Patents Examined by Zachary Pape
  • Patent number: 11229144
    Abstract: A heat dissipation housing includes an outer casing and the heat conduction block. The heat dissipation housing includes a thickness portion and at least one first tenon extending towards the inner direction of the outer casing from the inner surface of the thickness portion. Heat conduction block includes a base and at least one second tenon extending towards the outer direction of the outer casing from the base. The first tenon and the second tenon are combined, such that the first tenon, the second tenon, and the base together form a column extending towards the inner direction of the outer casing from the inner surface of the thickness portion. The outer casing and the heat conduction block both have a thermal conductivity greater than 0.5 W/m-k.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: January 18, 2022
    Assignee: SERCOMM CORPORATION
    Inventors: Shi-Jun Weng, Cheng-Chung Chang
  • Patent number: 11229114
    Abstract: This heat dissipation structure includes: a circuit board; an integrated circuit mounted thereon; a first thermal pad disposed on the surface of the integrated circuit; a heat sink having a first surface that applies pressure to the first thermal pad by sandwiching the first thermal pad together with the surface of the integrated circuit and a second surface facing the first surface; a second thermal pad disposed on the second surface; a heat dissipation casing having a surface that applies pressure to the second thermal pad by sandwiching the second thermal pad together with the second surface; and stud components for pulling up the heat sink from the heat dissipation casing side together with the circuit board such that the second thermal pad is sandwiched and pressurized between the heat dissipation casing and the heat sink.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: January 18, 2022
    Assignee: NEC Platforms, Ltd.
    Inventor: Jun Eto
  • Patent number: 11226658
    Abstract: Apparatus and methods may be provided that may include a single bracket (e.g., a single universal support or anchor bracket) capable of operably mounting or supporting multiple diverse configurations of system hardware components (e.g., such as solid state drive (SSD) cards) to an existing motherboard or other system support component/surface on or within the same system chassis of an information handling system.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: January 18, 2022
    Assignee: Dell Products L.P.
    Inventors: Yi-Ning Shen, Mei-Chih Wu, Chih-Wei Chang, Yen-Kai Chiu, Chin-Chung Wu
  • Patent number: 11229146
    Abstract: Systems and methods are disclosed relating to welding-type power supplies. In some examples, the power supplies may have no vents, which may help prevent environmental contaminants from entering the power supplies. Instead, the power supplies include one or more thermal interfaces configured to conduct heat generated by internal circuitry of the power supply from the interior of the power supply to an exterior of the power supply. Additionally, the thermal interface(s) may be configured for attachment to one or more exterior heat dissipating devices.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: January 18, 2022
    Assignee: Illinois Tool Works Inc.
    Inventors: Alan Adam Manthe, Nicholas James Dessart
  • Patent number: 11224146
    Abstract: An apparatus to cool electronics in an autonomous vehicle, where the autonomous vehicle includes significant computing power to receive data from on-board sensor, cellular data and user interactions and to navigate an environment to a predetermined location. The cooling system includes a radiator, fan, pump and cold plate. The cold plate is formed from two plates with extended surfaces that are mated together so that the cavities around the extended surfaces form a flow passage. The electronics processing the data and navigating are mounted on the outside surface of the cold plate.
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: January 11, 2022
    Assignee: DEKA Products Limited Partnership
    Inventor: Christopher C. Langenfeld
  • Patent number: 11219141
    Abstract: A data center cooling system includes a housing to contain electronic racks of IT components operating therein, a coolant distribution unit (CDU) situated within the housing to control a liquid flow of a cooling liquid. One or more liquid cooling devices are disposed on the IT components to receive a first liquid from the CDU, to exchange or extract heat generated from the IT components, to transform the first liquid to a second liquid with a higher temperature, and to transmit the second liquid back to the CDU. The CDU is coupled to a heat transfer system to dissipate the exchanged heat to an external environment. The data center cooling system includes an airflow delivery system to generate a direct or indirect airflow to travel through the servers of the electronic racks to remove heat generated by the servers to the external environment eliminating chiller and IT fans.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: January 4, 2022
    Assignees: BAIDU USA LLC, BAIDU.COM TIMES TECHNOLOGY (BEIJING) CO., LTD.
