Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.

Abstract: A cooling apparatus for an electronic or computing device includes a base for thermal coupling to a surface of the electronic or computing device and a cover spaced from the base. A nozzle plate is disposed between the base and the cover to partially define an inlet volume and an outlet volume. Cooling fluid enters the inlet volume and passes through the nozzle plate to the outlet volume and out of the apparatus. The nozzle plate includes a plurality of flow paths through which the cooling fluid passes from the inlet volume to the outlet volume. The flow paths cause the fluid to exit the nozzle plate as transversely expanding fluid jets.

Abstract: This power conversion device includes: a cooler having a cooling surface; one or a plurality of power modules and thermally connected to the cooling surface; a board placed with a space from the power module; and a board-retention member, the board-retention member including an extending portion which extends in the first direction through the space between the board and the power module, and supports the board, a first fixation portion which is connected to an end on the one side in the first direction of the extending portion and is fixed to the cooler on the one side in the first direction of the power module, and a second fixation portion which is connected to an end on the other side in the first direction of the extending portion and is fixed to the cooler on the other side in the first direction of the power module.

Abstract: A cooling module comprising a porous media that is at least partially inserted into a coolant channel of a heatsink. Generally the coolant is a liquid, though in some instances it may be a gas. More specific, a cooling module for providing enhanced localized cooling of a heatsink comprising a porous media having a volume and a seal plate connected to the porous media, wherein a portion of the volume of the porous media extends through a wall and/or a heatframe of the heatsink into a coolant channel such that coolant flows through the porous media extending into the coolant channel. The seal plate provides a seal for the wall and/or the heatframe so that the coolant does not flow out the wall and/or the heatframe. The seal plate provides enhanced localized cooling to a heat producing device that is at least in partial contact with the seal plate.

Abstract: A middle frame assembly includes a middle frame, connectors, and a vapor chamber. The middle frame is provided with a through hole, the connectors are fixedly coupled to the middle frame, and some of the connectors are exposed to form a welding part. The vapor chamber includes a vapor chamber body and a surrounding edge surrounding the vapor chamber body. The vapor chamber is accommodated in the through hole, and the surrounding edge is welded to the welding part. The connectors are configured to couple the middle frame and the vapor chamber and are welded to the vapor chamber.

Abstract: An electronic assembly is provided. The electronic assembly includes a heat-spreader component and at least one spring. The electronic assembly further includes a thermal pad contacting the at least one spring, and at least one layer of polymer directly contacting at least one of an upper surface and a lower surface of the thermal pad. Further disclosed is a method of assembling the electronic assembly. The method includes adhering a heat-dissipating sheet on a surface of a metal heat-spreader component. The method also includes placing a thermal pad on at least one spring extending from the surface of the metal heat-spreader component, and placing at least one layer of polymer so as to directly contact at least one of an upper surface and a lower surface of the thermal pad.

Abstract: The invention relates to a power electrical apparatus comprising a first electrical module (21) forming a power electronic module, a second electrical module (22) forming a power electronic module, a third electrical module (4) forming a capacitive module which comprises a plurality of electrical components and a housing, a cooling system, configured to cool said second electrical module (22), a connecting portion of the cooling circuit connecting a first (31) and a second (32) cooling module, said connecting portion providing a fluidic connection between said first (31) and said second (32) cooling module, said first and second cooling modules (31-32) being positioned on either side of said third electrical module (4), said first and second cooling modules (31-32) each having a portion extending beyond one and the same lateral face of said third electrical module (4), vertically in line therewith, said portions facing one another.

Abstract: An immersion cooling system comprising a tank module couplable to a plurality of cooling distribution modules. The cooling distribution modules circulate a dielectric fluid into the tank module allowing the dielectric fluid to extract heat from a plurality of electrical appliances. The cooling distribution modules are configured to operate in a fault tolerance environment.

Abstract: An electronic module includes a pulsating heat pipe having a channel structure for arrangement of a heat transport medium. The channel structure is formed of ceramic bodies, a metallic cover element, and a metallic carrier element. An electrical structural element is in contact with the heat transport medium.

Abstract: An electronic device includes a printed circuit board (“PCB”) structure which accommodates a thermal interface material (“TIM”). The PCB structure includes a base plate, a first component on the base plate, a second component on the base plate and apart from the first component, an interposer connected to the base plate and surrounding the first component and the second component, a cover plate connected to the interposer and covering the first component and the second component, and an accommodation part which is between the base plate and a heat conduction plate and accommodates the TIM.

Abstract: Systems are provided for a power electronics cooling assembly. In one example, a system for a power electronics cooling assembly includes: a first cooling plate, a mounting plate, the mounting plate having mounting points to be attached to a housing, an electronic module disposed between the first cooling plate and the mounting plate, and a spring bracket applying force towards the first cooling plate, the spring bracket having mounting points aligned with the mounting points of the mounting plate.

