Abstract: An electronic device can include a housing that defines an internal volume. The electronic device can also include a component within the internal volume that divides the internal volume into a first volume and a second volume. The first volume and second volume can be fluidically isolated except at an aperture defined by the component. An air-moving system can produce a positive air pressure in the first volume and a negative air pressure in the second volume.

Abstract: Provided are a power module and a heat sink system. The power module includes a first circuit board, a second circuit board, at least one discrete component and an encapsulation body. One discrete component includes a lead frame and at least one chip, the lead frame is disposed between the first circuit board and the second circuit board, the lead frame includes two end faces and multiple mounting lateral surfaces connected in sequence, an angle is formed between one end face and one mounting lateral surface, one of the two end faces is electrically connected to the first circuit board and the other of the two end faces is electrically connected to the second circuit board, and the chip is disposed on each of the multiple mounting lateral surfaces. The encapsulation body is configured to pot a space between the first circuit board and the second circuit board.

Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Abstract: A frame for a liquid-cooled chassis in an IT rack, can include a fluid supply line contained within one or more walls of the frame and a fluid return line contained within the one or more walls of the frame. Fluid distribution function and hardware are integrated to the frame. One or more contact pads can be located on an external surface of the frame, for transferring thermal energy with IT equipment.

Abstract: The disclosure relates to an apparatus and method for liquid cooling of an electronic component. A housing includes an insertion slot and defines at least one component chamber for carrying the electronic component. A fluid inlet and fluid outlet are provided on the housing. A liquid coolant circuit passes through the housing at least from the inlet to the outlet.

Abstract: A heat-transfer component defines a thermal-interface surface and has a composite thermal-interface material on the thermal-interface surface. The composite thermal-interface material comprises a silicone oil substrate and a metallic filler. In some embodiments, the metallic filler undergoes a transition from solid to liquid at a temperature below a typical operating temperature of an electronic device. For example, an embodiment of a metallic filler has a solid-to-liquid transition temperature between about 25° C. and about 95° C. In some embodiments, a second thermal interface material extends around an outer periphery of the composite thermal interface material, which can inhibit or prevent seepage or other migration of metallic filler in the composite thermal-interface material out of a thermal interface region between the heat-transfer component and, e.g., a heat-generating component. Also disclosed are electrical devices having a heat generating component cooled by such a heat-transfer component.

Abstract: A robot control device includes a casing including a main body having a first opening and a second opening, and a door opening and closing the first opening, a first circuit including a heat generating element, and at least one blower device. The main body includes a first chamber accommodating the first circuit and open at the first opening, and a second chamber adjacent to the first chamber and open at the first opening and the second opening. When the door closes the first opening, the door closes the first chamber and communicates the second chamber with the outside via a door opening of the door. The blower device is disposed at least one of positions at the door opening, near the door opening, at the second opening, and near the second opening, and is configured to introduce and discharge air into/from the second chamber.

Abstract: Provided is a circuit structure having a novel structure with which the dissipation of heat from a heat generating component can be more reliably promoted with a short heat transfer path. A circuit structure includes: a heat generating component; bus bars connected to connection portions of the heat generating component; an insulating base member configured to hold the heat generating component and the bus bars; and a coolant flow path provided inside the base member and through which a coolant flows, the bus bars being in thermal contact with the coolant flow path.

Abstract: A cooling system for a capacitor may include a housing for the capacitor, the housing comprising of a bottom surface, a top surface, and at least one side surface connecting the bottom surface and the top surface, the housing further including: a bottom inlet manifold and a bottom outlet manifold extending along the bottom surface; an inlet side channel extending along the side surface, the inlet side channel being in fluid communication with the bottom inlet manifold; an outlet side channel extending along the side surface, the outlet side channel being in fluid communication with the bottom outlet manifold; a top inlet manifold extending along the top surface, the top inlet manifold being in fluid communication with the inlet side channel; and a top outlet manifold extending along the top surface, the top outlet manifold being in fluid communication with the outlet side channel.

Abstract: A system provides cooling to an infrastructure having heat-generating units. Internal cooling units are thermally connected to the heat-generating units. An external cooling unit dissipates thermal energy of a heat-transfer fluid circulating in the internal cooling units. A cooling circuit connects the internal and external cooling units. A pump maintains a flow of the heat-transfer fluid for transferring thermal energy from the heat generating units to the external cooling unit. A reservoir thermally connected to the cooling circuit contains a phase change material (PCM) changing between solid and liquid states according to a temperature of the heat-transfer fluid. Thermal energy is transferred between the cooling circuit and the PCM depending on whether a temperature of the heat-transfer fluid is above or below a phase-change temperature value of the PCM. A supplemental cooling device thermally connected to the reservoir dissipates heat from the reservoir to the atmosphere.

