Patents Examined by Zachary Pape
  • Patent number: 10856435
    Abstract: A fan attachment structure for attaching a fan to a casing is provided. The casing includes an accommodation portion configured to accommodate the fan, and an engaged portion formed on a side surface of the accommodation portion. The fan includes an engagement portion formed in a housing, and configured to engage with the engaged portion to restrict movement of the fan in a direction from an interior of the accommodation portion to an opening portion, and a rattling suppressing mechanism formed on a surface of the housing facing toward the side surface of the accommodation portion and configured to bias the fan in a direction apart from the side surface of the accommodation portion.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: December 1, 2020
    Assignee: FANUC CORPORATION
    Inventor: Kazuyuki Sasaki
  • Patent number: 10833566
    Abstract: An inverter integrated motor having a frame, a motor body, a cap, a fan, an inverter, and a heat transfer module is provided. The motor body is received in the frame, and a heat dissipation passage is formed between them, the motor body is covered and closed by the cap, and the cap and the motor body are presented in a continuous form. The inverter is attached on an outer side surface of the frame. The heat transfer module is located between the cap and the fan and thermally connected to the inverter. Airflow is generated by the fan to flow through the heat transfer module and exchange heat therewith, and the airflow then flows into the heat dissipation passage along the cap. Accordingly, an attached additional fan for the inverter is not necessary.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: November 10, 2020
    Assignee: CHICONY POWER TECHNOLOGY CO., LTD.
    Inventors: Meng-Fang Chang, Yu-Chia Ting
  • Patent number: 10834847
    Abstract: The disclosed apparatus may include (1) a cold plate base that (A) is thermally coupled to a component and (B) includes a set of heatsink fin structures that facilitate absorbing heat generated by the component and (2) a cold plate cover that (A) sits atop the cold plate base and (B) directs a cooling fluid across the set of heatsink fin structures to cool the cold plate base despite the heat absorbed by the cold plate base from the component. Various other apparatuses, systems, and methods are also disclosed.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: November 10, 2020
    Assignee: Juniper Networks, Inc
    Inventor: Alexander I. Yatskov
  • Patent number: 10833490
    Abstract: This control board has buses stored in a bus chamber extending in the vertical direction with respect to a floor surface inside a housing and power is supplied to stored devices from the buses. The control board includes an inlet which is provided on the bus chamber and through which cooling air is taken in, a device inlet provided on the stored devices and opposed to a bus chamber outlet provided on the bus chamber, a device outlet provided on the front side of the stored devices, and a door portion outlet provided on a door on the front side and opposed to the device outlet.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: November 10, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Hisanori Shindo
  • Patent number: 10825483
    Abstract: Embodiments of the present disclosure relate to an enclosure for a disk array. The enclosure comprises a chassis for receiving the disk array. Each disk in the disk array is enclosed by a frame. The enclosure also comprises a heat sink including a plurality of metal bars arranged on a bottom face of the chassis. Each of the plurality of metal bars is adapted to contact a respective disk through a notch in the frame of the respective disk, to position the respective disk and to transfer heat generated by the respective disk to the chassis. In the embodiments of the present disclosure, the metal bars may be used not only for reliable positioning of the disks, but also for improving thermal dissipation performance.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: November 3, 2020
    Assignee: Dell Products, L.P.
    Inventors: Haifang Zhai, Hendry Wu, David Dong, Yujie Zhou
  • Patent number: 10819114
    Abstract: A submodule according to the present invention includes a power pack including a plurality of switching modules, first and second input busbars connected to the plurality of switching modules and protruding to a first outer side of the power pack, first and second connection busbars connected to the plurality of switching modules and protruding to a second outer side of the power pack, a capacitor pack including a capacitor element, and first and second connection units provided at both sides of one surface of the capacitor pack. The first and second connection busbars are inserted into the first and second connection units, respectively, such that the power pack and the capacitor pack are electrically connected to each other.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: October 27, 2020
    Assignee: LSIS CO., LTD.
    Inventor: Teagsun Jung
  • Patent number: 10818985
    Abstract: The present invention relates to a heat exchanger for cooling an electrical element and a heat exchanger assembly for cooling an electrical element, and more particularly, to a heat exchanger for cooling an electrical element and a heat exchanger assembly for cooling an electrical element into which the electrical element may be easily inserted and in which both surfaces of the electrical element and a tube through which a coolant flows are formed to contact each other to improve cooling performance.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: October 27, 2020
    Assignee: Hanon Systems
    Inventors: Hong-Young Lim, Jun Young Song, Wi Sam Jo, Hyun Hee Jung, Sun Mi Lee
  • Patent number: 10813236
    Abstract: A housing for an electronic device can include an enclosure at least partially defining an internal volume. The enclosure can include a bottom panel. The housing can also include a tubular frame that includes a first pair of tubular support members extending from the bottom panel and a second pair of tubular support members extending from the bottom panel. The housing can also include a first tubular top frame member disposed outside the internal volume and connected to an end of each of the first pair of tubular support members through an opening defined by the enclosure, and a second tubular top frame member disposed outside the internal volume and connected to an end of each of the second pair of tubular support members through an opening defined by the enclosure.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: October 20, 2020
    Assignee: APPLE INC.