Abstract: A cooling arrangement for cooling at least one power cell, in particular of a motor vehicle, includes a power cell and a cooling fluid circuit, wherein the power cell is directly electrically connected to at least one power conductor of an electric power supply, wherein a cooling fluid circulates in the cooling fluid circuit, wherein the cooling fluid circuit is fluidly connected to the power cell and/or the power conductor, and wherein the cooling fluid is a cooling medium having electrically insulating properties, in particular a dielectric medium.

Abstract: A subsea substation system including: an oil-filled water impermeable enclosure; an AC-transformer, and at least one overcurrent device electrically connected to the AC-transformer, the at least one overcurrent device, the AC-transformer, and the electrical connections between them are accommodated in the oil-filled water impermeable enclosure, wherein the enclosure includes thermal zones within the enclosure, wherein the AC-transformer is arranged in a first thermal zone and the overcurrent devices are arranged in a second thermal zone of the enclosure, a thermal layer separate the first thermal zone and the second thermal zone, the at least one thermal layer is configured to allow oil flow between the thermal zones while reducing heat flow between the zones.

Abstract: An efficient thermal control system for microcircuits based on liquid metal coolant is provided, including a cooling water system, a liquid metal supply system and a cooling system. The liquid metal supply system is used for supplying liquid metal to the cooling system to achieve heat exchange with a chip through the liquid metal, and the cooling water system is used for cooling the liquid metal. The cooling system includes a cooling capacity distribution unit used for distributing the liquid metal; cabinets provided with chip cooling platforms, which are connected to the cooling capacity distribution unit through a pipe, and are provided with the chip; a temperature measuring component used for measuring temperature of the chips; and a control unit, and cooling capacity distribution unit and the temperature measuring component are electrically connected to the control unit.

Abstract: The present disclosure relates to a thermal coupling element, a method of manufacturing the coupling element, and a switchable arrangement for heat dissipation from electrical or electronic components of a motor vehicle.

Abstract: A liquid cooled server chassis comprising a chassis, at least one electronics module having at least one heat generating component mounted thereon, and a liquid cooling unit, having at least one liquid plate heat exchanger, a liquid row heat sink, an inlet chassis manifold, and an outlet chassis manifold, is provided. The at least one liquid plate heat exchanger, mounted and thermally coupled to the at least one heat generating component, is in fluid communication with the inlet chassis manifold and outlet chassis manifold, transporting heat away from the at least one heat generating component. The liquid row heat sink, in fluid communication with the inlet chassis manifold and outlet chassis manifold, is configured to lower a flowthrough temperature of ambient airflow flowing through the liquid row heat sink. The at least one electronics module and liquid row heat sink are parallel arranged, whereby cooling power is evenly distributed thereamong.

Abstract: Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows.

Abstract: Provided is a step-down converter including: a step-down transformer including a primary-side coil and a secondary-side coil; a resin molded body integrally molded through use of a non-conductive resin together with the primary-side coil and the secondary-side coil; and a rectifier element, wherein the resin molded body has a mounting surface on which the rectifier element is to be mounted, wherein the secondary-side coil includes a first plate-shaped terminal, wherein the first plate-shaped terminal is exposed from the resin molded body in the mounting surface, wherein, on the mounting surface, a second plate-shaped terminal is provided in parallel to the first plate-shaped terminal across a gap, wherein the rectifier element is bonded to both of the first plate-shaped terminal and the second plate-shaped terminal by soldering, and wherein the non-conductive resin has a melting point higher than a melting point of the solder.

Abstract: The present disclosure provides a liquid cooling system for dissipating heat from a heat source, including a liquid cooling module and a liquid leakage detecting module. The liquid cooling module includes a liquid cooling component. The liquid cooling component includes a liquid cooling plate, a liquid supply pipeline and a liquid return pipeline. The liquid supply pipeline and the liquid return pipeline are in communication with the liquid cooling plate receptively. The liquid leakage detecting module includes a liquid leakage detecting device, a monitoring device and a main wire. The liquid leakage detecting device includes a hub and a plurality of liquid leakage detection branches. The liquid leakage detection branches are electrically connected to the hub in parallel, and are provided in the liquid supply pipeline and the liquid return pipeline respectively. The main wire electrically connects the hub to the monitoring device.

Abstract: An apparatus includes a cabinet; an air-mover attached to the cabinet; a circuit board mounted in the cabinet; and an air-cooled heat sink attached in thermal contact with a heat-generating component on the circuit board. The heat sink includes a heat sink base; primary heat removal fins protruding from the heat sink base in a direction away from the circuit board; and secondary heat removal fins protruding from the heat sink base in a direction toward the circuit board. The air-mover is configured to force air between the primary heat removal fins and between the secondary heat removal fins.