed of one or more individual electrical card cages. Each card cage contains a back wall covering as well as a redesigned lateral part instead of a standard lateral part for fastening in a cabinet. The redesigned lateral part is designed as an outside wall and permits a stacking of the card cages above one another. The stack is completed so as to form an overall cabinet assembly by providing a bottom part and a top part.

Abstract: A carrier/insertion apparatus that has a U channel handle is improved to comprise an insertion portion, a stabilizer plate, and a deflector portion. The substrate that the carrier/insertion apparatus is mounted on comprises a carrier/insertion apparatus interface region that allows the carrier/insertion apparatus to mate thereto. As the carrier/insertion apparatus is slid into place, the deflector portion deflects the substrate a predetermined distance such that the carrier/insertion apparatus can be snapped into place. This arrangement allows for the carrier/insertion apparatus to be mounted on to a substrate without the use of mechanical hardware.

Abstract: A Power box (12) for a low voltage lighting system (10). Power box (12), which connects to a 120 VAC source via 120 VAC cable (15) and a plurality of low voltage light fixtures (14) via a 12 VAC cable (16), includes a "tortuous path" strain relief (40) including a first strain relief structure (41) in a base (19) having vertically spaced horizontal ribs (44, 46, 48) and a second strain relief structure (43) in a cover (28) having corresponding vertically spaced horizontal ribs (56, 54, 52). When base (19) and cover (28) are assembled, structures (41 and 43) align such that the ribs interdigitate or mesh to form the tortuous path strain relief (40) for the 120 VAC cable (15). Another aspect of the invention is the use of a standard spade lug connector (77) and a pair of "double-L" spade lug connectors (78) for making the internal and external 12 VAC connections to a step down transformer (60) and the 12 VAC cable (16), respectively.

Abstract: A modular computer chassis comprises a main chassis to which a motherboard is attached and a subchassis attachable to the main chassis. The subchassis is capable of having at least one computer component attached thereto such that the computer component is electrically connected to the motherboard. The computer component is thus separable from the main chassis by removing the subchassis from the main chassis. The subchassis contains those computer components subject to mechanical wear and most often requiring replacement, i.e. the power supply and disk drives. The subchassis is mechanically connected to the main chassis by using slots and tabs such that when the cover is in place upon the computer, then the subchassis is secured therein. The subchassis and the computer components disposed thereon thus form a module which is conveniently removable and replaceable such that those computer components most frequently requiring service is quickly removed and replaced by a person unskilled in computer repair.

Abstract: A retainer for retaining an electronic module, such as a printed circuit board, in the slot of a casing. Oppositely oriented wedge-shaped elements are slidingly received on a rail in a manner which prevents rotation of the wedge-shaped elements about the rail. A pivotable lever having a cam surface is provided such that rotation of the lever actuates the retainer by compressing the wedge-shaped elements. In one embodiment, the lever is provided with a projection which engages the casing to extract the module when the lever is pivoted to release the retainer.

Abstract: An underground transformer cabin consisting of two prefabricated vibrated reinforced concrete units, one inside the other. A larger external unit is enclosed by a covering plate, and a smaller, internal unit is raised off a bottom of the larger external unit so that there is a wide air space between the sides and bottom of the two walls. The bottom of said smaller internal unit has windows or openings through which fresh outdoor air flows into the smaller internal unit from underneath, passing first over the transformer and then into an outlet pipe which extend externally at a height above the inlet pipe.

Abstract: An electronic package, comprising a circuit carrying substrate (30) and a semiconductor device (35). The substrate (30) has two opposing surfaces, the first or bottom surface having a plurality of solder pads (31) and the second or top surface having a circuitry pattern defined on it. A semiconductor device (35) is attached to the top surface of the circuit carrying substrate (30). A molded body (33) is formed completely around the semiconductor device (35) in order to encapsulate it, the molded body also substantially covering the top surface of the circuit carrying substrate (30). A layer of metal deposited directly on the molded body and the top surface of the circuit carrying substrate is delineated into another conductive circuitry pattern (38), with part of the pattern (36) connected to the circuitry pattern on the circuit carrying substrate. An electronic component (32) is mounted on the molded body (33) and electrically connected to the conductive circuitry pattern (38).

Abstract: An electronic package which includes a substrate having a dielectric layer, a circuitized layer located on one surface of the dielectric and a thermally and electrically conductive layer located on a second surface of the dielectric, this thermally and conductive layer designed for providing enhanced heat removal from the package's semiconductor device. A pedestal element is located on or formed as part of the thermal and electrically conductive layer, and extends through the dielectric and circuitized layers for having the semiconductor device positioned thereon. The semiconductor device is thus in substantially direct thermal communication with the pedestal element and thus the adjacent, thick thermal conductive layer which functions as the package's heat sink. In one embodiment, solder is provided on the pedestal element to interconnect desired portions of the circuitized layer with the pedestal element (e.g., to provide electrical ground).