    Inventors: Brett W. Degner, Michael E. Leclerc, Danny L. McBroom, Houtan R. Farahani, Michael D. McBroom, Bart K. Andre, Sabrina K. Paseman
  • Patent number: 10813244
    Abstract: An electronic device includes a waterproof case, including a closed space, and a flow guide assembly, an electronic module and a cover, provided in the closed space. The cover includes a cover top plate and a cover side plate which, together with a case bottom plate and a case side plate, form an accommodation space for accommodating the flow guide assembly and the electronic module. Further, the cover includes a first vent hole and a second vent hole. The flow guide assembly is configured to guide air, entering the accommodation space from the first vent hole, to flow through the electronic module and to be discharged from the second vent hole. The flow guide assembly is further configured to guide air, entering the cavity from the first vent hole, to flow through the electronic module and to be discharged from the second vent hole.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: October 20, 2020
    Assignee: SIEMENS LTD., CHINA
    Inventors: Hai Liu, Xue Feng Zhu, De Zhong Han, Hai Bo Sheng, Xi Tao
  • Patent number: 10806058
    Abstract: Provided is a power distribution board including: a bus bar; and a heat dissipation member that is disposed on one side of the bus bar via an adhesive layer, wherein the bus bar includes a recess that is open to the adhesive layer side, and that is filled with a constituent material of the adhesive layer.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: October 13, 2020
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Shungo Hiratani, Kazuyoshi Ohara, Munsoku O
  • Patent number: 10806048
    Abstract: A secure electronic equipment rack allows electronic equipment to be hung vertically to save space for deep components. This is done by providing a vertical rack apparatus with horizontal side panels on which components are mounted vertically. The side panels of the rack are shorter than the depth of the components to be mounted on, to, or within the panels, thus allowing space to be saved. The rack can be expanded based on user's equipment growth. The apparatus can be mounted on a wall or on a standard EIA relay rack. The apparatus has cable management for equipment that fits into wire channels and allows having a patch panel mounted without taking up a “U” space in the apparatus itself. The apparatus can include a built-in level for ease of mounting, and an integrated earth grounding stud.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: October 13, 2020
    Assignee: BlackHawk Labs LLC
    Inventors: Tod A. Wagner, Richard F. Murphy
  • Patent number: 10798853
    Abstract: The present invention relates to an inverter device having an inverter module for converting DC power stored in an energy storage system (ESS) of a photovoltaic power generation system into AC power and supplying the AC power to a load. The inverter device comprises a case, an input/output terminal unit, and a heat dissipating fan. The case has an inverter module housed therein and a plurality of heat dissipating holes formed on the rear surface thereof. The input/output terminal unit is fixed to an upper portion of the front surface of the case through a first fastening member, and a plurality of cables are connected to an inner surface thereof through a second fastening member so as to be energized. The heat dissipating fan is fixed to the front surface of the case while being disposed below the input/output terminal unit, and discharges heat generated by the inverter module.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: October 6, 2020
    Assignee: LSIS CO., LTD.
    Inventor: Hyuk-Il Kwon
  • Patent number: 10798855
    Abstract: A refrigerant flow channel includes a first flow channel extending in a first direction and a plurality of first branching flow channels extending in a second direction by branching from the first flow channel. Three element arrays corresponding to a first motor for driving and three element arrays corresponding to a second motor for power generation are respectively disposed side by side in the first direction on a mounting surface. The element array of the first motor in each phase and the element array of the second motor in each phase face each other in the second direction, and are disposed at positions overlapping the first branching flow channel in a plan view. The element array of the first motor is located on an upstream side of the first branching flow channel with respect to the element array of the second motor.
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: October 6, 2020
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Takahiro Uneme
  • Patent number: 10782492
    Abstract: A heatsink for pluggable optical devices that incorporates features to limit the travel and deformation of the mating/mated spring clip that holds the heatsink to the cage of a pluggable optical device. The heatsink bearing surface takes the shape and contour of the leaf spring portion of the spring clip, thereby contacting and supporting it well before it plastically yields and permanently deforms. The shape of this feature, which may be coupled to or integrally formed with the heatsink bearing surface, can match exactly the shape of the spring clip or approximate the shape using a curved, variable, or other easier to manufacture profile, as long as the associated protrusions extend up into the corners of the leaf spring portion of the spring clip. This feature effectively acts as a hard stop and prevents the spring clip from being compromised due to improper handling or installation.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: September 22, 2020
    Assignee: Ciena Corporation
    Inventors: Trevor Meunier, Mitchell O'Leary, Victor Aldea, Kamran Rahmani
  • Patent number: 10784664
    Abstract: A three-piece electronics enclosure may be provided. The electronics enclosure may comprise a back housing, a lid, and a center frame. The back housing may comprise back housing heat sinks on an exterior of the back housing and back housing circuitry disposed in an interior of the back housing. The lid may comprise lid heat sinks on an exterior of the lid and lid circuitry disposed in an interior of the lid. The center frame may be disposed between the back housing and the lid. The center frame may comprise a plurality of input/output (I/O) ports comprising a first I/O port and a second I/O port. At least one of the plurality of I/O ports may provide power to the back housing circuitry and the lid circuitry. The center frame may further comprise a power bypass that passes power between the first I/O port and the second I/O port.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: September 22, 2020
    Assignee: Cisco Technology, Inc.