Abstract: A heat dissipation device includes a plurality of fins, at least one first heat pipe and at least one second heat pipe. Each of the fins includes a main body and two first deflectors. The main body has an inflow side, an outflow side and two first communication openings. The first communication openings are located between the inflow side and the outflow side. The first deflectors are arranged obliquely relative to the main body and respectively located on sides of the first communication openings. Air flowing out of the first communication openings is guided by the first deflectors to flow into an area between the first deflectors. The first heat pipe is located between the first deflectors. The second heat pipe is located on one side of one of the first deflectors located relatively far away from the other one of the first deflectors.

Abstract: A liquid cooling device includes first cold plates, second cold plates, a water divider, a first inlet pipe, a first outlet pipe, first connection pipes, second inlet pipes, second outlet pipes, second connection pipes. The water divider has inner inlet connectors and inner outlet connectors. The first inlet pipe connects one inner inlet connector and one first cold plate. The first outlet pipe connects one inner outlet connector and another one first cold plate. The first connection pipes each connect different two of the other first cold plates. The second inlet pipes respectively connect the other inner inlet connectors and some second cold plates. The second outlet pipes respectively connect the other inner outlet connectors and some second cold plates. The second connection pipes each connect different two second cold plates.

Abstract: A heat dissipation device includes a first heat dissipator, a second heat dissipator, a first tank connected to one side of each of the first heat dissipator and the second heat dissipator in a first direction, and a second tank connected to another side in the first direction. A coolant flows through an inside of the first heat dissipator, the second heat dissipator, the first tank, and the second tank. The first tank includes a tank-side first outflow port through which the coolant flows out to a first cooling device, and a tank-side first inflow port through which the coolant from the first cooling device flows in. The second tank includes a tank-side second outflow port through which the coolant flows out to a second cooling device, and a tank-side second inflow port through which the coolant from the second cooling device flows in.

Abstract: A board structure includes: a board with a heat generating element; a heat sink including a plate-shaped base member with one face contacting the heat generating element, and plural fins side by side on another face of the base member, the fins extending in a cooling air flow direction, the fins having distal ends downstream in the flow direction; a first resisting member on a downstream side with respect to the heat sink and acting as a resistor for exhaust of the cooling air; and a second resisting member on the downstream side and on a first side that the fins are arranged respective to the heat sink and acting as a resistor for the cooling air. Distal ends of the fins on a second side that the fins are arranged are upstream of the distal ends of the fins on the first side.

Abstract: A computer chassis includes walls defining an airspace containing heat-generating components (e.g., storage drives). The airspace is divided into first and second regions, such as by a printed circuit board supporting the heat-generating components within the first region. An air input feeds both the first region and second region. Input air going through the first region first passes by a forward set of heat-generating components before continuing to a rearward set of heat-generating components to extract heat therefrom. Input air going through the second region bypasses the forward set of heat-generating components before being directed out through an air opening partway down the length of the chassis, after which this air passes by a rearward set of heat-generating components to extract heat.

Abstract: A computing device includes a heat dissipation component, a heating or cooling apparatus, and a printed circuit board. The heating or cooling apparatus includes a heating or cooling component and a wire, and the heating or cooling component is affixed to a surface of the heat dissipation component. The printed circuit board includes a printed circuit board component, and the heat dissipation component is affixed to the printed circuit board component and configured to heat or cool the printed circuit board component.

Abstract: A module is provided for housing electronic devices and a liquid coolant. The module comprises: a housing defining a sealable internal volume for containing the electronic devices and the liquid coolant, the sealable internal volume having a base; a substrate in the sealable internal volume approximately parallel to the base, one of the electronic devices being mounted on a side of the substrate proximal the base; and a heat sink device, comprising a receptacle part defining an internal volume that is arranged to receive the liquid coolant and accumulate the liquid coolant therein. The heat sink is mounted such that the one of the electronic devices or a component that is thermally conductively coupled to the one of the electronic devices is at least partially within the internal volume.

Abstract: Separating temperature domains in cooled systems, including: cooling at least one first component of a circuit board using a first cooling system; and conductively coupling the at least one first component to at least one second component using a superconductive portion of a power plane of the circuit board.

Abstract: The invention relates to a heat dissipation device comprising a support (10) and a heat sink (12) designed to be cooled by an air flow passing through the sink (12), the support (10) having a first housing inside which the sink (10) is held, the support (10) being further configured to accommodate an electronic control module (2) designed to be cooled by the sink (12).

Abstract: A heat dissipation apparatus includes a heat-conducting plate, where a liquid channel is disposed on a first surface of the heat-conducting plate; a mounting base, where an accommodation cavity configured to accommodate a partial area that is in the heat-conducting plate and that includes a second surface is disposed on the mounting base. The first surface and the second surface are disposed opposite to each other. A pressing plate is configured to fasten the heat-conducting plate in the accommodation cavity. The pressing plate is detachably and firmly connected to the mounting base, a sealing cavity is formed between the pressing plate and the first surface of the heat-conducting plate, and the sealing cavity is configured to accommodate the liquid channel A liquid inlet connector and a liquid outlet connector that are connected to the liquid channel are disposed on the pressing plate.