    Inventors: Tianyi Gao, Yan Cui, Xiaogang Sun, Ali Heydari
  • Patent number: 11212940
    Abstract: The present document describes a passive thermal-control structure for speakers and associated apparatuses and methods. The architecture of the passive thermal-control structure is such that heat is transferred from electronic subsystems of the electronic speaker device to the passive thermal-control structure, which acts as an internal, structural frame of the electronic speaker device and provides both thermal mitigation and structural stability. The passive thermal-control structure conducts heat from the electronic subsystems to a housing of the electronic speaker device. The housing of the electronic speaker device may dissipate the heat to the ambient environment to prevent thermal runaway of the electronic subsystems, and the internal frame mitigates the temperature of the housing from exceeding ergonomic temperature limits.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: December 28, 2021
    Assignee: Google LLC
    Inventors: Emil Rahim, Ihab A. Ali, Phanindraja Ancha, Neha Ravi Dixit
  • Patent number: 11205873
    Abstract: A connector includes a cage having a plurality of receiving chambers, a separation mechanism including a lower separation plate and an upper separation plate, a radiator disposed between the lower separation plate and the upper separation plate, and an elastic clip mounted on the radiator and elastically holding the radiator in the separation mechanism. The separation mechanism is located between and separates a pair of adjacent receiving chambers of the plurality of receiving chambers in a height direction of the connector. A pair of sides of the elastic clip opposite to each other in a lateral direction of the radiator are fixed between the lower separation plate and the upper separation plate.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: December 21, 2021
    Assignee: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Wenyu Liu, Hongqiang Han, Lizhou Li, Xingjie Ge
  • Patent number: 11197398
    Abstract: An installation structure and an installation method of a plug-in switch tube is disclosed in the present invention, the installation structure comprises, a PCB board, a plug-in switch tube fixed on said PCB board, and a housing matching said PCB board and said plug-in switch tube, wherein the lower end surface of said housing is provided with a cooling liquid flow channel, and said plug-in switch tube is pressed against the side wall of the cooling liquid flow channel by an elastic pressing-piece. The installation structure according to the present invention has the advantages of small volume, excellent heat dissipation effect, simple assembly, low cost and light weight.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: December 7, 2021
    Assignee: SHENZHEN VMAX NEW ENERGY CO., LTD.
    Inventors: Jun Liu, Yingying Feng, Shun Yao
  • Patent number: 11197395
    Abstract: Embodiments are disclosed of a cooling system for use in a data center. The cooling system includes an IT region, a ceiling region, and a cooling air plenum sandwiched between the IT region and the ceiling region. The IT region includes one or more IT plenums that are coupled to the cooling air plenum to supply cooling air to the IT region, which can have house a plurality of IT racks that are clustered around the IT plenums and are adapted to house one or more pieces of liquid-cooled or hybrid-cooled information technology (IT) equipment. The ceiling region includes one or more ceiling plenums and one or more sets of heat exchangers, each heat exchanger being cooled by the cooling air delivered to the ceiling plenums. The cooling air plenum is fluidly coupled by a flow control to the one or more IT plenums and is fluidly coupled by a flow control to the one or more ceiling plenums or to the volume of the ceiling region between ceiling plenums.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: December 7, 2021
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11194362
    Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: December 7, 2021
    Assignee: APPLE INC.
    Inventors: Scott Myers, Matthew Theobald, Richard Heley, Adam Stagnaro, Richard Hung Minh Dinh, David Pakula, Tang Yew Tan
  • Patent number: 11184998
    Abstract: Electronic device including a housing enclosing an electronic board and a heatsink having a first face applied against the electronic board and, opposite, a second face making contact with the housing, an antenna being electrically connected to the electronic board and extending flatly between the heatsink and the housing while making contact with the heatsink and the housing.
    Type: Grant
    Filed: November 27, 2015
    Date of Patent: November 23, 2021
    Assignee: SAGEMCOM BROADBAND SAS
    Inventor: Romain Dejardin
  • Patent number: 11184997
    Abstract: Embodiments described herein may include apparatuses, systems and/or processes to encapsulate a circuit board to be cooled with a liquid coolant, that includes a first part dimensioned to receive the circuit board coupled with one or more heat sinks; a second part dimensioned to mate with the first part, and with a portion of a side of the circuit board around the one or more heat sinks to create a volume surrounding the circuit board, with a portion of the one or more heat sinks are outside the volume and is to be exposed to the liquid coolant, and a sealer to seal areas where the second part mates with the first part and the portion of the side of the circuit board, to prevent the liquid coolant from entering the volume. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: November 23, 2021
    Assignee: Intel Corporation
    Inventors: Joseph Andrew Broderick, Barrett M. Faneuf, Eric D. McAfee, Juan G. Cevallos, Jaime A. Sanchez, Emery E. Frey
  • Patent number: 11178795