Abstract: A bracket for fuse holders includes heat sink fins for cooling the fuse holders. The bracket has a main body conforming to the shape of the fuse holders and mounting members or feet which can be attached, using self-clinching nuts, to a printed circuit board on which the fuse holders are mounted. The heat sink is formed of fins attached to the main body. When space is limited, the fins preferably have a rectangular U-shape to provide increased cooling area. The main body provides structural rigidity to prevent the fuse holders from being dislodged due to torquing of the fuse holder caps.

Abstract: Thermally reactive lead assemblies and electronic circuits are provided which include a solderable, conductive metallic element having a first configuration at ambient temperature and a second expanded configuration at an elevated temperature, such as at soldering temperatures. The second configuration of the conductive metallic element provides electrical continuity between a pair of soldering locations of the electronic circuit, such as between a semiconductor device lead and a conductive surface on a printed circuit board.

Abstract: An electronic module housing (30) with an integral heatsink (32) is provided as part of an electronic module assembly (31). The heatsink (32) has a general U-shape formed by a pair of opposing sidewalls (33, 34) rising upward from a central intermediate portion (37) having a planar surface (38) for mounting a module substrate thereon. Plastic housing material is molded about the heatsink so as to form an interior module receiving cavity (50). The cavity is generally defined by the heatsink sidewalls (33, 34) and a pair of molded plastic opposing sidewalls (55, 56) provided between the heatsink sidewalls. Preferably heat conductive mounting ear portions (40, 41) extend from ends (43, 44) of the heatsink sidewalls and permit thermally mounting the housing to another heatsinking structure. Preferably molded interior plastic sidewalls (57, 58) separate the heatsink sidewalls (33, 34) from the cavity (50).

Abstract: Wells are formed in an external surface of a semiconductor device package body. Capacitors are disposed within the wells at least partially, and preferably fully within the body. Cleaning channels are formed underneath the capacitors, for removing residual flux and/or solder.

Abstract: An improvement in a radial-and-parallel bus structure which includes a stack assembly of bus-printed disks whose centers are arranged on common center axis. Each bus-printed disk consists of a disk of dielectric material bearing on each of its opposite major surfaces, a printed radial pattern including a plurality of printed signal conductors of equal length radially extending from the center of the disk. Each signal conductor on one of the opposite major surfaces of the disk is coupled to a corresponding signal conductor on the other major surface to make up a signal conductor pair, and every signal conductor pair is terminated with an impedance matching element which is adapted to be connected to a selected lead in a selected one of CPU boards standing upright around the stack assembly of bus-printed disks. The impedance matching element prevents signal reflections of data being transmitted between selected CPU boards.

Abstract: An electronic device including a card having first and second faces opposite each other, electrical devices including at least one of a printed circuit and a plurality of components fixed to the first face of the card, a metal plate spaced apart from the card such that a gap is formed therebetween, a pulp filled within the gap which is more thermally conductive than air, and a plastic insulating film disposed between the pulp and the card. The card, electrical components, the plastic insulating film and the metal plate form an integrated assembly.

Abstract: Provided is a cooling system for transferring heat away from heat dissipative devices. The cooling system includes a thermally conductive heat sink member which is connected on one side to a heat dissipating device and attached on the second side to a resilient bellows pipe element filled with liquid coolant. The other end of the bellows is attached to and communicates with an evaporator section which communicates with a condenser section. The thermally conductive heat sink member, which may include thermally conductive fins, conducts transfers heat energy from the heat dissipating device to the liquid coolant. As the liquid coolant in the heat pipe heats and expands, the liquid in evaporator section of the cooling system can evaporate, the vapor passing to the condenser section. Vapor cools and returns to liquid state in the condenser section, wherein it is gravitationally returned to the evaporator section of the cooling device.

Abstract: An electrical substrate including a flexible printed circuit mounted on the substrate arranged to provide electrical contact between the flexible printed circuit and circuit contacts on an associated carrier substrate. Portions of the flexible printed circuit extended from the top surface of the electrical substrate to the bottom of the substrate by way of recesses included in the geometry of the electrical substrate. Portions of the flexible printed circuit are folded under the bottom side of the electrical substrate and fastened thereto by some compliant material. Properly positioned, electrical contact is established between the flexible printed circuit and circuit contacts on the carrier substrate.