    Inventors: William George Mahoney, John Alexander Ritchie, Jr.
  • Patent number: 10785892
    Abstract: A heat dissipation system and a coolant distribution module for plural electronic components of an electronic computing device are provided. The heat dissipation system includes plural water-cooling heads, a heat dissipation device and the coolant distribution module. When a fluid medium flows through the heat dissipation device, the heat dissipation device exchanges heat with the fluid medium. The coolant distribution module is connected between the plural water-cooling heads and the heat dissipation device. The coolant distribution module includes a main body and a power module. The module main body includes a cooled fluid chamber. The cooled fluid chamber includes plural first outlets corresponding to the plural water-cooling heads. The power module is installed in the module main body. The power module drives the fluid medium to be outputted from the plural first outlets. Consequently, the fluid medium is transferred through a circulating loop.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: September 22, 2020
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Chien-An Chen, Chien-Yu Chen, Mu-Shu Fan, Shih-Chieh Kao, Che-Chia Chang
  • Patent number: 10777979
    Abstract: A racking assembly for an electrical apparatus is provided. The racking assembly includes a movable carriage assembly and a drive assembly. The movable carriage assembly is sized to fit within a housing assembly and is structured to be moved between a first position and a second position. The carriage assembly is further structured to support at least one electrical component. The drive assembly includes a motor assembly and a positioning assembly. The motor assembly is structured to impart movement to said positioning assembly. The motor assembly is coupled to said positioning assembly. The positioning assembly is structured to impart movement to said carriage assembly and to move said carriage assembly from said first position to said second position. The positioning assembly is coupled to said carriage assembly. In this configuration, the racking assembly is structured to move the carriage assembly, and therefore the electrical apparatus, between the first and second positions.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: September 15, 2020
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Russell Irving Boyce, Michael Davis Pearce, Melvin LaVern Hughes
  • Patent number: 10778118
    Abstract: Provided herein is a power converter component to power a drive unit of an electric vehicle drive system. The power converter component includes an inverter module formed having three half-bridge modules arranged in a triplet configuration for electric vehicle drive systems. Positive inputs, negative inputs, and output terminals of the different half-bridge inverter modules are aligned with each other. The inverter module includes a positive bus-bar coupled with the positive inputs and a negative bus-bar coupled with the negative inputs of the half-bridge inverter modules. The positive bus-bar is positioned adjacent to and parallel with the negative bus-bar. The inverter module can be coupled with a drive train unit of the electric vehicle and provide three phase voltages to the drive train unit. Each of the half bridge modules can generate a single phase voltage and three half-bridge modules arranged in a triplet configuration can provide three phase voltages.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: September 15, 2020
    Assignees: CHONGQING JINKANG NEW ENERGY VEHICLE CO., LTD., SF MOTORS, INC.
    Inventors: Nathan Chung, Jinzhu Li, Kangwei Mao, Colin Haag, Zhong Nie, Duanyang Wang, Yifan Tang
  • Patent number: 10779438
    Abstract: An electronics thermal conduction package is provided. The package may include a housing and an interior space, or envelope, configured to receive a printed circuit board assembly (“PCBA”) with one or more microprocessors or other heat generating elements. The package can be elastically deformed to open a dimension of the envelope, or receiving cavity, such that a complete PCBA can be inserted inside the interior space of the package. Once inserted, the package may be returned to its undeformed, or substantially undeformed, state such that surfaces in the interior space of the package contact one or more of the heat generating elements on the PCBA creating a conductive thermal path from the heat generating elements to the housing of the package.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: September 15, 2020
    Assignee: NIO USA, Inc.
    Inventor: Nermin Mujcinovic
  • Patent number: 10779445
    Abstract: Provided herein is a power converter component to power a drive unit of an electric vehicle drive system. The power converter component includes an inverter module formed having three half-bridge modules arranged in a triplet configuration for electric vehicle drive systems. Positive inputs, negative inputs, and output terminals of the different half-bridge inverter modules are aligned with each other. The inverter module includes a positive bus-bar coupled with the positive inputs and a negative bus-bar coupled with the negative inputs of the half-bridge inverter modules. The positive bus-bar is positioned adjacent to and parallel with the negative bus-bar. The inverter module can be coupled with a drive train unit of the electric vehicle and provide three phase voltages to the drive train unit. Each of the half bridge modules can generate a single phase voltage and three half-bridge modules arranged in a triplet configuration can provide three phase voltages.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: September 15, 2020
    Assignees: CHONGQING JINKANG NEW ENERGY VEHICLE CO., LTD., SF MOTORS, INC.
    Inventors: Nathan Chung, Jinzhu Li, Kangwei Mao, Colin Haag, Zhong Nie, Duanyang Wang, Yifan Tang