    Abstract: A cooling device for a heterogeneous microchip is fabricated such that different cooling profiles can be provided for different chips. A housing is made of thermal conductive material, the housing having a plurality of channels formed therein. Electric contacts are provided inside each of the channels. Each channel can fit either a thermoelectric cooling device or a metallic block to provide different cooling profiles and design requirements. The cooling device is inserted between a liquid cooling plate and the chip to adjust and enhance heat transfer from the chip to the cooling plate. Alternatively, the cooling plate itself can serve as the housing with the channels, in which case the housing is provided with coupling for liquid pipes or hoses.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: November 16, 2021
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11178798
    Abstract: A cooling system for a power converter includes a first cooling channel configured to form an air channel, and a second cooling channel configured to form an air channel. The first and second cooling channels have at least one section in which the first and second cooling channels extend in a parallel arrangement in which the first cooling channel cools semiconductors of the power converter and the second cooling channel cools intermediate circuit capacitors of the power converter An air distributor is provided to divide an air stream between the first cooling channel and the second cooling channel in a ratio in a range of 80:20 to 95:5 as a function of a measurement value generated by a temperature sensor.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: November 16, 2021
    Assignee: Siemens Aktiengesellschaft
    Inventor: Hans Knauer
  • Patent number: 11160192
    Abstract: The disclosed apparatus may include (1) a cold plate base that (A) is thermally coupled to a component and (B) includes a set of heatsink fin structures that facilitate absorbing heat generated by the component and (2) a cold plate cover that (A) sits atop the cold plate base and (B) directs a cooling fluid across the set of heatsink fin structures to cool the cold plate base despite the heat absorbed by the cold plate base from the component. Various other apparatuses, systems and methods are also disclosed.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: October 26, 2021
    Assignee: Juniper Networks, Inc
    Inventor: Alexander I. Yatskov
  • Patent number: 11153996
    Abstract: An electronic assembly includes a PCB disposed on an end-face of a motor proximate to a first surface thereof and a thermal management assembly (TMA) thermally connected to the PCB. One or more switching semiconductor devices are disposed on the first surface. The TMA includes a cooling jacket disposed around a circumference of the motor, at least one jacket manifold formed through the cooling jacket, a thermal compensation base layer thermally coupled to the cooling jacket and the one or more switching semiconductor devices, and a cooling manifold disposed through the PCB to form a fluid flow path therethrough. The at least one jacket manifold has a fluid inlet and a fluid outlet. Two or more electrically insulated posts, each having a cooling channel, are disposed between the at least one jacket manifold and the cooling manifold and form a fluid circuit between the fluid inlet and the fluid outlet.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: October 19, 2021
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Shailesh N. Joshi, Shohei Suenaga
  • Patent number: 11153994
    Abstract: Systems, methods, and computer-readable media are disclosed. An example coolant system can be configured in an autonomous vehicle. The system can include a first coolant loop configured with a first series of coolant hoses to communicate a first volume of coolant fluid between a first reservoir, a first coolant pump, a three-way heat exchanger, and a computer system heat exchanger and a second coolant loop configured with a second series of coolant hoses to communicate a second volume of coolant fluid between a second reservoir, a second coolant pump, the three way heat exchanger, and the computer system heat exchanger. The system can further include a third coolant loop configured with a third series of coolant hoses to communicate third volume of coolant fluid between the three-way heat exchanger and an engine heat exchanger of the vehicle.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: October 19, 2021
    Assignee: GM Cruise Holdings, LLC
    Inventors: Roger Lo, Brian Schlotterbeck
  • Patent number: 11152771
    Abstract: A switching device including a switching unit having one or more electric poles and including, for each electric pole, a first power contact and a second power contact along which a line current can circulate and one or more solid-state switches; and a supporting frame adapted to be fixed to a supporting structure and including, for each electric pole, a third power contact and a fourth power contact along which said line current can circulate. The switching unit is reversibly movable, with respect to said supporting frame, between an insertion position and a withdrawn position. The switching unit includes, for each electric pole, at least a hydraulic circuit along which a cooling fluid can circulate to remove heat generated by said solid-state switches.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: October 19, 2021
    Assignee: ABB S.P.A.
    Inventors: Alessio Bergamini, Matteo Minuti
  • Patent number: 11147187
    Abstract: A cooling device includes at least two cooling units, each cooling unit including a plate-shaped cold plate extending in a horizontal direction, a radiator extending in a first direction perpendicular to the horizontal direction and having a plurality of plate-shaped fins which, on the cold plate, is disposed parallel to a second direction perpendicular to the first direction, and a pump which supplies a refrigerant liquid to the cold plate and the radiator, in which the pump is adjacent to the radiator and is disposed in the second direction of the radiator, and the pump of one first cooling unit of the two cooling units faces the other second cooling unit of the two cooling units in the second direction or in a third direction orthogonal to the first direction and the second direction.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: October 12, 2021
    Assignee: NIDEC CORPORATION
    Inventors: Toshihiko Tokeshi, Nobuya Nakae, Takahiro Imanishi, Akihiko Makita, Takehito Tamaoka